CN220292252U

CN220292252U - Bearing type flexible substrate

Info

Publication number: CN220292252U
Application number: CN202322014447.1U
Authority: CN
Inventors: 陈后生
Original assignee: Guangdong Hangneng Circuit Technology Co ltd
Current assignee: Guangdong Hangneng Circuit Technology Co ltd
Priority date: 2023-07-28
Filing date: 2023-07-28
Publication date: 2024-01-02
Anticipated expiration: 2033-07-28

Abstract

The utility model discloses a bearing type flexible substrate, which comprises a flexible substrate body and a bearing table, wherein the top surface of the bearing table is provided with a plurality of clamping holes, the flexible substrate body comprises an FPC flexible board and a circuit layer positioned on the top surface of the FPC flexible board, and the bottom surface of the FPC flexible board is integrally formed with a plurality of clamping convex columns matched with the clamping holes in position; a through slot hole for heat dissipation is arranged in the bearing table; the flexible substrate body is combined with the bearing table, the buckling convex columns are clamped into the clamping holes for positioning, and a heat-conducting silica gel layer is arranged between the bearing table and the FPC flexible board. The flexible substrate is reasonably arranged, the flexible substrate body is matched with the bearing table, the convenience of combination is improved, the through slot holes for heat dissipation are formed in the bearing table, and the heat conducting silica gel layer is matched, so that the overall heat dissipation performance is improved, damage is not easy to occur, the use stability is improved, and the flexible substrate is high in applicability and good in practicability.

Description

Bearing type flexible substrate

Technical Field

The utility model belongs to the technical field of soft substrates, and particularly relates to a bearing type flexible substrate.

Background

The flexible substrate is an important component in the flexible LED strip, and in the prior art, if it is desired to fix the material substrate to the carrier substrate, it is generally necessary to use a chemical method such as an adhesive to provide adhesion between the material substrate and the carrier substrate. For example, an adhesive may be coated on the surface of the material substrate or the carrier substrate, or an adhesive layer (e.g., double-sided tape) may be provided on the surface of the material substrate or the carrier substrate, and then the material substrate and the carrier substrate may be bonded.

However, the manufacturing process using the above-described operation method is complicated, and has some drawbacks. For example, after the adhesive is coated on the surface of the carrier substrate, the subsequent process of disposing the material substrate on the surface of the carrier substrate coated with the adhesive needs to be precisely controlled so that the material substrate is precisely disposed on the carrier substrate. In addition, if the material substrate and the carrier substrate need to be separated from each other during the manufacturing process (i.e., the material substrate and the carrier substrate are only temporarily fixed to each other), a pulling force may need to be applied to the material substrate or the carrier substrate, which may easily cause damage to the material substrate, so that applicability and practicality are limited.

Disclosure of Invention

The utility model aims to provide a bearing type flexible substrate which is reasonable in structural arrangement and beneficial to improving use stability.

The technical scheme for achieving the purpose of the utility model is that the bearing type flexible substrate comprises a flexible substrate body and a bearing table, wherein the top surface of the bearing table is provided with a plurality of clamping holes, the flexible substrate body comprises an FPC flexible board and a circuit layer positioned on the top surface of the FPC flexible board, and the bottom surface of the FPC flexible board is integrally formed with a plurality of clamping convex columns matched with the clamping holes;

a through slot hole for heat dissipation is formed in the bearing table;

the flexible substrate body is combined with the bearing table, the clamping convex columns are clamped into the clamping holes for positioning, and a heat-conducting silica gel layer is arranged between the bearing table and the FPC flexible board.

Further preferred are: and a braiding layer is arranged between the FPC flexible board and the circuit layer, and the FPC flexible board, the braiding layer and the circuit layer are fixed through an adhesive layer.

Further preferred are: the edge of the bearing bench is provided with a clamping block which is rotatably connected through a pin shaft, the top of the side face of the clamping block is provided with a boss, and the clamping block rotates around the pin shaft and enables the boss to be buckled on the edge of the top face of the flexible substrate body for positioning.

Further preferred are: a plurality of reverse V-shaped buffer grooves with openings on the bottom surface are uniformly formed in the bearing table, and the reverse V-shaped buffer grooves are parallel to the through slotted holes.

Further preferred are: the surface of the bearing table is fixedly provided with an antistatic film layer.

The utility model has the positive effects that: the flexible substrate is provided with the flexible substrate body, the flexible substrate body is matched with the bearing table, the flexible substrate body and the bearing table are positioned through the buckles, so that the convenience of combination is improved, the bearing table is provided with the through slot holes for heat dissipation, the heat conducting silica gel layer is matched, the overall heat dissipation performance is improved, the damage is not easy to cause, the use stability is improved, and the flexible substrate is high in applicability and good in practicability.

Drawings

In order that the utility model may be more readily understood, a more particular description of the utility model will be rendered by reference to specific embodiments that are illustrated in the appended drawings, in which:

fig. 1 is a schematic structural view of the present utility model.

Reference numerals: the flexible substrate comprises a flexible substrate body 1, an FPC flexible board 11, a circuit layer 12, a bearing bench 2, a clamping hole 3, a clamping convex column 4, a through slot 5, a heat conduction silica gel layer 6, a weaving layer 7, a pin shaft 8, a clamping block 9, a boss 10, an inverted V-shaped buffer groove 13 and an antistatic film layer 14.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Example 1

Referring to fig. 1, a bearing type flexible substrate comprises a flexible substrate body 1 and a bearing table 2, wherein the top surface of the bearing table is provided with a plurality of clamping holes 3, the flexible substrate body 1 comprises an FPC flexible board 11 and a circuit layer 12 positioned on the top surface of the FPC flexible board, and the bottom surface of the FPC flexible board is integrally formed with a plurality of clamping convex columns 4 matched with the clamping holes; the size of the clamping convex column is the same as that of the clamping hole, and the length of the clamping convex column is the same as the thickness of the bearing table, so that the convenience of assembly can be improved during assembly,

a through slot 5 for heat dissipation is arranged in the bearing table; the flexible substrate body is combined with the bearing table, the clamping convex columns are clamped into the clamping holes for positioning, and a heat-conducting silica gel layer 6 is arranged between the bearing table and the FPC flexible board. In this embodiment, its flexible substrate body is the same with the size of plummer, also can not cause the damage when the dismouting moreover, is favorable to improving holistic use stationarity and reliability, and simultaneously, its heat conduction silica gel layer cooperation is used for radiating link up the slotted hole, also can improve holistic heat dispersion to be favorable to improving flexible substrate body's life, the practicality is good.

In the practical application process, a braiding layer 7 is arranged between the FPC flexible board and the circuit layer, and the FPC flexible board, the braiding layer and the circuit layer are fixed through an adhesive layer. The strength of the whole flexible substrate body can be ensured through the braiding layer, and damage is prevented.

In the practical application process, in order to better improve overall stability and reliability, the border of plummer is through round pin 8 rotatable coupling's buckle piece 9, the side top of buckle piece is provided with boss 10, the buckle piece is rotatory and makes the boss keep out in the top surface border location of flexible substrate body as the center with the round pin axle. After the assembly, the edge can be buckled through the structure, so that loosening or displacement is prevented, and the overall use stability and reliability are improved.

A plurality of reverse V-shaped buffer grooves 13 with openings on the bottom surface are uniformly formed in the bearing table, and the reverse V-shaped buffer grooves are parallel to the through slotted holes. The surface of the bearing table is fixedly provided with an antistatic film layer 14. The reverse V-shaped buffer groove is arranged, so that the bearing performance of the bearing table tool can be improved, and the antistatic film layer is favorable for improving the overall antistatic performance, and the practicability is good.

The flexible substrate is provided with the flexible substrate body, the flexible substrate body is matched with the bearing table, the flexible substrate body and the bearing table are positioned through the buckles, so that the convenience of combination is improved, the bearing table is provided with the through slot holes for heat dissipation, the heat conducting silica gel layer is matched, the overall heat dissipation performance is improved, the damage is not easy to cause, the use stability is improved, and the flexible substrate is high in applicability and good in practicability.

The standard components used in this embodiment may be purchased directly from the market, but the nonstandard structural components described in the specification may also be obtained directly by unambiguous processing according to the common general knowledge in the prior art, and meanwhile, the connection manner of each component adopts the conventional means mature in the prior art, and the machinery, the components and the equipment all adopt the conventional types in the prior art, so that no specific description will be made here.

It is to be understood that the above examples of the present utility model are provided by way of illustration only and not by way of limitation of the embodiments of the present utility model. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. While those obvious variations or modifications which come within the spirit of the utility model remain within the scope of the utility model.

Claims

1. The utility model provides a bear formula flexible substrate, includes flexible substrate body and plummer, its characterized in that: the top surface of the bearing table is provided with a plurality of clamping holes, the flexible substrate body comprises an FPC flexible board and a circuit layer positioned on the top surface of the FPC flexible board, and the bottom surface of the FPC flexible board is integrally formed with a plurality of clamping convex columns matched with the clamping holes;

a through slot hole for heat dissipation is formed in the bearing table;

2. The carrier flexible substrate of claim 1, wherein: and a braiding layer is arranged between the FPC flexible board and the circuit layer, and the FPC flexible board, the braiding layer and the circuit layer are fixed through an adhesive layer.

3. The carrier flexible substrate of claim 2, wherein: the edge of the bearing bench is provided with a clamping block which is rotatably connected through a pin shaft, the top of the side face of the clamping block is provided with a boss, and the clamping block rotates around the pin shaft and enables the boss to be buckled on the edge of the top face of the flexible substrate body for positioning.

4. A carrier flexible substrate according to claim 3, wherein: a plurality of reverse V-shaped buffer grooves with openings on the bottom surface are uniformly formed in the bearing table, and the reverse V-shaped buffer grooves are parallel to the through slotted holes.

5. The carrier flexible substrate of claim 4, wherein: the surface of the bearing table is fixedly provided with an antistatic film layer.