CN220340013U - Semiconductor material detection device - Google Patents
Semiconductor material detection device Download PDFInfo
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- CN220340013U CN220340013U CN202321086272.9U CN202321086272U CN220340013U CN 220340013 U CN220340013 U CN 220340013U CN 202321086272 U CN202321086272 U CN 202321086272U CN 220340013 U CN220340013 U CN 220340013U
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- 238000001514 detection method Methods 0.000 title claims abstract description 58
- 239000000463 material Substances 0.000 title claims abstract description 44
- 239000004065 semiconductor Substances 0.000 title claims abstract description 43
- 238000012360 testing method Methods 0.000 claims description 9
- 238000007689 inspection Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 239000000523 sample Substances 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 6
- 230000008569 process Effects 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000007306 turnover Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model relates to a semiconductor material detection device, which aims to solve the technical problems that the current detection device cannot achieve an accurate detection effect according to use requirements and cannot ensure the stability of overturning on the detection device, and comprises a first support plate, wherein a first placement groove is formed in the upper end surface of the first support plate, first support columns are arranged at the four corners of the top of a support base, second support plates are arranged at the upper ends of the first support columns, second placement grooves are formed in the upper end surface of the second support plates, second support columns are arranged at the four corners of the top of the second support plates, and third support plates are arranged at the upper ends of the second support columns.
Description
Technical Field
The utility model relates to a detection device, in particular to a semiconductor material detection device.
Background
With the progress of technology, semiconductors are widely applied in daily life, and because the semiconductor sheet material has high surface requirements, after the semiconductor is produced and processed, the three-dimensional detection and the secondary detection are needed to be carried out on the semiconductor by combining a detection device, and the subsequent treatment is carried out in time, so that the performance and the efficiency of the semiconductor sheet material are improved, and technical support is provided for process improvement.
Currently, the patent 202020802724.9 discloses an internal defect detection device for semiconductor materials. The semiconductor material internal defect detection device comprises an infrared microscope body; the shading box is arranged outside the infrared microscope body, and the top of the shading box is an opening; the sliding port is formed in the inner wall of one side of the light shielding box; the placing plate is arranged in the sliding port, one side of the placing plate extends out of the shading box, and the other end of the placing plate extends into the shading box; the printing opacity lens, printing opacity lens is inlayed place on the board, but this detection device is when using, can't play accurate detection effect according to the use needs, because semiconductor material's structure is complicated, need overturn it in the testing process, especially to some large-scale semiconductor material, can't guarantee its stability of overturning on detection device, current upset mode is mostly by artifical turn-over, press from both sides again, easy incident to appear to the high efficiency that detection device used has been reduced.
Therefore, the problem that the detection device cannot achieve an accurate detection effect according to the use requirement and cannot ensure the stability of the turnover of the detection device is needed to be solved, so as to improve the use scene of the detection device.
Disclosure of Invention
The utility model aims to overcome the defects of the prior art, adapt to the actual needs, and provide a semiconductor material detection device so as to solve the technical problems that the current detection device cannot achieve an accurate detection effect according to the use needs and cannot ensure the overturning stability of the current detection device on the detection device.
In order to achieve the purpose of the utility model, the technical scheme adopted by the utility model is as follows:
the utility model provides a semiconductor material detection device, includes first backup pad, first recess of placing has been seted up to the up end of first backup pad, first support column is all installed at four angles in top of supporting the base, the upper end of first support column is provided with the second backup pad, the recess is placed to the second is seted up to the up end of second backup pad, the second support column is all installed at four angles in top of second backup pad, the upper end of second support column is provided with the third backup pad, the top central point of third backup pad puts and is provided with the detection and places the platform, first spacing spout has all been seted up at both ends around the upper end of second backup pad and third backup pad, the second spacing spout has been seted up at both ends about the up end of third backup pad.
When the detection device of the technical scheme is used, through the arrangement of the first limiting sliding plate and the second limiting sliding plate, the two first limiting sliding plates or the two second limiting sliding plates can be simultaneously moved inwards or outwards, semiconductor materials with different widths and lengths can be clamped and fixed conveniently and efficiently, further stability and safety of subsequent work can be guaranteed, the use efficiency of the detection device is further improved, and through the arrangement of the first rotating clamping plate and the third rotating clamping plate, the left side and the right side or the front side and the back side of the clamped semiconductor materials can be turned according to use requirements, the automatic turning is convenient to achieve the effect of convenient and quick use on each plane of the conductor materials needing to be detected.
Further, support base is all installed at four angles in the bottom of first backup pad, support the lower extreme of base and be provided with the slipmat, guaranteed this detection device's stability, place and take place the displacement in the testing process.
Further, the inside rear end of first recess of placing is provided with first rotating electrical machines, the inboard of first recess of placing just is located the front side output of first rotating electrical machines and is connected with first screw thread lead screw, both ends are provided with relative screw thread around the lateral wall of first screw thread lead screw, both ends are all threaded connection has first spacing slider around the lateral wall of first screw thread lead screw, two first spacing slider's top is all installed first spacing slide, drives the rotation of first screw thread lead screw through starting first rotating electrical machines, makes two first spacing slides inwards or outwards remove simultaneously, can carry out convenient efficient centre gripping to the semiconductor material of different width fixedly.
Further, the inside left end of recess is placed to the second is provided with the second rotating electrical machines, the inside of recess is placed to the second just is located the right side output of second rotating electrical machines and is connected with the second screw thread lead screw, both ends are provided with relative screw thread about the lateral wall of second screw thread lead screw, both ends are all threaded connection has the spacing slider of second about the lateral wall of second screw thread lead screw, two the spacing slider of second is all installed at the top of the spacing slider of second, drives the rotation of second screw thread lead screw through starting the second rotating electrical machines, makes two spacing sliders of second inwards or outwards remove simultaneously, can carry out convenient efficient centre gripping to the semiconductor material of different length fixedly, and then can guarantee the stability and the safety of follow-up work.
Further, the front side the first driving motor is installed to the front side upper end of first spacing slide, first driving motor runs through first spacing slide and extends to its rear side and be connected with first rotation splint, the rear side the front side upper end of first spacing slide is provided with first dead lever, the front end swing joint of first dead lever has the second to rotate splint, after pressing from both sides tight semiconductor material, drives the rotation of first rotation splint through starting first driving motor, makes the semiconductor material overturn on the left and right sides.
Further, the right side the second driving motor is installed to the right side upper end of the spacing slide of second, the second driving motor runs through the spacing slide of second and extends to its left side and be connected with the third and rotate the splint, and the left side the right side upper end of the spacing slide of second is provided with the second dead lever, the right-hand member swing joint of second dead lever has the fourth to rotate the splint, and after the semiconductor material pressed from both sides tightly, through the rotation that starts the rotation that the second driving motor drove the third and rotate the splint, the upset of messenger's semiconductor material front and back is convenient for change each plane of the conductor material that the upset needs to detect, improves this detection device's convenience.
Further, the top rear side of third backup pad is provided with the mount, the connecting rod is installed to the front end bottom of mount, the lower extreme of connecting rod is connected with test probe, the detection box is installed on the top of third backup pad and the right side that is located the mount, the front side upper end of detection box is provided with the display screen, the front side of detection box and the lower extreme that is located the display screen are provided with control button, can show the data of detection through the display screen, also be convenient for seek the operation through control button, improved the device's suitability.
The utility model has the beneficial effects that:
1. according to the utility model, through the arrangement of the first limit sliding plate and the second limit sliding plate, the two first limit sliding plates or the two second limit sliding plates can be simultaneously moved inwards or outwards, and semiconductor materials with different widths and lengths can be conveniently and efficiently clamped and fixed, so that the stability and safety of subsequent work can be ensured, and the use efficiency of the detection device is further improved.
2. According to the utility model, through the arrangement of the first rotating clamping plate and the third rotating clamping plate, the clamped semiconductor material can be quickly turned left and right or front and back according to the use requirement, so that the automatic turning of each plane of the conductor material to be detected is facilitated, and the effect of convenience and rapidness in use is achieved.
Drawings
FIG. 1 is a schematic perspective view of a detection device according to an embodiment of the present utility model;
FIG. 2 is a schematic diagram of a split structure of a detection device according to an embodiment of the present utility model;
FIG. 3 is a schematic view of a first limit slide mounting structure of an embodiment of the detection device of the present utility model;
FIG. 4 is a schematic diagram of a second limit slide mounting structure of an embodiment of the detection device of the present utility model;
fig. 5 is a schematic view of a mounting structure of a fixing frame of an embodiment of the detection device of the present utility model.
In the figure: 1. a first support plate; 2. a support base; 3. an anti-slip pad; 4. a first placement groove; 5. a first rotating electric machine; 6. a first threaded screw; 7. the first limiting slide block; 8. the first limit sliding plate; 9. a first support column; 10. a second support plate; 11. a second placement groove; 12. a second rotating electric machine; 13. a second threaded screw rod; 14. the second limit sliding block; 15. the second limit sliding plate; 16. a second support column; 17. a third support plate; 18. detecting a placing table; 19. the first limiting chute; 20. the second limiting chute; 21. a first driving motor; 22. a first rotating clamping plate; 23. a first fixing rod; 24. a second rotating clamping plate; 25. a second driving motor; 26. a third rotating clamping plate; 27. a second fixing rod; 28. a fourth rotating clamping plate; 29. a fixing frame; 30. a connecting rod; 31. a detection probe; 32. detecting a box body; 33. a display screen; 34. and controlling the keys.
Detailed Description
The utility model is further illustrated by the following examples in conjunction with the accompanying drawings:
example 1: a semiconductor material inspection apparatus, see fig. 1-5; including first backup pad 1, support base 2 is all installed to four angles in the bottom of first backup pad 1, the lower extreme of supporting base 2 is provided with slipmat 3, has guaranteed this detection device's stability, places and takes place the displacement in the testing process, first recess 4 has been seted up to the up end of first backup pad 1, the inside rear end of first recess 4 of placing is provided with first rotating electrical machines 5, the inboard of first recess 4 of placing just is located first rotating electrical machines 5's front side output and is connected with first screw rod 6, both ends are provided with relative screw thread around the lateral wall of first screw rod 6, both ends all threaded connection has first spacing slider 7 around the lateral wall of first screw rod 6, two first spacing slider 7's top all installs first spacing slider 8, drives the rotation of first screw rod 6 through starting first rotating electrical machines 5, makes two first spacing sliders 8 inwards or outwards remove simultaneously, can carry out convenient high-efficient centre gripping to the semiconductor material of different width.
To this concrete implementation, first support column 9 is all installed at four angles in the top of supporting base 2, the upper end of first support column 9 is provided with second backup pad 10, recess 11 is placed to the second up end of second backup pad 10 has been seted up, the inside left end of recess 11 is placed to the second is provided with second rotating electrical machines 12, the inside of recess 11 is placed to the second and is located the right side output of second rotating electrical machines 12 and be connected with second screw rod 13, both ends are provided with relative screw thread about the lateral wall of second screw rod 13, both ends are all threaded connection has second spacing slider 14 about the lateral wall of second screw rod 13, two spacing slider 15 of second are all installed at the top of second spacing slider 14, drive the rotation of second screw rod 13 through starting second rotating electrical machines 12, make two spacing sliders 15 inwards or outwards remove simultaneously, can carry out convenient high-efficient centre gripping to the semiconductor material of different length and fix, and then can guarantee the stability and the safety of follow-up work.
The utility model provides a semiconductor material clamping device, including first backup pad 10, second backup pad 10, first backup pad, second backup pad 16, first backup pad 16 are all installed at four angles in top of second backup pad 10, the upper end of second backup pad 16 is provided with third backup pad 17, the top intermediate position of third backup pad 17 is provided with the detection and places platform 18, first spacing spout 19 has all been seted up at both ends around the upper end of second backup pad 10 and third backup pad 17, second spacing spout 20 has been seted up at both ends about the up end of third backup pad 17, the front side first limiting slide 8's front side upper end installs first driving motor 21, first driving motor 21 runs through first limiting slide 8 and extends to its rear side and be connected with first rotation splint 22, the rear side the front side upper end of first limiting slide 8 is provided with first dead lever 23, the front end swing joint of first dead lever 23 has second rotation splint 24, after the semiconductor material presss the clamp, drives the rotation of first rotation splint 22 through starting first driving motor 21, makes the semiconductor material carry out the upset on the left and right side, the right side limiting motor 15 installs the front side upper end of second limiting slide 25, and the second rotation splint 25 has the second rotation splint 25, and the second rotation splint 25 need be connected to the second rotation splint, the second rotation of the second driving motor 25, the front end of second rotation splint 25 has the second rotation splint 25.
In addition, the top rear side of third backup pad 17 is provided with mount 29, connecting rod 30 is installed to the front end bottom of mount 29, the lower extreme of connecting rod 30 is connected with test probe 31, the detection box 32 is installed on the top of third backup pad 17 and be located the right side of mount 29, the front side upper end of detection box 32 is provided with display screen 33, the front side of detection box 32 and be located the lower extreme of display screen 33 are provided with control button 34, can show the data of detection through display screen 33, also be convenient for seek the operation through control button 34, improved the device's suitability.
When the semiconductor material detection device of the technical scheme is used, firstly, the support base 2 is arranged at the four corners of the bottom of the first support plate 1, the anti-slip pad 3 is arranged at the lower end of the support base 2, the stability of the detection device is ensured, the detection device is placed to displace in the detection process, then the first rotating motor 5 is started to drive the first threaded screw rod 6 to rotate, so that the two first limit sliding plates 8 simultaneously move inwards or outwards, the semiconductor materials with different widths can be clamped and fixed conveniently and efficiently, the second rotating motor 12 is started to drive the second threaded screw rod 13 to rotate, the two second limit sliding plates 15 simultaneously move inwards or outwards, the semiconductor materials with different lengths can be clamped and fixed conveniently and efficiently, and then can guarantee the stability and the safety of follow-up work, after the semiconductor material presss from both sides tightly, start first driving motor 21 and drive the rotation of first rotation splint 22, make the semiconductor material carry out the upset on the left and right sides, start second driving motor 25 and drive the rotation of third rotation splint 26, make the semiconductor material carry out the upset on the front and back, be convenient for automatic upset each plane of the conductor material that needs to detect, improve this detection device's convenience, the lower extreme of connecting rod 30 is connected with test probe 31, the front side upper end of test box 32 is provided with display screen 33, the front side of test box 32 just is provided with control button 34 in the lower extreme of display screen 33, can show the data of detection through display screen 33, also be convenient for carry out the operation of looking for through control button 34, the suitability of this device has been improved.
The embodiments of the present utility model are disclosed as preferred embodiments, but not limited thereto, and those skilled in the art will readily appreciate from the foregoing description that various modifications and variations can be made without departing from the spirit of the present utility model.
Claims (6)
1. A semiconductor material inspection apparatus includes a first support plate (1); the method is characterized in that: the utility model discloses a first backup pad, including first backup pad (1), second backup pad (10), first backup pad (9), first backup pad (10), second backup pad (11) have been seted up to the up end, second backup pad (16) have all been installed at the four angles in top of second backup pad (10), the upper end of second backup pad (16) is provided with third backup pad (17), the top intermediate position of third backup pad (17) is provided with detects and places platform (18), first spacing spout (19) have all been seted up at both ends around the upper end of second backup pad (10) and third backup pad (17), second spacing spout (20) have been seted up at both ends about the up end of third backup pad (17).
2. A semiconductor material inspection apparatus according to claim 1, wherein: the inside rear end of first recess (4) of placing is provided with first rotating electrical machines (5), the inboard of first recess (4) of placing just is located the front side output of first rotating electrical machines (5) and is connected with first screw thread lead screw (6), both ends are provided with relative screw thread around the lateral wall of first screw thread lead screw (6), both ends all threaded connection has first spacing slider (7) around the lateral wall of first screw thread lead screw (6), two first spacing slide (8) are all installed at the top of first spacing slider (7).
3. A semiconductor material inspection apparatus according to claim 2, wherein: the inside left end of recess (11) is placed to the second is provided with second rotating electrical machines (12), the inside of recess (11) is placed to the second just is located the right side output of second rotating electrical machines (12) and is connected with second screw thread lead screw (13), both ends are provided with relative screw thread about the lateral wall of second screw thread lead screw (13), both ends are all threaded connection has second spacing slider (14) about the lateral wall of second screw thread lead screw (13), two second spacing slide (15) are all installed at the top of second spacing slider (14).
4. A semiconductor material inspection apparatus according to claim 3, wherein: the front side first limiting slide (8) front side upper end installs first driving motor (21), first driving motor (21) run through first limiting slide (8) and extend to its rear side and be connected with first rotation splint (22), the rear side first limiting slide (8) front side upper end is provided with first dead lever (23), the front end swing joint of first dead lever (23) has second rotation splint (24).
5. A semiconductor material inspection apparatus according to claim 4, wherein: the right side second driving motor (25) is installed to the right side upper end of second spacing slide (15), second driving motor (25) run through second spacing slide (15) and extend to its left side and be connected with third rotation splint (26), the left side the right side upper end of second spacing slide (15) is provided with second dead lever (27), the right-hand member swing joint of second dead lever (27) has fourth rotation splint (28).
6. A semiconductor material inspection apparatus according to claim 5, wherein: the top rear side of third backup pad (17) is provided with mount (29), connecting rod (30) are installed to the front end bottom of mount (29), the lower extreme of connecting rod (30) is connected with test probe (31), detection box (32) are installed on the top of third backup pad (17) and the right side that is located mount (29), the front side upper end of detection box (32) is provided with display screen (33), the front side of detection box (32) and the lower extreme that is located display screen (33) are provided with control button (34).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321086272.9U CN220340013U (en) | 2023-05-05 | 2023-05-05 | Semiconductor material detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321086272.9U CN220340013U (en) | 2023-05-05 | 2023-05-05 | Semiconductor material detection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220340013U true CN220340013U (en) | 2024-01-12 |
Family
ID=89456233
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321086272.9U Active CN220340013U (en) | 2023-05-05 | 2023-05-05 | Semiconductor material detection device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220340013U (en) |
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2023
- 2023-05-05 CN CN202321086272.9U patent/CN220340013U/en active Active
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