CN202185831U - Tool setting device for silicon wafer grinding wheel - Google Patents
Tool setting device for silicon wafer grinding wheel Download PDFInfo
- Publication number
- CN202185831U CN202185831U CN 201120261326 CN201120261326U CN202185831U CN 202185831 U CN202185831 U CN 202185831U CN 201120261326 CN201120261326 CN 201120261326 CN 201120261326 U CN201120261326 U CN 201120261326U CN 202185831 U CN202185831 U CN 202185831U
- Authority
- CN
- China
- Prior art keywords
- grinding wheel
- laser sensor
- grinding
- tool setting
- sucker
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
The utility model discloses a tool setting device for a silicon wafer grinding wheel. The device comprises a grinding wheel main shaft, a grinding wheel main shaft feeding device, a grinding wheel and a sucker; a laser sensor is arranged at the position of one side of the grinding wheel, certain height is kept between the space on the upper surface of the sucker and the side of the grinding wheel, an output signal of the laser sensor is connected with a signal input end of a control circuit, a signal output end of the control circuit is connected with a grinding wheel drive motor, and the laser sensor is connected with a drive device at the side part through a connecting piece. As the height detected by the laser sensor in the device is a set value, the downward grinding feed quantity of the grinding wheel is the differential value of the height measured by the laser sensor and the thickness of the grinded solar silicon wafer, at this time, the tool setting function is completed, the noncutting stroke of the grinding wheel main shaft is shortened during the grinding, so that the grinding efficiency of the solar silicon wafer is improved.
Description
Technical field
The utility model relates to the process equipment of solar silicon wafers, is specifically related to a kind of tool setting device of silicon chip abrasive grinding wheel.
Background technology
In the prior art, solar silicon wafers grinding wheel for grinding in grinding process can constantly consume when the grinding solar silicon wafers; Reasons such as the sucker of absorption solar silicon wafers is trimmed; Can cause the idle stroke of emery wheel feeding to become increasing; Because the feed speed of grinding wheel spindle is very slow; Again because the idle stroke of emery wheel feeding becomes increasing, so more and more longer at the whole stroke of grinding wheel spindle during grinding, it causes the grinding efficiency of solar silicon wafers more and more lower.
The utility model content
The purpose of the utility model is to overcome the defective that exists in the prior art; A kind of improved sun ability silicon chip abrasive grinding wheel tool setting device is provided; It can accomplish the tool setting of the preceding emery wheel of sun ability silicon chip grinding, and the idle stroke of grinding wheel spindle when shortening grinding makes the grinding efficiency of sun ability silicon chip be improved.
For realizing above-mentioned purpose; The technical scheme of the utility model is the tool setting device of a kind of silicon chip abrasive grinding wheel of design; Said device comprises grinding wheel spindle, grinding wheel spindle feed arrangement, emery wheel, sucker; It is characterized in that having the position highly confirmed that laser sensor is housed apart from the space of the upper surface of said sucker in a side of said emery wheel, the output signal of said laser sensor is connected with the signal input part of control circuit; The signal output part of said control circuit is connected with the emery wheel drive motors, and said laser sensor is connected with the drive unit that is loaded on sidepiece through connector.
As optimized technical scheme; Described connector is specially spring, rotating shaft, and said drive unit is specially oscillating cylinder, and an end of said spring is connected with said laser sensor; The other end of said spring is connected with the top of said rotating shaft, and said rotating shaft bottom is connected with said oscillating cylinder.
The advantage and the beneficial effect of the utility model are: in the said structure; Because the output signal of the good said laser sensor of laser sensor of height setting is housed in the space of the upper surface of the lower surface of said emery wheel and said sucker to be connected with the signal input part of control circuit; The signal output part of said control circuit is connected with the emery wheel drive motors; Said laser sensor is connected with the drive unit that is loaded on sidepiece through connector; Said emery wheel is grinding when work, and laser sensor is through said drive device drives, moves to setting height and be the lower surface of said emery wheel when the distance of the upper surface (or lower surface of said emery wheel) of said sucker is H; Said laser sensor was blocked and sent signal to control circuit this moment, and control circuit output this moment control signal makes the grinding wheel spindle stop motion.The said laser sensor of said drive device drives moves to space outerpace; The distance of the upper surface of said emery wheel lower surface and said sucker is the height H of setting at this moment; Because the detected height of said laser sensor is a definite value; And then the downward grinding and feeding amount of its emery wheel be height that said laser sensor measures with by the difference of the solar silicon wafers one-tenth-value thickness 1/10 of grinding; This moment, oneself warp of its tool setting function was accomplished, and the idle stroke of grinding wheel spindle when very having shortened grinding makes the grinding efficiency of solar silicon wafers be improved.
Description of drawings
Fig. 1 is the structural representation of the tool setting device of the utility model silicon chip abrasive grinding wheel.
Among the figure: 1, grinding wheel spindle; 2, grinding wheel spindle feed arrangement; 3, emery wheel; 4, sucker; 5, laser sensor; 6, setting height H; 7, spring; 8, rotating shaft; 9, oscillating cylinder; 10, the fixed structure of sucker.
The specific embodiment
Below in conjunction with accompanying drawing and embodiment, the specific embodiment of the utility model is further described.Following examples only are used for more clearly explaining the technical scheme of the utility model, and can not limit the protection domain of the utility model with this.
As shown in Figure 1; The utility model is a kind of tool setting device of silicon chip abrasive grinding wheel; This device comprises grinding wheel spindle 1, grinding wheel spindle feed arrangement 2, emery wheel 3, sucker 4, and emery wheel 3 is set on the grinding wheel spindle 1, and sucker 4 is positioned at emery wheel 3 belows; It is that the side of H is equipped with laser sensor 5 that setting height is arranged in the space of the upper surface of the lower surface of emery wheel 3 and sucker 4; The output signal of said laser sensor 5 is connected with the signal input part of control circuit, and the signal output part of said control circuit is connected with the emery wheel drive motors, and said laser sensor is connected with the drive unit that is loaded on sidepiece through connector; Described connector is specially spring 7, rotating shaft 8, and said drive unit is specially oscillating cylinder 9, and an end of said spring 7 is connected with said laser sensor 5; The other end of said spring 7 is connected with the top of said rotating shaft 8; Said rotating shaft 8 bottoms are connected with said oscillating cylinder 9, and the spring 7 of laser sensor 5 through being loaded on sidepiece connects the top of rotating shafts 8, and the bottom of rotating shaft 8 connects oscillating cylinder 9; 10 is the fixed structure of sucker among the figure, 6 setting height H among the figure.
Its operation principle is following: oscillating cylinder 9 actions, and make laser sensor 5 can shine the lower surface of emery wheel 3, grinding wheel spindle 1 rotates drive emery wheel 3 and moves downward; Emery wheel 3 shelters from the light of laser sensor 5, and laser sensor 5 connects rotating shaft 8 through spring 7, and spring 7 has enough retractilities; So laser sensor 5 can be after emery wheel 3 shelters from its light; Make control circuit send control signal control emery wheel and main shaft 1 stop motion, the distance of the upper surface of the lower surface of emery wheel 3 and sucker 4 is H at this moment, after it accomplishes tool setting; Oscillating cylinder 9 action breaks away from the formed solid space of upper surface of lower surface and sucker 4 of emery wheels 3 laser sensor 5.
The above only is the preferred implementation of the utility model; Should be understood that; For those skilled in the art; Under the prerequisite that does not break away from the utility model know-why, can also make some improvement and retouching, these improvement and retouching also should be regarded as the protection domain of the utility model.
Claims (2)
1. the tool setting device of a silicon chip abrasive grinding wheel; Said device comprises grinding wheel spindle, grinding wheel spindle feed arrangement, emery wheel, sucker; It is characterized in that; There is the position highly confirmed that laser sensor is housed apart from the space of the upper surface of said sucker in a side of said emery wheel; The output signal of said laser sensor is connected with the signal input part of control circuit, and the signal output part of said control circuit is connected with the emery wheel drive motors, and said laser sensor is connected with the drive unit that is loaded on sidepiece through connector.
2. according to the tool setting device of the said silicon chip abrasive grinding wheel of claim 1; It is characterized in that; Described connector is specially spring, rotating shaft, and said drive unit is specially oscillating cylinder, and an end of said spring is connected with said laser sensor; The other end of said spring is connected with the top of said rotating shaft, and said rotating shaft bottom is connected with said oscillating cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120261326 CN202185831U (en) | 2011-07-22 | 2011-07-22 | Tool setting device for silicon wafer grinding wheel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120261326 CN202185831U (en) | 2011-07-22 | 2011-07-22 | Tool setting device for silicon wafer grinding wheel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202185831U true CN202185831U (en) | 2012-04-11 |
Family
ID=45917301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120261326 Expired - Fee Related CN202185831U (en) | 2011-07-22 | 2011-07-22 | Tool setting device for silicon wafer grinding wheel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202185831U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105666288A (en) * | 2016-04-12 | 2016-06-15 | 安徽雷默模具制造有限公司 | Automatic numerical control grinding machine for punch press die machining and using method thereof |
| CN107263319A (en) * | 2017-05-25 | 2017-10-20 | 郑州磨料磨具磨削研究所有限公司 | One kind tracks method emery wheel presetting cutter method and system |
-
2011
- 2011-07-22 CN CN 201120261326 patent/CN202185831U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105666288A (en) * | 2016-04-12 | 2016-06-15 | 安徽雷默模具制造有限公司 | Automatic numerical control grinding machine for punch press die machining and using method thereof |
| CN107263319A (en) * | 2017-05-25 | 2017-10-20 | 郑州磨料磨具磨削研究所有限公司 | One kind tracks method emery wheel presetting cutter method and system |
| CN107263319B (en) * | 2017-05-25 | 2019-11-08 | 郑州磨料磨具磨削研究所有限公司 | One kind tracks method grinding wheel presetting cutter method and system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120411 Termination date: 20120722 |