CN201559101U - Improved grinding wheel tool setting device for grinding of semiconductor chip - Google Patents
Improved grinding wheel tool setting device for grinding of semiconductor chip Download PDFInfo
- Publication number
- CN201559101U CN201559101U CN2009202341128U CN200920234112U CN201559101U CN 201559101 U CN201559101 U CN 201559101U CN 2009202341128 U CN2009202341128 U CN 2009202341128U CN 200920234112 U CN200920234112 U CN 200920234112U CN 201559101 U CN201559101 U CN 201559101U
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- China
- Prior art keywords
- grinding
- microswitch
- grinding wheel
- tool setting
- emery wheel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model relates to an improved grinding wheel tool setting device for grinding of a semiconductor chip, which can complete tool setting operation of a grinding wheel before the semiconductor chip is ground and shorten a noncutting stroke of a grinding wheel spindle in the grinding process to make the grinding efficiency of the semiconductor chip improved. The improved grinding wheel tool setting device for grinding of the semiconductor chip comprises the grinding wheel spindle, a grinding wheel spindle feeding device, the grinding wheel and a sucking disc and is characterized in that the space between the lower surface of the grinding wheel and the upper surface of the sucking disc is internally provided with a highly determined microswitch; one end of the microswitch is provided with a switch contact; and the microswitch is connected with a driving device by a connecting piece arranged at the lateral part.
Description
(1) technical field
The utility model relates to the semiconductor wafer processing device technical field, is specially a kind of improved grinding semiconductor wafer emery wheel tool setting device.
(2) background technology
Grinding wheel for grinding can constantly consume when the grinded semiconductor wafer in the grinding semiconductor wafer process; Reasons such as the sucker of absorption semiconductor wafer is trimmed; can cause the idle stroke of emery wheel feeding to become increasing; because the feed speed of grinding wheel spindle is very slow; again because the idle stroke of emery wheel feeding becomes increasing; so the whole stroke of grinding wheel spindle is more and more longer during grinding, it causes the grinding efficiency of semiconductor wafer low.
(3) summary of the invention
At the problems referred to above, the utility model provides a kind of improved grinding semiconductor wafer emery wheel tool setting device, it can finish the tool setting of the preceding emery wheel of grinding semiconductor wafer, and the idle stroke of grinding wheel spindle makes the grinding efficiency of semiconductor wafer be improved when shortening grinding.
Its technical scheme is such: it comprises grinding wheel spindle, grinding wheel spindle feed arrangement, emery wheel, sucker, it is characterized in that: a microswitch of highly determining is housed in the space of the lower surface of described emery wheel and the upper surface of described sucker, described microswitch one end is equipped with switch contact, and described microswitch connects drive unit by the connector that is loaded on sidepiece.
It is further characterized in that: described connector is specially spring, rotating shaft, and described drive unit is specially oscillating cylinder, and described spring connects the top of described microswitch sidepiece and described rotating shaft, and described rotating shaft bottom connects described oscillating cylinder.
In the said structure of the present utility model, because a microswitch of highly determining is housed in the space of the lower surface of described emery wheel and the upper surface of described sucker, described microswitch one end is equipped with switch contact, described microswitch connects drive unit by the connector that is loaded on sidepiece, described emery wheel is grinding when work, the non-switch contact end of microswitch drives by described drive unit, move to the lower surface (or upper surface of the described sucker of fitting) of the described emery wheel of fitting, starting grinding wheel spindle then moves downward, the upper surface (or lower surface of described emery wheel) that makes described microswitch that the switch contact termination is housed to contact described sucker, this moment, described microswitch sent the switching value signal to digital control system, grinding wheel spindle stop motion this moment, described drive unit drives described microswitch and moves to space outerpace, the distance of the upper surface of described emery wheel lower surface and described sucker is the height of microswitch at this moment, because the height of described microswitch is a definite value, and then the downward grinding and feeding amount of its emery wheel is the difference of height with the semiconductor wafer one-tenth-value thickness 1/10 that is ground of described microswitch, this moment, its tool setting function was finished, the idle stroke of grinding wheel spindle when very having shortened grinding makes the grinding efficiency of semiconductor wafer be improved.
(4) description of drawings
Fig. 1 is the structural representation of front view of the present utility model.
(5) specific embodiment
See Fig. 1, the utility model comprises grinding wheel spindle 1, grinding wheel spindle feed arrangement 2, emery wheel 3, sucker 4, emery wheel 3 is set in grinding wheel spindle 1, sucker 4 is positioned at emery wheel 3 belows, be equipped with in the space of the upper surface of the lower surface of emery wheel 3 and sucker 4 and highly be the microswitch 5 of H, switch contact 6 is equipped with in microswitch 5 bottoms, and microswitch 5 connects the top of rotating shafts 8 by the spring 7 that is loaded on sidepiece, the bottom of rotating shaft 8 connects oscillating cylinder 9, and 10 is the fixed structure of sucker among the figure.
Its operation principle is as follows: oscillating cylinder 9 actions, make the lower surface of the top contact emery wheel 3 of microswitch 5, grinding wheel spindle 1 rotates drive emery wheel 3 and moves downward, emery wheel 3 drives microswitch 5 and moves downward, microswitch 5 connects rotating shaft 8 by spring 7, spring 8 has enough retractilities, so microswitch 5 can move downward under the drive of emery wheel 3, when the switch contact 6 of microswitch 5 bottoms touches the upper surface of sucker 4, microswitch 5 sends the switching value signal and gives digital control system, grinding wheel spindle 1 stop motion, the distance of the upper surface of the lower surface of emery wheel 3 and sucker 4 is H at this moment, after it finished tool setting, oscillating cylinder 9 action broke away from the formed solid space of upper surface of the lower surface of emery wheels 3 and sucker 4 microswitch 5.
Claims (2)
1. improved grinding semiconductor wafer emery wheel tool setting device, it comprises grinding wheel spindle, grinding wheel spindle feed arrangement, emery wheel, sucker, it is characterized in that: a microswitch of highly determining is housed in the space of the lower surface of described emery wheel and the upper surface of described sucker, described microswitch one end is equipped with switch contact, and described microswitch connects drive unit by the connector that is loaded on sidepiece.
2. according to the described a kind of improved grinding semiconductor wafer emery wheel tool setting device of claim 1, it is characterized in that: described connector is specially spring, rotating shaft, described drive unit is specially oscillating cylinder, described spring connects the top of described microswitch sidepiece and described rotating shaft, and described rotating shaft bottom connects described oscillating cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202341128U CN201559101U (en) | 2009-07-29 | 2009-07-29 | Improved grinding wheel tool setting device for grinding of semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202341128U CN201559101U (en) | 2009-07-29 | 2009-07-29 | Improved grinding wheel tool setting device for grinding of semiconductor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201559101U true CN201559101U (en) | 2010-08-25 |
Family
ID=42624247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202341128U Expired - Lifetime CN201559101U (en) | 2009-07-29 | 2009-07-29 | Improved grinding wheel tool setting device for grinding of semiconductor chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201559101U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101633152B (en) * | 2009-07-29 | 2012-09-05 | 无锡机床股份有限公司 | Tool setter of sharpening grinding wheel of semiconductor wafer |
| CN102658524A (en) * | 2012-04-20 | 2012-09-12 | 华南理工大学 | Contact-type automatic detection and compensation method for grinding wheel abrasion and device thereof |
| CN102765015A (en) * | 2012-08-07 | 2012-11-07 | 苏州施莱医疗器械有限公司 | Mechanism for compensating grinding wheel wear automatically |
| CN104275647A (en) * | 2013-07-03 | 2015-01-14 | 阳东县国浩机械制造有限公司 | Grinding wheel wear detection device |
-
2009
- 2009-07-29 CN CN2009202341128U patent/CN201559101U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101633152B (en) * | 2009-07-29 | 2012-09-05 | 无锡机床股份有限公司 | Tool setter of sharpening grinding wheel of semiconductor wafer |
| CN102658524A (en) * | 2012-04-20 | 2012-09-12 | 华南理工大学 | Contact-type automatic detection and compensation method for grinding wheel abrasion and device thereof |
| CN102765015A (en) * | 2012-08-07 | 2012-11-07 | 苏州施莱医疗器械有限公司 | Mechanism for compensating grinding wheel wear automatically |
| CN102765015B (en) * | 2012-08-07 | 2014-09-17 | 苏州施莱医疗器械有限公司 | Mechanism for compensating grinding wheel wear automatically |
| CN104275647A (en) * | 2013-07-03 | 2015-01-14 | 阳东县国浩机械制造有限公司 | Grinding wheel wear detection device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20100825 Effective date of abandoning: 20090729 |
|
| RGAV | Abandon patent right to avoid regrant |