CN220255009U

CN220255009U - SMT chip mounter adsorption equipment

Info

Publication number: CN220255009U
Application number: CN202321887632.5U
Authority: CN
Inventors: 钟明; 张春燕; 刘美兵
Original assignee: Sichuan Zhikefu Technology Co ltd
Current assignee: Sichuan Zhikefu Technology Co ltd
Priority date: 2023-07-18
Filing date: 2023-07-18
Publication date: 2023-12-26
Anticipated expiration: 2033-07-18

Abstract

The utility model relates to the technical field of chip mounters and discloses an adsorption device of an SMT chip mounter, which comprises an adsorber, wherein a limiting frame is arranged at the top of the inner side of the adsorber, a pushing component is arranged in the limiting frame and used for separating adsorbed electronic components, an auxiliary adsorption component is arranged on the back surface of the inner side of the adsorber, and the auxiliary adsorption component is used for improving adsorption stability. This SMT chip mounter adsorption equipment is through installing pushing component, can drive the locating shaft through the rotation and adjust, will promote the buffer frame of bottom along the inside decline of major structure after the movable rod upset, the buffer frame can provide the restriction for inboard support spring, utilize support spring then can promote the movable disk of bottom and descend, can the lifting adsorber after the promotion dish contact electronic component through the pushing rod bottom, promote the dish under the effect of support spring and will continue to promote electronic component, can avoid the sucking disc to drive electronic component when the separation and appear the problem of skew.

Description

SMT chip mounter adsorption equipment

Technical Field

The utility model relates to the technical field of chip mounters, in particular to an SMT chip mounter adsorption device.

Background

SMT chip mounter is SMT processingequipment, through setting up the circuit board in the bottom of chip mounter, adsorbs electronic component and set up on the circuit board and can weld through the adsorption equipment at top to realize the effect of paster processing.

The suction device generally adopts a vacuum pump structure to generate suction force, and the suction head connected with the vacuum pump is used for contacting with the end head of the electronic component, so that the electronic component is sucked by the effect of negative pressure to carry out position movement and adjustment.

Chinese patent publication No.: CN216566151U discloses an SMT chip mounter adsorption device, which comprises a cylinder, wherein a first hydraulic cylinder is arranged at one side of the cylinder, a sliding ring is arranged below the first hydraulic cylinder, the sliding ring is sleeved on the cylinder, a cylinder is arranged on the sliding ring, the cylinder is fixedly connected with the free end of the first hydraulic cylinder, an outer sucking disc is arranged on the cylinder, a limiting ring is arranged below the cylinder, and the limiting ring is fixedly connected with the cylinder; the outer sucking disc and the inner sucking disc that set up through being convenient for use, the inner sucking disc that sets up cooperates first exhaust tube can carry out the absorption of less object fixedly, when the absorption dynamics of needs is great, cover interior sucking disc through the downshift of outer sucking disc to adsorb fixedly simultaneously through two sucking discs, both can adjust absorbing dynamics size as required, be convenient for lift up the object of different weight, can increase the adsorption area again when needing, guarantee stability.

In the prior art, when using, come the electronic component of contact equidimension through being provided with two sets of sucking disc structures and control the size of absorption dynamics, increase stability, but when carrying out electronic component absorption, place behind the sucking disc electronic component and pass through stop absorption or come to separate in fixed position, the direct separation appears the condition that electronic component's stitch position appears shifting easily.

Disclosure of Invention

The utility model aims to provide an adsorption device of an SMT chip mounter, which solves the problems that in the background art, after an electronic component is sucked, the electronic component is placed at a fixed position and separated by stopping suction, and the pin positions of the electronic component are easily deviated during direct separation.

In order to solve the technical problems, the utility model provides the following technical scheme: the adsorption device of the SMT chip mounter comprises an adsorber, wherein a limit frame is arranged at the top of the inner side of the adsorber, a pushing component is arranged in the limit frame and used for separating adsorbed electronic elements, an auxiliary adsorption component is arranged on the back surface of the inner side of the adsorber, and the auxiliary adsorption component is used for improving adsorption stability;

the pushing assembly comprises a micro motor, the micro motor is positioned on the right side of the absorber, a rotary disc is arranged on the outer side of the output end of the micro motor, a positioning shaft is arranged on the front face of the rotary disc, a movable rod is arranged at the bottom of the outer side of the positioning shaft, a buffer frame is arranged at the bottom of the movable rod, a supporting spring is arranged in the buffer frame, a pushing rod is arranged below the supporting spring, and the pushing disc is arranged at the bottom of the pushing rod;

the auxiliary adsorption component comprises a jogging frame, two groups of limiting frames are arranged on the front face of the inner side of the jogging frame, a sealing plate is arranged on the inner side of the limiting frames, and small springs are arranged on the sealing plate and the inner side of the jogging frame.

Preferably, the bottom of adsorber is provided with the absorption mouth, the inboard bottom of spacing frame is provided with the guide pin bushing, and the guide pin bushing is located the outside of push rod, the mounting disc is installed in the front of adsorber, and the fixed disk is installed at the top of adsorber.

Preferably, the output end of the miniature motor is provided with a rotating shaft, and the rotating shaft is positioned at the inner side of the rotating disc.

Preferably, the bottom of the supporting spring is provided with a movable disc, the movable disc is located at the inner side of the buffer frame, and the buffer frame is located at the top of the pushing rod.

Preferably, the adsorption tube is installed on the front surface of the installation plate, and the inner side of the adsorption tube is provided with a circulation port.

Preferably, a through hole is formed in the inner side of the jogged frame, and the through hole is positioned on the right side of the sealing plate.

Preferably, the top of fixed disk is installed the piston rod, and the outside at piston rod top is provided with electric putter, the welding disk is installed at electric putter's top.

Compared with the prior art, the utility model has the following beneficial effects:

according to the utility model, the pushing assembly is arranged on the right side of the main body structure, so that the rotating disc in the main body structure can be provided with the capability of rotating and adjusting, the positioning shaft can be driven to adjust through rotation, the movable rod connected to the outer side is driven and adjusted through transmission, the buffer frame at the bottom can be pushed to descend along the inner side of the main body structure after overturning, the buffer frame can provide limitation for the supporting spring at the inner side, the movable disc at the bottom can be pushed to descend by the supporting spring, the absorber can be lifted after the pushing disc at the bottom of the pushing rod contacts with the electronic element, the electronic element can be continuously pushed by the pushing disc under the action of the supporting spring, and the problem that the electronic element is driven to deviate by the sucker during separation can be avoided.

According to the utility model, through the auxiliary adsorption component, the situation that gas leakage occurs and the falling off is avoided in the existing sucker structure in order to increase the sealing effect, but the soft adsorption port is deformed and damaged after long-time use, so that the electronic component is easy to fall off, the embedded frame structure is arranged inside, a group of communication areas with the outside are provided by utilizing the inner through holes, the limit frame can provide limitation for the inner sealing plate, the sealing plate can be kept to be always extruded to avoid gas leakage under the action of the small spring, the adsorption port at the bottom adopts a hard structure, the continuous suction is provided, the sealing plate is used for opening to provide an additional air inlet, the adsorption state can be kept, and the falling off problem of the electronic component is avoided.

Drawings

FIG. 1 is a schematic diagram of the main structure of the present utility model;

FIG. 2 is a schematic view of the structure of the electric putter of the present utility model;

FIG. 3 is a schematic cross-sectional view of a rotating disk according to the present utility model;

FIG. 4 is a schematic cross-sectional view of an adsorption tube according to the present utility model;

FIG. 5 is a schematic cross-sectional view of a seal plate according to the present utility model.

Wherein: 1. an adsorber; 101. an adsorption port; 102. a limit frame; 103. a guide sleeve; 2. a rotating disc; 201. a micro motor; 202. a rotating shaft; 203. positioning a shaft; 204. a movable rod; 3. a push rod; 301. a buffer frame; 302. a support spring; 303. a movable plate; 304. pushing the disc; 4. an adsorption tube; 401. a mounting plate; 402. a flow port; 5. a sealing plate; 501. a jogging frame; 502. a through hole; 503. a limiting frame; 504. a small spring; 6. an electric push rod; 601. a fixed plate; 602. a piston rod; 603. and welding the disc.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-5, an adsorption device of an SMT chip mounter includes an adsorber 1, a limit frame 102 is installed at the top of the inner side of the adsorber 1, a pushing component is provided in the limit frame 102, the pushing component is used for separating adsorbed electronic components, an auxiliary adsorption component is installed at the back of the inner side of the adsorber 1, and the auxiliary adsorption component is used for improving adsorption stability;

the pushing assembly comprises a micro motor 201, the micro motor 201 is positioned on the right side of the absorber 1, a rotary disc 2 is arranged on the outer side of the output end of the micro motor 201, a positioning shaft 203 is arranged on the front surface of the rotary disc 2, a movable rod 204 is arranged at the bottom of the outer side of the positioning shaft 203, a buffer frame 301 is arranged at the bottom of the movable rod 204, a supporting spring 302 is arranged in the buffer frame 301, a pushing rod 3 is arranged below the supporting spring 302, and a pushing disc 304 is arranged at the bottom of the pushing rod 3;

the auxiliary adsorption assembly comprises a jogging frame 501, two groups of limiting frames 503 are arranged on the front surface of the inner side of the jogging frame 501, a sealing plate 5 is arranged on the inner side of the limiting frames 503, and small springs 504 are arranged on the sealing plate 5 and the inner side of the jogging frame 501.

Through above-mentioned technical scheme, through setting up micro motor 201 on the right side of main structure, can provide rotatory regulation's ability for inside rotary disk 2, can drive locating shaft 203 through the rotation and adjust, the transmission will control the movable rod 204 of connecting in the outside and drive the regulation, buffer frame 301 that will promote the bottom after the upset descends along main structure's inside, buffer frame 301 can provide the restriction for inboard support spring 302, utilize support spring 302 then can promote the movable disk 303 of bottom and descend, can lift adsorber 1 after the pushing disc 304 contact electronic component through pushing rod 3 bottom, promote the disk 304 under the effect of support spring 302 and will continue to promote electronic component, can avoid the sucking disc to drive the problem that electronic component appears the skew in the time of the separation.

Through above-mentioned technical scheme, through being provided with gomphosis frame 501 structure inside, utilize inboard through hole 502 to provide a set of intercommunication district with the external world, utilize spacing 503 can provide the restriction for inboard closing plate 5 to can keep extruding all the time under the effect of small-size spring 504 and avoid gas leakage, when carrying out the absorption, the absorption mouth 101 of bottom adopts the stereoplasm structure, and the continuous production is inhaled and is utilized closing plate 5 to open and provide extra air inlet, can keep absorbing the state and avoid appearing the problem that electronic component drops.

Specifically, the bottom of adsorber 1 is provided with adsorption port 101, and the bottom of spacing frame 102 inboard is provided with guide sleeve 103, and guide sleeve 103 is located the outside of push rod 3, and mounting plate 401 is installed in adsorber 1's front, and fixed disk 601 is installed at adsorber 1's top.

Through above-mentioned technical scheme, adsorb mouthful 101 structure and adsorb electronic component through positive adsorption structure control, can provide mounted position for pushing the subassembly through the spacing frame 102 structure of inside, utilize guide pin bushing 103 then can assist inboard catch bar 3 to adjust, increase the stability of adjusting.

Specifically, the output end of the micro motor 201 is provided with a rotating shaft 202, and the rotating shaft 202 is located inside the rotating disc 2.

Through the above technical scheme, the rotating shaft 202 structure can drive the rotating disc 2 to adjust under the action of the micro motor 201.

Specifically, the bottom of the supporting spring 302 is provided with a movable disc 303, and the movable disc 303 is located inside the buffer frame 301, and the buffer frame 301 is located at the top of the push rod 3.

Through the above technical scheme, the movable disc 303 structure can be continuously pushed downwards under the supporting action of the supporting spring 302, and the electronic component can be limited from moving by pushing downwards through the pushing rod 3 structure at the bottom.

Specifically, the adsorption tube 4 is mounted on the front surface of the mounting plate 401, and the flow port 402 is provided on the inner side of the adsorption tube 4.

Through the above technical scheme, the adsorption tube 4 structure can be connected with an external vacuum pump, and gas can pass through the circulation port 402.

Specifically, the inner side of the fitting frame 501 is provided with a through hole 502, and the through hole 502 is located on the right side of the sealing plate 5.

Through the above technical solution, the through hole 502 is used for assisting gas circulation.

Specifically, the piston rod 602 is mounted on the top of the fixed disk 601, and the electric push rod 6 is disposed on the outer side of the top of the piston rod 602, and the welding disk 603 is mounted on the top of the electric push rod 6.

Through above-mentioned technical scheme, the welding disk 603 structure can be connected with the drive structure of chip mounter main part, and the piston rod 602 that can drive the output through the electric putter 6 of bottom carries out flexible regulation, and the transmission will promote the effect that the structure of welding disk 603 structure control bottom of bottom realizes the altitude mixture control.

When the electric absorber is used, firstly, the piston rod 602 of the output end and the absorber 1 at the bottom are driven to descend through the electric push rod 6, the absorption port 101 at the bottom is contacted with the electronic element after descending, continuous absorption air flow enters the interior through the through hole 502 at the back, the sealing plate 5 is pushed to extrude the small-sized spring 504 structure after entering the interior, after continuous absorption control movement, the electronic element at the bottom is contacted with the circuit board, the rotating shaft 202 of the output end can be driven to rotate through the micro motor 201 at the right side during separation, the rotary disk 2 is controlled to overturn and adjust by transmission, the buffer frame 301 is synchronously driven to descend by the control movable rod 204, the electronic element is limited by the pushing disk 304 and the supporting spring 302 is compressed, and finally, the electronic element is pushed and separated by the pushing disk 304 when the absorber 1 is controlled to separate by the electric push rod 6.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit thereof, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides an SMT chip mounter adsorption equipment, includes adsorber (1), its characterized in that: a limiting frame (102) is arranged at the top of the inner side of the absorber (1), a pushing component is arranged in the limiting frame (102) and used for separating absorbed electronic components, an auxiliary absorption component is arranged on the back side of the inner side of the absorber (1), and the auxiliary absorption component is used for improving absorption stability;

the pushing assembly comprises a micro motor (201), the micro motor (201) is located on the right side of the absorber (1), a rotary disc (2) is arranged on the outer side of the output end of the micro motor (201), a positioning shaft (203) is arranged on the front face of the rotary disc (2), a movable rod (204) is arranged at the bottom of the outer side of the positioning shaft (203), a buffer frame (301) is arranged at the bottom of the movable rod (204), a supporting spring (302) is arranged in the buffer frame (301), a pushing rod (3) is arranged below the supporting spring (302), and a pushing disc (304) is arranged at the bottom of the pushing rod (3);

the auxiliary adsorption component comprises a jogging frame (501), two groups of limiting frames (503) are arranged on the front face of the inner side of the jogging frame (501), a sealing plate (5) is arranged on the inner side of the limiting frames (503), and small springs (504) are arranged on the inner sides of the sealing plate (5) and the jogging frame (501).

2. The SMT chip mounter adsorption device according to claim 1, wherein: the bottom of adsorber (1) is provided with adsorption port (101), the inboard bottom of spacing frame (102) is provided with guide sleeve (103), and guide sleeve (103) are located the outside of push rod (3), mounting disc (401) are installed in the front of adsorber (1), and fixed disk (601) are installed at the top of adsorber (1).

3. The SMT chip mounter adsorption device according to claim 1, wherein: the output end of the miniature motor (201) is provided with a rotating shaft (202), and the rotating shaft (202) is positioned at the inner side of the rotating disc (2).

4. The SMT chip mounter adsorption device according to claim 1, wherein: the bottom of the supporting spring (302) is provided with a movable disc (303), the movable disc (303) is located on the inner side of the buffer frame (301), and the buffer frame (301) is located on the top of the pushing rod (3).

5. An SMT pick and place machine adsorption device according to claim 2, wherein: the front of the mounting plate (401) is provided with an adsorption pipe (4), and the inner side of the adsorption pipe (4) is provided with a circulation port (402).

6. The SMT chip mounter adsorption device according to claim 1, wherein: the inner side of the jogged frame (501) is provided with a through hole (502), and the through hole (502) is positioned on the right side of the sealing plate (5).

7. An SMT pick and place machine adsorption device according to claim 2, wherein: the top of fixed disk (601) is installed piston rod (602), and the outside at piston rod (602) top is provided with electric putter (6), welding disk (603) are installed at the top of electric putter (6).