CN220254795U - Copper deposition equipment for circuit board - Google Patents
Copper deposition equipment for circuit board Download PDFInfo
- Publication number
- CN220254795U CN220254795U CN202320543995.0U CN202320543995U CN220254795U CN 220254795 U CN220254795 U CN 220254795U CN 202320543995 U CN202320543995 U CN 202320543995U CN 220254795 U CN220254795 U CN 220254795U
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- Prior art keywords
- circuit board
- copper deposition
- piece
- clamping
- pulling
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 31
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 31
- 239000010949 copper Substances 0.000 title claims abstract description 31
- 230000008021 deposition Effects 0.000 title claims abstract description 30
- 238000004381 surface treatment Methods 0.000 claims abstract description 35
- 238000011144 upstream manufacturing Methods 0.000 claims abstract description 4
- 238000007599 discharging Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000005484 gravity Effects 0.000 description 2
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
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- Manufacturing Of Printed Wiring (AREA)
Abstract
The utility model discloses a circuit board copper deposition device, which comprises a surface treatment assembly for carrying out surface treatment on a circuit board, wherein the circuit board copper deposition device further comprises a feeding device arranged at the upstream of the surface treatment assembly, and the feeding device comprises a first rack, a pushing piece and a first driving piece; the first rack is provided with a first unpowered raceway for transporting the circuit board; the pushing piece is movably arranged on the first frame, and is provided with a limiting groove which is used for being inserted into the side of the circuit board, so that the circuit board can be driven by the pushing piece to move along the first unpowered raceway to feed the surface treatment assembly; the first driving piece is installed on the first frame and is in driving connection with the pushing piece. The technical scheme of the utility model can increase the feeding efficiency of the feeding device in the circuit board copper deposition equipment.
Description
Technical Field
The utility model relates to the technical field of circuit board processing, in particular to copper deposition equipment for a circuit board.
Background
In the production process of the printed circuit board, the conducting interconnection between layers is realized by manufacturing a conducting hole, and the manufacturing of the conducting hole involves copper deposition and electroplating processes. Common circuit board copper deposition equipment includes feed arrangement, surface treatment subassembly and discharging device, firstly pass through feed arrangement with the circuit board material loading to surface treatment subassembly, carry out copper deposition to the circuit board in surface treatment subassembly department again, in the in-process with circuit board material loading to surface treatment subassembly, feed arrangement needs to make the edge extension part of circuit board than feed channel, so that the anchor clamps clamp in the surface treatment subassembly get, however, when the circuit board stretches out too much, because gravity cause, the circuit board can drop perpendicularly, lead to the anchor clamps on the surface treatment subassembly to unable this circuit board of centre gripping, cause the material loading failure, feed arrangement's feeding efficiency has been reduced.
Disclosure of Invention
The utility model mainly aims to provide circuit board copper deposition equipment, which aims to ensure the feeding efficiency of a feeding device in the circuit board copper deposition equipment.
In order to achieve the above object, the circuit board copper deposition apparatus according to the present utility model includes a feeding device disposed upstream of the surface treatment assembly, the feeding device including:
the first rack is provided with a first unpowered raceway for transporting the circuit board;
the pushing piece is movably arranged on the first rack and is provided with a limit groove, and the limit groove is used for being inserted into the side of the circuit board, so that the circuit board can be driven by the pushing piece to move along the first unpowered raceway to feed the surface treatment assembly; and
the first driving piece is arranged on the first rack and is in driving connection with the pushing piece.
Optionally, the pushing piece includes push plate and screens piece, first driving piece drive connect in the push plate, the screens piece install in the push plate, the screens piece keep away from one side of push plate is equipped with the spacing groove.
Optionally, the clamping piece includes two opposite clamping parts, two limiting grooves are formed between the two clamping parts, one clamping part is located above the circuit board, and the length of the clamping part located above the circuit board is greater than or equal to that of the other clamping part.
Optionally, the bottom wall of the limiting groove is a plane, and in a direction away from the bottom wall of the limiting groove, the distance between the two clamping parts is gradually increased.
Optionally, the screens piece is provided with a plurality ofly, and a plurality of screens piece is followed the edge of pushing plate interval distribution in proper order.
Optionally, the circuit board copper deposition apparatus further includes a discharging device disposed downstream of the surface treatment assembly, the discharging device including:
the second rack is provided with a second unpowered raceway for transporting the circuit board;
the pulling piece is movably arranged on the second rack and is provided with a clamping hook part, and the clamping hook part is used for being hooked on the side of the circuit board, so that the circuit board can be driven by the pulling piece to move along the second unpowered raceway to be discharged from the surface treatment assembly; and
the second driving piece is arranged on the second rack and is in driving connection with the pulling piece.
Optionally, the pulling piece includes pulling piece and pulling rod, the second driving piece drive connect in the pulling piece, the pulling rod install in the pulling piece, trip portion install in the pulling rod is kept away from the one end of pulling piece, trip portion orientation one side of pulling piece is equipped with the recess, be used for colluding in the avris of circuit board.
Alternatively, the pulling rod may be movably mounted to the pulling block.
Optionally, the feeding device further comprises a positioning mechanism, the positioning mechanism comprises two positioning cylinders and two positioning plates, the two positioning cylinders are respectively arranged on two sides of the first unpowered roller path and are positioned on two sides of the circuit board in the flowing direction, the positioning plates are arranged at the movable ends of the positioning cylinders, and the positioning plates are used for being abutted to the circuit board.
Optionally, the first driving piece includes first cylinder and second cylinder, first cylinder install in the frame, first cylinder drive connect in the second cylinder is used for driving the second cylinder is followed the removal of the length direction of first unpowered raceway, the impeller install in the expansion end of second cylinder, the second cylinder is used for controlling the impeller reciprocates.
According to the technical scheme, the first driving piece is arranged on the first frame and is in driving connection with the pushing piece, the pushing piece is used for pushing the circuit board to move on the first unpowered raceway, the limiting groove is formed in the pushing piece and is used for pushing the circuit board to the clamp of the surface treatment assembly, when the circuit board is pushed out of the first unpowered raceway, one suspended end of the circuit board gradually falls, the other end of the circuit board is lifted upwards, but because the circuit board is inserted into the limiting groove, one lifted end of the circuit board can be abutted against the upper side wall of the limiting groove, the pushing piece can give downward force to the circuit board so as to prevent the circuit board from continuously lifting, and thus the arrangement can prevent the other end of the circuit board from dropping vertically, so that the circuit board is guaranteed to be successfully conveyed to the clamp, the occurrence of feeding failure caused by dropping of the circuit board is reduced, the operation of manually feeding the circuit board to the clamp again is reduced, and the feeding efficiency of the feeding device of the copper deposition equipment of the circuit board is improved.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a feeding device of an embodiment of a circuit board copper deposition apparatus according to the present utility model;
FIG. 2 is a schematic view of the first driving member and the pushing member of FIG. 1;
FIG. 3 is an enlarged view of a portion of FIG. 2 at A;
FIG. 4 is a schematic diagram of a discharging device of an embodiment of the circuit board copper deposition apparatus of the present utility model;
fig. 5 is a schematic structural diagram of the second driving member, the pulling member and the hook in fig. 4.
Reference numerals illustrate:
the achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present utility model are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.
In the present utility model, unless specifically stated and limited otherwise, the terms "connected," "affixed," and the like are to be construed broadly, and for example, "affixed" may be a fixed connection, a removable connection, or an integral body; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present utility model, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" as it appears throughout includes three parallel schemes, for example "A and/or B", including the A scheme, or the B scheme, or the scheme where A and B are satisfied simultaneously. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.
The utility model provides a circuit board copper deposition device which comprises a surface treatment component for carrying out surface treatment on a circuit board.
In one embodiment of the present utility model, as shown in fig. 1 to 3, the circuit board copper deposition apparatus includes a feeding device 10 disposed upstream of a surface treatment assembly, the feeding device 10 including: the first frame 11 pushes the first driving member 13 of the member 12, the first frame 11 is provided with a first unpowered raceway 111 for transporting circuit boards; the pushing piece 12 is movably arranged on the first frame 11, the pushing piece 12 is provided with a limiting groove 121, the limiting groove 121 is used for being inserted into the side of the circuit board, so that the circuit board can be driven by the pushing piece 12 to move along the first unpowered roller path 111 so as to feed the surface treatment assembly; the first driving member 13 is mounted to the first frame 11 and is drivingly connected to the pushing member 12.
The circuit board is required to be transported to the surface treatment assembly by the feeding device 10 for copper deposition treatment, but in the transportation process, due to gravity, the circuit board falls down perpendicular to the feeding device after being output by the feeding device 10, so that the fixture on the surface treatment assembly may not be directly clamped to the circuit board, and thus the feeding of the surface treatment assembly fails, and the circuit board needs to be manually clamped to the fixture again, so that the feeding efficiency of the feeding device 10 is lower.
According to the technical scheme, the first driving piece 13 is arranged on the first rack 11, the first driving piece 13 is in driving connection with the pushing piece 12, the pushing piece 12 is used for pushing the circuit board to move on the first unpowered raceway 111, the pushing piece 12 is used for pushing the circuit board to the clamp of the surface treatment assembly, the limiting groove 121 is formed in the pushing piece 12, the side of the circuit board is inserted into the limiting groove 121, when the circuit board is pushed out of the first unpowered raceway 111, one suspended end of the circuit board gradually falls, the other end of the circuit board is lifted upwards, but because the circuit board is inserted into the limiting groove 121, one lifted end of the circuit board can be abutted against the upper side wall of the limiting groove 121, the pushing piece 12 can provide a downward force for preventing the circuit board from continuously lifting, the other end of the circuit board can be prevented from being vertically dropped down, the condition that the circuit board is successfully conveyed to the clamp is reduced, the condition that feeding failure is caused by dropping of the circuit board is reduced, the operation of manually feeding the circuit board to the clamp is reduced, and the feeding efficiency of the feeding device 10 of the copper sinking equipment for the circuit board is improved.
In an embodiment, the pushing member 12 includes a pushing plate 122 and a positioning member 123, the first driving member 13 is drivingly connected to the pushing plate 122, the positioning member 123 is mounted on the pushing plate 122, and a limiting slot 121 is disposed on a side of the positioning member 123 away from the pushing plate 122.
Specifically, the pushing plate 122 includes a first plate body 122a and a second plate body 122b, the first plate body 122a and the second plate body 122b are connected to form a Z shape, the second plate body 122b is parallel to the first unpowered raceway 111, the first driving member 13 is in driving connection with the upper end of the first plate body 122a, the first driving member 13 can drive the pushing plate 122 to move along the length direction of the first unpowered raceway 111, the clamping member 123 is mounted on the edge of the second plate body 122b facing the circuit board, the limiting groove 121 is arranged on one side of the clamping member 123 facing the circuit board, the limiting groove 121 is a through groove, the notch of the limiting groove 121 faces one side of the circuit board, and the pushing plate 122 moves towards the circuit board, so that the clamping member 123 is clamped on the circuit board, and thus the circuit board can be directly inserted into the limiting groove 121.
In an embodiment, the clamping member 123 includes two opposite clamping portions, a limiting groove 121 is formed between the two clamping portions, one clamping portion is located above the circuit board, and the length of the clamping portion located above the circuit board is greater than or equal to that of the other clamping portion.
Specifically, the first driving member 13 can drive the pushing plate 122 to lift in the height direction, the two opposite clamping parts are respectively an upper clamping part 123a and a lower clamping part 123b, the length of the upper clamping part 123a is greater than that of the lower clamping part 123b in the length direction of the first unpowered raceway 111, the circuit board is inserted into the limiting groove 121, one end of the circuit board, which is tilted, is clamped by the upper clamping part 123a in the outward conveying process of the circuit board, and the contact part between the circuit board and the clamping part 123 can be more by increasing the length of the clamping part, so that the clamping part 123 can improve the pressing effect of the circuit board, and the possibility of vertical falling of the circuit board is further reduced. In some other embodiments, the length of the clamping portion above the circuit board is smaller than the other clamping portion.
In an embodiment, the bottom wall of the limiting groove 121 is a plane, and the distance between the two clamping portions gradually increases in a direction away from the bottom wall of the limiting groove 121.
Specifically, the bottom wall of the limiting groove 121 is set to be a plane, so that the side wall of the circuit board can be abutted against the bottom wall of the limiting groove 121, and the two clamping parts are distributed in a V shape, so that the circuit board can conveniently enter the limiting groove 121 of the clamping piece 123. In other embodiments, the distance between the two snap-in portions is consistent in a direction away from the bottom wall of the limiting groove 121.
In an embodiment, the plurality of the clamping members 123 are provided, and the plurality of clamping members 123 are sequentially spaced apart along the edge of the pushing plate 122.
Specifically, the plurality of clamping pieces 123 are distributed at intervals, when the pushing plate 122 pushes the circuit board to move, the plurality of clamping pieces 123 can be clamped on the circuit board, the contact part between the circuit board and the pushing piece 12 is increased, and the arrangement is such that one end of the circuit board, which is tilted, can be simultaneously subjected to the downward pressure given by the plurality of clamping pieces 123, so that the circuit board is further prevented from falling vertically.
In one embodiment, as shown in fig. 4 to 5, the circuit board copper deposition apparatus further includes a discharging device 20 disposed downstream of the surface treatment assembly, the discharging device 20 including: the second frame 21 pulls the second driving member 24 of the member 22, and the second frame 21 is provided with a second unpowered raceway 211 for transporting circuit boards; the pulling member 22 is movably arranged on the second frame 21, the pulling member 22 is provided with a clamping hook part 23, and the clamping hook part 23 is used for hooking the side of the circuit board, so that the circuit board can be driven by the pulling member 22 to move along the second unpowered roller path 211 so as to be discharged from the surface treatment assembly; the second driving member 24 is mounted to the second frame 21 and drivingly connected to the pulling member 22.
Specifically, after the surface treatment assembly finishes treating the circuit board, the second driving member 24 can drive the pulling member 22 to extend into the upper part of the surface treatment assembly, after the circuit board is hooked by the clamping hook portion 23, the second driving member 24 drives the pulling member 22 to pull the circuit board back to the second unpowered roller path 211 so as to finish discharging the circuit board, and in this way, the clamping hook portion 23 can hook the circuit board, and the circuit board is prevented from falling in the discharging process.
In an embodiment, the pulling member 22 includes a pulling block 221 and a pulling rod 222, the second driving member 24 is drivingly connected to the pulling block 221, the pulling rod 222 is mounted on the pulling block 221, the hook portion 23 is mounted on an end of the pulling rod 222 away from the pulling block 221, and a groove 231 is disposed on a side of the hook portion 23 facing the pulling block 221 for hooking to an edge of the circuit board.
Specifically, the hook portion 23 is provided with a groove 231, the circuit board can be inserted into the groove 231, one end of the pull rod 222 is mounted on the pull block 221, the other end of the pull rod 222 is used for mounting the hook portion 23, the pull rod 222 extends towards the side provided with the circuit board, and the second driving member 24 moves towards the surface treatment assembly by driving the pull block 221, so that the hook portion 23 at the end of the pull rod 222 is hooked on the edge of the circuit board, and the circuit board is hooked back onto the second unpowered raceway 211 from the surface treatment assembly. This arrangement eliminates the need for an additional drive mechanism on the surface treating assembly to discharge the circuit board.
In one embodiment, the pulling rod 222 is movably mounted to the pulling block 221.
Specifically, the position of the pulling rod 222 on the pulling block 221 is adjusted according to the size of the circuit board, so that the hook portion 23 can extend to the edge of the circuit board, and the arrangement is that the distance that the hook portion 23 extends can be adjusted to adapt to circuit boards with different sizes, so that universality of the discharging device 20 is improved. In other embodiments, the hook 23 is movably mounted on the pulling rod 222, and the hook 23 can move along the length direction of the pulling rod 222.
In an embodiment, as shown in fig. 1, the feeding device 10 further includes a positioning mechanism 14, the positioning mechanism 14 includes two positioning cylinders 141 and two positioning plates 142, the two positioning cylinders 141 are respectively disposed on two sides of the first unpowered raceway 111 and are disposed on two sides of the circuit board in the flow direction, the positioning plates 142 are mounted on movable ends of the positioning cylinders 141, and the positioning plates 142 are used for abutting against the circuit board.
Specifically, after the circuit board moves to the first unpowered roller path 111, the two positioning plates 142 are driven by the positioning cylinders 141 at two sides to push the circuit board to the middle position of the first unpowered roller path 111, and then the pushing piece 12 pushes the circuit board outwards, so that the arrangement can ensure that the circuit board is aligned with the fixture of the surface treatment assembly before feeding, and when the pushing piece 12 pushes the circuit board to move, the circuit board cannot deviate from the fixture, so that the fixture is clamped on the circuit board conveniently.
In an embodiment, as shown in fig. 1 and 2, the first driving member 13 includes a first cylinder 131 and a second cylinder 132, the first cylinder 131 is mounted on the frame, the first cylinder 131 is drivingly connected to the second cylinder 132 for driving the second cylinder 132 to move along the length direction of the first unpowered raceway 111, the pushing member 12 is mounted on the movable end of the second cylinder 132, and the second cylinder 132 is used for controlling the pushing member 12 to move up and down.
Specifically, the height of the pushing member 12 is adjusted according to the position of the circuit board, and the second cylinder 132 can control the pushing member 12 to be lifted or lowered to be aligned with the circuit board so that the circuit board can be inserted into the limit groove 121, and the pushing member 12 is driven by the first cylinder 131 to push the movement of the circuit board.
Further, the second driving member 24 has the same result as the first driving member 13, and the first cylinder 131 on the second frame 21 is drivingly connected to the second cylinder 132, and the pulling member 22 is mounted on the movable end of the second cylinder 132.
In this embodiment, the first unpowered raceway 111 is provided with a mounting plate 15, a plurality of rotating shafts 16 and a plurality of rollers 17, the mounting plate 15 is mounted on the first frame 11, one end is used for entering the circuit board, the other end is used for outputting the circuit board, the plurality of rotating shafts 16 are rotatably mounted on the mounting plate 15 and are uniformly arranged at intervals along the length direction of the mounting plate 15, a plurality of rollers 17 are sleeved on one rotating shaft 16, and the plurality of rollers 17 are alternately arranged on the same rotating shaft 16. The second unpowered roller path 211 is identical in structure to the first unpowered roller path 111, and the mounting plate 15 is mounted to the second frame 21 for conveying the circuit board. The clamping piece 123 and the clamping hook part 23 are arranged to avoid the roller 17, namely, the clamping piece 123 and the clamping hook part 23 cannot interfere with the roller 17 in the moving process.
The foregoing description is only of the optional embodiments of the present utility model, and is not intended to limit the scope of the utility model, and all the equivalent structural changes made by the description of the present utility model and the accompanying drawings or the direct/indirect application in other related technical fields are included in the scope of the utility model.
Claims (10)
1. A circuit board copper deposition apparatus comprising a surface treatment assembly for surface treating a circuit board, characterized by further comprising a feeding device disposed upstream of the surface treatment assembly, the feeding device comprising:
the first rack is provided with a first unpowered raceway for transporting the circuit board;
the pushing piece is movably arranged on the first rack and is provided with a limit groove, and the limit groove is used for being inserted into the side of the circuit board, so that the circuit board can be driven by the pushing piece to move along the first unpowered raceway to feed the surface treatment assembly; and
the first driving piece is arranged on the first rack and is in driving connection with the pushing piece.
2. The circuit board copper deposition apparatus according to claim 1, wherein the pushing member comprises a pushing plate and a positioning member, the first driving member is in driving connection with the pushing plate, the positioning member is mounted on the pushing plate, and the side, away from the pushing plate, of the positioning member is provided with the limiting groove.
3. The copper deposition apparatus of claim 2, wherein the clamping member comprises two opposite clamping portions, the limiting groove is formed between the two clamping portions, one clamping portion is located above the circuit board, and the length of the clamping portion located above the circuit board is greater than or equal to that of the other clamping portion.
4. A circuit board copper deposition apparatus according to claim 3, wherein the groove bottom wall of the limit groove is a plane, and the distance between the two clamping portions is gradually increased in a direction away from the groove bottom wall of the limit groove.
5. The circuit board copper deposition apparatus according to claim 2, wherein a plurality of the clamping members are provided, and a plurality of the clamping members are sequentially spaced apart along the edge of the pushing plate.
6. The circuit board copper deposition apparatus of claim 1, further comprising a discharge device disposed downstream of the surface treatment assembly, the discharge device comprising:
the second rack is provided with a second unpowered raceway for transporting the circuit board;
the pulling piece is movably arranged on the second rack and is provided with a clamping hook part, and the clamping hook part is used for being hooked on the side of the circuit board, so that the circuit board can be driven by the pulling piece to move along the second unpowered raceway to be discharged from the surface treatment assembly; and
the second driving piece is arranged on the second rack and is in driving connection with the pulling piece.
7. The circuit board copper deposition apparatus according to claim 6, wherein the pulling member comprises a pulling block and a pulling rod, the second driving member is drivingly connected to the pulling block, the pulling rod is mounted to the pulling block, the hook portion is mounted to an end of the pulling rod away from the pulling block, and a groove is formed in a side of the hook portion facing the pulling block for hooking to an edge side of the circuit board.
8. The circuit board copper deposition apparatus of claim 7, wherein the pull rod is movably mounted to the pull block.
9. The circuit board copper deposition apparatus according to any one of claims 1 to 8, wherein the feeding device further comprises a positioning mechanism, the positioning mechanism comprises two positioning cylinders and two positioning plates, the two positioning cylinders are respectively arranged on two sides of the first unpowered raceway and are positioned on two sides of the circuit board in the flowing direction, the positioning plates are arranged on movable ends of the positioning cylinders, and the positioning plates are used for being abutted against the circuit board.
10. The circuit board copper deposition apparatus according to claim 1, wherein the first driving member comprises a first cylinder and a second cylinder, the first cylinder is mounted on the frame, the first cylinder is in driving connection with the second cylinder for driving the second cylinder to move along the length direction of the first unpowered raceway, the pushing member is mounted on the movable end of the second cylinder, and the second cylinder is used for controlling the pushing member to move up and down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320543995.0U CN220254795U (en) | 2023-03-17 | 2023-03-17 | Copper deposition equipment for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320543995.0U CN220254795U (en) | 2023-03-17 | 2023-03-17 | Copper deposition equipment for circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220254795U true CN220254795U (en) | 2023-12-26 |
Family
ID=89268563
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320543995.0U Active CN220254795U (en) | 2023-03-17 | 2023-03-17 | Copper deposition equipment for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220254795U (en) |
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2023
- 2023-03-17 CN CN202320543995.0U patent/CN220254795U/en active Active
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