CN220329383U

CN220329383U - Surface dirt fully cleaning equipment for bonding copper wire processing

Info

Publication number: CN220329383U
Application number: CN202321482527.3U
Authority: CN
Inventors: 李盛伟; 李妍琼
Original assignee: Shenzhen Shengdebao New Materials Technology Co ltd
Current assignee: Shenzhen Shengdebao New Materials Technology Co ltd
Priority date: 2023-06-12
Filing date: 2023-06-12
Publication date: 2024-01-12
Anticipated expiration: 2033-06-12

Abstract

The utility model relates to the technical field of bonded copper wire processing, in particular to surface dirt full cleaning equipment for bonded copper wire processing, which comprises a cleaning box, wherein the upper surface of the cleaning box is provided with a box cover, both sides of the cleaning box are provided with wire inlet holes, the upper surface of the cleaning box is provided with a spraying assembly, the upper surface of the box cover is provided with an access door, the other side of the box body is provided with a cleaning assembly, and the full cleaning equipment further comprises a rotating assembly.

Description

Surface dirt fully cleaning equipment for bonding copper wire processing

Technical Field

The utility model relates to the technical field of bonding copper wire processing, in particular to surface dirt full cleaning equipment for bonding copper wire processing.

Background

Bonding is an important step in the production of integrated circuits and is the operation of connecting the circuit chip to the leadframe. Bonding copper wires are a microelectronic fabrication technique used to connect metal lines between a semiconductor chip and a package. This technology is commonly used in the fabrication of integrated circuits, LEDs, solar cells, and other microelectronic devices.

In the prior art, during the bonding of copper wires, the copper wires are cut into small sections with proper lengths, then welded on pins of a chip and a package through special equipment and technology, and subjected to heating treatment, so that the copper wires and the chip or the package form firm connection. Compared with the traditional bonding alloy wire technology, the bonding copper wire has higher conductivity and reliability, and meanwhile, the cost and the energy consumption can be reduced, and the production efficiency and the product quality are improved.

However, the production line has more dust and dirt, and some impurities are attached to the surface of the bonding wire after the bonding wire is processed, and because bonding equipment is relatively precise, if the bonding wire is not cleaned, the bonding wire can be damaged or poor in contact due to the impurities in the bonding process, and the bonding effect is affected.

Disclosure of Invention

The utility model aims to provide a device for sufficiently cleaning surface dirt for processing bonding copper wires, which solves the problems in the prior art.

The technical scheme of the utility model is as follows: the utility model provides a bonding copper wire processing is with abundant cleaning equipment of surface dirt, includes the cleaning case, the upper surface of cleaning case is provided with the case lid, the wire inlet has all been seted up to the both sides of cleaning case, the upper surface of cleaning case is provided with the subassembly that sprays, the upper surface of case lid is provided with the access door, the opposite side of cleaning case is provided with the subassembly that cleans, still includes;

the rotary assembly comprises a motor arranged on one side of the cleaning box, a main gear is rotationally connected to the inner wall of one side of the cleaning box, the output end of the motor is fixedly connected with one side of the main gear, two circular grooves are formed in the inner wall of one side of the cleaning box, arc-shaped blocks are connected to the inner wall of each circular groove in a sliding mode, a plurality of auxiliary gears are fixedly connected to the surfaces of the arc-shaped blocks respectively, the main gear is meshed with the two auxiliary gears respectively, two electric push rods are fixedly connected to the inner wall of each auxiliary gear respectively, and clamping rings are fixedly connected to the output ends of the two electric push rods respectively.

Preferably, the spray assembly comprises a water tank fixedly connected with the upper surface of the cleaning tank, the upper surface of the water tank is fixedly connected with a liquid adding pipe, and the inner bottom wall of the water tank is fixedly connected with a water pump.

Preferably, the water inlet pipe is installed to the water inlet end of water pump, the outlet pipe is installed to the water outlet end of water pump, the other end of outlet pipe runs through the interior roof of clean case and fixedly connected with connecting rod.

Preferably, the cleaning assembly comprises a driving device arranged on the other side of the cleaning box, and the inner wall of the cleaning box is in threaded connection with a threaded rod.

Preferably, the inner wall fixedly connected with two gag levers, the surface threaded connection slider of threaded rod, the surface of slider and the other end fixed connection of connecting rod.

Preferably, two avoidance holes are formed in one side of the sliding block in a penetrating mode, the inner walls of the two avoidance holes are connected with the surfaces of the two limiting rods in a sliding mode, and a cleaning device is arranged on the lower surface of the sliding block.

The utility model provides a device for fully cleaning surface dirt for bonding copper wire processing through improvement, which has the following improvement and advantages compared with the prior art:

according to the utility model, the motor drives the main gear to rotate, the two auxiliary gears are driven to rotate through the rotation of the main gear, copper wires with different specifications can be clamped through the electric push rods and the clamping rings arranged on the inner walls of the two auxiliary gears, the copper wires clamped by the clamping rings are driven to rotate along with the rotation through the rotation of the two auxiliary gears, and the omnibearing cleaning under the cleaning device can be realized through the rotation, so that the problem that only two surfaces can be cleaned is avoided.

Drawings

The utility model is further explained below with reference to the drawings and examples:

FIG. 1 is a schematic perspective view of the present utility model;

FIG. 2 is a schematic cross-sectional perspective view of the cleaning tank of the present utility model;

FIG. 3 is a schematic perspective view of a spray assembly of the present utility model;

fig. 4 is a schematic perspective view of a rotating assembly according to the present utility model.

Reference numerals illustrate:

1. a cleaning tank; 2. a case cover; 3. a rotating assembly; 301. a motor; 302. a main gear; 303. a pinion gear; 304. an electric push rod; 305. a clamping ring; 306. a circular groove; 307. an arc-shaped block; 4. a wire inlet hole; 5. a spray assembly; 501. a water tank; 502. a water pump; 503. a water outlet pipe; 504. a connecting rod; 505. a water inlet pipe; 6. an access door; 7. a cleaning assembly; 701. a driving device; 702. a threaded rod; 703. a limit rod; 704. a slide block; 705. a cleaning device; 8. a liquid adding tube.

Detailed Description

The following detailed description of the present utility model clearly and fully describes the technical solutions of the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The utility model provides a device for fully cleaning surface dirt for bonding copper wire processing by improving the device, which has the technical scheme that: as shown in fig. 1-4: the utility model provides a bonding copper wire processing is with abundant cleaning equipment of surface dirt, includes clean case 1, and the upper surface of clean case 1 is provided with case lid 2, and wire inlet 4 has all been seted up to the both sides of clean case 1, and the upper surface of clean case 1 is provided with spray assembly 5, and the upper surface of case lid 2 is provided with access door 6, and the opposite side of clean case 1 is provided with cleaning assembly 7, still includes;

the rotating assembly 3, the rotating assembly 3 is including installing the motor 301 in one side of clean case 1, one side inner wall rotation of clean case 1 is connected with master gear 302, two circular grooves 306 have been seted up to one side inner wall of motor 301's output and master gear 302, the equal sliding connection of inner wall of two circular grooves 306 has arc piece 307, the surface of a plurality of arc pieces 307 is fixedly connected with pinion 303 respectively, master gear 302 meshes with two pinion 303 respectively, the equal fixedly connected with of inner wall of two pinion 303 is electric putter 304, the equal fixedly connected with clamp ring 305 of output of two electric putter 304.

By the above structure or mechanism: through the cooperation of circular slot 306 and the arc piece 307 that set up, can support two pinion 303, have certain limiting displacement simultaneously, the motion of clamp ring 305 can adapt to the copper wire of different specifications, makes the device practicality stronger.

Further, spray assembly 5 includes the water tank 501 with clean case 1 upper surface fixed connection, the upper surface fixedly connected with filling pipe 8 of water tank 501, the interior bottom wall fixedly connected with water pump 502 of water tank 501, inlet tube 505 is installed to the water inlet end of water pump 502, outlet pipe 503 is installed to the water outlet end of water pump 502, the other end of outlet pipe 503 runs through the interior roof of clean case 1 and fixedly connected with connecting rod 504.

By the above structure or mechanism: the water outlet pipe 503 is made of a hose material, and the movement track of the slide block 704 can not be influenced by the arrangement of the hose, and the water outlet pipe 503 is connected with the connecting rod 504, so that the water outlet pipe 503 is fixed on the slide block 704, and the cleaning liquid and the cleaning device 705 synchronously move.

Further, the cleaning assembly 7 comprises a driving device 701 which is installed on the other side of the cleaning box 1, a threaded rod 702 is connected with the inner wall of the cleaning box 1 in a threaded manner, two limiting rods 703 are fixedly connected with the inner wall of the cleaning box 1, a sliding block 704 is connected with the surface of the threaded rod 702 in a threaded manner, the surface of the sliding block 704 is fixedly connected with the other end of the connecting rod 504, two avoidance holes are formed in one side of the sliding block 704 in a penetrating manner, the inner walls of the two avoidance holes are in sliding connection with the surfaces of the two limiting rods 703, and a cleaning device 705 is arranged on the lower surface of the sliding block 704.

By the above structure or mechanism: the driving device 701 comprises a motor, two pulleys and a belt, the cleaning assembly 7 is provided with two groups, the two groups are symmetrically distributed on the upper and lower sides of the cleaning box 1, the two threaded rods 702 are respectively arranged on the two pulleys, the cleaning device 705 comprises two electric push rods, a rotating frame and cleaning rollers arranged on the inner wall, one end of each cleaning roller is provided with the motor, and the cleaning rollers are driven to rotate on the rotating frame through the driving of the motor.

Working principle: when the bonding copper wire processing surface dirt full cleaning device is used, a user drives the main gear 302 to rotate through the driving of the motor 301, drives the two auxiliary gears 303 to rotate through the rotation of the main gear 302, can clamp copper wires with different specifications through the electric push rods 304 and the clamping rings 305 arranged on the inner walls of the two auxiliary gears 303, drives the copper wires clamped by the clamping rings 305 to rotate along with the rotation of the two auxiliary gears 303, and can realize the omnibearing cleaning under the cleaning device 705 through the rotation, so that the problem that only two sides can be cleaned is avoided; through drive arrangement 701, can drive the rotation of two threaded rods 702, and then drive the motion of slider 704, realize cleaning device 705 and remove the cleanness, cooperate the effect of water pump 502, can spray the washing liquid, make its cleaning performance better.

Claims

1. The utility model provides a bonding copper wire processing is with abundant cleaning equipment of surface dirt, includes clean case (1), the upper surface of clean case (1) is provided with case lid (2), wire feed hole (4) have all been seted up to the both sides of clean case (1), the upper surface of clean case (1) is provided with spray assembly (5), the upper surface of case lid (2) is provided with access door (6), the opposite side of clean case (1) is provided with clean subassembly (7), its characterized in that: also comprises;

rotating assembly (3), rotating assembly (3) are including installing motor (301) in clean case (1) one side, one side inner wall rotation of clean case (1) is connected with master gear (302), one side fixed connection of output and master gear (302) of motor (301), two circular grooves (306) have been seted up to one side inner wall of clean case (1), two the equal sliding connection of inner wall of circular groove (306) has arc piece (307), a plurality of the surface of arc piece (307) is fixedly connected with pinion (303) respectively, master gear (302) respectively with two pinion (303) meshing, two the equal fixedly connected with two electric putter (304) of inner wall of pinion (303), the equal fixedly connected with clamp ring (305) of output of two electric putter (304).

2. A bonding copper wire processing surface soil adequate cleaning apparatus according to claim 1, wherein: the spray assembly (5) comprises a water tank (501) fixedly connected with the upper surface of the cleaning tank (1), a liquid adding pipe (8) is fixedly connected with the upper surface of the water tank (501), and a water pump (502) is fixedly connected with the inner bottom wall of the water tank (501).

3. A bonding copper wire processing surface soil adequate cleaning apparatus according to claim 2, wherein: the water inlet pipe (505) is installed to the water inlet end of water pump (502), outlet pipe (503) is installed to the play water end of water pump (502), the other end of outlet pipe (503) runs through the interior roof of clean case (1) and fixedly connected with connecting rod (504).

4. A bonding copper wire processing surface soil adequate cleaning apparatus according to claim 1, wherein: the cleaning assembly (7) comprises a driving device (701) which is arranged on the other side of the cleaning box (1), and the inner wall of the cleaning box (1) is connected with a threaded rod (702) in a threaded manner.

5. The surface soil adequate cleaning device for bonding copper wire processing according to claim 4, wherein: the inner wall fixedly connected with two gag lever posts (703) of clean case (1), the surface threaded connection slider (704) of threaded rod (702), the surface of slider (704) and the other end fixed connection of connecting rod (504).

6. A bonding copper wire processing surface soil adequate cleaning apparatus according to claim 5, wherein: two avoidance holes are formed in one side of the sliding block (704) in a penetrating mode, the inner walls of the two avoidance holes are connected with the surfaces of the two limiting rods (703) in a sliding mode, and a cleaning device (705) is arranged on the lower surface of the sliding block (704).