JP2007266409A - Optical element, aligner, and method for manufacturing micro device - Google Patents

Optical element, aligner, and method for manufacturing micro device Download PDF

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JP2007266409A
JP2007266409A JP2006091003A JP2006091003A JP2007266409A JP 2007266409 A JP2007266409 A JP 2007266409A JP 2006091003 A JP2006091003 A JP 2006091003A JP 2006091003 A JP2006091003 A JP 2006091003A JP 2007266409 A JP2007266409 A JP 2007266409A
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optical element
film
surface
formed
liquid
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Hirohisa Tani
裕久 谷
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Nikon Corp
株式会社ニコン
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical element capable of preventing accumulation of foreign materials on the surface of the optical element. <P>SOLUTION: The optical element, used for an aligner 11 for transferring the pattern formed in a mask R to a photosensitive substrate W, comprises a base material for comprising a transmitting optical element, and a surface smoothing film 29, at least on a part of the surface of the effective region of the base material comprising the transmitting optical element. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an optical element used in an exposure apparatus used for transferring a mask pattern onto a photosensitive substrate, and a specific optical path space among a plurality of optical path spaces formed along the optical axis direction of exposure light. The present invention relates to an optical element used in an exposure apparatus including a projection optical system in which a liquid immersion area is formed, an exposure apparatus including the optical element, and a method of manufacturing a micro device using the exposure apparatus.

  Conventionally, for example, an exposure apparatus described in Patent Document 1 has been proposed as an immersion type exposure apparatus in which an immersion area is formed in a specific optical path space. In the exposure apparatus of Patent Document 1, an illumination optical system that irradiates a mask such as a photomask or a reticle with exposure light emitted from an exposure light source, and a photosensitive material (resist) applied to the exposure pattern formed on the mask. A projection optical system for projecting onto a substrate such as a wafer or a glass plate. The illumination optical system and the projection optical system each have a lens barrel, and at least one optical element (such as a lens) is accommodated in each lens barrel.

Further, in the exposure apparatus of Patent Document 1, in order to cope with the higher density of devices and the miniaturization of the pattern formed on the substrate, the optical path space that is the space between the projection optical system and the substrate is more than the gas. A liquid (pure water) having a high refractive index is supplied to form an immersion area. Therefore, the exposure light that has passed through the projection optical system irradiates the substrate after passing through the immersion area.
International Publication No. 99/49504 Pamphlet

  By the way, in the exposure apparatus of Patent Document 1, since the surface of the optical element arranged closest to the substrate in the projection optical system is in contact with the liquid, for example, in a liquid supply control mechanism or the like. When a large amount of liquid is supplied unexpectedly, a part of the liquid in the immersion area travels along the side surface of the optical element, and the optical element and a holder (holding member) that holds the optical element in the lens barrel, There is a possibility of passing through the gap between and entering the lens barrel.

  In addition, fine irregularities remain on the surface of the optical element, particularly on the ground surface outside the effective area, and foreign matter may accumulate on the fine irregularities. That is, when the surface roughness is rough like a ground surface, foreign matter is accumulated on the surface of the optical element, and gaseous substances generated from the foreign matter may adhere to the surface of the optical element as oxides or carbides by exposure light. is there. When these oxides and carbides adhere to the effective area of the optical element, there is a possibility of deteriorating the optical characteristics, so it is desirable to perform polishing. However, it may be difficult to polish due to the shape constraints of the optical element, and it may be difficult to appropriately prevent foreign matter from accumulating on the fine irregularities formed on the optical element surface. .

  An object of the present invention is to provide an optical element that prevents accumulation of foreign matters on the surface of the optical element, an optical element that can prevent liquid in the immersion area from entering the lens barrel, an exposure apparatus including the optical element, and It is to provide a method for manufacturing a micro device using the exposure apparatus.

  An optical element of the present invention is an optical element used in an exposure apparatus (11) for transferring a pattern formed on a mask (R) to a photosensitive substrate (W), and includes a base material constituting the transmission optical element, And a surface smoothing film (29) formed on at least a part of the surface outside the effective region of the base material constituting the transmissive optical element.

  The optical element of the present invention has a plurality of optical elements, and a liquid immersion region (16) in the optical path space (16) on the light emitting surface side of the specific optical element (LS6) on the photosensitive substrate W side among the optical elements. LT2) is an optical element used in an exposure apparatus (11) provided with a projection optical system (PL) that projects a pattern formed on a mask (R) onto the photosensitive substrate (W). A substrate comprising an optical element and a surface smoothing film (29) formed on at least a part of the surface outside the effective region of the substrate constituting the transmissive optical element are provided.

  An exposure apparatus (11) of the present invention is characterized in that the optical element of the present invention is used for at least a part of an optical system.

  The microdevice manufacturing method of the present invention includes an exposure step of exposing a predetermined pattern on the photosensitive substrate W using the exposure apparatus (11) of the present invention, and the photosensitive substrate exposed by the exposure step. And a developing step for developing W.

  According to the optical element of the present invention, since the surface smoothing film formed on at least a part of the surface outside the effective region of the base material constituting the transmission optical element is provided, foreign matter accumulates on the surface of the optical element. This can be prevented appropriately. Even when foreign matter adheres to the surface of the optical element, the foreign matter can be easily removed by washing because the surface smoothing film is formed.

  Further, according to the optical element of the present invention, since the surface smoothing film formed on at least a part of the surface outside the effective region of the base material constituting the transmission optical element is provided, foreign matter is not present on the surface of the optical element. Adhesion can be prevented appropriately. In addition, since the surface of the optical element is provided with a surface smoothing film, the adhesion of the liquid repellent functional film can be improved when a predetermined film such as a liquid repellent functional film is formed on the surface of the optical element. .

  Further, according to the exposure apparatus of the present invention, since the surface smoothing film is provided on at least a part of the surface outside the effective area of the optical element, and foreign matter is appropriately prevented from being accumulated on the surface of the optical element, It is possible to perform good exposure by preventing the exposure of foreign matter to the exposure light and adhesion of oxides or carbides to the surface of the optical element to deteriorate the optical characteristics of the optical element. Further, since the surface smoothing film is provided on at least a part of the surface outside the effective area of the optical element, for example, the adhesion of the liquid repellent functional film can be improved, and pure water enters the lens barrel. This can be prevented appropriately. Moreover, according to the microdevice manufacturing method of the present invention, it is possible to manufacture a favorable microdevice.

  Hereinafter, an exposure apparatus according to an embodiment of the present invention will be described with reference to the drawings. As shown in FIG. 1, the exposure apparatus 11 of the present embodiment synchronously moves a reticle R as a mask and a wafer W as a substrate in a one-dimensional direction (here, left and right in the drawing in FIG. 1). The circuit pattern formed on the reticle R is transferred to each shot area on the wafer W through the projection optical system PL. That is, the exposure apparatus 11 of the present embodiment is a step-and-scan type scanning exposure measure, that is, a so-called scanning stepper.

  The exposure apparatus 11 includes an exposure light source (not shown), an illumination optical system 12, a reticle stage RST, a projection optical system PL, a wafer stage WST, and the like. Reticle stage RST holds reticle R, and wafer stage WST holds wafer W. The exposure light source of the present embodiment uses a light source that emits ArF excimer laser light (wavelength 193 nm) as exposure light EL.

  The illumination optical system 12 includes an optical integrator (not shown) such as a fly-eye lens and a rod lens, various lens systems such as a relay lens and a condenser lens, an aperture stop, and the like. The exposure light EL emitted from an exposure light source (not shown) is adjusted so as to uniformly illuminate the pattern on the reticle R by passing through the illumination optical system 12.

  Reticle stage RST is arranged between illumination optical system 12 and projection optical system PL so that the mounting surface of reticle R is substantially orthogonal to the optical path. That is, reticle stage RST is arranged on the object plane side of projection optical system PL (on the exposure light EL incident side, which is the upper side in FIG. 1).

  The projection optical system PL includes a plurality of lens elements LS1, LS2, LS3, LS4, LS5, LS6 and LS7 (only seven are shown in FIG. 1). Among these lens elements LS <b> 1 to LS <b> 7, lens elements LS <b> 1 to LS <b> 6 other than the lens element closest to the wafer W (hereinafter referred to as a first specific lens element) LS <b> 7 are held in the lens barrel 13. A space between the lens elements LS1 to LS6 in the lens barrel 13 is filled with a purge gas (for example, nitrogen). A lens holder 14 for holding the first specific lens element (first specific optical element) LS7 is disposed at the lower end of the lens barrel 13. Each of the lens elements LS1 to LS7 has a light incident surface on which the exposure light EL is incident and a light emission surface on which the incident exposure light EL is emitted. The lens elements LS <b> 1 to LS <b> 7 are arranged so that their optical axes are substantially coincident and optical path spaces are formed on the light incident surface side and the light exit surface side.

  Wafer stage WST is arranged on the image plane side of projection optical system PL so that the mounting surface of wafer W is substantially orthogonal to the optical path of exposure light EL. Then, the pattern image on reticle R illuminated by exposure light EL is projected and transferred onto wafer W on wafer stage WST while being reduced to a predetermined reduction magnification through projection optical system PL.

  Here, the exposure apparatus 11 according to the present embodiment is a so-called immersion exposure in which the immersion method is applied in order to substantially shorten the wavelength of the exposure light EL to improve the resolution and substantially widen the depth of focus. Device. Therefore, the exposure apparatus 11 includes a first liquid supply device 17 for individually supplying pure water LQ to the light path space 15 on the light exit surface side and the light path space 16 on the light incident surface side of the first specific lens element LS7, and A second liquid supply device 18 is provided. Further, the exposure apparatus 11 is provided with a first liquid recovery apparatus 19 and a second liquid recovery apparatus 20 for individually recovering the pure water LQ supplied to the optical path space 15 and the optical path space 16.

  As shown in FIG. 2, in the optical path space 15 between the first specific lens element LS7 and the wafer W, the pure water LQ is supplied from the first liquid supply device 17, thereby forming the liquid immersion region LT1. The Then, the pure water LQ that forms the liquid immersion region LT1 is recovered from the optical path space 15 based on the drive of the first liquid recovery device 19. Further, in the optical path space 16 between the first specific lens element LS7 and the lens element (second specific optical element) LS6 disposed on the object plane side of the projection optical system PL with respect to the first specific lens element LS7, The liquid immersion region LT2 is formed by supplying the pure water LQ from the second liquid supply device 18. That is, the lens element LS6 is configured as a second specific lens element close to the image plane of the projection optical system PL after the first specific lens element LS7. Then, the pure water LQ that forms the liquid immersion region LT2 is recovered from the optical path space 16 based on the driving of the second liquid recovery device 20.

  Here, the second specific lens element LS6 is an optical element having refractive power (lens action), and its lower surface LS6c is planar, and its upper surface LS6b is convex toward the object plane side of the projection optical system PL. And has a positive refractive power. The second specific lens element LS6 has a substantially circular shape when viewed from above, and the outer diameter of the upper surface LS6b is larger than the outer diameter of the lower surface LS6c. That is, the second specific lens element LS6 has an exposure light passage portion (effective area) LS6A through which the exposure light EL passes, and a flange portion LS6B formed on the outer peripheral side of the exposure light passage portion LS6A. Yes. The second specific lens element LS6 is supported by the lens barrel 13 via the flange portion LS6B.

  The first specific lens element LS7 is a non-refractive parallel plate that can transmit the exposure light EL, and the lower surface LS7c and the upper surface LS7b are parallel to each other. The first specific lens element LS7 has a substantially circular shape when viewed from above, and the outer diameter of the upper surface LS7b is formed larger than the outer diameter of the lower surface LS7c. That is, the first specific lens element LS7 is an exposure light passage portion (effective region) LS7A that allows the exposure light EL to pass through, and a flange portion LS7B is formed on the outer peripheral side of the exposure light passage portion LS7A. Yes. The first specific lens element LS7 is supported by the lens holder 14 via the flange portion LS7B.

  In the projection optical system PL according to the present embodiment, pure water LQ is supplied to the second optical path space 16 from the wafer W side between the lens barrel 13 and the lens holder 14 in the form of an annular nozzle member. Since it is a thing, it is called "the 2nd nozzle member.") 21 is arrange | positioned so that the optical path of exposure light EL may be enclosed. The second nozzle member 21 is fixed to the lower end portion of the lens barrel 13 with a screw (not shown). The lens holder 14 is fixed to the lower surface side of the second nozzle member 21 by a plurality of screws SC (only two are shown in FIG. 2).

  2, the inner surface 21b of the second nozzle member 21 faces the side surface LS6a between the lower surface LS6c and the lower surface LS6d of the second specific lens element LS6, and the upper surface 21c of the second nozzle member 21 is second. The specific lens element LS6 is disposed so as to face the lower surface LS6d. Here, an annular convex portion 21d is formed on the upper surface 21c of the second nozzle member 21, and by this convex portion 21d, between the upper surface of the convex portion 21d and the lower surface LS6d of the second specific lens element LS6. A very narrow gap is formed. That is, the second nozzle member 21 is formed between the inner side surface 21b and the side surface LS6a of the second specific lens element LS6, the upper surface of the convex portion 21d of the second nozzle member 21, and the lower surface LS6d of the second specific lens element LS6. By forming a gap between them, they are arranged so as not to contact the second specific lens element LS6.

Further, the surface smoothing film 29 and the liquid repellent functional film 28 are formed on the side surface LS6a of the second specific lens element LS6 and the lower surface LS6d of the flange portion LS6B, that is, on the surface outside the effective area of the second specific lens element LS6. Has been. As shown in FIG. 3, the surface smoothing film 29 is formed on the surfaces of the side surface LS6a and the lower surface LS6d of the base material constituting the second specific lens element LS6, and the liquid repellent functional film 28 is the surface of the surface smoothing film 29. And a liquid repellent film 28b which is a liquid repellent film formed on the surface of the light shield film 28a. Here, the surface smoothing film 29 is a film formed by a wet film forming method such as a sol-gel method, and specifically, SiO 2 , ZrO 2 , HfO 2 , TiO 2 , Al 2 O 3. , A sol substance having one or more substances in the group consisting of Lu 2 O 3 , MgF 2 and CaF 2 as a basic skeleton, or a mixed sol substance of two or more substances in this group It is a membrane. The liquid repellent film 28b constituting the liquid repellent functional film 28 is formed of a fluorine resin material that can be formed at a low temperature, a fluorine resin material such as polytetrafluoroethylene, an acrylic resin material, or a silicon resin material. The light shielding film 28a constituting the liquid functional film 28 is a metal film or a metal oxide film having an optical density OD1 or more. Specifically, the metal film is a film formed of at least one metal selected from the group consisting of Au, Pt, Ag, Ni, Ta, W, Pd, Mo, Ti, Si, and Cr. The metal oxide film is specifically selected from at least one substance selected from the group consisting of ZrO 2 , HfO 2 , TiO 2 , Ta 2 O 5 , SiO and Cr 2 O 3 , or selected from the above group. It is a film formed by a mixture of substances.

  Since the surface smoothing film 29 is formed by a wet film forming method such as a sol-gel method, even if the surface roughness such as a ground surface is rough, the fine unevenness formed on the surface is a liquid sol. Since the solution is buried, the film is gelled to form a film, thereby forming a film having a smooth surface. This eliminates the need for a polishing step for smoothing the minute irregularities on the surface of the second specific lens element LS6, and makes it possible to easily form the light shielding film 28a having sufficient light shielding performance even by a conventional vacuum deposition method or the like. Become. Also, for example, even if the optical element shape cannot be polished, the surface of the optical element is smoothed by forming a surface smoothing film formed by a wet film forming method, and sufficient light shielding performance is satisfied on the optical element surface. The light shielding film can be easily formed in a state having high adhesion.

  Since the liquid repellent functional film 28 includes the light shielding film 28a formed on the surface of the surface smoothing film 29, the liquid repellent film 28b can be prevented from being irradiated with the laser light that is the exposure light EL. Therefore, it is possible to prevent the liquid repellent film 28b from being deteriorated by the laser light irradiation. Here, when a metal film is used for the light shielding film 28a, since the metal film is a reflective film, the energy absorption of the light shielding film 28a can be suppressed, and the optical characteristics of the second specific lens element LS6 accompanying the temperature rise of the light shielding film 28a. Can be prevented. Further, when a metal oxide film is used for the light shielding film 28a, stray light can be prevented from being generated because the metal oxide film is an absorption film.

Here, the surface smoothing film 29 may be a light shielding film, and only the liquid repellent film 28 b may be formed as the liquid repellent functional film 28 formed on the surface smoothing film 29. That is, ZrO 2 , HfO 2 , TiO 2 , Al 2 O 3, and Lu 2 O 3 used as materials for forming the surface smoothing film 29 have a light-shielding property in the ultraviolet region, so ZrO 2 , HfO 2 , TiO 2 , Al 2 O 3, Lu 2 O 3 group of one or more substances of the basic skeleton or a mixed sol substance of two or more substances in this group By forming the chemical film 29, the surface smoothing film 29 can be a light shielding film having an optical density of OD1 or more. It is also possible to form a surface smoothing film having a light shielding property by adopting a configuration in which a metal element is incorporated with SiO 2 as a basic skeleton. In these cases, the step of forming the light shielding film 28a on the surface smoothing film 29 can be omitted.

  The second nozzle member 21 is connected to the second liquid supply device 18 via the liquid supply pipe 22. A liquid supply passage 23 communicating with the liquid supply pipe 22 is formed in the second nozzle member 21, and the pure water LQ that has flowed through the liquid supply pipe 22 and the liquid supply passage 23 is the inner surface of the second nozzle member 21. It flows into the optical path space 16 through the supply opening 24 formed on the 21b side. The second nozzle member 21 is connected to the second liquid recovery device 20 via the liquid recovery pipe 25. A liquid recovery passage 26 communicating with the liquid recovery pipe 25 is formed in the second nozzle member 21. The pure water LQ that forms the liquid immersion region LT2 in the optical path space 16 passes through a recovery opening 27 formed on the inner surface 21b side of the second nozzle member 21 on the side facing the supply opening 24. Then, it is recovered by the second liquid recovery device 20. The recovery opening 27 is formed on the object plane side (above in FIG. 2) with respect to the liquid immersion region LT2.

  Further, since the lens holder 14 and the wafer W are provided with an annular nozzle member (hereinafter referred to as pure water LQ is supplied to the first optical path space 15 from the wafer W side, “first nozzle member”). 30) is disposed so as to surround the optical path of the exposure light EL. The first nozzle member 30 is supported by a support member (not shown) so as not to contact the first specific lens element LS7 and the lens holder 14.

  Further, the inner surface 30b of the first nozzle member 30 faces the side surface LS7a between the lower surface LS7c and the lower surface LS7d of the first specific lens element LS7, and the upper surface 30c of the first nozzle member 30 is a flange portion of the first specific lens element LS7. It is arranged so as to face the lower surface LS7d of LS7B. The first nozzle member 30 is disposed so as not to contact the first specific lens element LS7 by forming a gap between the inner side surface 30b and the side surface LS7a of the first specific lens element LS7.

  Here, the peripheral edge LS7e on the upper surface of the first specific lens element LS7, that is, the circumference provided along the edge of the first specific lens element LS7 outside the effective area on the light incident surface side of the first specific lens element LS7. A step shape 50 which is a boundary shape, and a liquid repellent film 51 which is formed on the surface of the first specific lens element LS7 outside the circumferential step shape 50 and which can be formed at a low temperature. It has. The liquid repellent film 51 may be formed of a fluorine resin material such as polytetrafluoroethylene, an acrylic resin material, or a silicon resin material, similarly to the liquid repellent film 28b.

  The first nozzle member 30 is connected to the first liquid supply device 17 via a liquid supply pipe 31. A liquid supply passage 32 communicating with the liquid supply pipe 31 is formed in the first nozzle member 30, and a supply opening 33 communicating with the liquid supply passage 32 is annular on the lower surface side of the first nozzle member 30. It is formed to make. The first nozzle member 30 is connected to the first liquid recovery device 19 via the liquid recovery pipe 34. A liquid recovery passage 35 communicating with the liquid recovery pipe 34 is formed in the first nozzle member 30, and a recovery opening 36 communicating with the liquid recovery passage 35 has an annular shape on the lower surface side of the first nozzle member 30. It is formed to make. The collection opening 36 is formed outside the supply opening 33 so as to surround the supply opening 33. The recovery opening 36 is provided with a porous member 37 in which a large number of holes are formed.

  Next, the operation when pure water LQ is supplied to the optical path spaces 15 and 16 of the exposure apparatus 11 of the present embodiment will be described. When wafer W placed on wafer stage WST is placed on the optical path of exposure light EL, first liquid supply device 17 and second liquid supply device 18 start driving. Then, pure water LQ is supplied from the first liquid supply device 17, and this pure water LQ flows in the liquid supply pipe 31 and the liquid supply passage 32 and enters the optical path space 15 through the supply opening 33. Supplied. At the same time, pure water LQ is supplied from the second liquid supply device 18, and this pure water LQ flows in the liquid supply pipe 22 and the liquid supply passage 23 and enters the optical path space 16 through the supply opening 24. Supplied.

  The first liquid supply device 17 stops driving when supplying a predetermined volume of pure water LQ into the optical path space 15. As a result, a liquid immersion region LT1 made of pure water LQ is formed in the optical path space 15. The second liquid supply device 18 stops driving when a predetermined volume of pure water LQ is supplied into the optical path space 16. As a result, a liquid immersion region LT2 made of pure water LQ is formed in the optical path space 16.

  At this time, a part of the pure water LQ in the optical path space 16 enters the gap between the second specific lens element LS6 and the second nozzle member 21, but the surface of the second specific lens element LS6 Since the liquid repellent functional film 28 is formed via the surface smoothing film 29, the liquid repellent effect of the liquid repellent functional film 28 prevents the pure water LQ from entering the upper optical path space. When the pure water LQ enters the upper optical path space because the liquid repellent functional film 28 is not formed on the surface of the second specific lens element LS6, it is convex toward the object plane side of the second specific lens element LS6. There is a concern that the pure water LQ permeates into the optical thin film formed on the upper surface LS6b formed on the upper surface LS6b and the optical characteristics of the optical thin film deteriorate. Further, the optical thin film is dissolved by the pure water LQ, and the desired performance cannot be maintained. Therefore, the liquid repellent functional film 28 is necessary to prevent the pure water LQ from entering the optical path space above the second specific lens element LS6.

  Further, since the liquid repellent functional film 28 is formed by forming the light shielding film 28a on the surface smoothing film 29 and forming the liquid repellent film 28b on the light shielding film 28a, the light shielding film 28a is closely attached. The light shielding performance can be sufficiently exhibited. Accordingly, the light-repellent effect of the liquid-repellent film 28b can be maintained for a long period of time because the light-shielding function of the light-shielding film 28a can appropriately prevent the liquid-repellent film 28b from being irradiated with laser light as the exposure light EL. be able to.

  Further, since the liquid repellent functional film 28 prevents the pure water LQ from entering above the second specific lens element LS6, the side surface LS6a of the second specific lens element LS6 and the second surface facing the side surface LS6a. Pure water LQ enters between the inner surface 21b of the nozzle member 21, the second specific lens element sticks to the second nozzle member 21 due to the surface tension of the pure water LQ, and receives the force, whereby the second specific lens element LS6. It is possible to prevent the optical characteristics from deteriorating due to deformation. Further, since the pure water LQ is prevented from entering upward, the second specific lens element LS6 is cooled by the heat of vaporization accompanying the evaporation of the pure water LQ, and the optical characteristics of the second specific lens element LS6 deteriorate. This can be prevented.

  In the exposure apparatus according to the above-described embodiment, the illumination optical device illuminates the mask (reticle) R (illumination process), and the transfer pattern formed on the mask R using the projection optical system PL is transferred to the photosensitive substrate ( By transferring the wafer (wafer) W (transfer process), a microdevice (semiconductor element, imaging element, liquid crystal display element, thin film magnetic head, etc.) can be manufactured. FIG. 4 shows an example of a technique for obtaining a semiconductor device as a micro device by forming a predetermined circuit pattern on a wafer W as a photosensitive substrate using the exposure apparatus according to the above-described embodiment. This will be described with reference to a flowchart.

  First, in step S301 in FIG. 4, a metal film is deposited on one lot of wafers W. In the next step S302, a photoresist is applied on the metal film on the wafer W of the l lot. Thereafter, in step S303, using the exposure apparatus according to the above-described embodiment, the image of the pattern on the mask R is sequentially exposed to each shot area on the wafer W of one lot via the projection optical system PL. Transcribed. After that, in step S304, the photoresist on the one lot of wafers W is developed, and in step S305, etching is performed on the mask M by using the resist pattern as a mask on the one lot of wafers W. A circuit pattern corresponding to this pattern is formed in each shot area on each wafer W.

  Thereafter, a device pattern such as a semiconductor element is manufactured by forming a circuit pattern of an upper layer. According to the semiconductor device manufacturing method described above, since the exposure apparatus according to the above-described embodiment is used, a fine pattern can be satisfactorily exposed on the wafer. In steps S301 to S305, a metal is deposited on the wafer W, a resist is applied onto the metal film, and exposure, development, and etching processes are performed. Prior to these processes, the wafer is processed. It goes without saying that after a silicon oxide film is formed on W, a resist is applied onto the silicon oxide film, and each step such as exposure, development, and etching may be performed.

  In the exposure apparatus according to the above-described embodiment, a liquid crystal display element as a micro device can be obtained by forming a predetermined pattern (circuit pattern, electrode pattern, etc.) on a plate (glass substrate). Hereinafter, an example of the technique at this time will be described with reference to the flowchart of FIG. In FIG. 5, in the pattern forming step S401, a so-called photolithography step is performed in which the pattern of the mask R is transferred and exposed to a photosensitive substrate (such as a glass substrate coated with a resist) using the exposure apparatus according to the above-described embodiment. Executed. By this photolithography process, a predetermined pattern including a large number of electrodes and the like is formed on the photosensitive substrate. Thereafter, the exposed substrate undergoes steps such as a developing step, an etching step, and a resist stripping step, whereby a predetermined pattern is formed on the substrate, and the process proceeds to the next color filter forming step S402.

  Next, in the color filter forming step S402, a large number of groups of three dots corresponding to R (Red), G (Green), and B (Blue) are arranged in a matrix or three of R, G, and B A color filter is formed by arranging a plurality of stripe filter sets in the horizontal scanning line direction. Then, after the color filter formation step S402, a cell assembly step S403 is executed. In the cell assembly step S403, a liquid crystal panel (liquid crystal cell) is assembled using the substrate having the predetermined pattern obtained in the pattern formation step S401, the color filter obtained in the color filter formation step S402, and the like. In the cell assembly step S403, for example, liquid crystal is injected between the substrate having the predetermined pattern obtained in the pattern formation step S401 and the color filter obtained in the color filter formation step S402, and a liquid crystal panel (liquid crystal cell ).

  Thereafter, in a module assembly step S404, components such as an electric circuit and a backlight for performing a display operation of the assembled liquid crystal panel (liquid crystal cell) are attached to complete a liquid crystal display element. According to the method for manufacturing a liquid crystal display element described above, since the exposure apparatus according to the above-described embodiment is used, a fine pattern can be satisfactorily exposed on the wafer.

  In the above-described embodiment, the first specific lens element LS7 and the second specific lens element LS6 are integrally formed, and the liquid immersion region is formed only in the space on the light emission surface side of the integrally formed optical element. And a liquid repellent functional film may be provided on at least a part of the surface outside the effective region of the integrally formed optical element via a surface smoothing film.

  In the above-described embodiment, the second specific lens element is disposed on the side surface LS7a of the first specific lens element LS7 and the lower surface LS7d of the flange portion LS7B, that is, on the surface of the base material outside the effective area of the first specific lens element LS7. Similarly to LS6, the surface smoothing film 29 and the liquid repellent functional film 28 may be formed. In this case, since the pure water LQ can be prevented from entering upward by the liquid repellent functional film 28, the side surface LS7a of the first specific lens element LS7 and the inner surface of the first nozzle member 30 facing the side surface LS7a. 30b, pure water LQ permeates, the first specific lens element sticks to the first nozzle member 30 due to the surface tension of the pure water LQ, and the first specific lens element LS7 is deformed by receiving the force, so that the optical characteristics are improved. Deterioration can be prevented. Further, since the pure water LQ is prevented from entering upward, the first specific lens element LS7 is cooled by the heat of vaporization accompanying the evaporation of the pure water LQ, and the optical characteristics of the first specific lens element LS7 are deteriorated. This can be prevented.

  In the above-described embodiment, in order to further smooth the surface of the optical element, a surface smoothing film may be formed a plurality of times to form a multi-layered surface smoothing film. In this case, the light-shielding film can be more securely adhered to the film, so that the liquid-repellent function of the liquid-repellent film can be maintained for a longer period.

  In the above-described embodiment, when the surface smoothing film has a multilayer structure, the adhesion with the optical element and the adhesion with the light shielding film or the liquid repellent film formed on the surface smoothing film are improved. Therefore, the sol substance constituting each layer of the multilayer surface smoothing film may be appropriately changed to obtain an optimum film configuration.

In the above-described embodiment, as the exposure light source, for example, a KrF excimer laser (248 nm), a Kr 2 laser (146 nm), an Ar 2 laser (126 nm), or the like may be used in addition to the F 2 laser (157 nm). .

In the above-described embodiment, the liquid may be other than pure water LQ. For example, when the exposure light source is an F 2 laser, since the F 2 laser beam does not pass through the pure water LQ, it is desirable that the exposure light source is a fluorinated liquid such as perfluorinated polyether (PFPE) or fluorinated oil. . What is required in this case is a functional film that repels fluorinated liquid, and it is necessary to provide a liquid repellent functional film made of a substance having a high contact angle with the liquid to be used.

  Further, a surface smoothing film may be formed on the surface of the base material outside the effective area of one or a plurality of optical elements constituting the illumination optical system 12 or the projection optical system PL. In this case, even when fine irregularities remain on the surface of the optical element due to the surface smoothing film, the surface of the optical element can be smoothed. Accordingly, the foreign matter adhering to the optical element can be surely removed by washing, and the exposure to the foreign matter adhering to the surface of the optical element causes oxides or carbides to adhere to the optical element surface. Can be prevented. That is, it is possible to prevent the formation of an oxide film or a carbonized film on the surface of the optical element, and to appropriately prevent the optical characteristics of the optical element from deteriorating. Further, by forming a surface smoothing film on the ground surface of the optical element in the form of ground glass, the inside of the optical element can be observed through the surface smoothing film. In other words, in order to detect an increase in the temperature of the optical element due to exposure light exposure, internal observation of the optical element may be required. In such a case, the surface smoothing is performed without polishing the ground surface. By forming a chemical film, internal observation can be easily performed.

  Further, in order to manufacture reticles or masks used in not only microdevices such as semiconductor elements but also light exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, electron beam exposure apparatuses, etc. The present invention can also be applied to an exposure apparatus that transfers a circuit pattern to a silicon wafer or the like. Here, in an exposure apparatus using DUV (deep ultraviolet) or VUV (vacuum ultraviolet) light, a transmission type reticle is generally used. As a reticle substrate, quartz glass, quartz glass doped with fluorine, fluorite, fluoride, and the like are used. Magnesium or quartz is used. Further, in proximity type X-ray exposure apparatuses and electron beam exposure apparatuses, a transmission type mask (stencil mask, member mask) is used, and a silicon wafer or the like is used as a mask substrate.

  Further, in the above-described embodiment, the case where the liquid repellent functional film is formed on the surface of the optical element via the surface smoothing film in the liquid immersion type exposure apparatus has been described as an example. It is not limited to the mold. That is, an exposure apparatus that does not form a liquid immersion region (dry exposure apparatus) may include an optical element in which only a surface smoothing film is formed on the surface of the optical element. In this case, since the surface smoothing film is formed on the surface of the optical element, it is possible to appropriately prevent foreign matter from remaining on the surface of the optical element, and an oxide film or a carbide film is formed on the surface of the optical element due to the remaining foreign matter. Therefore, it is possible to prevent the optical performance of the optical element from deteriorating and perform good exposure. Further, one or a plurality of optical elements constituting the illumination optical system 12 or the projection optical system PL may have a surface smoothing film on the surface outside the effective area of the exposure light EL.

It is a schematic block diagram which shows the exposure apparatus which concerns on embodiment. It is the schematic block diagram which expanded a part of exposure apparatus which concerns on embodiment. It is a figure which shows the structure of the surface smoothing film | membrane and liquid repellent functional film which concern on embodiment. It is a flowchart which shows the manufacturing method of the microdevice which concerns on embodiment. It is a flowchart which shows the manufacturing method of the microdevice which concerns on embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 ... Exposure apparatus, 13 ... Lens barrel, 14 ... Lens holder, 15 ... Optical path space, 16 ... Optical path space, 17 ... 1st liquid supply apparatus, 18 ... 2nd liquid supply apparatus, 19 ... 1st liquid recovery apparatus, 20 DESCRIPTION OF SYMBOLS ... 2nd liquid collection | recovery apparatus, 21 ... 2nd nozzle member, 28 ... Liquid-repellent functional film, 28a ... Light-shielding film, 28b ... Liquid-repellent film, 29 ... Surface smoothing film, 30 ... 1st nozzle member, 50 ... Border shape 51 ... Liquid repellent film, EL ... exposure light, LS1 to LS5 ... lens element, LS6 ... second specific lens element, LS7 ... first specific lens element, LT1, LT2 ... immersion region, LQ ... pure water (liquid) , PL: projection optical system, R: reticle (mask), W: wafer.

Claims (13)

  1. An optical element used in an exposure apparatus for transferring a pattern formed on a mask to a photosensitive substrate,
    A base material constituting a transmission optical element;
    An optical element comprising: a surface smoothing film formed on at least a part of the surface outside the effective region of the base material constituting the transmissive optical element.
  2. A liquid immersion area is formed in the optical path space on the light exit surface side of the specific optical element on the photosensitive substrate side of each of the optical elements, and the pattern formed on the mask is changed to the photosensitive substrate. An optical element used in an exposure apparatus having a projection optical system for projecting onto
    A base material constituting a transmission optical element;
    An optical element comprising: a surface smoothing film formed on at least a part of the surface outside the effective region of the base material constituting the transmissive optical element.
  3.   The optical element according to claim 1, wherein the surface smoothing film is formed by a wet film forming method.
  4.   The optical element according to claim 2, further comprising a liquid repellent functional film formed on the surface smoothing film.
  5.   The optical element according to claim 4, wherein the liquid repellent functional film is a liquid repellent film.
  6.   5. The liquid repellent functional film includes a light shielding film formed on the surface smoothing film and a liquid repellent film formed on the surface of the light shielding film. The optical element according to any one of the above.
  7.   The optical element according to any one of claims 2 to 5, wherein the surface smoothing film is a light shielding film.
  8.   The optical element according to claim 6, wherein the light shielding film has an optical density of 1 or more.
  9. The surface smoothing film has one or more substances in the group consisting of SiO 2 , ZrO 2 , HfO 2 , TiO 2 , Al 2 O 3 , Lu 2 O 3 , MgF 2 and CaF 2 as a basic skeleton. The optical element according to claim 1, wherein the optical element is formed of a sol substance or a mixed sol substance of two or more substances in the group.
  10.   An exposure apparatus using the optical element according to claim 1 for at least a part of an optical system.
  11.   An exposure apparatus, wherein the specific optical element includes the optical element according to any one of claims 2 to 9.
  12.   The specific optical element includes a first specific optical element on the photosensitive substrate side and a second specific optical element on the mask side, and a liquid is interposed between the first specific optical element and the second specific optical element. The exposure apparatus according to claim 11, wherein an immersion area is formed.
  13. An exposure step of exposing a predetermined pattern on a photosensitive substrate using the exposure apparatus according to claim 10;
    A developing step of developing the photosensitive substrate exposed by the exposing step;
    A method for manufacturing a microdevice, comprising:
JP2006091003A 2006-03-29 2006-03-29 Optical element, aligner, and method for manufacturing micro device Pending JP2007266409A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009521105A (en) * 2005-12-22 2009-05-28 フリースケール セミコンダクター インコーポレイテッド Immersion exposure apparatus and immersion exposure method
JP2013051444A (en) * 2009-04-10 2013-03-14 Asml Netherlands Bv Immersion lithography apparatus, shutter member, and substrate table

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009521105A (en) * 2005-12-22 2009-05-28 フリースケール セミコンダクター インコーポレイテッド Immersion exposure apparatus and immersion exposure method
JP2013051444A (en) * 2009-04-10 2013-03-14 Asml Netherlands Bv Immersion lithography apparatus, shutter member, and substrate table
US8993220B2 (en) 2009-04-10 2015-03-31 Asml Netherlands B.V. Immersion lithographic apparatus and a device manufacturing method

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