CN220358056U

CN220358056U - Stacked semiconductor packaging device

Info

Publication number: CN220358056U
Application number: CN202321983174.5U
Authority: CN
Inventors: 殷泽安; 刘远良
Original assignee: Dongguan Yima Semiconductor Co ltd
Current assignee: Dongguan Yima Semiconductor Co ltd
Priority date: 2023-07-26
Filing date: 2023-07-26
Publication date: 2024-01-16
Anticipated expiration: 2033-07-26

Abstract

The utility model discloses a stacked semiconductor packaging device which comprises a main body, wherein a first cavity is formed in the inner bottom wall of the main body, a first screw rod is rotatably connected to the inner wall of the first cavity, a first sliding groove is formed in the inner wall of the main body, a lower base is slidably connected to the inner wall of the first sliding groove, and the lower base is in threaded connection with the first screw rod. This range upon range of semiconductor packaging device, through the setting of first cavity, first screw rod, first spout, lower base and second cavity, thereby can carry out screw thread motion with lower base when first screw rod rotates and drive lower base and carry out front and back position adjustment in first spout, thereby carry out screw thread motion with upper base when the second screw rod rotates and drive the position adjustment about the upper base, can drive the position adjustment of base plate frame when adjusting lower base and upper base position for can make the center of base plate frame can aim at the wafer that needs to install, guarantee the position accuracy of wafer installation.

Description

Stacked semiconductor packaging device

Technical Field

The present utility model relates to the field of semiconductor manufacturing technology, and in particular, to a stacked semiconductor package device.

Background

The semiconductor is a material with conductivity between a conductor and an insulator at normal temperature, the semiconductor is a material with controllable conductivity ranging from the insulator to the conductor, and the patent number is CN209492854U, which is an acrylic box packaged by the semiconductor.

Through searching, chinese patent publication (bulletin) No. CN219237823U discloses a semiconductor packaging device, this patent passes through the setting of sealing mechanism and fixture for the apron can closely laminate with the side of box body inner wall, so guarantee the holistic sealing performance of device, and can resist the device and influence its inside semiconductor when receiving the striking, although this patent can improve the device leakproofness and resist the striking and damage semiconductor, but in the encapsulation of semiconductor at present, the wafer after cutting can paste on the base plate frame through specific glue, and in the pasting process, need in time adjust the base plate frame position so that the wafer can be installed at the base plate frame center, and still need to fix a position the wafer in the installation process, make the wafer paste the back accord with the shape requirement, therefore it is very necessary to design a stacked semiconductor packaging device.

Disclosure of Invention

The utility model mainly aims to provide a stacked semiconductor packaging device which can effectively solve the problems in the background technology.

In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:

the utility model provides a range upon range of semiconductor packaging device, includes the main part, first cavity has been seted up to the interior bottom wall of main part, the inner wall of first cavity rotates and is connected with first screw rod, the inner wall of main part has been seted up first spout, the inner wall sliding connection of first spout has lower base, lower base is threaded connection with first screw rod, the second cavity has been seted up to the inner wall of lower base; the inner wall rotation of second cavity is connected with the second screw rod, the upper surface sliding connection of lower base has last base, it is threaded connection to go up base and second screw rod, the upper surface of going up the base is provided with the base plate frame.

In order to facilitate the rotation of the first screw, as a stacked semiconductor packaging device of the present utility model, the first screw penetrates through the inner wall of the first cavity and extends to the outer surface of the main body, and one end of the first screw is fixedly connected with a turntable.

In order to facilitate the rotation of the second screw rod, as the stacked semiconductor packaging device, the second screw rod penetrates through the inner wall of the second cavity and extends to one side of the lower base, and one end of the second screw rod is fixedly connected with a knob.

In order to make the stacked semiconductor packaging device have a supporting function, as the stacked semiconductor packaging device, a hydraulic rod is fixedly connected to the inner surface of the main body, and a supporting frame is fixedly connected to the upper surface of the hydraulic rod.

In order to position the wafer, as the stacked semiconductor packaging device provided by the utility model, the upper surface of the supporting frame is rotatably connected with the swivel, the inner wall of the swivel is slidably connected with the sliding column, one side of the outer surface of the sliding column is slidably connected with the inner ring, and one end of the sliding column is fixedly connected with the positioning plate.

In order to enable the sliding column to rebound, as the stacked semiconductor packaging device, a limiting plate is fixedly connected to the outer surface of the sliding column, a spring is fixedly connected to one side of the limiting plate, and the spring is fixedly connected with the inner ring.

In order to enable the positioned wafer to be pressed down, as the stacked semiconductor packaging device, a hydraulic cylinder is arranged on the upper surface of the main body, a piston rod is arranged on the inner top wall of the main body, the output end of the hydraulic cylinder is fixedly connected with the piston rod, and a pressing block is fixedly connected to the bottom end of the piston rod.

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the utility model, through the arrangement of the first cavity, the first screw rod, the first sliding chute, the lower base and the second cavity, the first screw rod can perform threaded movement with the lower base when rotating so as to drive the lower base to perform front-back position adjustment in the first sliding chute, the second screw rod can perform threaded movement with the upper base when rotating so as to drive the left-right position adjustment of the upper base, and the position adjustment of the substrate frame can be driven when adjusting the positions of the lower base and the upper base, so that the center of the substrate frame can be aligned with a wafer to be installed, and the accuracy of the mounting position of the wafer is ensured.

2. According to the utility model, through the arrangement of the hydraulic rod, the support frame, the swivel, the sliding column, the inner ring, the limiting plate and the spring, after the swivel is rotated, the inner wall of the swivel is in sliding connection with one end of the sliding column so as to push the sliding column to slide with the inner ring, at the moment, the sliding column stretches, the positioning plate is used for clamping and positioning the wafer, so that the square wafer is fixed in shape during installation, the hydraulic cylinder operates to drive the piston rod to move with the pressing block, the pressing block can press the wafer onto the substrate frame, the sliding column can be reset under the action of the spring during the reverse rotation of the swivel, the positioning plate is separated from the clamping and positioning of the wafer, the clamping and positioning of the wafer by the positioning plate are utilized to ensure that the wafer can be fixed in shape during installation, and the friction force between the sliding column and the swivel is greater than the elastic force of the spring during the movement of the sliding column and the swivel.

Drawings

FIG. 1 is a schematic elevational view of the present utility model;

FIG. 2 is a schematic view of the upper base structure of the present utility model;

FIG. 3 is a schematic view of a positioning plate structure according to the present utility model;

FIG. 4 is a schematic diagram of a briquette structure according to the present utility model;

fig. 5 is a schematic view of the spring structure of the present utility model.

In the figure: 1. a main body; 2. a first cavity; 3. a first screw; 4. a first chute; 5. a lower base; 6. a second cavity; 7. a second screw; 8. an upper base; 9. a substrate frame; 10. a turntable; 11. a knob; 12. a hydraulic rod; 13. a support frame; 14. a swivel; 15. a spool; 16. an inner ring; 17. a positioning plate; 18. a limiting plate; 19. a spring; 20. a hydraulic cylinder; 21. a piston rod; 22. and (5) briquetting.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

As shown in fig. 1-5, a stacked semiconductor packaging device comprises a main body 1, wherein a first cavity 2 is formed in the inner bottom wall of the main body 1, a first screw rod 3 is rotatably connected to the inner wall of the first cavity 2, a first sliding groove 4 is formed in the inner wall of the main body 1, a lower base 5 is slidably connected to the inner wall of the first sliding groove 4, the lower base 5 is in threaded connection with the first screw rod 3, and a second cavity 6 is formed in the inner wall of the lower base 5;

in this embodiment, the inner wall of the second cavity 6 is rotatably connected with a second screw rod 7, the upper surface of the lower base 5 is slidably connected with an upper base 8, the upper base 8 is in threaded connection with the second screw rod 7, and the upper surface of the upper base 8 is provided with a substrate frame 9.

When the device is specifically used, the first screw 3 can perform screw thread movement with the lower base 5 when rotating so as to drive the lower base 5 to perform front-back position adjustment in the first chute 4, the second screw 7 performs screw thread movement with the upper base 8 when rotating so as to drive left-right position adjustment of the upper base 8, and the position adjustment of the substrate frame 9 can be driven when adjusting the positions of the lower base 5 and the upper base 8, so that the center of the substrate frame 9 can be aligned with a wafer needing to be installed, and the position accuracy of the wafer installation is ensured.

In this embodiment, the first screw 3 penetrates through the inner wall of the first cavity 2 and extends to the outer surface of the main body 1, and one end of the first screw 3 is fixedly connected with the turntable 10.

When the rotary table 10 is rotated, the first screw 3 can be driven to rotate in the first cavity 2.

In this embodiment, the second screw 7 penetrates through the inner wall of the second cavity 6 and extends to one side of the lower base 5, and one end of the second screw 7 is fixedly connected with a knob 11.

When the rotary knob 11 is turned, the second screw rod 7 can be driven to rotate on the inner wall of the second cavity 6.

In this embodiment, the inner surface of the main body 1 is fixedly connected with a hydraulic rod 12, and the upper surface of the hydraulic rod 12 is fixedly connected with a supporting frame 13.

In particular use, the hydraulic rod 12 can drive the height position of the support frame 13 to be adjusted during operation.

In this embodiment, the upper surface of the supporting frame 13 is rotatably connected with a swivel 14, the inner wall of the swivel 14 is slidably connected with a sliding column 15, one side of the outer surface of the sliding column 15 is slidably connected with an inner ring 16, and one end of the sliding column 15 is fixedly connected with a positioning plate 17.

When the wafer clamping device is specifically used, when the swivel 14 is rotated, the swivel 14 and the slide column 15 perform sliding movement, so that the slide column 15 and the inner ring 16 perform sliding movement, and the slide column 15 extends out and clamps and positions the wafer by using the positioning plate 17.

In this embodiment, the outer surface of the sliding column 15 is fixedly connected with a limiting plate 18, one side of the limiting plate 18 is fixedly connected with a spring 19, and the spring 19 is fixedly connected with the inner ring 16.

In particular use, when the spool 15 is extended, the spring 19 is in a compressed state, and when the spool 15 is reset, the spring 19 follows the reset.

In this embodiment, a hydraulic cylinder 20 is disposed on the upper surface of the main body 1, a piston rod 21 is disposed on the inner top wall of the main body 1, an output end of the hydraulic cylinder 20 is fixedly connected with the piston rod 21, and a pressing block 22 is fixedly connected with the bottom end of the piston rod 21.

When the device is particularly used, after the hydraulic cylinder 20 operates, the output end of the hydraulic cylinder can drive the piston rod 21 to operate and the pressing block 22 to press the clamped and positioned wafer down onto the substrate frame 9.

Working principle: in use, the first screw 3 can be in threaded movement with the lower base 5 to drive the lower base 5 to perform front-rear position adjustment in the first chute 4, the second screw 7 is in threaded movement with the upper base 8 to drive the left-right position adjustment of the upper base 8, the position adjustment of the substrate frame 9 can be driven when the positions of the lower base 5 and the upper base 8 are adjusted, the center of the substrate frame 9 can be aligned with a wafer to be installed, the accurate installation position of the wafer is ensured, specific glue is smeared at the center position of the substrate frame 9, the inner wall of the rotary ring 14 is in sliding connection with one end of the slide column 15 through the movement adjustment support frame 13 of the hydraulic rod 12 to perform sliding movement to push the slide column 15 and the inner ring 16, the slide column 15 is stretched at the moment, the positioning plate 17 is used for positioning the wafer, the square wafer is fixed in a mounting way, the hydraulic cylinder 20 is operated to drive the piston rod 21 and the press block 22 to enable the wafer to be pressed down onto the substrate frame 9, the rotary ring 14 can be separated from the slide column 15 through the action of the rotary ring 19 when the rotary ring 14 is reversely, the positioning plate 17 can be separated from the slide column 15 by the positioning plate 15, and the positioning plate 17 can be fixed by the positioning plate 17, and the positioning plate can be positioned by the positioning plate 15.

The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. A stacked semiconductor package apparatus comprising a main body (1), characterized in that: the novel plastic bottle is characterized in that a first cavity (2) is formed in the inner bottom wall of the main body (1), a first screw rod (3) is rotatably connected to the inner wall of the first cavity (2), a first sliding groove (4) is formed in the inner wall of the main body (1), a lower base (5) is slidably connected to the inner wall of the first sliding groove (4), the lower base (5) is in threaded connection with the first screw rod (3), and a second cavity (6) is formed in the inner wall of the lower base (5);

the inner wall rotation of second cavity (6) is connected with second screw rod (7), the upper surface sliding connection of lower base (5) has last base (8), it is threaded connection with second screw rod (7) to go up base (8), the upper surface of going up base (8) is provided with base plate frame (9).

2. The stacked semiconductor package apparatus of claim 1, wherein: the first screw rod (3) penetrates through the inner wall of the first cavity (2) and extends to the outer surface of the main body (1), and one end of the first screw rod (3) is fixedly connected with a rotary disc (10).

3. The stacked semiconductor package apparatus of claim 1, wherein: the second screw rod (7) penetrates through the inner wall of the second cavity (6) and extends to one side of the lower base (5), and one end of the second screw rod (7) is fixedly connected with a knob (11).

4. The stacked semiconductor package apparatus of claim 1, wherein: the inner surface of the main body (1) is fixedly connected with a hydraulic rod (12), and the upper surface of the hydraulic rod (12) is fixedly connected with a supporting frame (13).

5. The stacked semiconductor package apparatus of claim 4, wherein: the upper surface of support frame (13) rotates and is connected with swivel (14), the inner wall sliding connection of swivel (14) has traveller (15), the surface one side sliding connection of traveller (15) has inner ring (16), the one end fixedly connected with locating plate (17) of traveller (15).

6. The stacked semiconductor package apparatus of claim 5, wherein: the outer surface of the sliding column (15) is fixedly connected with a limiting plate (18), one side of the limiting plate (18) is fixedly connected with a spring (19), and the spring (19) is fixedly connected with the inner ring (16).

7. The stacked semiconductor package apparatus of claim 1, wherein: the hydraulic cylinder (20) is arranged on the upper surface of the main body (1), a piston rod (21) is arranged on the inner top wall of the main body (1), the output end of the hydraulic cylinder (20) is fixedly connected with the piston rod (21), and a pressing block (22) is fixedly connected with the bottom end of the piston rod (21).