CN220383279U - SDIP23 module - Google Patents

Abstract

The application provides a SDIP23 module, wherein a U-phase pin of the SDIP23 module is led out from a first chip, a V-phase pin is led out from a second chip, and a W-phase pin is led out from a third chip. The SDIP23 module of the application, three phases are concentrated on the first, second and third chips, so that the mutual distance is indeed reduced, and the interfaces of the M (three-phase motor) are just U, V and W three phases, so that the three-phase motor wiring equipped with the module is smaller in U, V and W phase spans, the complexity of a peripheral circuit is greatly reduced, the practical use and installation are more facilitated, the reduction of the complexity of the intersection layout is also facilitated, the reduction of the area of a circuit board is also facilitated, the application circuit bears more functions, the use cost is greatly reduced, and good economic benefit is achieved.

Description

SDIP23 module

Technical Field

The utility model relates to the technical field of bladeless fan vibration reduction, in particular to a SDIP23 module.

Background

At present, the internet of things equipment is increasingly miniaturized, machines are developed towards the integrated industry, the machines are becoming more compact and complex, and in connectors, components and solutions, such trend of miniaturization of all levels must be achieved in terms of size, design, weight, use, availability and handling. This is a great challenge for hardware manufacturers in terms of size and power consumption to accommodate this new, compact size, and the continued miniaturization of electronic components has many advantages in many application areas. In addition to the consumer electronics industry, the automotive industry would benefit from small electronic products. In the future, electronic products will be further miniaturized, modularized and multifunctional, and the compact design perfectly solves the limited installation space.

The new generation IPM has built-in switch power supply, power factor correction circuit and signal processing circuit, and develops single power supply IPM with only one power supply. In the future, IPM will develop in the directions of large capacity, multifunction, high frequency, miniaturization, high performance, low inductance packaging and smaller thermal resistance, and will be mixed and integrated with a part of the microcontroller, and develop IPM by adopting a new structure and a new packaging technology.

As shown in fig. 1 and 2, the U, V and W phases of the existing module are led out from the second, fourth and sixth chips respectively, the three-phase distance almost spans one chip, so that the existing module adopts three driving ICs, the corresponding lower bridge output terminals NU, NV and NW have relatively high levels, so that each phase needs to have a resistor to reduce the levels, meanwhile, the driving capability of the three ICs has a difference, so that the three ICs cannot necessarily use the same specification of resistor, when the MCU of the existing module drives VCC and VB to supply power, the distribution of the three ICs is adopted, the winding and crossing of the wiring exist, and the interference between the two ICs is relatively large, so that the wiring is relatively disordered as a whole.

Disclosure of Invention

The technical problem to be solved by the utility model is to overcome one of the problems in the prior art, and provide the SDIP23 module, so that the three-phase motor wiring equipped by the module has smaller span of U, V and W phases, thereby greatly reducing the complexity of peripheral circuits, being more beneficial to practical use and installation, reducing the complexity of intersection layout, being beneficial to the reduction of the area of a circuit board, leading an application circuit to bear more functions, and finally greatly reducing the use cost and obtaining good economic benefit.

In order to solve the technical problems, the technical scheme provided by the utility model is as follows:

a U-phase pin of the SDIP23 module is led out from a first chip, a V-phase pin is led out from a second chip, and a W-phase pin is led out from a third chip.

According to the SDIP23 module, three phases are concentrated in the first, the second and the third chips, so that the mutual distance is reduced, and the interfaces of an M (three-phase motor) are exactly U, V and W three phases, so that the three-phase motor provided by the module is arranged in U, V and W phases with smaller span, the complexity of a peripheral circuit is greatly reduced, the practical use and installation are facilitated, the reduction of the complexity of the intersection layout is also facilitated, the reduction of the area of a circuit board is also facilitated, the application circuit bears more functions, the use cost is greatly reduced, and good economic benefit is obtained.

Further improvements to the above described solution are possible as follows.

According to the SDIP23 module of the present utility model, in a preferred embodiment, the output NU pin, the UV pin, and the NW pin of the SDIP23 module are all led out from the same driving IC.

Furthermore, the output ends (NU, UV and NW) of the SDIP23 module are all formed by the same driving IC, so that a resistor with the same specification can be adopted, the number of peripheral pull-down resistors is obviously reduced, and the use cost and the influence of mutual signal interference among devices are reduced.

Further, in a preferred embodiment, when the MCU of the SDIP23 module drives VCC and VB for power, the U-phase pin, V-phase pin, and W-phase pin are concentrated above.

Specifically, when the left MCU drives VCC and VB to supply power, as VBU, VBV and VBW are concentrated above and distribution of three ICs is not adopted, winding and crossing of wiring are reduced, and interference among the wirings is reduced, so that the wirings are relatively simple and orderly in overall view.

Specifically, in a preferred embodiment, the SDIP23 module of the present utility model includes a plastic package body and pins connected to the plastic package body, where the pins are symmetrically arranged on two sides of the plastic package body in double rows.

Specifically, the double-row pins further reduce the occupied area of the module, so that the module is small in appearance, small in occupied space and beneficial to installation.

Further, in a preferred embodiment, the heat sink is disposed within the plastic package.

By arranging the radiating fins in the plastic package body, the volume of the module is further reduced, and the appearance aesthetic property is improved.

Further, in a preferred embodiment, the two sides of the upper top surface of the plastic package body corresponding to the pins are provided with step structures.

Through design two rows of steps in the module front, turn into the broken line with the straight line, increased the creepage safe distance between both sides pin and the radiator, reduced the module and used the risk, both satisfied the functional requirement and promoted the product and distinguished the degree.

Further, in a preferred embodiment, the step structure of the upper top surface of the plastic package body is symmetrically arranged.

Furthermore, two alignment steps are designed beside the pins, so that the attractiveness of the whole module can be ensured.

Further, in a preferred embodiment, the two sides of the upper bottom surface of the plastic package body corresponding to the pins are provided with step structures.

Two alignment steps are further designed beside the pins, and the distance between the alignment steps and the pins is prolonged, so that the creepage distance is further increased.

Further, in a preferred embodiment, mounting through holes are provided at both ends of the plastic package body.

Through setting up the installation through-hole, be convenient for plastic envelope body both ends and the radiator between fixed mounting and dismantlement.

Further, in a preferred embodiment, the mounting through hole is semicircular.

Through setting up semi-circular screw through-hole for the installation and the dismantlement of module are more convenient, and can avoid influencing the structural strength of the plastic envelope body of whole module.

Compared with the prior art, the utility model has the advantages that: the three phases are concentrated in the first, second and third chips, so that the mutual distance is truly reduced, and the interfaces of the M (three-phase motor) are exactly U, V and W three phases, so that the three-phase motor wiring equipped with the module has smaller spans of U, V and W phases, the complexity of a peripheral circuit is greatly reduced, the practical use and installation are more facilitated, the complexity reduction of the intersection layout is also favorable for the reduction of the area of a circuit board, the application circuit bears more functions, the use cost is greatly reduced finally, and good economic benefit is obtained.

Drawings

The utility model will be described in more detail hereinafter on the basis of embodiments and with reference to the accompanying drawings. Wherein:

FIG. 1 schematically illustrates application routing of a prior art module;

FIG. 2 schematically shows an identification description in an application wiring of a module in the prior art;

FIG. 3 schematically illustrates application wiring of a SDIP23 module of an embodiment of the utility model;

FIG. 4 schematically shows an identification description in the application wiring of the SDIP23 module of the embodiment of the utility model;

FIG. 5 schematically shows a front view of a SDIP23 module according to an embodiment of the utility model;

FIG. 6 schematically shows the overall structure of the SDIP23 module of the embodiment of the utility model in the first direction;

fig. 7 schematically shows the overall structure of the SDIP23 module of the embodiment of the utility model in the second direction.

In the drawings, like parts are designated with like reference numerals. The figures are not drawn to scale.

Detailed Description

The utility model will now be described in further detail with reference to the drawings and the specific examples, which are not intended to limit the scope of the utility model.

Fig. 1 schematically shows the application wiring of a module of the prior art. Fig. 2 schematically shows an identification description in the application wiring of a module in the prior art. Fig. 3 schematically shows the application wiring of the SDIP23 module of the embodiment of the utility model. Fig. 4 schematically shows an identification description in the application wiring of the SDIP23 module of the embodiment of the utility model. Fig. 5 schematically shows a front view structure of the SDIP23 module of the embodiment of the utility model. Fig. 6 schematically shows the overall structure of the SDIP23 module of the embodiment of the utility model in the first direction. Fig. 7 schematically shows the overall structure of the SDIP23 module of the embodiment of the utility model in the second direction.

As shown in fig. 1 and 2, in the SDIP23 module 10 of the embodiment of the present utility model, the U-phase pin of the SDIP23 module 10 is led out from the first chip, the V-phase pin is led out from the second chip, and the W-phase pin is led out from the third chip.

According to the SDIP23 module provided by the embodiment of the utility model, three phases are concentrated in the first, second and third chips, so that the mutual distance is reduced, and the interfaces of the M (three-phase motor) are exactly U, V and W three phases, so that the three-phase motor wiring provided by the module has smaller spans of U, V and W phases, the complexity of a peripheral circuit is greatly reduced, the practical use and installation are facilitated, the reduction of the complexity of the intersection layout is also facilitated, the reduction of the area of a circuit board is also facilitated, the application circuit bears more functions, the use cost is greatly reduced, and good economic benefit is obtained.

As shown in fig. 1 and 2, further, in the present embodiment, the output terminal NU pin, the UV pin, and the NW pin of the SDIP23 module 10 are all led out from the same driving IC. Specifically, the output ends (NU, UV and NW) of the SDIP23 module are all formed by the same driving IC, so that a resistor with the same specification can be adopted, the number of peripheral pull-down resistors is obviously reduced, and the use cost and the influence of mutual signal interference among devices are reduced. Further, in the present embodiment, when the MCU of the SDIP23 module 10 drives VCC and VB for power supply, the U-phase pin, the V-phase pin, and the W-phase pin are concentrated above. Specifically, when the left MCU drives VCC and VB to supply power, as VBU, VBV and VBW are concentrated above and distribution of three ICs is not adopted, winding and crossing of wiring are reduced, and interference among the wirings is reduced, so that the wirings are relatively simple and orderly in overall view.

As shown in fig. 5 to 7, specifically, the SDIP23 module 10 of the present embodiment includes a plastic package body 1 and pins 2 connected to the plastic package body 1, the pins 2 being symmetrically arranged in double rows on both sides of the plastic package body 1. Specifically, the double-row pins further reduce the occupied area of the module, so that the module is small in appearance, small in occupied space and beneficial to installation. Further, in the present embodiment, the heat sink is disposed in the plastic package. By arranging the radiating fins in the plastic package body, the volume of the module is further reduced, and the appearance aesthetic property is improved.

As shown in fig. 5 to 7, further, in this embodiment, step structures 11 are disposed on both sides of the upper top surface of the plastic package body 1 corresponding to the leads 2. Through design two rows of steps in the module front, turn into the broken line with the straight line, increased the creepage safe distance between both sides pin and the radiator, reduced the module and used the risk, both satisfied the functional requirement and promoted the product and distinguished the degree. Further, in the present embodiment, the step structures 11 on the upper top surface of the plastic package 1 are symmetrically arranged. Furthermore, two alignment steps are designed beside the pins, so that the attractiveness of the whole module can be ensured.

As shown in fig. 5 to 7, further, in this embodiment, both sides of the upper bottom surface of the plastic package body 1 corresponding to the leads 2 are provided with step structures. Two alignment steps are further designed beside the pins, and the distance between the alignment steps and the pins is prolonged, so that the creepage distance is further increased.

As shown in fig. 5 to 7, further, in the present embodiment, both ends of the plastic package 1 are provided with mounting through holes 12. Through setting up the installation through-hole, be convenient for plastic envelope body both ends and the radiator between fixed mounting and dismantlement. Further, in the present embodiment, the mounting through hole 12 is semicircular. Through setting up semi-circular screw through-hole for the installation and the dismantlement of module are more convenient, and can avoid influencing the structural strength of the plastic envelope body of whole module.

According to the above embodiment, it can be seen that the SDIP23 module according to the present utility model, three phases are concentrated in the first, second and third chips, so that the distance between the three phases is reduced, and the interfaces of the M (three-phase motor) are exactly U, V and W three phases, so that the three-phase motor provided by the module is arranged with a smaller span between U, V and W phases, thereby greatly reducing the complexity of the peripheral circuit, being more beneficial to the practical use and installation, reducing the complexity of the intersection layout, being also beneficial to the reduction of the area of the circuit board, allowing the application circuit to bear more functions, and finally greatly reducing the use cost, and obtaining good economic benefits.

While the utility model has been described with reference to a preferred embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the utility model. In particular, the technical features mentioned in the respective embodiments may be combined in any manner as long as there is no structural conflict. The present utility model is not limited to the specific embodiments disclosed herein, but encompasses all technical solutions falling within the scope of the claims.

Claims (9)

1. The U-phase pin of the SDIP23 module is led out from a first chip, the V-phase pin is led out from a second chip and the W-phase pin is led out from a third chip, and an output end NU pin, an UV pin and an NW pin of the SDIP23 module are led out from the same driving IC.

2. The SDIP23 module of claim 1 wherein the MCU of the SDIP23 module is configured to focus the U-phase pin, the V-phase pin, and the W-phase pin above when driving VCC and VB for power.

3. The SDIP23 module of claim 1, comprising a plastic package and pins coupled to the plastic package; the pins are symmetrically arranged on two sides of the plastic package body in double rows.

4. The SDIP23 module of claim 3 wherein a heat sink is disposed within the plastic enclosure.

5. The SDIP23 module of claim 3 wherein both sides of the upper top surface of the plastic package body that correspond to the pins are provided with a step structure.

6. The SDIP23 module of claim 5 wherein the step structure of the top surface on the molded body is symmetrically disposed.

7. The SDIP23 module of claim 3 wherein both sides of the bottom surface of the plastic package body that correspond to the pins are provided with a step structure.

8. The SDIP23 module of claim 3 wherein mounting through holes are provided at both ends of the molding compound.

9. The SDIP23 module of claim 8 wherein the mounting throughbore is semi-circular.