CN210252873U - Die bonder - Google Patents

Die bonder Download PDF

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Publication number
CN210252873U
CN210252873U CN201920443218.2U CN201920443218U CN210252873U CN 210252873 U CN210252873 U CN 210252873U CN 201920443218 U CN201920443218 U CN 201920443218U CN 210252873 U CN210252873 U CN 210252873U
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CN
China
Prior art keywords
glue
workbench
movable platform
swing arm
disc
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Active
Application number
CN201920443218.2U
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Chinese (zh)
Inventor
王耀村
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Zhongshan Walxin Intelligent Technology Co Ltd
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Zhongshan Walxin Intelligent Technology Co Ltd
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Priority to CN201920443218.2U priority Critical patent/CN210252873U/en
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Abstract

The utility model discloses a solid brilliant machine, include: the LED support frame comprises a workbench, wherein a movable platform for placing an LED support frame is arranged on the workbench, the movable platform is connected with a first linear mechanism for driving the movable platform to reciprocate left and right and a second linear mechanism for driving the movable platform to reciprocate front and back, a first swing arm positioned above the movable platform is arranged on the workbench, at least two glue dispensing needles distributed side by side are arranged on the first swing arm, the first swing arm is connected with a first lifting mechanism for driving the first swing arm to lift, and a glue disc is arranged on one side of the first swing arm; the die bonder with the structure drives the LED chips on the LED support to move to the positions to be glued by the glue by the first linear mechanism and the second linear mechanism, meanwhile, each glue point needle is stained with glue on the glue tray and then aligns to the LED chips on the LED support to carry out glue dispensing operation, and the first swing arm can carry out glue dispensing fixation on the LED chips during single glue dispensing action, so that the glue dispensing efficiency of the die bonder is improved.

Description

Die bonder
Technical Field
The utility model relates to a LED technical field, especially a solid brilliant machine.
Background
The LED chip is required to be installed and fixed on a sheet-shaped LED support during manufacturing of the LED lamp, a die bonder is often used in the production process of fixing the LED chip, the die bonder mainly comprises two parts, one part is used for extracting the LED chip and placing the LED chip on the corresponding position of the LED support, and the other part is used for dispensing glue on the fixed position of the LED chip through a glue dispensing mechanism.
The existing die bonder has the following defects: 1. the common dispensing machine is only provided with a single dispensing head, so that the dispensing efficiency is low; 2. in the process of single dispensing operation, the amount of glue adhered to the dispensing head is uneven, so that part of the LED chips are easy to lack glue for fixation, and the glue on part of the LED chips is excessive; 3. the LED chip cannot be fixedly extracted in the process of extracting the LED chip, so that the LED chip cannot be mounted in a corresponding position on the LED support due to displacement deviation.
SUMMERY OF THE UTILITY MODEL
The utility model discloses lie in solving one of the technical problem that exists among the prior art at least, provide the higher solid brilliant machine of efficiency is glued to point.
The utility model discloses a technical scheme that the solution problem adopted is:
a die bonder includes: the LED support frame comprises a workbench, wherein a movable platform used for placing an LED support frame is arranged on the workbench, the movable platform is connected with a first linear mechanism driving the left and right reciprocating motion of the movable platform and a second linear mechanism driving the front and back reciprocating motion of the movable platform, a first swing arm positioned above the movable platform is arranged on the workbench, at least two glue dispensing needles distributed side by side are arranged on the first swing arm, the first swing arm is connected with a first lifting mechanism driving the lifting motion of the first swing arm, a glue tray used for placing glue is arranged on one side of the first swing arm, and the glue dispensing needles can move to the glue tray or the LED support frame on the movable platform along with the first swing arm. The die bonder with the structure drives the LED chips on the LED support to move to the positions to be glued by the glue by the first linear mechanism and the second linear mechanism, meanwhile, each glue point needle is stained with glue on the glue tray and then aligns to the LED chips on the LED support to carry out glue dispensing operation, and the first swing arm can carry out glue dispensing fixation on the LED chips during single glue dispensing action, so that the glue dispensing efficiency of the die bonder is improved.
Preferably, the glue disc is rotatably arranged on the workbench around a vertical rotating shaft, the workbench is provided with a scraping blade which extends downwards to the position near the disc surface of the glue disc, a height gap is formed between the scraping blade and the disc surface of the glue disc, and the scraping blade can rotate relative to the glue disc to form a glue layer with uniform thickness. In the process of dispensing operation of the die bonder, the glue tray keeps rotating, the scraping blade can scrape the surface of glue on the glue tray flat, the phenomenon that the glue amount of a certain position on the glue tray is too much or too little after the dispensing needle is contacted with the glue is avoided, the glue amount on the dispensing needle is enabled to be stable to a certain extent, and the stability of the quality of dispensing the LED chips is guaranteed.
Preferably, in order to realize the automatic production of the die bonder, a film disc located on one side of the movable platform is movably arranged on the workbench, the film disc is used for fixedly mounting a film with LED chips, the film disc is connected with a third linear mechanism driving the film disc to reciprocate left and right and a fourth linear mechanism driving the film disc to reciprocate front and back, an ejector pin mechanism used for jacking one of the LED chips on the film disc upwards is arranged below the film disc, a second swing arm is movably arranged on the workbench and used for grabbing the LED chip jacked by the ejector pin mechanism and conveying the LED chip onto an LED support on the movable platform.
Preferably, the thimble mechanism is fixedly arranged on a mounting frame, and an adjusting mechanism for adjusting the relative position of the mounting frame on the workbench is connected between the mounting frame and the workbench. The adjusting mechanism can align the ejector pins on the ejector pin mechanism to the grabbing part of the second swing arm, and the centering function is achieved.
Preferably, adjustment mechanism is including sliding seat that slides and set up on the workstation, the mounting bracket slides and sets up on the sliding seat, is equipped with on the workstation and links to each other in order to order about gliding lead screw mechanism around the sliding seat with the sliding seat, is equipped with on the sliding seat and links to each other in order to order about the gliding worm and worm-gear mechanism of mounting bracket horizontal with the mounting bracket.
Preferably, the thimble mechanism includes an eccentric wheel, the surface of eccentric wheel has a lift valve rod to the connection, and the top of this lift valve rod is equipped with a thimble, and the outside cover of lift valve rod is equipped with a sleeve, offers the perforation that lets the head that is located the thimble pass on the telescopic up end.
Preferably, the upper end surface of the sleeve is also provided with a plurality of air suction holes which are positioned around the through holes and communicated with the inside of the sleeve, and the sleeve is provided with an air suction device communicated with the inside of the sleeve.
The LED die fixing machine is characterized in that a first visual positioning system is arranged above the movable platform, a second visual positioning system is arranged above the film disc, the first visual positioning system and the second visual positioning system are electrically connected with an industrial personal computer of the die fixing machine, the first visual positioning system is used for positioning the position of an LED chip placed on the LED support, and the second visual positioning system is used for positioning the position of the LED chip on the film disc. The accuracy of the process of dispensing and the process of grabbing the LED chip can be ensured through the first visual positioning system and the second visual positioning system.
Preferably, the front end of the movable platform is connected with a feeding track matched with the width of the LED support, a first clamping and conveying mechanism located on one side of the feeding track is arranged on the workbench, and the first clamping and conveying mechanism can clamp the LED support and push the LED support backwards along the length direction of the feeding track. The structure can lead the die bonder to carry out continuous dispensing operation.
Preferably, the first linear mechanism and the second linear mechanism are linear motors, and the linear motors can improve the motion precision of the movable platform.
The utility model has the advantages that: the die bonder with the structure drives the movable platform to move by utilizing the first linear mechanism and the second linear mechanism so that the LED chips to be glued on the LED support are moved to the position below the first swing arm, meanwhile, each glue dispensing needle on the first swing arm is stained with glue on the glue tray, then each glue dispensing needle is aligned to the corresponding LED chip on the LED support to perform glue dispensing operation, the first swing arm can perform glue dispensing fixation on a plurality of LED chips during single glue dispensing action, and therefore the glue dispensing efficiency of the die bonder is greatly improved.
Drawings
The invention will be further explained with reference to the drawings and the detailed description.
Fig. 1 is a schematic structural diagram of an embodiment of the present invention;
FIG. 2 is a schematic view of the combination of the movable platform, the first linear mechanism, the second linear mechanism, the first clamping and conveying mechanism and the feeding track;
FIG. 3 is a schematic view of the combination of the first swing arm and the glue tray;
FIG. 4 is a schematic view of the combination of the second swing arm, the film tray, the ejector pin mechanism and the adjusting mechanism;
FIG. 5 is a schematic view of the combination of the ejector pin mechanism and the adjusting mechanism shown in FIG. 4;
FIG. 6 is a schematic structural view of the ejector pin mechanism with the sleeve removed;
fig. 7 is a schematic view of the structure of the sleeve.
Detailed Description
Referring to fig. 1 to 3, the utility model discloses a die bonder, include: workstation 10, be provided with a movable platform 2 that is used for placing the LED support on the workstation 10, movable platform 2 is connected with the first linear mechanism 21 of its left and right reciprocating motion of drive and the second linear mechanism 22 of its reciprocating motion, is equipped with the first swing arm 3 that is located movable platform 2 top on the workstation 10, is provided with two at least some glue needles 31 that distribute side by side on the first swing arm 3, and first swing arm 3 is connected with the first elevating system of its elevating system of drive, one side of first swing arm 3 is provided with the glue dish 4 that is used for placing glue, and some glue needles 31 can follow first swing arm 3 and remove to glue dish 4 or the LED support on the movable platform 2 in. The die bonder with the structure drives the movable platform 2 to move by utilizing the first linear mechanism 21 and the second linear mechanism 22 so that LED chips to be glued on the LED support are moved to the position below the first swing arm 3, meanwhile, glue is adhered to the glue disc 4 through the point glue needles 31 on the first swing arm 3, then the point glue needles 31 are aligned to the corresponding LED chips on the LED support to carry out glue dispensing operation, the first swing arm 3 can carry out glue dispensing fixation on the LED chips during single glue dispensing action, and therefore glue dispensing efficiency of the die bonder is greatly improved. Here, the feeding direction of the movable platform 2 is defined as a front-rear direction, and the first linear mechanism 21 and the second linear mechanism 22 are linear motors, which can improve the precision of the movement of the movable platform 2.
As the preferred embodiment of the present invention, the glue tray 4 rotates around a vertical rotation shaft and is disposed on the working table 10, the working table 10 is provided with the scraping blade 41 extending downward to the vicinity of the surface of the glue tray 4, a height gap is provided between the scraping blade 41 and the surface of the glue tray 4, the scraping blade 41 can rotate relative to the glue tray 4 to form a glue layer with uniform thickness. In the process of dispensing operation of the die bonder, the glue tray 4 keeps rotating, the scraping blade 41 can scrape the surface of the glue on the glue tray 4 flat, the phenomenon that the amount of glue at a certain position on the glue tray 4 is too much or too little after the dispensing needle 31 is contacted with the glue is avoided, the amount of glue on the dispensing needle 31 is stable to a certain extent, and the stability of the quality of dispensing the LED chips is guaranteed.
In order to realize the automatic production of the die bonder, a film disc 5 positioned on one side of the movable platform 2 is movably arranged on the workbench 10, the film disc 5 is used for fixedly mounting a film with LED chips, the film disc 5 is connected with a third linear mechanism 51 for driving the film disc to reciprocate left and right and a fourth linear mechanism 52 for driving the film disc to reciprocate back and forth, the third linear mechanism 51 and the fourth linear mechanism 52 are preferably linear motors, an ejector pin mechanism 70 for jacking one of the LED chips on the film disc is arranged below the film disc 5, a second swing arm 6 is movably arranged on the workbench 10, and the second swing arm 6 is used for grabbing the LED chip jacked by the ejector pin mechanism 70 and conveying the LED chip to an LED support on the movable platform 2. In this embodiment, the second swing arm 6 is provided with the air suction mechanism, and the LED chip is sucked up by the air suction mechanism, so that the LED chip is prevented from being damaged due to grabbing by the clamping mechanism.
Referring to fig. 5, 6 and 7, the thimble mechanism 70 includes an eccentric wheel 71, the eccentric wheel 71 is connected to a motor for driving the eccentric wheel 71 to rotate, a lifting valve rod 72 is abutted to the surface of the eccentric wheel 71, a spring for driving the lifting valve rod 72 to return is sleeved on the lifting valve rod 72, a thimble 73 is disposed at the top of the lifting valve rod 72, a sleeve 74 is sleeved outside the lifting valve rod 72, and a through hole 741 allowing the head of the thimble 73 to pass through is formed in the upper end surface of the sleeve 74. The eccentric wheel 71 is driven to rotate through the rotation of the motor, when the eccentric wheel 71 drives the lifting valve rod 72 to ascend, so that the thimble 73 extends upwards out of the through hole, the thimble 73 jacks up one of the LED chips from the bottom surface of the diaphragm, and then the second swing arm 6 is used for sucking up the LED chips.
More preferably, the upper end surface of the sleeve 74 is further provided with a plurality of suction holes 742 which are positioned around the through hole 741 and communicate with the interior of the sleeve 74, and the sleeve 74 is provided with a suction device which communicates with the interior thereof. When the thimble lifts up an LED chip, the other area of the diaphragm outside the LED chip is attracted to the suction hole 742 of the sleeve 74, so as to prevent the other LED chips from being separated from the diaphragm when the second swing arm 6 grabs the LED chip.
In some embodiments of the present invention, the ejector pin mechanism 70 is fixedly disposed on a mounting frame, and an adjusting mechanism 80 for adjusting the relative position of the mounting frame on the working table 10 is connected between the mounting frame and the working table 10. The adjusting mechanism 80 can align the thimble 73 on the thimble mechanism 70 with the grabbing part of the second swing arm 6, so as to realize the centering function.
Referring to fig. 4 and 5, in the present embodiment, the adjusting mechanism 80 includes a sliding seat 83 slidably disposed on the worktable 10, the mounting bracket is slidably disposed on the sliding seat, a screw rod mechanism 81 connected to the sliding seat for driving the sliding seat to slide back and forth is disposed on the worktable 10, a worm and worm gear mechanism 82 connected to the mounting bracket for driving the mounting bracket to slide left and right is disposed on the sliding seat, the rotating worm can drive the worm gear to rotate, an external thread is disposed on the rotating shaft of the worm gear, and a threaded hole matched with the external thread is disposed on the mounting bracket for driving the mounting bracket to slide left and right relative to the sliding seat.
Further preferably, a first visual positioning system 91 is arranged above the movable platform 2, a second visual positioning system 92 is arranged above the film disc 5, the first visual positioning system 91 and the second visual positioning system 92 are electrically connected with an industrial personal computer of the die bonder, the first visual positioning system 91 is used for positioning the position of an LED chip placed on the LED support, and the second visual positioning system 92 is used for positioning the position of the LED chip on the film disc 5. The accuracy of the dispensing process and the LED chip grabbing process can be ensured by the first visual positioning system 91 and the second visual positioning system 92.
Preferably, the front end of the movable platform 2 is connected with a feeding track 23 adapted to the width of the LED support, the workbench 10 is provided with a first clamping and conveying mechanism 24 located on one side of the feeding track 23, and the first clamping and conveying mechanism 24 can clamp the LED support and push the LED support backwards along the length direction of the feeding track 23. During the glue dispensing operation, the first swing arm 3 swings to a fixed position, then the first lifting mechanism drives the glue dispensing needle 31 to move downwards to complete the glue dispensing, the first swing arm 3 drives the glue dispensing needle 31 to reset, then the movable platform 2 utilizes the matching motion of the first linear mechanism 21 and the second linear mechanism 22 to move the LED support on the movable platform 2 to the position needing the glue dispensing, the first swing arm 3 carries out the glue dispensing operation again, when the moving distance of the movable platform 2 exceeds the stroke range of the first linear mechanism 21 and the second linear mechanism 22, the first clamping and conveying mechanism 24 clamps the LED support and pushes the LED support backwards along the length direction of the feeding track 23, and then the first clamping and conveying mechanism 24 resets, so that the die bonder can carry out the continuous glue dispensing operation.
The above is only the preferred embodiment of the present invention, not limiting the patent scope of the present invention, all of which are under the concept of the present invention, the equivalent structure transformation made by the contents of the specification and the drawings is utilized, or the direct or indirect application is included in other related technical fields in the patent protection scope of the present invention.

Claims (10)

1. A die bonder, comprising:
the LED support frame comprises a workbench, wherein a movable platform used for placing an LED support frame is arranged on the workbench, the movable platform is connected with a first linear mechanism driving the left and right reciprocating motion of the movable platform and a second linear mechanism driving the front and back reciprocating motion of the movable platform, a first swing arm positioned above the movable platform is arranged on the workbench, at least two glue dispensing needles distributed side by side are arranged on the first swing arm, the first swing arm is connected with a first lifting mechanism driving the lifting motion of the first swing arm, a glue tray used for placing glue is arranged on one side of the first swing arm, and the glue dispensing needles can move to the glue tray or the LED support frame on the movable platform along with the first swing arm.
2. The die bonder of claim 1, wherein:
the glue disc is characterized in that the glue disc is rotatably arranged on the workbench around a vertical rotating shaft, a scraping piece which extends downwards to the position near the disc surface of the glue disc is arranged on the workbench, a height gap is formed between the scraping piece and the disc surface of the glue disc, and the scraping piece can rotate relative to the glue disc to form a glue layer with uniform thickness.
3. The die bonder of claim 1, wherein:
the LED film forming machine is characterized in that a film disc located on one side of the movable platform is movably arranged on the workbench, the film disc is used for fixedly mounting a film with LED chips, the film disc is connected with a third linear mechanism for driving the film disc to reciprocate left and right and a fourth linear mechanism for driving the film disc to reciprocate front and back, an ejector pin mechanism used for upwards jacking one of the LED chips on the film disc is arranged below the film disc, a second swing arm is movably arranged on the workbench and used for grabbing the LED chip jacked by the ejector pin mechanism and conveying the LED chip onto an LED support on the movable platform.
4. A die bonder as claimed in claim 3, characterized in that:
the thimble mechanism is fixedly arranged on a mounting frame, and an adjusting mechanism for adjusting the relative position of the mounting frame on the workbench is connected between the mounting frame and the workbench.
5. The die bonder of claim 4, wherein:
the adjusting mechanism comprises a sliding seat arranged on the workbench in a sliding mode, the mounting frame is arranged on the sliding seat in a sliding mode, a screw rod mechanism which is connected with the sliding seat and used for driving the sliding seat to slide back and forth is arranged on the workbench, and a worm and worm gear mechanism which is connected with the mounting frame and used for driving the mounting frame to slide left and right is arranged on the sliding seat.
6. A die bonder as claimed in claim 3, characterized in that:
the thimble mechanism comprises an eccentric wheel, a lifting valve rod is abutted to the surface of the eccentric wheel, a thimble is arranged at the top of the lifting valve rod, a sleeve is sleeved outside the lifting valve rod, and a through hole allowing the head of the thimble to penetrate is formed in the upper end face of the sleeve.
7. The die bonder of claim 6, wherein:
the upper end surface of the sleeve is also provided with a plurality of air suction holes which are positioned around the through holes and communicated with the interior of the sleeve, and the sleeve is provided with an air suction device communicated with the interior of the sleeve.
8. A die bonder as claimed in claim 3, characterized in that:
the LED die fixing machine is characterized in that a first visual positioning system is arranged above the movable platform, a second visual positioning system is arranged above the film disc, the first visual positioning system and the second visual positioning system are electrically connected with an industrial personal computer of the die fixing machine, the first visual positioning system is used for positioning the position of an LED chip placed on the LED support, and the second visual positioning system is used for positioning the position of the LED chip on the film disc.
9. The die bonder of claim 1, wherein:
the front end of the movable platform is connected with a feeding track matched with the width of the LED support, a first clamping and conveying mechanism located on one side of the feeding track is arranged on the workbench, and the first clamping and conveying mechanism can clamp the LED support and push the LED support backwards along the length direction of the feeding track.
10. The die bonder of claim 1, wherein:
the first linear mechanism and the second linear mechanism are linear motors.
CN201920443218.2U 2019-04-01 2019-04-01 Die bonder Active CN210252873U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920443218.2U CN210252873U (en) 2019-04-01 2019-04-01 Die bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920443218.2U CN210252873U (en) 2019-04-01 2019-04-01 Die bonder

Publications (1)

Publication Number Publication Date
CN210252873U true CN210252873U (en) 2020-04-07

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ID=70021476

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920443218.2U Active CN210252873U (en) 2019-04-01 2019-04-01 Die bonder

Country Status (1)

Country Link
CN (1) CN210252873U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111769055A (en) * 2020-07-09 2020-10-13 深圳新益昌科技股份有限公司 Crystal supplementing equipment for oversized substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111769055A (en) * 2020-07-09 2020-10-13 深圳新益昌科技股份有限公司 Crystal supplementing equipment for oversized substrate

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