CN202399110U - Augmentor for diamond wafer polishing machine - Google Patents
Augmentor for diamond wafer polishing machine Download PDFInfo
- Publication number
- CN202399110U CN202399110U CN2011204846251U CN201120484625U CN202399110U CN 202399110 U CN202399110 U CN 202399110U CN 2011204846251 U CN2011204846251 U CN 2011204846251U CN 201120484625 U CN201120484625 U CN 201120484625U CN 202399110 U CN202399110 U CN 202399110U
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- China
- Prior art keywords
- spring
- augmentor
- adjusting screw
- hole
- axial
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses an augmentor for a diamond wafer polishing machine. The augmentor comprises an extension-type housing; the inner cavity of the housing is provided with a stepped surface; an axial threaded hole is formed on the upper side of the stepped surface; an axial through hole is formed on the lower side of the stepped surface; an adjusting screw rod is mounted in the axial threaded hole; a spring is sleeved in the axial through hole; a movable bar is connected with the lower end of the spring; part of the movable bar is sleeved in the axial through hole and can axially slide; and the lower end of the movable bar is in slide fit with a main shaft. The adjusting screw rod is arranged on the upper sides of the movable bar and the spring, the augmented force can be adjusted at any time through augmenting force by selecting the adjusting screw rod, the processing requirement is met, the structure is simple, the manufacturing or reformation is easy, the operation is simple and convenient, the control precision is high, and the augmentor can be popularized and implemented very advantageously.
Description
Technical field:
The utility model relates to diamond polishing wafer machine improvement technology, is specifically related to a kind of diamond polishing wafer machine augmentor.
Background technology:
To the polishing machine that uses in the diamond wafer processing and utilization, it is according to stock removal, and main shaft thrust of mill vertically also in rotation at a high speed compensates to guarantee grinding dynamics and grinding.Simultaneously, also to consider afterburning size, satisfy different diamonds are carried out afterburning requirement in various degree.Though existing diamond polishing wafer machine main shaft has adopted the elastic stressing device, also there be the dynamics adjustment problem afterburning to.
The utility model content:
The utility model proposes a kind of diamond polishing wafer machine augmentor to the problem and shortage that at present existing situation exists.
The technical scheme that the utility model adopted: a kind of diamond polishing wafer machine augmentor, comprise a telescopic shell, this shell inner cavity is provided with step surface; The step surface upside is the axial thread hole, and the step surface downside is an axially extending bore, and said axial thread is equipped with adjusting screw(rod) in the hole; Be set with spring in the axially extending bore; The spring lower end connects motion bar, and the part of this motion bar is set in the axially extending bore and can endwisely slips, and motion bar lower end and main shaft are slidingly matched.
Between adjusting screw(rod) and the spring pad can be set.
Between spring and the motion bar pad can be set.
The good effect of the utility model: at motion bar and spring upside adjusting screw(rod) is set, carries out reinforcing through selecting adjusting screw(rod), its afterburning size can be adjusted at any time; Satisfy process requirements; It is simple in structure, makes easily or transforms, and is easy and simple to handle; Control accuracy is high, is beneficial to very much promotion and implementation.
Description of drawings:
Fig. 1 is the utility model cross-sectional view.
The specific embodiment:
Referring to Fig. 1, this diamond polishing wafer machine augmentor comprises a telescopic shell 1, and this shell 1 inner chamber is provided with step surface, and the step surface upside is the axial thread hole, and axial thread is equipped with adjusting screw(rod) in the hole.
The step surface downside is an axially extending bore 3, is set with spring 5 in the axially extending bore 3, and spring 5 lower ends connect motion bar 4, and the part of this motion bar 4 is set in the axially extending bore and can endwisely slips, and motion bar 4 lower ends and main shaft are slidingly matched.Simultaneously, can also between adjusting screw(rod) and spring, pad be set, and between spring and motion bar, pad be set.
Claims (3)
1. diamond polishing wafer machine augmentor, it is characterized in that: comprise a telescopic shell, this shell inner cavity is provided with step surface; The step surface upside is the axial thread hole, and the step surface downside is an axially extending bore, and said axial thread is equipped with adjusting screw(rod) in the hole; Be set with spring in the axially extending bore; The spring lower end connects motion bar, and the part of this motion bar is set in the axially extending bore and can endwisely slips, and motion bar lower end and main shaft are slidingly matched.
2. diamond polishing wafer machine augmentor according to claim 1 is characterized in that: be provided with pad between adjusting screw(rod) and the spring.
3. diamond polishing wafer machine augmentor according to claim 1 is characterized in that: be provided with pad between spring and the motion bar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204846251U CN202399110U (en) | 2011-11-29 | 2011-11-29 | Augmentor for diamond wafer polishing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204846251U CN202399110U (en) | 2011-11-29 | 2011-11-29 | Augmentor for diamond wafer polishing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202399110U true CN202399110U (en) | 2012-08-29 |
Family
ID=46696786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204846251U Expired - Fee Related CN202399110U (en) | 2011-11-29 | 2011-11-29 | Augmentor for diamond wafer polishing machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202399110U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103111930A (en) * | 2013-02-25 | 2013-05-22 | 山东龙祥金属复合材料有限公司 | Welding joint polishing machine for repair of composite boards |
| CN108992229A (en) * | 2018-08-03 | 2018-12-14 | 刘炳阳 | A kind of tractor and traction control apparatus |
-
2011
- 2011-11-29 CN CN2011204846251U patent/CN202399110U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103111930A (en) * | 2013-02-25 | 2013-05-22 | 山东龙祥金属复合材料有限公司 | Welding joint polishing machine for repair of composite boards |
| CN108992229A (en) * | 2018-08-03 | 2018-12-14 | 刘炳阳 | A kind of tractor and traction control apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120829 Termination date: 20131129 |