CN220232237U - Semiconductor manufacturing equipment - Google Patents
Semiconductor manufacturing equipment Download PDFInfo
- Publication number
- CN220232237U CN220232237U CN202321824469.8U CN202321824469U CN220232237U CN 220232237 U CN220232237 U CN 220232237U CN 202321824469 U CN202321824469 U CN 202321824469U CN 220232237 U CN220232237 U CN 220232237U
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- CN
- China
- Prior art keywords
- shaft portion
- optically transmissive
- photomask
- transmissive film
- semiconductor manufacturing
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 48
- 239000004065 semiconductor Substances 0.000 title claims abstract description 47
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 230000000903 blocking effect Effects 0.000 claims abstract description 10
- 230000005540 biological transmission Effects 0.000 claims description 46
- 238000004140 cleaning Methods 0.000 claims description 37
- 230000003287 optical effect Effects 0.000 claims description 17
- 238000007664 blowing Methods 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000000059 patterning Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
A semiconductor manufacturing apparatus for forming a predetermined pattern on a substrate using a photomask opposing the substrate, the semiconductor manufacturing apparatus comprising: and a blocking portion having an optically transmissive film interposed between the photomask and the substrate and a transmitting portion that moves one film of the optically transmissive film against a surface of the photomask facing the substrate side.
Description
Technical Field
The present utility model relates to semiconductor manufacturing equipment, and more particularly to semiconductor manufacturing equipment for semiconductor patterning.
Background
Photomasks (photomasks) are commonly used in photolithographic (photolit hography) processes for semiconductor manufacturing. The photomask is generally made of very flat quartz or glass, and at the time of the photolithography step, the semiconductor manufacturing apparatus is capable of transferring a pattern on the photomask onto a target substrate by irradiating light to the photomask, thereby forming a predetermined pattern on the substrate.
In the exposure process, the photoresist is easily volatilized and attached to the photomask under the influence of temperature or illumination, so that the photomask is atomized due to the fact that the volatile matters of the photoresist along with the increase of the exposure time, and the exposure quality is affected when the exposure time reaches a certain degree, so that the patterning accuracy is reduced. In addition, when the airflow disturbance and other factors may cause the particles of the volatile matter that is originally attached to the photomask to fall onto the substrate, the patterning quality is affected. Therefore, it is necessary to stop the semiconductor manufacturing and detach the photomask for cleaning. Thus, the production efficiency is greatly reduced.
Disclosure of Invention
Therefore, there is a need for a semiconductor manufacturing apparatus that can avoid the removal of the photomask and can avoid the attachment of the atomized particles of the photoresist to the photomask.
A semiconductor manufacturing apparatus according to an aspect of the present utility model, which forms a predetermined pattern on a substrate through a photomask, is characterized by comprising: and a blocking portion having an optically transmissive film interposed between the photomask and the substrate and a transmitting portion capable of moving one film of the optically transmissive film against the photomask.
Further, in the semiconductor manufacturing apparatus according to an aspect of the present utility model, the optically transmissive film is opposed to the photomask and the substrate with a space therebetween, respectively.
Further, in the semiconductor manufacturing apparatus according to an aspect of the present utility model, the transmission portion is at least two shaft portions extending in a width direction of the optically transmissive film, the at least two shaft portions including a start shaft portion for fixing to a start end of the optically transmissive film and a stop shaft portion for fixing to a stop end of the optically transmissive film, in a case where the start shaft portion further has a part of the optically transmissive film that is curled, when the optically transmissive film moves from the start end toward the stop end, a part of the optically transmissive film on the stop end side is curled by the stop shaft portion, and a part of the optically transmissive film that is originally curled by the start shaft portion is spread.
Further, in the semiconductor manufacturing apparatus according to an aspect of the present utility model, the at least two shaft portions are the start shaft portion and the end shaft portion, which are respectively arranged outside opposite end edges of the photomask along a moving direction of the optically transmissive film and traverse between the photomask and the substrate.
Further, in the semiconductor manufacturing apparatus according to an aspect of the present utility model, the optically transmissive film covers the entirety of the photomask in a region between the start shaft portion and the end shaft portion when the photomask is viewed from above.
Further, in the semiconductor manufacturing apparatus according to an aspect of the present utility model, the at least two shaft portions further include at least one abutment shaft portion in addition to the start shaft portion and the end shaft portion, the at least one abutment shaft portion being located between the start shaft portion and the end shaft portion with respect to the optically transmissive film, the optically transmissive film being in slidable contact or frictional contact with an outer surface of the at least one abutment shaft portion.
Further, in the semiconductor manufacturing apparatus according to an aspect of the present utility model, in a region between two shaft portions of the at least two shaft portions, which are respectively arranged outside opposite end edges of the photomask in a moving direction of the optically transmissive film and traverse between the photomask and the substrate, the optically transmissive film covers the entirety of the photomask when the photomask is viewed from above.
Further, in the semiconductor manufacturing apparatus according to an aspect of the present utility model, a cleaning portion that is provided at a portion of the optically transmissive film that is located outside the region and is in contact with a film surface of the optically transmissive film on a side facing the substrate is further included.
Further, in the semiconductor manufacturing apparatus according to an aspect of the present utility model, the cleaning portion is located at least between the adjacent two shaft portions.
Further, in the semiconductor manufacturing apparatus according to an aspect of the present utility model, a cleaning portion is further included, which is provided next to the termination shaft portion and is in contact with a film surface of the optically transmissive film on a side facing the substrate.
Further, in the semiconductor manufacturing apparatus according to an aspect of the present utility model, the cleaning portion is at least one of a burr-attached roller, a blowing portion that blows a cleaning gas, and a cleaning liquid supply portion.
Further, in the semiconductor manufacturing apparatus according to an aspect of the present utility model, the cleaning portion may be in slidable contact or frictional contact with the optically transmissive film as an abutment shaft portion.
Further, in the semiconductor manufacturing apparatus according to an aspect of the present utility model, the optically transmissive film is a high light-transmitting film having flexibility.
The present utility model has been made in view of the above-described problems. According to one aspect of the present utility model, it is possible to avoid disassembly of the photomask, and to avoid attachment of atomized particles of the photoresist to the photomask and contamination of semiconductor manufacturing equipment due to long-term stack drop, resulting in higher production efficiency of the semiconductor.
Drawings
Fig. 1 is a schematic view of a semiconductor manufacturing apparatus according to embodiment 1.
Fig. 2 is a schematic diagram of a semiconductor manufacturing apparatus according to embodiment 2.
Fig. 3 is a schematic view of a semiconductor manufacturing apparatus according to embodiment 3.
Description of the main reference signs
Semiconductor manufacturing apparatus 1
Photomask apparatus 10
Photomask 11
Barrier 13
Optically transmissive film 131
Transmission section, first to fourth transmission sections 133
A start shaft 1331
Terminating shaft portion 1333
Cleaning section 135
Substrate 20
Photoresist 30
Detailed Description
In the following, in order to more clearly and easily understand the above objects, features and advantages of the present utility model, specific embodiments of the present utility model will be described in detail with reference to the accompanying drawings.
Although numerous specific details are set forth in the following description in order to provide a thorough understanding of the present utility model, the present utility model may be practiced in other ways described herein, and those skilled in the art may likewise be able to practice the present utility model without departing from the meaning thereof. The present utility model is not limited by the specific examples disclosed below.
For convenience in description, unless otherwise specified, the same reference numerals denote the same functions, and the description thereof may be omitted. In the drawings referred to below, the configuration is simplified or schematically shown for ease of understanding, or some of the constituent members are omitted. The dimensional ratios between the constituent members shown in the drawings do not necessarily represent actual dimensional ratios.
Embodiment 1
Fig. 1 shows a semiconductor manufacturing apparatus 1 according to the present embodiment. As shown in fig. 1, the semiconductor manufacturing apparatus 1 includes a photomask apparatus 10 and a substrate 20. In the semiconductor manufacturing process, before exposure, for example, a resist 30 is coated on a substrate 20 by a conventional method, light is irradiated onto the resist 30 on the substrate 20 through a photomask 11 including a pattern of openings, and the resist is developed, cleaned, and the like by a conventional method, thereby forming a predetermined pattern on the substrate 20.
In the present embodiment, the photomask apparatus 10 further includes a blocking portion 13. The blocking portion 13 includes an optically transmissive film 131 and at least two transmitting portions 133. The optically transmissive film 131 is interposed between the photomask 11 and the substrate 20, and at least two transmitting portions 133 move one film of the optically transmissive film 131 against the surface of the photomask 11 facing the substrate 20 side. The optically transmissive film 131 is opposed to the photomask 11 and the substrate 20 with a gap therebetween, that is, an air gap (air gap) is formed between the optically transmissive film 131 and the photomask 11, so that the movement of the optically transmissive film 131 is not hindered by the photomask 11, and the rolling of the optically transmissive film 131 is further realized. The optically transmissive film 131 is a film having high light transmittance to light and has flexibility. For example, a resin material such as ethylene-tetrafluoroethylene copolymer (ETFE), polycarbonate resin, polyethylene terephthalate, polyamide, or a composite film obtained by coating a flexible substrate with an antireflective film may be used. Preferably, a flexible film having a light transmittance of 95% or more is used.
Specifically, the at least two transmitting portions 133 are at least two shaft portions extending along the width direction of the optically transmissive film 131, and the width direction of the optically transmissive film 131 is perpendicular to the moving direction of the optically transmissive film 131. At least two of the transmitting portions 133 include a start shaft portion for fixing to the start end of the optically transmissive film 131 and a stop shaft portion for fixing to the stop end of the optically transmissive film 131, and in the case where the start shaft portion further has a portion of the optically transmissive film 131 that is curled, after the optically transmissive film 131 moves from the start end toward the stop end, a portion of the optically transmissive film 131 on the stop end side is curled by the stop shaft portion, and a portion of the optically transmissive film 131 that was originally curled by the start shaft portion is spread.
"the starting shaft portion also has a portion of the optically transmissive film 131 that is curled" means that there is still an unused portion on the starting shaft portion, where the use refers to being applied to a photolithography process. By "a portion of the optically transmissive film 131 that is originally curled by the starting shaft portion is unfolded" is meant that an unused portion of the optically transmissive film 131 moves toward the ending shaft portion, turning into a portion to be used. The portion of the optically transmissive film 131 interposed between the photomask 11 and the substrate 20 and facing both is a portion to be used or being used, and when the portion of the optically transmissive film 131 is separated from a position interposed between the photomask 11 and the substrate 20 and facing both, this means that the portion of the optically transmissive film 131 is contaminated, and as a result, is cleaned by a cleaning portion 135 described later, is used as a reusable optically transmissive film 131, or is terminated with the shaft portion curled and discarded when the use of the optically transmissive film 131 is completed.
The start shaft portion and the end shaft portion are rotatable, and a driving portion (not shown) is preferably provided in the end shaft portion. However, the driving portion may be provided for both the start shaft portion and the end shaft portion. Further, a sensor may be additionally provided for detecting whether or not the haze of the optically transmissive film 131 directly under the photomask 11, the size of volatile particles on the film surface, the change in optical characteristics of light passing through the optically transmissive film 131, or the like is within a predetermined threshold range indicating that replacement is not necessary, and if it is determined that the threshold is exceeded, a signal may be sent to the driving unit to cause the driving unit to operate. Further, a timer may be provided to the driving unit, and the driving unit may be automatically operated after a predetermined time has elapsed. Instead of the driving unit, a handle or the like for facilitating manual operation may be provided, and a user may determine whether to replace the optically transmissive film 131.
The at least two transmission portions 133 include at least one abutment shaft portion in addition to the start shaft portion and the end shaft portion. With respect to the optically transmissive film 131, all of the at least one abutment shaft portion is located between the start shaft portion and the end shaft portion, and the optically transmissive film 131 is in slidable contact or frictional contact with the outer surface of the at least one abutment shaft portion, the abutment shaft portion not only can transmit the function of the optically transmissive film 131, but also can change the transmission direction of the optically transmissive film 131 by abutment with the optically transmissive film 131.
In the example of fig. 1, at least two of the transmission portions 133 include four transmission portions 133 as abutting shaft portions and a start shaft portion and a stop shaft portion, which are not shown. The four transmission portions 133 as the abutment shaft portions are the first transmission portion 133, the second transmission portion 133, the third transmission portion 133, and the fourth transmission portion 133, respectively. The optical transmission film 131 is wound around the first transmission part 133, the second transmission part 133, the third transmission part 133, the fourth transmission part 133, and the end shaft part (not shown) in this order from the start shaft part, and the optical transmission film 131 is wound around the first transmission part 133, the second transmission part 133, the third transmission part 133, the fourth transmission part 133, and the end shaft part in this order, so that the unused optical transmission film 131 is wound around the end shaft part from just below the photomask 11 through at least the second transmission part 133 after the optical transmission film 131 moves along these shaft parts, and the used optical transmission film 131 is finally wound around the end shaft part from just below the photomask 11 through the third transmission part 133 and the subsequent fourth transmission part 133.
The present embodiment is not limited to this, and the number of contact shaft portions may be appropriately set as long as the optical transmission film 131 can be appropriately transmitted between the photomask 11 and the substrate 20, and light passing at the time of lithography is not affected.
In the example shown in fig. 1, the second and third transmission portions 133 and 133 as abutment portions are arranged outside opposite end edges of the photomask 11 along the moving direction of the optically transmissive film 131 and traverse between the photomask 11 and the substrate 20. Thus, in a region between the two abutting shaft portions (hereinafter, also referred to as a blocking region) when the surface of the photomask 11 facing the substrate 20 side is viewed in plan, the optical transmission film 131 covers the entire surface of the photomask 11.
The present utility model is not limited to the example of fig. 1, and one of the two shaft portions arranged outside the opposite end edges of the photomask 11 in the moving direction of the optically transmissive film 131 and crossing between the photomask 11 and the substrate 20 may be an abutment shaft portion, and the other may be any one of the start shaft portion 1331 and the end shaft portion 1333, and the same effect can be achieved.
The present utility model is not limited to the example of fig. 1, and the first transmission portion 133 and the fourth transmission portion 133, which are contact portions, may be replaced with a start shaft portion and a stop shaft portion, respectively, so that the same effect can be achieved.
According to the above embodiment, by providing the blocking portion 13, it is possible to prevent the photomask from being atomized, and by rotating the shaft portion of the transmission portion 133, the used contaminated optically transmissive film 131 can be replaced with an unused optically transmissive film 131, and it is possible to prevent the photomask from being detached, and to prevent the atomized particles of the photoresist from adhering to the photomask and contaminating the semiconductor manufacturing apparatus 1 due to the long-term deposition and dropping, thereby improving the production efficiency of the semiconductor.
Embodiment 2
In embodiment 2 of the present utility model shown in fig. 2, at least two transmission portions 133 have only two shaft portions, namely, a start shaft portion 1331 and a stop shaft portion 1333, without having abutting shaft portions. The start shaft portion 1331 and the end shaft portion 1333 are arranged outside the opposite end edges of the photomask 11 along the moving direction of the optically transmissive film 131 and traverse between the photomask 11 and the substrate 20, respectively. Thus, in a region between the start shaft portion 1331 and the end shaft portion 1333 (hereinafter, also referred to as a blocking region) when the surface of the photomask 11 facing the substrate 20 side is viewed in plan, the entire surface of the photomask 11 is covered with the optically transmissive film 131.
Further, in the example of fig. 2, the start shaft portion 1331 and the end shaft portion 1333 are rotated in synchronization to keep the optically transmissive film 131 flat. This reduces the influence on the image light. Further, when the optically transmissive film 131 is moved, the start shaft portion 1331 and the end shaft portion 1333 are rotated synchronously in the same direction, but the present utility model is not limited thereto, and the start shaft portion 1331 and the end shaft portion 1333 are rotated synchronously in the opposite direction, and the relative heights of the start shaft portion 1331 and the end shaft portion 1333 may be appropriately adjusted so that the film surface of the optically transmissive film 131 therebetween is parallel to the surface of the photomask 11.
Of course, the start shaft portion 1331 is not limited to the left shaft portion, the end shaft portion 1333 is not limited to the right shaft portion, and the positions of the start shaft portion 1331 and the end shaft portion 1333 may be reversed.
According to this embodiment, the same effects as those of embodiment 1 can be achieved.
Embodiment 3
As shown in fig. 3, the semiconductor manufacturing apparatus 1 of the present utility model may also include a cleaning section 135. The optically transmissive film 131 is provided with a cleaning section 135 in contact with a portion other than the blocking region. The film surface contacted by the optically transmissive film 131 is a surface facing the substrate 20.
The cleaning portion 135 may be provided between two adjacent shaft portions other than the blocking region, for example, between the end shaft portion and the adjacent abutment shaft portion, or between the adjacent two abutment shaft portions. Further, one type of cleaning portion 135 may be provided between the two shaft portions, or a plurality of types of cleaning may be combined between the two shaft portions. In addition, one cleaning method may be provided between two adjacent shaft portions and another cleaning method may be provided between the other two adjacent shaft portions, but the present utility model is not limited thereto, as long as the contaminated optical transmission film 131 can be properly cleaned.
Further, the cleaning portion 135 may be in slidable contact or frictional contact with the optically transmissive film 131 instead of the position where the cleaning portion 135 is abutted against the shaft portion, so that the cleaning portion 135 can serve both the purposes of conveyance and cleaning.
Further, the cleaning portion 135 may be provided next to the end shaft portion 1333 and may be in contact with a film surface of the optically transmissive film 131 on a side facing the substrate 20. In particular, in the example of fig. 2, the cleaning portion 135 is in contact with a film surface of the optically transmissive film 131 on an outer surface of the end shaft portion 1333 remote from the start shaft portion 1331.
In the example shown in fig. 3, the cleaning portion 135 may be a burr roller, but the present utility model is not limited thereto, and the cleaning portion 135 may be at least one of a blowing portion for blowing cleaning gas and a cleaning liquid supply portion, and may be appropriately combined or modified. The cleaning section 135 may further include a contaminant collecting section (not shown) for collecting the detached contaminants, the contaminated gas, the contaminated liquid, and the like generated at the time of cleaning. The cleaning gas may be nitrogen, compressed clean air, or the like. The cleaning liquid may be an ammonium ion (NH 4) + ) Sulfate ion (SO 4) 2- ) And the like.
According to the present embodiment, the same effects as those of embodiment 1 can be obtained, and the contaminated optical transmission film 131 can be reused by providing the cleaning portion 135. In addition, the transmission part is preferably capable of reversing, thereby facilitating the reuse of the optical transmission film 131, reducing the replacement time of the optical transmission film 131, and greatly improving the production efficiency.
Claims (10)
1. A semiconductor manufacturing apparatus that forms a predetermined pattern on a substrate through a photomask, the semiconductor manufacturing apparatus characterized by comprising:
and a blocking portion having an optically transmissive film interposed between the photomask and the substrate and a transmitting portion capable of moving one film of the optically transmissive film against the photomask.
2. The semiconductor manufacturing apparatus according to claim 1, wherein,
the optically transmissive film is opposed to the photomask and the substrate with a gap therebetween.
3. The semiconductor manufacturing apparatus according to claim 1 or 2, wherein,
the transmission part is at least two shaft parts extending along the width direction of the optical transmission film,
the at least two shaft portions include a start shaft portion for fixing to a start end of the optically transmissive film and a stop shaft portion for fixing to a stop end of the optically transmissive film, and in the case where the start shaft portion further has a portion of the optically transmissive film curled, when the optically transmissive film moves from the start end toward the stop end, a portion of the optically transmissive film on the stop end side is curled by the stop shaft portion, and a portion of the optically transmissive film originally curled by the start shaft portion is spread.
4. The semiconductor manufacturing apparatus according to claim 3, wherein,
the at least two shaft portions are the start shaft portion and the end shaft portion, which are respectively arranged outside opposite end edges of the photomask along a moving direction of the optically transmissive film and traverse between the photomask and the substrate.
5. The semiconductor manufacturing apparatus according to claim 4, wherein,
the optically transmissive film covers the entirety of the photomask in a region between the start shaft portion and the end shaft portion when the photomask is viewed in plan.
6. The semiconductor manufacturing apparatus according to claim 3, wherein,
the at least two shaft portions include at least one abutment shaft portion in addition to the start shaft portion and the end shaft portion, the at least one abutment shaft portion being located between the start shaft portion and the end shaft portion with respect to the optically transmissive film,
the optically transmissive film is in slidable or frictional contact with an outer surface of the at least one abutment shaft portion.
7. The semiconductor manufacturing apparatus according to claim 6, wherein,
the optical transmission film covers the entire photomask in a region between two shaft portions of the at least two shaft portions, which are arranged outside opposite end edges of the photomask along a moving direction of the optical transmission film and traverse between the photomask and the substrate, respectively, when the photomask is viewed from above.
8. The semiconductor manufacturing apparatus according to claim 5 or 7, wherein,
the cleaning part is arranged at a part of the optical transmission film, which is positioned outside the area, and is contacted with the film surface of one side of the optical transmission film, which is towards the substrate.
9. The semiconductor manufacturing apparatus according to claim 8, wherein,
the cleaning portion is located at least between two adjacent shaft portions.
10. The semiconductor manufacturing apparatus according to claim 8, wherein,
the cleaning part is at least one of a roller with burrs, an air blowing part for blowing cleaning air and a cleaning liquid supply part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321824469.8U CN220232237U (en) | 2023-07-11 | 2023-07-11 | Semiconductor manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321824469.8U CN220232237U (en) | 2023-07-11 | 2023-07-11 | Semiconductor manufacturing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220232237U true CN220232237U (en) | 2023-12-22 |
Family
ID=89198659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321824469.8U Active CN220232237U (en) | 2023-07-11 | 2023-07-11 | Semiconductor manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220232237U (en) |
-
2023
- 2023-07-11 CN CN202321824469.8U patent/CN220232237U/en active Active
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