CN220252527U - Vehicle-mounted 5G terminal air-cooled heat dissipation waterproof structure - Google Patents
Vehicle-mounted 5G terminal air-cooled heat dissipation waterproof structure Download PDFInfo
- Publication number
- CN220252527U CN220252527U CN202321356131.4U CN202321356131U CN220252527U CN 220252527 U CN220252527 U CN 220252527U CN 202321356131 U CN202321356131 U CN 202321356131U CN 220252527 U CN220252527 U CN 220252527U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- liquid cooling
- cooling plate
- heat
- plastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 66
- 238000001816 cooling Methods 0.000 claims abstract description 47
- 239000007788 liquid Substances 0.000 claims abstract description 40
- 238000004891 communication Methods 0.000 claims abstract description 15
- 238000013461 design Methods 0.000 claims abstract description 10
- 239000003292 glue Substances 0.000 claims abstract description 7
- 229910000679 solder Inorganic materials 0.000 claims abstract description 5
- 238000003825 pressing Methods 0.000 claims abstract description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 238000010276 construction Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 6
- 239000000463 material Substances 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000000110 cooling liquid Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 230000009545 invasion Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241001124569 Lycaenidae Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses an air-cooling heat-dissipation waterproof structure of a vehicle-mounted 5G terminal, which mainly comprises a main PCB (printed circuit board), a VC (video) liquid cooling plate, a heat dissipation part, a fan assembly and a plastic rear shell. The VC liquid cooling plate is welded on the heat dissipation piece through heat conduction solder paste, the VC liquid cooling plate is directly in pressing contact with the 5G communication module of the main PCB circuit board, and heat conduction gel is filled in the VC liquid cooling plate to remove air, so that hot spots of the 5G communication module of the PCB circuit board can be quickly soaked through the VC liquid cooling plate; the fan component and the radiating piece are locked and fixed by adopting screws; the plastic back shell and the heat dissipation piece are assembled through interference fit, and an assembling gap between the plastic back shell and the heat dissipation piece is filled by extruding the plastic back shell; the plastic back shell and the VC liquid cooling plate form a sealed whole through dispensing waterproof glue. According to the utility model, the 5G communication module is enabled to rapidly dissipate heat by virtue of the combination design of the air cooling heat dissipation part of the fan and the VC liquid cooling plate. The gap and the waterproof glue seal are assembled and filled through interference fit, so that the waterproof effect of the equipment is achieved.
Description
Technical Field
The utility model relates to a radiating piece structure of vehicle-mounted equipment, in particular to an air-cooled radiating waterproof structure of a vehicle-mounted 5G terminal for industrial and agricultural medium-sized electronic products.
Background
Conventional heavy vehicles, such as tractors, excavators and harvesters, usually run in severe environments, need to bear challenges of dust, moisture, vibration and extremely high temperature, are relatively severe in environments, the products need to reach or exceed the waterproof and dustproof grade of IP65, meet MIL-STD-810 vibration resistance standards, and ISO16750 road vehicle standards, and can stably run in extreme temperature and humidity environments (-40 ℃ to 90 ℃ and humidity of 0% -90%), so that requirements on heat dissipation and waterproof performance of the products are relatively high, and in order to enable a vehicle-mounted flat plate to stably run in high-temperature and rainy environments, air cooling and heat conduction design needs to be conducted on vehicle-mounted equipment, heat dissipation pieces are increased in heat conduction efficiency of internal chips, and integral waterproof performance is synchronously improved.
Generally, the vehicle-mounted flat plate heat dissipation mainly depends on an aluminum alloy piece, the heat conduction mode is back-moving heat dissipation, and the efficiency is low due to the influence of the heat conduction coefficient of the material. At present, the vehicle-mounted flat plate radiating piece is mainly made of aluminum alloy, the heat conductivity coefficient is only 96.2 (W/m.K), the vehicle radiating requirement under a special environment is difficult to meet, the use influence on high-power-consumption devices is relatively large, and the vehicle-mounted development of the whole agricultural machinery is affected deeply.
In addition, the conventional vehicle-mounted flat waterproof design is also defective, the plastic rear shell and the heat dissipation part are mainly designed through in-mold injection molding, the scheme has certain technological defects, the heat dissipation part is easy to crush during production, poor appearance is caused, the BOM cost of the structure is increased, in addition, the aluminum alloy and plastic particles are difficult to joint, a fine gap is left at a joint position after molding, the waterproof structure is used in a rainstorm day for a long time, water can infiltrate into the whole machine from the heat dissipation part area, and thus a main PCB circuit board device is broken.
Disclosure of Invention
In order to solve the technical problems, the utility model provides the air-cooling heat-dissipation waterproof structure of the vehicle-mounted 5G terminal, which solves the problem of heat dissipation and water drainage of the vehicle-mounted flat panel device in a long-term severe environment, and enables a heating device of the vehicle-mounted terminal device to rapidly dissipate heat through the combined design of a heat dissipation piece and a VC liquid cooling plate; the plastic back shell is assembled with the heat dissipation piece in interference fit, and the plastic back shell and the VC liquid cooling plate are provided with waterproof glue, so that the long-term effectiveness of waterproof is maintained.
The technical scheme adopted for solving the technical problems is as follows:
an air-cooled heat dissipation waterproof structure of a vehicle-mounted 5G terminal mainly comprises a main PCB circuit board, a VC liquid cooling plate, a heat dissipation part, a fan assembly and a plastic rear shell.
The VC liquid cooling plate is welded on the radiating piece through heat conduction solder paste, the VC liquid cooling plate is directly in pressing contact with the 5G communication module of the main PCB circuit board, and heat conduction gel is filled in the VC liquid cooling plate to remove air, so that hot spots of the 5G communication module of the PCB circuit board can be quickly soaked through the VC liquid cooling plate; the fan component and the radiating piece are locked and fixed by adopting screws; the plastic back shell and the heat dissipation piece are assembled through interference fit, and an assembling gap between the plastic back shell and the heat dissipation piece is filled by extruding the plastic back shell; the plastic back shell and the VC liquid cooling plate are subjected to waterproof glue dispensing, so that the whole heat dissipation assembly and the plastic back shell form a sealed whole.
The utility model adopts the vacuum cavity vapor chamber technology, the inside is filled with the cooling liquid, and when in work, the cooling liquid is rapidly evaporated into hot air-heat absorption under the vacuum ultra-low pressure environment; the hot air heats up and rises, and radiates heat after encountering the cold source at the upper part of the radiating plate, and is condensed into liquid for radiating heat, so that the hot air circulates in the copper mesh microenvironment more quickly for heat conduction.
When the fan assembly works, air is driven to flow in an accelerating way, the heat radiating area is increased by the fin structure design of the heat radiating piece, so that an internal heat source can be rapidly led out through the heat radiating piece, and the heat is actively radiated through the fan, so that the air cooling effect is achieved.
Furthermore, the heat dissipation piece is made of pure aluminum, the heat conductivity coefficient is 210W (m.K), and the back surface is provided with a large-area fin design.
Further, the heat dissipation piece is locked and fixed with the plastic rear shell through 4 screws, and the plastic rear shell is provided with a large slot structure.
Furthermore, 4 screw posts are designed on the heat dissipation piece, so that the heat dissipation piece is fixed and plays a limiting role.
The beneficial effects of the utility model are as follows: the utility model utilizes the fan to drive the air convection to form active heat dissipation, and drives the air convection to form air-cooled heat dissipation by the fan, so that the surface temperature of the heat dissipation part is rapidly reduced, and the heat source of the main device of the main PCB can be rapidly led out.
In addition, through radiating piece and VC liquid cooling board integrated design, utilize pure aluminum material high thermal conductivity and VC liquid cooling board quick soaking principle, let the inside biggest consumption device 5G communication module heating source of complete machine hug closely together, let the quick heat dissipation of 5G communication module, extension mainboard subassembly 5G communication module and the life of components and parts that generate heat such as CPU device.
According to the waterproof heat radiator, the plastic rear shell and the heat radiator are assembled through interference fit, and gaps assembled in a matched mode are filled, so that a waterproof effect is achieved. In addition, the plastic back shell and the VC liquid cooling plate are subjected to waterproof glue dispensing, so that the whole heat dissipation assembly and the plastic back shell form a sealed whole, and secondary rainwater invasion resistance is increased.
Drawings
The technical solution of the present utility model and its advantageous effects will be made apparent by the following detailed description of the specific embodiments of the present utility model with reference to the accompanying drawings.
Fig. 1 is a plan view of the complete machine of the present utility model.
Fig. 2 is an expanded view of the whole structure of the present utility model.
Fig. 3 is a plan view of a motherboard assembly of the present utility model.
Fig. 4 is a partial cross-sectional view of the rear housing assembly and heat sink and VC liquid cooling plate and fan assembly of the present utility model.
Fig. 5 is an assembled view of the heat sink and VC liquid cooling plate and fan assembly of the present utility model.
FIG. 6 is an assembled view of the rear housing assembly, heat sink and VC liquid cooling panel and fan assembly of the present utility model.
Description of the embodiments
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which some, but not all embodiments of the utility model are shown.
As shown in fig. 1 and 2, the vehicle-mounted 5G terminal 001 according to the present utility model includes a front case assembly 100, a main board assembly 200, a waterproof ring 300, a rear case assembly 400, a VC liquid cooling plate 500, a heat dissipation assembly 600, and a fan assembly 700.
The utility model comprises the following structural components and assembly processes: the main board assembly 200 is firstly installed on the front shell assembly 100, and is fixed by locking screws; then, the VC liquid cooling plate 500 is welded on the heat dissipation assembly 600 through heat conduction solder paste, and screws are locked for fixation when the fan assembly 700 is assembled on the assembly 600; then the heat radiation component 600 assembled with the VC liquid cooling plate and the fan is assembled on the rear shell component 400, and the screws are locked for fixation and sleeved with the waterproof 300; and finally, mounting the rear shell assembly 400 assembled with the heat dissipation part on the front shell assembly 100, and locking and fixing by screws to complete the whole structure assembly of the vehicle-mounted 5G terminal 001.
As shown in fig. 4 and 5, the heat dissipating assembly 600 includes a heat dissipating member 610 and a ground pin 620. The grounding spring needle 620 is assembled on the heat dissipation member 610 through interference fit, then the VC liquid cooling plate 500 is welded on the heat dissipation member 610 through heat conduction solder paste, and the point at the gap 810 between the heat dissipation member 610 and the grounding spring needle of the VC liquid cooling plate 500 is sealed.
As shown in fig. 5, the fan assembly 700 and the heat dissipation assembly 600 are fastened and fixed by screws, and when the fan assembly 700 works, air is driven to circulate in an accelerating way, so that an internal heat source can be rapidly led out through the heat dissipation member, and the heat is actively dissipated through the fan, thereby achieving the air cooling effect.
As shown in fig. 2 and fig. 3, the VC liquid cooling board 500 is directly in press-fit contact with the motherboard assembly 200 5G communication module 210, and the interior is filled with a heat-conducting gel to remove air, so that the hot spot of the PCB circuit board 5G communication module 210 can be quickly soaked by the VC liquid cooling board.
As shown in fig. 4 to 6, the heat conductivity coefficient of the heat dissipation element 610 is 210W (m·k), and the design of the large-area fins 630 is added on the back surface, so that the contact area between the back surface of the heat dissipation element and the outside air is increased, and the overall heat conduction efficiency is greatly improved.
The heat dissipation assembly 600 is locked and fixed with the rear shell assembly 400 through 4 screws, and the VC liquid cooling plate is avoided through the structural design of the large slot 840 on the plastic rear shell, so that the heat dissipation efficiency of the main PCB circuit board is increased, and the heat source of the large-power-consumption device of the main board assembly 200 can be rapidly conducted through the VC liquid cooling plate 500.
As shown in fig. 2 to 6, the fan assembly 700 is connected to the main board assembly 200 through a grounding pin 620, and the main board assembly 200 provides power, and the main board power interface is located at 220.
The heat dissipation assembly 600 is provided with 4 screw posts 640, which play a role in fixing and limiting, and when the heat dissipation assembly 600 is assembled, the screw posts 640 can effectively maintain the stability of the relative positions of the heat dissipation part and the plastic rear shell, reduce the damage to the appearance surface of the assembled aluminum part, and improve the production and assembly yield.
The back shell assembly 400 and the heat dissipation assembly 600 are assembled through interference fit, the heat dissipation piece is high in material hardness, and the assembled gap 850 is filled by extruding the plastic back shell by utilizing the plastic shrinkage principle, so that a waterproof effect is achieved.
The gap position 820 between the rear shell assembly 400 and the VC liquid cooling plate 500 is filled with waterproof glue, so that the whole heat dissipation assembly and the plastic rear shell form a sealed whole, and secondary rainwater invasion resistance is increased.
As shown in fig. 2 to 6, the heat dissipation assembly 600 is combined with the VC liquid cooling plate 500, and the fan assembly 700 drives air convection to form air cooling heat dissipation, so that the VC liquid cooling plate 500 is tightly attached to the heat sources of the CPU device 230 and the 5G communication module 210 in the whole machine, and the CPU device 230 and the 5G communication module 210 can quickly dissipate heat and cool down, thereby prolonging the service lives of the heat generating components such as the CPU device 230 and the 5G communication module 210 of the main board assembly. The stable operation of the work of the vehicle-mounted flat plate 001 is ensured, and the service life of heating components of the CPU component of the main board component is prolonged.
In summary, the utility model not only solves the problem of heat dissipation and water drainage of the vehicle-mounted flat panel device in a long-term severe environment, but also has the following advantages: the heat dissipation part and the rear shell are fixed through screws, so that the assembly is simple, convenient and reliable, the production defects of an in-mold injection molding process are reduced, and the cost of the project structural part is reduced. The heat dissipation part material can meet different process requirements, such as oxygen electrode cationization of the appearance surface, sand blasting, paint baking, product attractive appearance improvement and texture improvement.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (4)
1. The utility model provides a on-vehicle 5G terminal forced air cooling heat dissipation waterproof construction, mainly comprises main PCB circuit board, VC liquid cooling board, radiating part, fan subassembly and plastic backshell, characterized by: the VC liquid cooling plate is welded on the radiating piece through heat conduction solder paste, the VC liquid cooling plate is directly in pressing contact with the 5G communication module of the main PCB circuit board, and heat conduction gel is filled in the VC liquid cooling plate to remove air, so that hot spots of the 5G communication module of the PCB circuit board can be quickly soaked through the VC liquid cooling plate; the fan component and the radiating piece are locked and fixed by adopting screws; the plastic back shell and the heat dissipation piece are assembled through interference fit, and an assembling gap between the plastic back shell and the heat dissipation piece is filled by extruding the plastic back shell; the plastic back shell and the VC liquid cooling plate are subjected to waterproof glue dispensing, so that the whole heat dissipation assembly and the plastic back shell form a sealed whole.
2. The vehicle-mounted 5G terminal air-cooled heat dissipation waterproof structure according to claim 1, wherein: the heat dissipation part is made of pure aluminum, the heat conductivity coefficient is 210W (m.K), and the back surface is provided with a large-area fin design.
3. The vehicle-mounted 5G terminal air-cooled heat dissipation waterproof structure according to claim 1, wherein: the heat dissipation part is locked and fixed with the plastic rear shell through 4 screws, and the plastic rear shell is provided with a large slot structure.
4. The vehicle-mounted 5G terminal air-cooled heat dissipation waterproof structure according to claim 1, wherein: the heat dissipation part is provided with 4 screw posts, which play a role in fixing and limiting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321356131.4U CN220252527U (en) | 2023-05-31 | 2023-05-31 | Vehicle-mounted 5G terminal air-cooled heat dissipation waterproof structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321356131.4U CN220252527U (en) | 2023-05-31 | 2023-05-31 | Vehicle-mounted 5G terminal air-cooled heat dissipation waterproof structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220252527U true CN220252527U (en) | 2023-12-26 |
Family
ID=89228968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321356131.4U Active CN220252527U (en) | 2023-05-31 | 2023-05-31 | Vehicle-mounted 5G terminal air-cooled heat dissipation waterproof structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220252527U (en) |
-
2023
- 2023-05-31 CN CN202321356131.4U patent/CN220252527U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112714601B (en) | A heat radiation structure and intelligent terminal for intelligent terminal | |
| CN215987101U (en) | Server | |
| CN220252527U (en) | Vehicle-mounted 5G terminal air-cooled heat dissipation waterproof structure | |
| CN116594486A (en) | Vehicle-mounted 5G terminal air-cooled heat dissipation waterproof structure | |
| CN210555610U (en) | Unmanned aerial vehicle's heat radiation structure | |
| CN219120411U (en) | Passive heat radiation structure of front combination lamp LED driver | |
| CN212544070U (en) | Embedded intelligent terminal based on 5G communication | |
| CN209710590U (en) | A kind of radiator structure suitable for Full-enclosed electronic equipment | |
| CN201286213Y (en) | Communication product with high heat radiation efficiency | |
| CN220252834U (en) | Water cooling and heat dissipation waterproof structure of engineering vehicle-mounted data box | |
| CN110677738A (en) | Anti-interference indoor 5G network communication device | |
| CN220820607U (en) | Heat abstractor for microcomputer | |
| CN101149056A (en) | Cooling fan | |
| CN210537216U (en) | Circuit board cooling device | |
| CN2537200Y (en) | Electric housing with large radiating surfaces | |
| CN216058045U (en) | Small-sized closed case adopting heat pipe coupling heat dissipation tooth natural air cooling heat dissipation mode | |
| CN217088511U (en) | Camera module and shooting assembly | |
| CN214797397U (en) | Integrated high-power triode | |
| CN220208185U (en) | Improved chassis radiating module and structure | |
| CN218603831U (en) | Heat radiator for on-vehicle host computer | |
| CN217884273U (en) | USB module of charging with heat dissipation and EMC shielding function | |
| CN217088512U (en) | Camera module capable of dissipating heat | |
| CN219437469U (en) | Heat radiation structure of electric vehicle controller | |
| CN219876681U (en) | Vehicle-mounted terminal equipment | |
| CN220305771U (en) | Micro computer host with integrated space liquid cooling heat dissipation function |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |