CN220313042U

CN220313042U - CMP polishing pad reprocessing device

Info

Publication number: CN220313042U
Application number: CN202321603922.2U
Authority: CN
Inventors: 张佳林; 杨渊思; 喻康
Original assignee: Hangzhou Zhonggui Electronic Technology Co ltd
Current assignee: Hangzhou Zhonggui Electronic Technology Co ltd
Priority date: 2023-06-21
Filing date: 2023-06-21
Publication date: 2024-01-09
Anticipated expiration: 2033-06-21

Abstract

The utility model discloses a CMP polishing pad reprocessing device, comprising: a main body; the cutting unit is arranged at the bottom of the main body and is provided with a cutting knife; the fluid jet unit at least comprises buffer bodies arranged on two sides of the cutting unit and a fluid source for conveying fluid into the buffer bodies, wherein the buffer bodies are made of elastic materials and are provided with output holes. The buffer bodies are arranged on the two sides of the cutting unit, the up-and-down or/and transverse movement of the cutting knife is realized by utilizing the fluid thrust, the adjustment is quick, the adjustment range is wide, the structure is simple, the volume is small, the weight is light, and the maintenance is convenient; the fluid driving can stop the danger of a great deal of electricity consumption in a wet environment; the buffer body can also play a role in buffering when the device breaks down, so that the polishing pad is protected from being injured by a smash.

Description

CMP polishing pad reprocessing device

Technical Field

The utility model belongs to the technical field of semiconductor integrated circuit chip manufacturing, and particularly relates to a CMP polishing pad reprocessing device.

Background

In integrated circuit technology, wafer polishing is one of very important processes, and CMP polishing pads are one of the main consumables in wafer polishing processes, and with the increase of production efficiency, the consumption of polishing pads is also increasing, and the price of current polishing pads is very high, which is a huge expense in long-term wafer polishing processes.

The thickness of the existing polishing pad is generally a few millimeters, grooves with different shapes exist on the surface directly contacted with a wafer, the grooves become shallow gradually until the grooves disappear along with the abrasion of the polishing pad, and the polishing pad fails, but the residual thickness of the CMP polishing pad is still far greater than the depth of the original grooves at the moment, if the residual thickness of the polishing pad can be utilized, the grooves of the polishing pad can be processed and reused, so that the service life of the polishing pad is prolonged, and the process cost is greatly reduced.

Disclosure of Invention

In order to overcome the defects in the prior art, the utility model provides a CMP polishing pad reprocessing device which utilizes a fluid injection unit to realize the position adjustment of a cutting knife, has a simple structure and is rapid and effective in adjustment.

The technical scheme adopted for solving the technical problems is as follows: a CMP polishing pad reprocessing apparatus comprising:

a main body;

the cutting unit is arranged at the bottom of the main body and is provided with a cutting knife;

the fluid jet unit at least comprises buffer bodies arranged on two sides of the cutting unit and a fluid source for conveying fluid into the buffer bodies, wherein the buffer bodies are made of elastic materials and are provided with output holes.

The buffer bodies are arranged on the two sides of the cutting unit, and the up-down or/and transverse movement of the cutting knife is realized by utilizing the fluid thrust, so that the device has the advantages of simple structure, small volume, light weight and convenience in maintenance; the fluid driving can stop the danger of a great deal of electricity consumption in a wet environment; the buffer body can also play a role in buffering when the device breaks down, so that the polishing pad is protected from being injured by a smash.

Further, the cutter extends downwards, and the output hole is positioned below and/or beside the buffer body. When the cutting knife extends downwards, the output hole is positioned below the buffer body, the height of the main body can be adjusted by adjusting the size of fluid output by the output hole below, so that the height of the cutting knife is driven to be adjusted, the adjustment is convenient and effective, and the adjustment range is wide; when the output hole is positioned at the side of the buffer body, the left-right translation of the main body can be realized by adjusting the size of the fluid output by the side output hole, so that the horizontal position of the cutting knife is driven to be adjusted, the adjustment is quick, and the adjustment range is wide.

Further, the side of the buffer body far away from the cutting unit is provided with an output hole. The output hole is arranged at the side far away from the cutting unit, and the cutting unit is not adversely affected on the premise of realizing the adjustment of the horizontal position of the main body.

Further, the buffer body is an air bag. The air bag is convenient to process, large in deformation and convenient to open.

Further, the device also comprises an image acquisition unit which is arranged on the side wall of the main body and is close to the cutting unit. The image acquisition unit is used for accurately acquiring the surface condition of the polishing pad, so that the cutting unit is conveniently controlled, and the controllability of groove processing is higher.

Further, the image acquisition unit is a camera, and the camera is arranged close to the central axis of the cutting knife. The image acquisition unit is arranged close to the central axis of the cutting knife, so that the image information near the cutting knife is acquired more accurately.

Further, the image acquisition device further comprises a laser sensor unit which is arranged on the side wall of the main body and is arranged close to the image acquisition unit. The laser sensor unit is used for measuring the height change of the surface of the polishing pad, can acquire the depth of the groove in real time, is convenient for adjusting the cutting depth of the cutting knife, and is convenient for acquiring the position and depth information of the groove on the surface of the polishing pad in real time and accurately when the laser sensor unit is arranged close to the image acquisition unit.

Further, the device also comprises a negative pressure adsorption unit, wherein the negative pressure adsorption unit is close to the cutting unit, and an adsorption port is arranged downwards; the adsorption port is close to the tail end of the cutting knife. The negative pressure adsorption unit can rapidly adsorb scraps generated by cutting, so that the scraps are prevented from adversely affecting the reprocessing of the polishing pad; the adsorption port is close to the tail end of the cutting knife, and the adsorption distance section is used for adsorbing the scraps more quickly and effectively, and meanwhile, the polishing pad cannot be adversely affected.

Further, the cutter may rotate around its own central axis. The processing of the groove by the cutting knife is faster.

Further, the device further comprises a support, wherein the support comprises a horizontal linear guide rail and a vertical linear guide rail, the vertical linear guide rail can move along the horizontal linear guide rail, and the main body can move along the vertical linear guide rail. The setting of support guarantees the translation of main part in horizontal direction and vertical direction, avoids it to produce the skew.

Further, the aperture of the output hole is 0.5-1mm; the fluid output of the fluid source is 10-200L/min. The aperture of the output hole is too large, so that the controllability of the fluid delivery capacity is reduced, the service life of the buffer body is also adversely affected, the height and the translational distance of the main body are adjusted slowly when the aperture of the output hole is too small, and the adjustment speed and the controllability of the adjustment can be considered under the numerical values; too large fluid output can cause too fast adjustment speed, and also can influence the accurate cutting of the cutting knife, too small fluid output can cause adjustment inefficiency, and under the numerical range, the adjustment effectiveness and the adjustment speed can be considered.

The beneficial effects of the utility model are as follows: the buffer bodies are arranged on two sides of the cutting unit, the up-down or/and transverse movement of the cutting knife is realized by utilizing the fluid thrust, the adjustment is quick, the adjustment range is wide, the structure is simple, the volume is small, the weight is light, and the maintenance is convenient; the fluid driving can stop the danger of a great deal of electricity consumption in a wet environment; the buffer body can also play a role in buffering when the device fails, so that the polishing pad is protected from being injured by a smash; the fluid output by the fluid jet unit can enable two sides of the cutting knife to form a layer of gas diaphragm, gas in the inner side of the buffer body is jetted to the cutting knife so as to prevent cutting scraps from flying away, and the negative pressure adsorption unit can timely clean the cutting scraps so as to reduce pollution to the greatest extent; the processing speed is high, the time is long, and the processing cost is saved; the image acquisition unit is matched with the laser sensor unit, so that the depth information of the surface of the polishing pad and the depth information of the grooves can be accurately acquired, and the accuracy of controlling the actions of the cutting knife is improved.

Drawings

FIG. 1 is a front view of the present utility model mated with a polishing pad.

Fig. 2 is a perspective view of the present utility model.

Fig. 3 is an enlarged view of the structure at a in fig. 2.

Fig. 4 is a perspective view of the second embodiment of the present utility model.

Fig. 5 is a perspective view of the present utility model mated with a polishing pad.

The device comprises a 1-main body, a 2-cutting unit, a 21-cutting knife, a 3-fluid injection unit, a 31-buffer body, a 311-output hole, a 4-image acquisition unit, a 5-laser sensor unit, a 6-negative pressure adsorption unit, a 61-adsorption port, a 7-bracket, a 71-horizontal linear guide rail, a 72-vertical linear guide rail, an 8-polishing pad and 81-grooves.

Detailed Description

In order to make the present utility model better understood by those skilled in the art, the following description of the technical solutions of the present utility model will be made in detail, but not all embodiments of the present utility model are apparent to some embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, shall fall within the scope of the present utility model.

As shown in fig. 1 to 5, a CMP polishing pad reprocessing apparatus includes a main body 1, a cutting unit 2 provided at the bottom of the main body 1, and a fluid ejecting unit 3, the cutting unit 2 having a cutter 21, the cutter 21 extending downward for cutting a groove 81 on the upper surface of a polishing pad 8, where the cutting may be performed in a state where the groove 81 is already present on the polishing pad 8, and the groove 81 needs to be deepened, although the cutting in a state where the groove 81 is not present on the polishing pad 8 is not excluded.

The fluid ejecting unit 3 is also disposed at the bottom of the main body 1, and includes at least a buffer body 31 disposed at two sides of the cutting unit 2, and a fluid source for delivering fluid into the buffer body 31, wherein the buffer body 31 is made of an elastic material, and has an output hole 311.

In this embodiment, the buffer body 31 is an air bag made of rubber material, and has an output hole 311 formed in the lower portion thereof, or has an output hole 311 formed in the side portion thereof, or has an output hole 311 formed in both the lower portion and the side portion thereof, according to the direction shown in the drawing. Preferably, the side here means the side of the buffer 31 away from the cutting unit 2. In other words, the buffer 31 is provided with an output hole 311 at a side corresponding to the outer sidewall of the main body 1.

Specifically, the aperture of the output hole 311 is 0.5-1mm, the fluid output of the fluid source is 10-200L/min, and the fluid source is a device in the prior art capable of continuously outputting fluid, which is not described in detail.

After the buffer body 31 is inflated, part of the gas is discharged from the lower output hole 311, so that the whole CMP pad reprocessing device is in a gas suspension state, and the height of the buffer body 31 can be changed by adjusting the size of the fluid output from the fluid source, thereby causing the CMP pad reprocessing device to move up and down. And all set up the buffer body 31 in the both sides of cutting unit 2, then the atress of cutting unit 2 both sides is balanced relatively, can not lead to the skew of cutting unit 2, guarantees the accuracy of cutting unit 2 cutting work. The number of the buffer bodies 31 may be two or four or more, and is not particularly limited, and the buffer bodies 31 may be equally distributed on both sides of the cutting unit 2, or may be differently arranged on both sides of the cutting unit 2, depending on the working conditions. In addition, the buffer body 31 can play a role of buffering when the CMP pad reprocessing apparatus malfunctions, thereby protecting the polishing pad 8 from being injured by a shock.

When the output hole 311 is formed at the side of the buffer body 31, the fluid output of the buffer body 31 at one side of the cutting unit 2 can be adjusted, and the relative fluid size of the buffer bodies 31 at the two sides of the cutting unit 2 can be changed, so that the CMP pad reprocessing device can move in the left-right direction.

When the cutter 21 of the cutting unit 2 performs cutting processing on the groove 81, chips are generated, which may adversely affect the cutting processing of the groove 81 if not handled in time, and thus the negative pressure suction unit 6 is provided close to the cutting unit 2 with the suction port 61 provided downward. In the present embodiment, the longitudinal section of the negative pressure adsorption unit 6 is tapered with a small upper part and a large lower part, so that the area of the adsorption port 61 at the lower end is larger, and the adsorption effect is better.

In this embodiment, the cutter 21 is a high-rotation-speed drill-mill cutter, or may be a grooving cutter, that is, it may rotate synchronously with the power shaft, or may rotate around the central axis while synchronously rotating with the power shaft. If the grooves 81 of the polishing pad 8 to be processed are annular grooves, the cutter 21 may not rotate, i.e., be a grooving cutter, and a rotary disk is added on which the cutter 21 moves in the radial direction, which greatly increases grooving efficiency.

In order to quickly absorb the chips generated by the cutting, the absorbing port 61 may be near the end of the cutting blade 21, and of course, in order not to adversely affect the polishing pad 8, the absorbing port 61 may be made of an elastic material, and may be deformed to some extent by an external force.

In order to facilitate the acquisition of information from the polishing pad 8 and the grooves 81 in the polishing pad 8, an image acquisition unit 4 may also be provided on the main body 1, specifically attached to the side wall of the main body 1, and disposed close to the cutting unit 2. In the present embodiment, the image acquisition unit 4 is a camera, which is disposed near the center axis of the cutter 21.

In order to facilitate the acquisition of the depth of the groove 81, a laser sensor unit 5 may also be provided on the main body 1, which is specifically attached to the side wall of the main body 1, and is provided close to the image acquisition unit 4.

For the purpose of adjusting the position of the main body 1 together with the cutting unit 2 and the fluid ejecting unit 3, and for ensuring the horizontal and vertical translation of the main body 1, the device further comprises a bracket 7, wherein the bracket 7 comprises a horizontal linear guide 71 and a vertical linear guide 72, the vertical linear guide 72 can move transversely along the horizontal linear guide 71, and the main body 1 can move up and down along the vertical linear guide 72.

The utility model has the working process that the image acquisition unit 4 is utilized to carry out plane imaging on the surface of the polishing pad 8, the laser sensor unit 5 is utilized to measure the height change of the surface of the polishing pad 8, the control system controls the fluid delivery quantity of the fluid injection unit 3 through the data acquired by the image acquisition unit 4 and the laser sensor unit 5, the specific functions can be realized in the prior art, and the specific functions are not repeated, if the position of the cutter 21 is deviated, the quantity of fluid delivered by the fluid source into the buffer body 31 is increased, the quantity of fluid discharged from the output hole 311 is increased, the whole device is lifted upwards, if the position of the cutter 21 is deviated, the quantity of fluid delivered by the fluid source into the buffer body 31 is reduced, the quantity of fluid discharged from the output hole 311 is reduced, the height of the whole device is reduced, so that the position of the cutter 21 is regulated in real time, and the cutter 21 can be accurately cut along the direction of the groove 81 all the time.

The foregoing detailed description is provided to illustrate the present utility model and not to limit the utility model, and any modifications and changes made to the present utility model within the spirit of the present utility model and the scope of the appended claims fall within the scope of the present utility model.

Claims

1. A CMP polishing pad reprocessing apparatus, comprising:

a main body (1);

the cutting unit (2) is arranged at the bottom of the main body (1) and is provided with a cutting knife (21);

the fluid jet unit (3) at least comprises buffer bodies (31) arranged at two sides of the cutting unit (2) and a fluid source for conveying fluid into the buffer bodies (31), wherein the buffer bodies (31) are made of elastic materials and are provided with output holes (311).

2. The CMP polishing pad reprocessing apparatus according to claim 1, wherein: the cutting blade (21) extends downwards, and the output hole (311) is positioned below and/or beside the buffer body (31).

3. The CMP polishing pad reprocessing apparatus according to claim 1 or 2, wherein: the side of the buffer body (31) far away from the cutting unit (2) is provided with an output hole (311).

4. The CMP polishing pad reprocessing apparatus according to claim 1, wherein: the buffer body (31) is an air bag.

5. The CMP polishing pad reprocessing apparatus according to claim 1, wherein: the device also comprises an image acquisition unit (4) which is arranged on the side wall of the main body (1) and is close to the cutting unit (2).

6. The CMP polishing pad reprocessing apparatus according to claim 5, wherein: the image acquisition unit (4) is a camera, and is arranged close to the central axis of the cutting knife (21).

7. The CMP polishing pad reprocessing apparatus according to claim 5, wherein: the device also comprises a laser sensor unit (5) which is arranged on the side wall of the main body (1) and is arranged close to the image acquisition unit (4).

8. The CMP polishing pad reprocessing apparatus according to claim 1, wherein: the vacuum suction unit (6) is close to the cutting unit (2), and the suction port (61) is arranged downwards;

the adsorption port (61) is close to the tail end of the cutter (21).

9. The CMP polishing pad reprocessing apparatus according to claim 1, wherein: the cutter (21) is rotatable about its central axis.

10. The CMP polishing pad reprocessing apparatus according to claim 1, wherein: the device also comprises a bracket (7) which comprises a horizontal linear guide rail (71) and a vertical linear guide rail (72), wherein the vertical linear guide rail (72) can move along the horizontal linear guide rail (71), and the main body (1) can move along the vertical linear guide rail (72).

11. The CMP polishing pad reprocessing apparatus according to claim 1, wherein: the aperture of the output hole (311) is 0.5-1mm; the fluid output of the fluid source is 10-200L/min.