CN217643907U

CN217643907U - Substrate fixing carrier

Info

Publication number: CN217643907U
Application number: CN202221056673.5U
Authority: CN
Inventors: 冯玉峰; 罗淦; 张晓婕
Original assignee: Shenzhen Zhenhua Microelectronics Co Ltd
Current assignee: Shenzhen Zhenhua Microelectronics Co Ltd
Priority date: 2022-04-29
Filing date: 2022-04-29
Publication date: 2022-10-21
Anticipated expiration: 2032-04-29

Abstract

The utility model provides a carrier is fixed to base plate, including base and multiunit setting element, the base has the installation face and the contact surface of relative setting, multiunit the setting element is located on the base, and the multiunit the setting element can inlay and be in form confined fixed area on the installation face. The size and the shape of the fixed area can be adjusted as required by the positioning piece, the processing period and the processing cost of the carrier can be effectively reduced, the cost for managing various carriers can be reduced, the urgent demand of a production field can be met, the limitation of the shape of the substrate is avoided during use, and the positioning piece is more convenient and fast.

Description

Substrate fixing carrier

Technical Field

The utility model belongs to the technical field of the circuit welding, especially, relate to a carrier is fixed to base plate.

Background

The thick film bonding wire process realizes the electrical interconnection function of elements of microelectronic products and printed substrates, and is widely applied in the field of microelectronics. The existing substrate carrier can not be used for general regular or irregular products, a special carrier is designed for each product, the cost is high, the special carrier needs to be replaced when different substrates are processed, the time consumption is long, the processing efficiency can be reduced, and the substrate carrier is inconvenient to use in a production line.

SUMMERY OF THE UTILITY MODEL

In view of the above problem, the utility model provides a carrier is fixed to base plate, include:

the base is provided with a mounting surface and a contact surface which are oppositely arranged;

and the plurality of groups of positioning pieces are arranged on the base and can be embedded and arranged on the mounting surface to form a closed fixing area.

In an embodiment of the present invention, the positioning element includes a clamping end and a connecting groove matched with the edge shape of the clamping end, the clamping end can be located in the connecting groove, so as to make the multiple positioning elements mutually embedded.

In an embodiment of the present invention, the substrate fixing carrier further includes a sealing member, the base has a through hole, and the sealing member is disposed on the mounting surface and can block the through hole.

In an embodiment of the present invention, the sealing member has at least two sets, at least two sets of the sealing member are detachably disposed on the mounting surface, and at least two sets of the sealing member abut against each other at the edge.

In an embodiment of the present invention, the substrate fixing carrier further includes a back plate, the back plate is disposed on the contact surface, and the back plate is provided with a through groove communicated with the through hole.

The utility model discloses an in one embodiment, the through-hole has the multiunit, just the multiunit through-hole is in the installation face is evenly arranged, it follows to lead to the groove the width direction of base is seted up and is corresponded with the multiunit the through-hole position.

In an embodiment of the present invention, along the length direction of the base, the two ends of the back plate are aligned with the two ends of the base, and along the width direction of the base, the width of the back plate is smaller than the width of the base.

The utility model discloses an in one embodiment, the base is seted up flutedly, the multiunit the setting element is located in the recess and with recess bottom butt, the through-hole is seted up in the grooved underside.

In an embodiment of the present invention, the substrate fixing carrier further includes an identification member, the identification member is disposed on the base and the identification member is disposed outside the groove.

In an embodiment of the present invention, the base has a fixing groove, and the identification member is disposed in the fixing groove.

Implement the embodiment of the utility model provides a, will have following beneficial effect at least:

the size and the shape of the fixing area can be adjusted according to needs by the positioning piece, the processing period and the processing cost of the carriers can be effectively reduced, the cost for managing various carriers can also be reduced, and the urgent demand of a production field can be met. The base plate fixing carrier is provided with the through hole and the through groove, the through hole and the through groove can form a vacuum channel for adsorbing a base plate, the sealing element can block or expose the vacuum channel according to requirements, the base plate fixing carrier is not limited by the shape of the base plate during use, and the base plate fixing carrier is more convenient and fast.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic view of a portion of a substrate mounting carrier according to an embodiment;

FIG. 2 is a schematic diagram illustrating a portion of a substrate-holding carrier according to an embodiment;

FIG. 3 is a schematic view of an embodiment of a substrate fixing carrier;

fig. 4 is a schematic view of an overall structure of the substrate fixing carrier according to an embodiment.

In the figure: 1. a substrate fixing carrier; 100. a base; 101. a fixed area; 102. a mounting surface; 103. a contact surface; 110. a groove; 111. a through hole; 120. fixing grooves; 130. positioning holes; 200. a positioning member; 210. connecting grooves; 220. clamping the end; 300. a seal member; 400. a back plate; 401. a through groove; 500. an identification member; 600. a substrate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that all directional indicators (such as upper, lower, left, right, front, and rear … …) in the embodiments of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit ly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory to each other or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a substrate fixing carrier 1, which includes a base 100 and a plurality of sets. The base 100 is substantially a plate-shaped structure and has a mounting surface 102 and a contact surface 103 which are oppositely arranged, the positioning members 200 have a plurality of sets which can be mutually embedded, and the plurality of sets of positioning members 200 can be embedded and form a closed fixing area 101 on the mounting surface 102. The substrate 600 may be disposed in the fixing region 101 and abut against the edges of the plurality of sets of positioning elements 200, respectively.

Further, the positioning member 200 is substantially a plate-shaped structure having a protrusion and a depression, the positioning member 200 is disposed on the mounting surface 102, in some embodiments, the positioning member 200 can be adhered to the mounting surface 102 by using double-sided glue, and in other embodiments, the positioning member 200 can be magnetically fixed to the mounting surface 102.

Referring to fig. 1, the positioning element 200 includes a locking end 220 and a connecting groove 210 matching with the edge shape of the locking end 220, and the locking end 220 can be disposed in the connecting groove 210, so that multiple sets of positioning elements 200 can be engaged with each other.

Further, in a plane parallel to the mounting surface 102, the latching end 220 protrudes away from the center of the positioning member 200, the connecting groove 210 is recessed toward the center of the positioning member 200, and the edge shape of the latching end 220 matches with the edge shape of the connecting groove 210.

Further, the shape of the locking end 220 is a structure that gradually narrows from a position far away from the center of the positioning member 200 to a position close to the center of the positioning member 200, and the shape of the connecting slot 210 can be matched with the locking end 220, so that the plurality of sets of positioning members 200 can be connected tightly and are not easy to fall off.

Further, in the direction perpendicular to the mounting surface 102, the positioning members 200 may be overlapped with each other to increase the thickness, so that the total thickness of the overlapped positioning members 200 is greater than or equal to the thickness of the edge of the substrate 600, and the substrate 600 is ensured to be fixed in the fixing area 101 surrounded by the plurality of positioning members 200.

Further, the substrate fixing carrier 1 further includes a sealing member 300, the base 100 has a through hole 111, and the sealing member 300 is disposed on the mounting surface 102 and can block the through hole 111.

Referring to fig. 1-2, the substrate fixing carrier 1 further includes a back plate 400, the back plate 400 is disposed on the contact surface 103, and the back plate 400 is provided with a through groove 401 communicating with the through hole 111. The two ends of the back plate 400 are aligned with the two ends of the base 100 along the length direction of the base 100, and the width of the back plate 400 is smaller than the width of the base 100 along the width direction of the base 100. So that two sets of limit platforms are arranged between the back plate 400 and the base 100, and the vacuum machine can be clamped on the limit platforms when the vacuum machine is installed, so that the position is fixed, and the operation is more stable during air suction.

Further, in some embodiments, the back plate 400 protrudes away from the base plate 100 along the thickness direction of the base plate 100, so that a certain distance is formed between the back plate 400 and the base plate 100, and the space of the vacuum channel is increased. In other embodiments, the backing plate 400 and the base 100 are tightly attached, and the edges of the backing plate 400 and the base 100 are integrally formed, so as to facilitate the processing of the substrate fixing carrier 1.

Further, the through holes 111 have multiple sets, the multiple sets of through holes 111 are respectively arranged in parallel along the length direction of the chassis 100 and the width direction of the chassis 100, the through slots 401 are approximately rectangular along the width direction of the chassis 100, the through slots 401 have multiple sets, and the multiple sets of through slots 401 are mutually communicated and correspond to the positions of the multiple sets of through holes 111. When the vacuum machine is attached to the through groove 401 and air is pumped out, since the through holes 111 at the positions other than the positions covered by the substrate 600 are all blocked by the sealing member 300, air flow can only flow from the through holes 111 covered by the substrate 600 to the through groove 401, so that the substrate 600 is compressed in the fixing region 101 for further processing operation.

Referring to fig. 3, the sealing members 300 have at least two sets, at least two sets of sealing members 300 are detachably disposed on the mounting surface 102, and edges of at least two sets of sealing members 300 are abutted to each other.

Preferably, the seal 300 is a high temperature resistant tape. When in use, the high-temperature resistant adhesive tape can bear high temperature generated in welding without damage, and the good sealing performance of the substrate fixing carrier 1 is ensured.

Further, along the thickness direction of the base 100, the mounting surface 102 of the base 100 is provided with a groove 110, and the size of the groove 110 is larger than the size of the largest-sized substrate 600 in use. The plurality of sets of positioning members 200 are disposed in the recess 110 and abut against the bottom of the recess 110. In some embodiments, the sets of positioning members 200 can be adhered to the bottom of the recess 110 by using double-faced adhesive, and in other embodiments, the sets of positioning members 200 can be magnetically fixed to the bottom of the recess 110.

Furthermore, the through hole 111 is formed at the bottom of the groove 110, the sealing element 300 is disposed in the groove 110 and can seal the through hole 111, when the positioning element 200 encloses the fixing region 101, the sealing element 300 in the fixing region 101 can be removed from the bottom of the groove 110 to expose the through hole 111, the back plate 400 is disposed on the side surface of the base 100 away from the groove 110, and the back plate 400 is provided with a through groove 401 communicated with the through hole 111. The through holes 111 and the through grooves 401 formed on the back plate 400 may form a vacuum channel, and after the substrate 600 is placed in the fixing region 101, the vacuum machine is turned on and air is pumped out through the vacuum channel, and the substrate 600 may be adsorbed at the bottom of the groove 110 of the base 100 under the action of air pressure.

Referring to fig. 3, the substrate fixing carrier 1 further includes an identifier 500, wherein the identifier 500 is disposed on the base 100 and the identifier 500 is disposed outside the groove 110. In some embodiments, the identifier 500 is a plate-shaped structure provided with a two-dimensional code, and when the substrate fixing carrier 1 moves to the fixed position of the production line, the information stored in the identifier 500 can be identified to read the related information of the substrate fixing carrier 1.

Further, the base 100 is formed with a fixing groove 120, and the identification member 500 may be disposed in the fixing groove 120. In some embodiments, the fixing grooves 120 include two sets of fixing grooves 120, and the two sets of fixing grooves 120 are respectively disposed on two opposite sides of the base 100 along the length direction of the base 100, and the two sets of identification members 500 respectively disposed in the fixing grooves 120 include different information for determining the placement direction of the substrate fixing carrier 1

Further, referring to fig. 1, the base 100 further has a positioning hole 130, and the assembly line guide rail has a fixing block corresponding to the positioning hole 130, and the fixing block can be disposed in the positioning hole 130, so that the substrate fixing carrier 1 is disposed at a fixed position of the assembly line.

The specific operation flow of an embodiment of the present application is as follows:

first, the number of sets and the mounting positions of the spacers 200 in the recess 110 are adjusted according to the shape of the substrate 600 to be processed, and the inner sides of the plurality of sets of spacers 200 can be respectively abutted against the edges of the substrate 600 to be processed, so that the position of the substrate 600 is fixed. Then, the substrate 600 is removed, the sealing element 300 in the fixing area 101 formed by mutually engaging and enclosing the plurality of sets of positioning elements 200 is removed, and when the sealing element 300 is a high temperature resistant adhesive tape, a relatively sharp tool can be used to directly cut the adhesive tape so as to expose the through hole 111 in the fixing area 101. The through hole 111 and the through groove 401 formed on the back plate 400 can form a vacuum channel, when the substrate 600 is placed in the fixing area 101, the vacuum machine is started and air is pumped out through the vacuum channel, the substrate 600 can be adsorbed at the bottom of the groove 110 of the base 100 under the action of air pressure, and then the positioning piece 200 can be taken down firstly and then the welding operation can be carried out, or the welding operation can be directly carried out. When the soldering is completed, the vacuum machine is turned off, and the substrate 600 can be removed from the substrate fixing carrier 1 and processed in the next step.

In the application, the size and the shape of the fixing area 101 can be adjusted by the positioning element 200 as required, so that the processing period and the processing cost of the carrier can be effectively reduced, the cost for managing various carriers can be reduced, the urgent requirement of a production field can be met, the limitation of the shape of the substrate 600 is avoided during use, and the positioning element is more convenient and fast.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the invention, which is defined by the appended claims.

Claims

1. A substrate fixing carrier is characterized by comprising:

2. The substrate holding carrier of claim 1, wherein: the locating piece includes that the card establishes the end and with the card establishes the edge shape complex spread groove of end, the card establishes the end can locate in the spread groove to make mutual gomphosis between the multiunit locating piece.

3. The substrate holding carrier of claim 1, wherein: the substrate fixing carrier further comprises a sealing element, the base is provided with a through hole, and the sealing element is arranged on the mounting surface and can block the through hole.

4. The substrate holding carrier of claim 3, wherein: the sealing elements are provided with at least two groups, the sealing elements are detachably arranged on the mounting surface, and the edges of the sealing elements are mutually abutted.

5. The substrate holding carrier of claim 3, wherein: the substrate fixing carrier further comprises a back plate, the back plate is arranged on the contact surface, and the back plate is provided with a through groove communicated with the through hole.

6. The substrate fixing carrier according to claim 5, wherein: the through holes are provided with a plurality of groups, the through holes are uniformly distributed on the mounting surface, and the through grooves are formed in the width direction of the base and correspond to the through holes in the groups.

7. The substrate holding carrier of claim 5, wherein: the width of the backboard is smaller than the width of the base along the width direction of the base.

8. The substrate holding carrier of claim 3, wherein: the base is provided with a groove, a plurality of groups of positioning pieces are arranged in the groove and are abutted against the bottom of the groove, and the through hole is formed in the bottom surface of the groove.

9. The substrate fixing carrier according to claim 1, wherein: the substrate fixing carrier further comprises a recognition piece, and the recognition piece is arranged on the base.

10. The substrate holding carrier of claim 9, wherein: the base is provided with a fixing groove, and the identification piece is arranged in the fixing groove.