CN220367933U

CN220367933U - CSP packaging structure and LED lamp

Info

Publication number: CN220367933U
Application number: CN202322052074.7U
Authority: CN
Inventors: 姜攀; 卢鹏; 王金鑫; 胡华东
Original assignee: Jiangxi Zhaochi Photoelectric Co ltd
Current assignee: Jiangxi Zhaochi Photoelectric Co ltd
Priority date: 2023-08-01
Filing date: 2023-08-01
Publication date: 2024-01-19
Anticipated expiration: 2033-08-01

Abstract

The utility model provides a CSP packaging structure and an LED lamp, wherein the CSP packaging structure comprises an LED chip, two bonding pad areas are uniformly separated on the LED chip through an insulating groove, connecting bonding pads are arranged in the two bonding pad areas, the CSP packaging structure further comprises a filling layer and an auxiliary electrode layer which are arranged in the bonding pad areas, the filling layer is formed by expanding along the periphery of the connecting bonding pads, the auxiliary electrode layer covers the filling layer, and the auxiliary electrode layers on the two bonding pad areas are respectively electrically connected with the anode and the cathode of the LED chip. Through this application, can enlarge the electrode connection region of LED chip, realize the purpose of enlarging the pad size, and then can effectively reduce because the pad size is little to the harmful effects when light splitting test and SMT some tin paster.

Description

CSP packaging structure and LED lamp

Technical Field

The utility model relates to the technical field of LED packaging, in particular to a CSP packaging structure and an LED lamp.

Background

Along with the development of technology, the application field of LED devices is wider and wider, and the CSP packaging technology has the advantages of bracket removal, quick heat conduction, low thermal resistance and the like, is mature in module application and has obvious cost reduction effect. CSP integration application is also fully spread on Mini products, and has higher requirements on chip size and packaging technology.

In the prior art, the conventional technology of CSP is that chips are cut into single LED light sources after chip arrangement and die pressing, and after SMT, solder reflow is performed, so that CSP electrodes are attached to a PCB, and the module effect of the whole machine is achieved. However, for small chip CSP products, because the chip bonding pad is small, the spectroscopic probe must contact the electrode during spectroscopic test to light the product, and when the spectroscopic probe test point has deviation, the test failure can be caused; in addition, because the size of the bonding pad is small, when the SMT is used for soldering the patch, the soldering position deviation can cause soldering difficulty, and the phenomenon of shifting and skewing of CSP lamp beads can be caused after reflow.

Disclosure of Invention

Based on the above, the utility model aims to provide a CSP packaging structure and an LED lamp so as to solve the defects in the prior art.

In order to achieve the above object, the present utility model provides a CSP package structure, which includes an LED chip, wherein two pad areas are uniformly separated from the LED chip by an insulation groove, connection pads are disposed in both of the two pad areas, the CSP package structure further includes a filling layer and an auxiliary electrode layer disposed in the pad areas, the filling layer is formed by expanding along the periphery of the connection pads, the auxiliary electrode layer covers the filling layer, and the auxiliary electrode layers on the two pad areas are respectively electrically connected with the positive electrode and the negative electrode of the LED chip.

The beneficial effects of the utility model are as follows: the LED chip is evenly divided into two pad areas through the insulating groove, the connecting pad, the filling layer and the auxiliary electrode layer are arranged in each pad area, the filling layer is formed by expanding the periphery of the connecting pad, the auxiliary electrode layer covers the filling layer, the auxiliary electrode layer in the two pad areas is respectively electrically connected with the anode and the cathode of the LED chip, and the LED chip is different from the prior art, the electrode connecting area of the LED chip is enlarged, the purpose of enlarging the size of the pad is achieved, and adverse effects on light splitting test and SMT (surface mount technology) spot tin paster due to small size of the pad can be effectively reduced.

Preferably, the filling layer is formed by coating fluorescent glue on the side wall of the LED chip.

Preferably, the auxiliary electrode layer has a thickness of 2 μm to 3 μm.

Preferably, the sum of the thicknesses of the auxiliary electrode layer and the filling layer is smaller than the thickness of the connection pad.

Preferably, the auxiliary electrode layer is made of a high-reflectivity metal.

Preferably, the connection pads in the two pad areas are symmetrically arranged with the insulation grooves as symmetry axes.

Preferably, the insulating layers are filled on two opposite sides of the insulating groove, and the surfaces of the insulating layers are flush with the opening of the insulating groove.

Preferably, the filling layer extends to form an extension portion at one side close to the insulation groove, and the extension portion covers the insulation layer.

In order to achieve the above purpose, the utility model also provides an LED lamp, which is characterized by comprising the CSP packaging structure.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

Drawings

Fig. 1 is a schematic structural diagram of a CSP package structure according to a first embodiment of the present utility model;

fig. 2 is a top view of a CSP package structure according to a first embodiment of the present utility model.

Description of main reference numerals:

LED chip	10	Filling layer	20
				Insulation groove	11	Extension part	21
Connection pad	12	Auxiliary electrode layer	30
				Insulating layer	13

The utility model will be further described in the following detailed description in conjunction with the above-described figures.

Detailed Description

In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. Several embodiments of the utility model are presented in the figures. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "mounted" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1 to 2, a CSP package structure in a first embodiment of the present utility model includes an LED chip 10, a filling layer 20 and an auxiliary electrode layer 30.

Wherein: the two equal-area pad areas are uniformly separated by the insulation groove 11 on the LED chip 10, the two pad areas are provided with the connection pads 12, and it can be understood that the connection pads 12 in the two pad areas are symmetrically arranged by taking the insulation groove 11 as a symmetry axis, each pad area is internally matched with the filling layer 20 and the auxiliary electrode layer 30, specifically, in each pad area, the filling layer 20 is formed by expanding along the periphery of the connection pad 12, the auxiliary electrode layer 30 covers the whole surface of the filling layer 20, so that the superposition of the auxiliary electrode layer 30 and the filling layer 20 is realized, the auxiliary electrode layer 30 is electrically connected with the anode or the cathode of the LED chip 10, the electrode connection area of the LED chip 10 is enlarged, the purpose of enlarging the pad size is further achieved, the adverse effect on the light splitting test and the SMT spot tin patch is solved, namely, after the auxiliary electrode layer 30 is increased, the pad area is increased, the probe contact property is better during light splitting, the electrical test is more accurate, the fault tolerance rate during the patch is lower, the patch stability is improved, and the risk of secondary reflux is also reduced.

The connection pad 12 has a rectangular parallelepiped structure, one side of the connection pad 12 is abutted against one side of the insulating trench 11, and the auxiliary electrode layer 30 has a frame structure.

In the present embodiment, the filling layer 20 is formed by coating the side wall of the LED chip 10 with fluorescent glue, that is, the material of the filling layer 20 is fluorescent glue, and it should be noted that the side walls of the LED chip 10 except for the bottom surface of the LED chip 10 are coated with fluorescent glue.

In this embodiment, the sum of the thicknesses of the auxiliary electrode layer 30 and the filling layer 20 is smaller than the thickness of the connection pad 12, and the upper surface of the auxiliary electrode layer 30 is lower than the upper surface of the connection pad 12, so as to ensure that the connection pad 12 is not concave, thereby avoiding the situation that the bottom plane of the LED chip 10 is inclined and the usage amount is different when the bottom plane of the LED chip is different in height. The auxiliary electrode layer 30 is made of a metal with high reflectivity, specifically, the material of the auxiliary electrode is Ag, the thickness of the auxiliary electrode layer 30 is 2 μm-3 μm, and the optimal thickness of the auxiliary electrode layer 30 is 2.5 μm.

In this embodiment, the insulating layer 13 is filled on two opposite sides of the insulating trench 11, the surface of the insulating layer 13 is flush with the opening of the insulating trench 11, the filling layer 20 extends to form an extension portion 21 near one side of the insulating trench 11, and the extension portion 21 covers the insulating layer 13, it can be understood that the extension portion 21 and the filling layer 20 are integrally formed, and the material of the extension portion 21 is consistent with the material of the filling layer 20, both of which are fluorescent glue, and it is noted that the material of the insulating layer 13 is rubber.

In one of the specific implementation processes, the chip is arranged and molded according to the conventional production process of the CSP, the whole CSP is connected together through fluorescent glue, and the connection pads 12 on the LED chip 10 are faced upwards through the film pouring process; after the connection pad 12 is faced upward, a high-reflectivity metal is vapor-deposited on the pad area of the LED chip 10 by a chip vapor deposition process, the LED chip 10 is divided into two pad areas with the insulating groove 11 as a dividing line, the high-reflectivity metal covers the whole pad area except the connection pad 12, wherein the vapor deposition process adds an auxiliary electrode layer 30 with the thickness of 2-3 μm around the connection pad 12, and the appearance looks consistent with the color of the connection pad 12.

In a specific implementation, the two pad areas are uniformly separated by the insulation groove 11, the connection pad 12, the filling layer 20 and the auxiliary electrode layer 30 are arranged in each pad area, the filling layer 20 is formed by expanding along the periphery of the connection pad 12, the auxiliary electrode layer 30 covers the filling layer 20, the auxiliary electrode layer 30 in the two pad areas is respectively electrically connected with the anode and the cathode of the LED chip 10, and the LED chip is different from the prior art, the electrode connection area of the LED chip 10 is enlarged, the purpose of enlarging the size of the pad is realized, and adverse effects on spectroscopic test and SMT spot tin pasting due to small size of the pad can be effectively reduced.

It should be noted that the foregoing implementation procedure is only for illustrating the feasibility of the present application, but this does not represent the only implementation procedure described above for the CSP package structure of the present application, and may be incorporated into the feasible embodiment of the present application as long as the CSP package structure of the present application can be implemented.

The LED lamp in the second embodiment of the utility model comprises the CSP packaging structure in the first embodiment.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The foregoing examples illustrate only a few embodiments of the utility model and are described in detail herein without thereby limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims

1. The utility model provides a CSP packaging structure, includes the LED chip, evenly separate two pad areas through the insulating tank on the LED chip, two all be equipped with the connection pad in the pad area, its characterized in that, CSP packaging structure still includes locates filling layer and auxiliary electrode layer in the pad area, the filling layer is followed the extension forms around the connection pad, auxiliary electrode layer covers the filling layer, and two auxiliary electrode layer on the pad area respectively with the positive pole and the negative pole electric connection of LED chip.

2. The CSP packaging structure according to claim 1, wherein the filler layer is formed by applying a fluorescent paste to a side wall of the LED chip.

3. The CSP packaging according to claim 1, wherein the auxiliary electrode layer has a thickness of 2 μm to 3 μm.

4. The CSP packaging structure according to claim 1, wherein a sum of thicknesses of the auxiliary electrode layer and the filler layer is smaller than a thickness of the connection pad.

5. The CSP packaging according to claim 1, wherein the auxiliary electrode layer is made of a high-reflectivity metal.

6. The CSP packaging according to claim 1, wherein the connection pads in the two pad areas are symmetrically arranged with the insulating groove as a symmetry axis.

7. The CSP packaging according to claim 1, wherein opposite sides of the insulating trench are filled with an insulating layer, a surface of the insulating layer being flush with an opening of the insulating trench.

8. The CSP packaging of claim 7 wherein the filler layer extends to form an extension on a side of the insulating trench that covers the insulating layer.

9. An LED lamp comprising the CSP packaging of any one of claims 1-8.