CN220272493U - LED wafer box clamping device - Google Patents
LED wafer box clamping device Download PDFInfo
- Publication number
- CN220272493U CN220272493U CN202320954895.7U CN202320954895U CN220272493U CN 220272493 U CN220272493 U CN 220272493U CN 202320954895 U CN202320954895 U CN 202320954895U CN 220272493 U CN220272493 U CN 220272493U
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- Prior art keywords
- stop block
- clamping
- bracket
- led wafer
- far away
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- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000001259 photo etching Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to the field of LED wafer processing, in particular to an LED wafer box clamping device, which comprises two clamping jaws, wherein one ends of the two clamping jaws are mutually hinged; the clamping jaw comprises a bracket, a first stop block, a second stop block and a third stop block, and one side of the bracket, which is close to the bracket of the other clamping jaw, is a straight surface; one end of the bracket, which is far away from the hinge joint of the clamping jaw, is provided with a first stop block protruding from the straight surface, and the other end of the bracket is provided with a second stop block protruding from the straight surface; the second stop block is provided with a third stop block protruding in the height direction, and one end of the third stop block, which is far away from the second stop block, extends towards the first stop block; the two second stop blocks are hinged with each other at one end far away from the respective brackets. When clamping, the straight surface of the bracket is attached to the side surface of the wafer box, the front side and the rear side of the wafer box are clamped by the first stop block and the second stop block, the convex edge on the upper side of the wafer box is pressed by the third stop block, so that the clamping of multiple points is formed, and the clamping is more stable.
Description
Technical Field
The utility model relates to the field of LED wafer processing, in particular to an LED wafer box clamping device.
Background
In the semiconductor production process, photoetching is a crucial process link, and the quality of the gluing process directly influences the photoetching quality. In the photoresist coating process, most of the photoresist used is hydrophobic, while the hydroxyl groups and residual water molecules on the surface of the wafer are hydrophilic, if the photoresist is directly coated on the surface of the wafer, poor adhesion between the photoresist and the wafer and even local gaps or bubbles are caused, and the thickness and uniformity of the photoresist coating are affected, so that the photoetching effect and development are affected. Therefore, HMDS is adopted before gluing, and after the HMDS is coated on the surface of the silicon wafer, a compound with siloxane as a theme can be generated by heating and reacting so as to change the surface of the silicon wafer from hydrophilic to hydrophobic.
During normal operation, the high-temperature wafer box and the wafer are put into a special oven together for 150-200 ℃ baking operation, and the next working procedure operation is performed after the baking is finished and cooling is performed. However, the operation efficiency is seriously affected by the temperature rise and fall each time, so that the baked high-temperature wafer box needs to be directly taken out to the next working procedure for cooling.
The clamping of the existing high-temperature wafer box does not have a special tool, the wafer box cannot be effectively fixed, the phenomenon of loosening during extraction exists, and the wafer box is damaged after falling.
Disclosure of Invention
The technical problems to be solved by the utility model are as follows: a clamping device for clamping a stable LED wafer box is provided.
In order to solve the technical problems, the utility model adopts the following technical scheme: the LED wafer box clamping device comprises two clamping jaws, wherein one ends of the two clamping jaws are hinged with each other; the clamping jaw comprises a bracket, a first stop block, a second stop block and a third stop block, and one side of the bracket, which is close to the bracket of the other clamping jaw, is a straight surface; one end of the bracket, which is far away from the hinge joint of the clamping jaw, is provided with a first stop block protruding from the straight surface, and the other end of the bracket is provided with a second stop block protruding from the straight surface; the second stop block is provided with a third stop block protruding in the height direction, and one end of the third stop block, which is far away from the second stop block, extends towards the first stop block; the two second stop blocks are hinged with each other at one end far away from the respective brackets.
Further, a plurality of anti-skid grooves are arranged on the flat surface.
Further, the clamping jaw further comprises a hinge rod, and one end, far away from the bracket, of the second stop block is provided with the hinge rod; one end of each hinge rod far away from the corresponding second stop block is hinged with each other.
Further, the device also comprises a handle, and one end of the hinging rod, which is far away from the second stop block, is connected with the handle.
Further, a buffer strip is arranged on the handle.
Further, the device also comprises a spring, and the spring is connected between the hinging rod and the handle corresponding to the other hinging rod.
Further, a first clamping hook is arranged on one side, opposite to the handle, of the other hinge rod, a second clamping hook is arranged on the handle, corresponding to the other hinge rod, of the hinge rod, and two ends of the spring are respectively connected with the first clamping hook and the second clamping hook.
The utility model has the beneficial effects that: when clamping, the straight surface of the bracket is attached to the side surface of the wafer box, the front side and the rear side of the wafer box are clamped by the first stop block and the second stop block, the convex edge on the upper side of the wafer box is pressed by the third stop block, so that the clamping of multiple points is formed, and the clamping is more stable.
Drawings
FIG. 1 is a schematic view of an LED wafer cassette clamping device according to an embodiment of the present utility model;
FIG. 2 is a schematic view of a wafer cassette;
FIG. 3 is a top view of an LED wafer cassette clamping device according to an embodiment of the present utility model;
FIG. 4 is a side view of an LED wafer cassette clamping device according to an embodiment of the present utility model;
fig. 5 is a front view of a bracket, a first stop, a second stop, and a third stop of an LED wafer cassette clamping device according to an embodiment of the present utility model.
Description of the reference numerals:
1. a clamping jaw; 11. a bracket; 111. a flat surface; 112. an anti-skid groove; 12. a first stopper; 13. a second stopper; 14. a third stopper; 15. a hinge rod; 2. a handle; 21. a buffer strip; 3. and (3) a spring.
Detailed Description
In order to describe the technical contents, the achieved objects and effects of the present utility model in detail, the following description will be made with reference to the embodiments in conjunction with the accompanying drawings.
Referring to fig. 1 to 5, an LED wafer cassette clamping device includes two clamping jaws 1, wherein one ends of the two clamping jaws 1 are hinged to each other; the clamping jaw 1 comprises a bracket 11, a first stop block 12, a second stop block 13 and a third stop block 14, and one side of the bracket 11, which is close to the bracket 11 of the other clamping jaw 1, is a straight surface 111; one end of the bracket 11, which is far away from the hinge joint of the clamping jaw 1, is provided with a first stop block 12 protruding from the flat surface 111, and the other end is provided with a second stop block 13 protruding from the flat surface 111; the second block 13 is provided with a third block 14 protruding in the height direction, and one end of the third block 14 away from the second block 13 extends towards the first block 12; the ends of the two second stops 13 remote from the respective brackets 11 are hinged to each other.
From the above description, the beneficial effects of the utility model are as follows: when clamping, the flat surface 111 of the bracket 11 is attached to the side surface of the wafer box, the front side and the rear side of the wafer box are clamped by the first stop block 12 and the second stop block 13, and the convex edge on the upper side of the wafer box is pressed by the third stop block 14 to form multi-point clamping, so that the clamping is more stable.
When the device is used, the existing wafer box is taken as an example, the device is a square box, and the upper side edge of the square box is protruded; during clamping, the device is pushed in along the length direction of the side face of the square box, wherein the protruding edge of the upper side of the square box abuts against the upper side of the bracket 11, and the protruding edge of the upper side of the square box abuts against the third stop block 14. One side (front side) of the square box, which is close to the device, is propped against the second stop block 13; at this time, the extension part of the third stop block 14 presses against the upper side edge of the square box, and the second stop block 13 presses against the front side of the square box; after that, the clamping jaw 1 is gripped, so that the two clamping jaws 1 rotate in opposite directions, the straight surface 111 of the bracket 11 is completely attached to the side surface of the square box, and meanwhile, the first stop block 12 is pressed against the side (rear side) of the square box away from the device; thereafter, the device is lifted up to clamp the entire wafer cassette.
Further, a plurality of anti-slip grooves 112 are provided on the flat surface 111.
As is apparent from the above description, the friction coefficient with the side of the cassette is increased by the provision of the anti-slip groove 112 on the flat surface 111 to prevent slipping.
Further, the clamping jaw 1 further comprises a hinge rod 15, and the hinge rod 15 is arranged at one end of the second stop block 13 away from the bracket 11; the ends of the two hinge rods 15 remote from the respective second stops 13 are hinged to each other.
As is evident from the above description, the cooperation of the hinge rod 15 serves as a hinge structure for the two jaws 1.
Further, the device also comprises a handle 2, and one end of the hinging rod 15 away from the second stop 13 is connected with the handle 2.
As can be seen from the above description, by providing the handle 2, the operator can grip the handle conveniently to rotate the clamping jaw 1 towards each other for clamping.
Further, a buffer bar 21 is arranged on the handle 2.
As is apparent from the above description, the comfort in gripping is ensured by providing the buffer strip 21.
Further, the device also comprises a spring 3, and the spring 3 is connected between the hinging rod 15 and the handle 2 corresponding to the other hinging rod 15.
As is clear from the above description, a certain opening interval can be kept between the two clamping jaws 1 through the arrangement of the springs 3, so that an operator can conveniently push the clamping jaws directly towards the wafer box during use.
Further, a first hook is disposed on a side, opposite to the handle 2, of the other hinge rod 15, of the hinge rod 15, a second hook is disposed on the handle 2, corresponding to the other hinge rod 15, and two ends of the spring 3 are connected with the first hook and the second hook respectively.
As can be seen from the above description, the quick connection of the spring 3 is facilitated by the arrangement of the first hook and the second hook.
Referring to fig. 1 to 5, a first embodiment of the present utility model is:
the application scene of the utility model is as follows: in the operation of taking and placing the high-temperature wafer box, the clamping of the existing high-temperature wafer box is not provided with a special tool, the wafer box cannot be effectively fixed, the phenomenon of loosening during extraction exists, and the wafer box is damaged after falling.
As shown in fig. 1, 3, 4 and 5, the LED wafer cassette clamping device of the present embodiment includes two clamping jaws 1, a handle 2 and a spring 3.
One ends of the two clamping jaws 1 are hinged with each other; the clamping jaw 1 comprises a bracket 11, a first stop block 12, a second stop block 13, a third stop block 14 and a hinging rod 15, wherein one side of the bracket 11, which is close to the bracket 11 of the other clamping jaw 1, is provided with a flat surface 111, and a plurality of anti-skid grooves 112 are formed in the flat surface 111;
one end of the bracket 11, which is far away from the hinge joint of the clamping jaw 1, is provided with a first stop block 12 protruding from the flat surface 111, and the other end is provided with a second stop block 13 protruding from the flat surface 111; the second block 13 is provided with a third block 14 protruding in the height direction, and one end of the third block 14 away from the second block 13 extends towards the first block 12; a hinge rod 15 is arranged at one end of the second stop block 13 far away from the bracket 11; the ends of the two hinge rods 15 remote from the respective second stops 13 are hinged to each other.
The end of the hinge rod 15 remote from the second stop 13 is connected to the handle 2. The handle 2 is provided with a buffer strip 21.
A spring 3 is connected between the hinging rod 15 and the handle 2 corresponding to the other hinging rod 15. Specifically, a first hook is disposed on a side, opposite to the handle 2, of the other hinge rod 15, of the hinge rod 15, a second hook is disposed on the handle 2, corresponding to the other hinge rod 15, and two ends of the spring 3 are connected with the first hook and the second hook respectively.
The working principle of the utility model is as follows: when the device is used, an existing wafer box is taken as an example, as shown in fig. 2, the device is a square box, and the upper side edge of the square box is protruded; during clamping, the device is pushed in along the length direction of the side face of the square box, wherein the protruding edge of the upper side of the square box abuts against the upper side of the bracket 11, and the protruding edge of the upper side of the square box abuts against the third stop block 14. One side (front side) of the square box, which is close to the device, is propped against the second stop block 13; at this time, the extension part of the third stop block 14 presses against the upper side edge of the square box, and the second stop block 13 presses against the front side of the square box; after that, the clamping jaw 1 is gripped, so that the two clamping jaws 1 rotate in opposite directions, the straight surface 111 of the bracket 11 is completely attached to the side surface of the square box, and meanwhile, the first stop block 12 is pressed against the side (rear side) of the square box away from the device; thereafter, the device is lifted up to clamp the entire wafer cassette.
In summary, according to the device for clamping the LED wafer box provided by the utility model, the flat surface of the bracket is attached to the side surface of the wafer box during clamping, the front side and the rear side of the wafer box are clamped by the first stop block and the second stop block, the convex edge on the upper side of the wafer box is pressed by the third stop block, so that multi-point clamping is formed, and the clamping is more stable.
The foregoing description is only illustrative of the present utility model and is not intended to limit the scope of the utility model, and all equivalent changes made by the specification and drawings of the present utility model, or direct or indirect application in the relevant art, are included in the scope of the present utility model.
Claims (7)
1. The LED wafer box clamping device is characterized by comprising two clamping jaws, wherein one ends of the two clamping jaws are hinged with each other; the clamping jaw comprises a bracket, a first stop block, a second stop block and a third stop block, and one side of the bracket, which is close to the bracket of the other clamping jaw, is a straight surface; one end of the bracket, which is far away from the hinge joint of the clamping jaw, is provided with a first stop block protruding from the straight surface, and the other end of the bracket is provided with a second stop block protruding from the straight surface; the second stop block is provided with a third stop block protruding in the height direction, and one end of the third stop block, which is far away from the second stop block, extends towards the first stop block; the two second stop blocks are hinged with each other at one end far away from the respective brackets.
2. The LED wafer cassette clamping device of claim 1, wherein a plurality of anti-slip grooves are provided on the planar surface.
3. The LED wafer cassette clamping device of claim 1, wherein the clamping jaw further comprises a hinge rod, and the end of the second stop, which is far away from the bracket, is provided with the hinge rod; one end of each hinge rod far away from the corresponding second stop block is hinged with each other.
4. The LED wafer cassette clamping device of claim 3, further comprising a handle, wherein an end of the hinge rod remote from the second stop is connected to the handle.
5. The LED wafer cassette clamping device of claim 4, wherein the handle is provided with a buffer bar.
6. The LED wafer cassette clamping device of claim 4, further comprising a spring connected between the handle corresponding to the other hinge lever and the hinge lever.
7. The device for clamping an LED wafer cassette according to claim 6, wherein a first hook is disposed on a side of the hinge rod opposite to the handle corresponding to the other hinge rod, a second hook is disposed on the handle corresponding to the other hinge rod, and two ends of the spring are connected with the first hook and the second hook respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320954895.7U CN220272493U (en) | 2023-04-25 | 2023-04-25 | LED wafer box clamping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320954895.7U CN220272493U (en) | 2023-04-25 | 2023-04-25 | LED wafer box clamping device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220272493U true CN220272493U (en) | 2023-12-29 |
Family
ID=89301956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320954895.7U Active CN220272493U (en) | 2023-04-25 | 2023-04-25 | LED wafer box clamping device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220272493U (en) |
-
2023
- 2023-04-25 CN CN202320954895.7U patent/CN220272493U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |