CN220295102U

CN220295102U - Centrifugal type gluing mechanism

Info

Publication number: CN220295102U
Application number: CN202321751591.7U
Authority: CN
Inventors: 董和平; 兑志魁; 田耕
Original assignee: Zhengzhou Rtit Research Institute
Current assignee: Zhengzhou Rtit Research Institute
Priority date: 2023-07-05
Filing date: 2023-07-05
Publication date: 2024-01-05
Anticipated expiration: 2033-07-05

Abstract

The utility model relates to the technical field of semiconductor manufacturing process equipment, in particular to a centrifugal gluing mechanism, which comprises an adsorption mechanism for fixing a wafer semiconductor, an adjusting mechanism for spraying and adjusting the spraying position of gluing, and a positioning mechanism for adjusting the same axis of the wafer semiconductor and a spray head; the beneficial effects are that: through being provided with lift post etc. when carrying out the rubber coating to the wafer, the lift post descends, drives mounting panel and last voussoir and descends in step, later lower voussoir and base contact, sliding sleeve and mounting panel sliding connection, lift post drive go up the voussoir and continue to descend, then go up the voussoir and contact with lower voussoir, four upward voussoirs inwards compress the lower voussoir that corresponds the setting, shrink to the centre, realize the position adjustment to wafer semiconductor, guarantee the axis of wafer semiconductor and rotate packing element, the collar, rubber bottom plate and sliding sleeve's axis collineation, make the surface quality of rubber coating behind the wafer more even.

Description

Centrifugal type gluing mechanism

Technical Field

The utility model relates to the technical field of semiconductor manufacturing process equipment, in particular to a centrifugal gluing mechanism.

Background

In order to realize more efficient gluing of a wafer semiconductor, the Chinese patent 'gluing device for wafer processing' (publication No. CN 218902296U) drives an empty transmission main shaft to rotate through the action of a stepping motor, namely, the hollow rod is driven to rotate, a mechanical arm is driven to rotate in the process of rotating the hollow rod, a spray gun is driven to rotate, the spray gun is assisted to move to a direction convenient to spray when spraying, after spraying is finished, the spray gun is moved to one side, lifting and descending are realized through the action of a lifting power mechanism, a wafer fixing assembly is used for fixing and placing a wafer, and a first power mechanism drives the wafer fixing assembly to rotate to realize uniform coating.

However, in the current wafer dicing, the wafer dicing technique may be generally divided into blade dicing, laser dicing and plasma dicing, in order to reduce the stress borne by the wafer during dicing and to ensure dicing accuracy of the wafer, and more use laser dicing to dice thin slices, after dicing is completed, the wafer surface is centrifugally coated with photoresist, in the process of coating the wafer semiconductor, in the above-mentioned patent, the wafer fixing component is lifted above the cleaning tank, and fixation is achieved by vacuum pumping through the vacuum cavity carrier, and the rotating press block component and the claw disposed at the front end achieve limiting of the wafer steel ring under the centrifugal force in the high-speed rotation process.

Disclosure of Invention

The utility model aims to provide a centrifugal gluing mechanism.

The technical scheme adopted by the utility model is as follows: the centrifugal gluing mechanism comprises an adsorption mechanism for fixing a wafer semiconductor, an adjusting mechanism for adjusting the spraying and painting positions of the wafer semiconductor, and a positioning mechanism for adjusting the same axis of the wafer semiconductor and a nozzle, wherein the positioning mechanism is arranged below the adjusting mechanism, and the adjusting mechanism is arranged above the adsorption mechanism;

the positioning mechanism comprises lifting columns, wherein the lifting columns are arranged below the adjusting mechanism, two lifting columns are arranged below the lifting columns, a mounting plate is arranged below the lifting columns, four upper wedges are arranged below the mounting plate in a surrounding mode, holes are formed in the middle positions of the mounting plate, sliding sleeves are arranged in the holes, mounting rings are arranged below the sliding sleeves, four sliding frames are arranged outside the mounting rings in a surrounding mode, sliding rods are arranged inside the sliding frames, lower wedges are arranged on the sliding rods, and springs are arranged between the lower wedges and the sliding rods.

Preferably: the adjusting mechanism comprises a support plate, the support plate is arranged above the lifting column, an extension frame is arranged below the support plate, a rotating hole is formed in the middle position of the support plate, a rotating rubber cylinder is connected in the rotating hole, one end of the upper portion of the rotating rubber cylinder penetrates through the support plate and is located outside the rotating rubber cylinder and provided with a first gear, one side of the first gear is provided with a driving motor, the output end of the driving motor is provided with a second gear, a transmission gear is arranged between the second gear and the first gear, the other end of the rotating rubber cylinder penetrates through the sliding sleeve, a spray head is arranged at the output end of the rotating rubber cylinder, two feed boxes are arranged above the support plate, and a rubber outlet pipe is arranged between the feed boxes.

Preferably: the adsorption mechanism comprises a base, the base sets up the below of extension frame, the below of base is provided with the vacuum pump, the output of vacuum pump is provided with the trachea, the trachea outside is provided with the control valve, the top of base is provided with four rubber bottom plates, four be provided with the sucking disc between the rubber bottom plate, the below of sucking disc with tracheal other end is connected, the sucking disc top is provided with the wafer body.

Preferably: the upper wedge block and the lower wedge block are correspondingly arranged, the sliding sleeve is in sliding connection with the mounting plate, the sliding frame is fixedly connected with the mounting ring, and the mounting ring is fixedly connected with the sliding sleeve.

Preferably: the rotary rubber cylinder is rotationally connected with the support plate and the sliding sleeve, and the rubber outlet pipe arranged between the feed boxes is rotationally connected with the rotary rubber cylinder.

Preferably: the rotary rubber cylinder, the mounting ring, the rubber bottom plate and the sliding sleeve are arranged on the same axis.

The beneficial effects of the utility model are as follows: through being provided with lift post, mounting panel and last voussoir etc. when carrying out the rubber coating to the wafer, firstly descend through the lift post, drive mounting panel and last voussoir simultaneously and descend in step, afterwards lower voussoir and base contact, sliding sleeve and mounting panel sliding connection, lift post drive go up the voussoir and continue to descend, then go up the voussoir and lower voussoir contact, four upward voussoirs inwards compress the lower voussoir that corresponds the setting, shrink to the centre, realize the position adjustment to wafer semiconductor, guarantee the axis of wafer semiconductor and rotate the packing element, the collar, rubber bottom plate and sliding sleeve's axis collineation, make the surface quality of rubber coating behind the wafer more even, later fix the wafer body by the sucking disc again, the lift post rises, driving motor drives and rotates the packing element, rotate the surface of wafer body and rotate the spraying, in addition, inboard and the rubber bottom plate upper end surface all are provided with the soft glue under four, avoid causing the damage to the wafer when centre gripping adjustment position.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings that are necessary for the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model and that other drawings can be obtained according to these drawings without inventive faculty for a person skilled in the art.

FIG. 1 is a cross-sectional view of a centrifugal glue mechanism according to the present utility model;

FIG. 2 is a schematic view of a positioning mechanism of a centrifugal glue applicator according to the present utility model;

FIG. 3 is a cross-sectional view of a positioning mechanism of a centrifugal glue applicator according to the present utility model;

FIG. 4 is a schematic view of an adjusting mechanism of a centrifugal glue applicator according to the present utility model;

FIG. 5 is a cross-sectional view of an adjustment mechanism of a centrifugal glue applicator according to the present utility model;

FIG. 6 is a schematic diagram of an adsorption mechanism of a centrifugal glue applicator according to the present utility model;

fig. 7 is a cross-sectional view of a centrifugal glue mechanism according to the utility model at a rubber floor.

The reference numerals are explained as follows:

1. a positioning mechanism; 11. lifting columns; 12. a mounting plate; 13. an upper wedge; 14. a sliding sleeve; 15. a mounting ring; 16. a sliding frame; 17. a slide bar; 18. a lower wedge; 19. a spring; 2. an adjusting mechanism; 21. an extension frame; 22. a support plate; 23. rotating the rubber cylinder; 24. a first gear; 25. a driving motor; 26. a second gear; 27. a feed box; 3. an adsorption mechanism; 31. a base; 32. a vacuum pump; 33. an air pipe; 34. a control valve; 35. a rubber bottom plate; 36. a suction cup; 37. a wafer body.

Detailed Description

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art in a specific case.

The utility model is further illustrated by the following examples in connection with the accompanying drawings.

As shown in fig. 1 to 7, a centrifugal glue spreading mechanism comprises an adsorption mechanism 3 for fixing a wafer semiconductor, an adjusting mechanism 2 for adjusting the spraying and painting positions of the glue spreading, and a positioning mechanism 1 for adjusting the same axis of the wafer semiconductor and a nozzle, wherein the positioning mechanism 1 is arranged below the adjusting mechanism 2, and the adjusting mechanism 2 is arranged above the adsorption mechanism 3.

In this embodiment: the positioning mechanism 1 comprises lifting columns 11, the lifting columns 11 are arranged below the adjusting mechanism 2, two lifting columns 11 are arranged, a mounting plate 12 is arranged below the lifting columns 11, four upper wedges 13 are arranged below the mounting plate 12 in a surrounding manner, a hole is formed in the middle of the mounting plate 12, a sliding sleeve 14 is arranged in the hole, a mounting ring 15 is arranged below the sliding sleeve 14, four sliding frames 16 are arranged outside the mounting ring 15 in a surrounding manner, sliding rods 17 are arranged inside the sliding frames 16, a lower wedge 18 is arranged on the sliding rods 17, a spring 19 is arranged between the lower wedges 18 and the sliding rods 17, the adjusting mechanism 2 comprises a support plate 22, the support plate 22 is arranged above the lifting columns 11, an extension frame 21 is arranged below the support plate 22, a rotating hole is formed in the middle of the support plate 22, a rotating rubber cylinder 23 is connected in the rotating hole, one end above the rotating rubber cylinder 23 penetrates through the support plate 22, the first gear 24 is arranged outside the rotary rubber cylinder 23, one side of the first gear 24 is provided with a driving motor 25, the output end of the driving motor 25 is provided with a second gear 26, a transmission gear is arranged between the second gear 26 and the first gear 24, the other end of the rotary rubber cylinder 23 passes through the sliding sleeve 14, the output end of the rotary rubber cylinder 23 is provided with a spray head, two feed boxes 27 are arranged above the support plate 22, a rubber outlet pipe is arranged between the feed boxes 27, the upper wedge 13 and the lower wedge 18 are correspondingly arranged, the sliding sleeve 14 is in sliding connection with the mounting plate 12, the sliding frame 16 is fixedly connected with the mounting ring 15, the mounting ring 15 is fixedly connected with the sliding sleeve 14, the upper wedge 13 is contacted with the lower wedge 18 through the height adjustment of the lifting column 11 through the arrangement of the upper wedge 13, the lower wedge 18, the sliding sleeve 14, the mounting plate 12, the sliding frame 16 and the mounting ring 15, the four upper wedges 13 inwardly compress the correspondingly arranged lower wedges 18 and shrink towards the middle, so that the position of the wafer body 37 is adjusted, and the axis of the wafer body 37 is ensured to be collinear with the axes of the mounting ring 15 and the sliding sleeve 14.

In this embodiment: the adsorption mechanism 3 comprises a base 31, the base 31 is arranged below the extension frame 21, a vacuum pump 32 is arranged below the base 31, an air pipe 33 is arranged at the output end of the vacuum pump 32, a control valve 34 is arranged outside the air pipe 33, four rubber bottom plates 35 are arranged above the base 31, a sucker 36 is arranged between the four rubber bottom plates 35, the lower part of the sucker 36 is connected with the other end of the air pipe 33, a wafer body 37 is arranged above the sucker 36, the rotary rubber cylinder 23 is rotationally connected with the support plate 22 and the sliding sleeve 14, an outlet pipe arranged between the feed boxes 27 is rotationally connected with the rotary rubber cylinder 23, the mounting ring 15, the rubber bottom plates 35 and the sliding sleeve 14 are arranged at the same axis, the second gear 26 arranged at the output end of the driving motor 25 drives the rotary rubber cylinder 23 to rotate through a transmission gear arranged on the surface of the rotary rubber cylinder 23, and the rotary rubber cylinder 23 is rotationally connected with the support plate 22 and the rotary sleeve 14 is rotationally connected with the sliding sleeve 14.

In this embodiment: the adsorption mechanism 3 comprises a base 31, the base 31 is arranged below the extension frame 21, a vacuum pump 32 is arranged below the base 31, an air pipe 33 is arranged at the output end of the vacuum pump 32, a control valve 34 is arranged outside the air pipe 33, four rubber bottom plates 35 are arranged above the base 31, a sucker 36 is arranged between the four rubber bottom plates 35, the lower part of the sucker 36 is connected with the other end of the air pipe 33, a wafer body 37 is arranged above the sucker 36, the vacuum pump 32 works through the base 31, the vacuum pump 32, the air pipe 33 and the like, suction control is carried out through the control valve 34 and the air pipe 33, and the fixation of the sucker 36 to the wafer body 37 is realized.

Working principle: firstly, processing the wafer raw material by a laser cutting machine, compared with non-contact cutting processing of laser cutting, mechanical stress is not generated on the wafer during cutting, damage to the wafer is reduced, after the wafer is cut into pieces, in the subsequent processing process, the surface of the wafer is glued, firstly, the wafer is lowered by a lifting column 11, meanwhile, a mounting plate 12 and an upper wedge 13 are driven to synchronously descend, meanwhile, a lower wedge 18 is driven to descend until the lower wedge 18 is contacted with a lower base 31, at the moment, a wafer body 37 is positioned between the four lower wedges 18, because a sliding sleeve 14 is in sliding connection with the mounting plate 12, the lifting column 11 and the mounting plate 12 continuously drive the upper wedges 13 to descend, the lower ends of the four upper wedges 13 are contacted with the lower wedges 18, the lower wedges 18 are extruded by the lowering of the upper wedges 13 inwards shrink along a sliding rod 17, the position of the wafer body 31 is adjusted, the center of the wafer body 37 and the central axes of the sliding sleeve 14 and the rotating rubber cylinder 23 are coaxial and collinear, the gluing quality of the surface of the wafer body 37 is improved, then the vacuum pump 32 works, suction control is carried out through the control valve 34 and the air pipe 33, the fixing of the wafer body 37 by the sucking disc 36 is realized, after the fixing is finished, the lifting column 11 is lifted, the upper wedge 13 releases the lower wedge 18, the spring 19 ejects the lower wedge 18 to reset, the lifting column 11 is synchronously lifted, the second gear 26 arranged at the output end of the driving motor 25 drives the first gear 24 arranged at the surface of the rotating rubber cylinder 23 to rotate through the arranged transmission gear, the extension frame 21 adjusts the position of the spray head arranged at the output end of the rotating rubber cylinder 23, the position of the spray head keeps a proper distance from the surface of the wafer body 37, the surface of the wafer body 37 is convenient to carry out rotary spraying, and the rubber outlet pipe between the rotary rubber cylinder 23 and the sliding sleeve 14 as well as the material box 27 is rotationally connected with the mounting plate 12, so that the rotary type rubber coating machine can rotate during the rubber coating, and more uniform rubber coating is realized on the surface of the wafer body 37.

The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims.

Claims

1. The utility model provides a centrifugal rubber coating mechanism, is including being used for carrying out fixed adsorption mechanism (3) to wafer semiconductor, be used for spraying and spraying adjustment mechanism (2) that the position adjusted to the rubber coating, its characterized in that: the wafer cleaning device further comprises a positioning mechanism (1) for coaxially adjusting the wafer semiconductor and the spray head, wherein the positioning mechanism (1) is arranged below the adjusting mechanism (2), and the adjusting mechanism (2) is arranged above the adsorbing mechanism (3);

positioning mechanism (1) is including lifting column (11), lifting column (11) set up the below of guiding mechanism (2), lifting column (11) are provided with two, lifting column (11)'s below is provided with mounting panel (12), the below of mounting panel (12) is encircleed and is provided with four upper wedge blocks (13), the intermediate position of mounting panel (12) is seted up porosely, and is provided with slip sleeve (14) in the downthehole, slip sleeve (14) below is provided with collar (15), the outside of collar (15) is encircleed and is provided with four slip frames (16), the inside of slip frame (16) all is provided with slide bar (17), be provided with down wedge block (18) on slide bar (17), down be provided with spring (19) between wedge block (18) with slide bar (17).

2. A centrifugal glue mechanism according to claim 1, wherein: adjustment mechanism (2) are including extension frame (21) including extension board (22), extension board (22) set up the top of lift post (11), the below of extension board (22) is provided with extension frame (21), the rotation hole has been seted up to the intermediate position of extension board (22), is connected with in the rotation hole and rotates packing element (23), the top one end of rotating packing element (23) is passed extension board (22), and be located the outside of rotating packing element (23) is provided with first gear (24), one side of first gear (24) is provided with driving motor (25), the output of driving motor (25) is provided with second gear (26), second gear (26) with be provided with drive gear between first gear (24), the other end of rotating packing element (23) is passed slide sleeve (14), just the output of rotating packing element (23) is provided with the shower nozzle, the top of extension board (22) is provided with two workbins (27), be provided with between workbin (27).

3. A centrifugal glue mechanism according to claim 2, wherein: the adsorption mechanism (3) comprises a base (31), the base (31) is arranged below the extension frame (21), a vacuum pump (32) is arranged below the base (31), an air pipe (33) is arranged at the output end of the vacuum pump (32), a control valve (34) is arranged outside the air pipe (33), four rubber bottom plates (35) are arranged above the base (31), sucking discs (36) are arranged between the four rubber bottom plates (35), the lower parts of the sucking discs (36) are connected with the other ends of the air pipes (33), and a wafer body (37) is arranged above the sucking discs (36).

4. A centrifugal glue mechanism according to claim 1, wherein: the upper wedge block (13) and the lower wedge block (18) are correspondingly arranged, the sliding sleeve (14) is in sliding connection with the mounting plate (12), the sliding frame (16) is fixedly connected with the mounting ring (15), and the mounting ring (15) is fixedly connected with the sliding sleeve (14).

5. A centrifugal glue mechanism according to claim 2, wherein: the rotary rubber cylinder (23) is rotationally connected with the support plate (22) and the sliding sleeve (14), and a rubber outlet pipe arranged between the feed boxes (27) is rotationally connected with the rotary rubber cylinder (23).

6. A centrifugal glue mechanism according to claim 3, wherein: the rotary rubber cylinder (23) and the mounting ring (15) are arranged on the same axis, and the rubber bottom plate (35) and the sliding sleeve (14) are arranged on the same axis.