CN220198151U - Cutting tool for processing silicon carbide semiconductor chip - Google Patents
Cutting tool for processing silicon carbide semiconductor chip Download PDFInfo
- Publication number
- CN220198151U CN220198151U CN202321599296.4U CN202321599296U CN220198151U CN 220198151 U CN220198151 U CN 220198151U CN 202321599296 U CN202321599296 U CN 202321599296U CN 220198151 U CN220198151 U CN 220198151U
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- CN
- China
- Prior art keywords
- semiconductor chip
- silicon carbide
- carbide semiconductor
- clamping block
- workbench
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 53
- 239000004065 semiconductor Substances 0.000 title claims abstract description 51
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 41
- 238000005520 cutting process Methods 0.000 title claims abstract description 30
- 230000001681 protective effect Effects 0.000 claims description 5
- 239000000428 dust Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 7
- 238000003825 pressing Methods 0.000 abstract description 6
- 230000008602 contraction Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The utility model discloses a cutting tool for processing a silicon carbide semiconductor chip, which comprises a workbench and a limiting groove arranged at the upper end of the workbench, wherein at least four clamping blocks for quickly fixing the silicon carbide semiconductor chip are slidably arranged in the limiting groove, at least two guide rails for moving the clamping blocks are arranged in the limiting groove, the clamping blocks are respectively arranged at four corners in the limiting groove, and the clamping blocks are connected with the interior of the workbench through springs; according to the utility model, the clamping block is connected with the inside of the workbench through the spring, so that a worker can carry out position contraction on the clamping block in a pressing mode, and when the clamping block is not subjected to external force, the clamping block can move to the center of the limiting groove through the guide rail by virtue of the tension of the spring, so that the silicon carbide semiconductor chip placed in the limiting groove can be rapidly fixed, and a great amount of time consumed by the worker in the fixing process is avoided.
Description
Technical Field
The utility model relates to the technical field of silicon carbide semiconductor chips, in particular to a cutting tool for processing a silicon carbide semiconductor chip.
Background
Silicon carbide cutting, also called dicing, is an indispensable procedure in the chip manufacturing process flow, namely, dividing the whole silicon carbide wafer with the chips by a cutting technology, so as to form independent single wafers, and preparing for subsequent procedures;
the demand on the silicon carbide semiconductor chip in the current market is gradually increased, and relative manufacturing factories need to keep work efficiency all the time for supply chain can not appear the problem, and most cutting device in the present mill all is through artifical placing then cut the silicon carbide semiconductor chip by the cutting machine, because need to spend a large amount of time fixed after placing the silicon carbide semiconductor chip, avoid the position to appear the deviation and lead to the finished product effect to be relatively poor influence production efficiency in cutting process.
Disclosure of Invention
The utility model aims to solve the defects in the prior art, and provides a cutting tool for processing a silicon carbide semiconductor chip.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
the utility model provides a cutting frock is used in carborundum semiconductor chip processing, includes the workstation, and set up in the spacing groove of workstation upper end, the inside slip of spacing groove sets up four at least clamping blocks that are used for carborundum semiconductor chip quick fixation, set up two at least guide rails that are used for in the spacing groove clamping block removes, just clamping block sets up respectively the inside four corners of spacing groove, clamping block all through the spring with workstation internal connection.
As still further aspects of the utility model: the workbench is internally provided with at least four telescopic chambers for moving the clamping blocks, the telescopic chambers are all located in the limiting grooves, and push rods are fixedly arranged on one sides, close to the telescopic chambers, of the clamping blocks.
As still further aspects of the utility model: the push rod is in sliding connection with the telescopic chamber, one end of the push rod, which is far away from the clamping block, is fixedly connected with the spring, and one end of the spring, which is far away from the push rod, is fixedly connected with the inner wall of the telescopic chamber.
As still further aspects of the utility model: the limiting groove is detachably connected with a placing disc used for placing the silicon carbide semiconductor chip, and the placing disc is connected with the inside of the limiting groove through the clamping block.
As still further aspects of the utility model: and a cutting machine for cutting the silicon carbide semiconductor chip is fixedly arranged at the upper end of the workbench.
As still further aspects of the utility model: the utility model discloses a dust-proof protection device for a workbench, including workstation, plug block, protection casing, limit groove, plug block, protection casing upper end is connected with the protection casing can be dismantled, the protection casing is used for dustproof protection, the protection casing has the plug groove through the plug block grafting, the plug groove is seted up the upper end of workstation, the plug groove with the quantity of plug block is four, the protection casing is located the top of limit groove.
Compared with the prior art, the utility model provides a cutting tool for processing a silicon carbide semiconductor chip, which has the following beneficial effects:
1. according to the utility model, the clamping block is connected with the inside of the workbench through the spring, so that a worker can shrink the clamping block in position in a pressing mode, and when the clamping block is not subjected to external force, the clamping block can move to the center of the limiting groove through the guide rail by virtue of the tension of the spring, so that the silicon carbide semiconductor chip placed in the limiting groove can be quickly fixed, and a great amount of time consumed by the worker in the fixing process is avoided.
2. According to the utility model, the placing disc is placed in the limiting groove, so that a worker can place the silicon carbide semiconductor chip in the placing disc, the silicon carbide semiconductor chip is not directly contacted with the clamping block, and the clamping block is prevented from damaging the silicon carbide semiconductor chip in the clamping process.
The device has the advantages that the parts which are not involved in the device are the same as or can be realized by adopting the prior art, and the device has a simple structure and is convenient to operate.
Drawings
Fig. 1 is a schematic diagram of the overall perspective structure of a cutting tool for processing a silicon carbide semiconductor chip according to the present utility model;
fig. 2 is a schematic diagram of a workbench of a cutting tool for processing a silicon carbide semiconductor chip according to the present utility model;
fig. 3 is an enlarged schematic diagram of a structure of a cutting tool for processing a silicon carbide semiconductor chip according to the present utility model;
fig. 4 is a schematic view of an inner structure of a telescopic chamber of a cutting tool for processing a silicon carbide semiconductor chip.
In the figure: 1. a work table; 2. a cutting machine; 3. a protective cover; 4. a plug block; 5. a plug-in groove; 6. placing a tray; 7. a guide rail; 9. a clamping block; 10. a limit groove; 11. a push rod; 12. a telescoping chamber; 13. and (3) a spring.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
In the description of the present utility model, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present utility model and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
Example 1
The utility model provides a cutting frock is used in carborundum semiconductor chip processing, in order to make the staff fix the convenient and fast more when carborundum semiconductor chip, as shown in fig. 1-4, including workstation 1, and set up in the spacing groove 10 of workstation 1 upper end, spacing groove 10 inside slides and sets up four at least clamping blocks 9 that are used for carborundum semiconductor chip to fix fast, set up two at least guide rails 7 that are used for clamping block 9 to remove in the spacing groove 10, and clamping blocks 9 set up respectively in the inside four corners of spacing groove 10, clamping blocks 9 all are through spring 13 and workstation 1 internal connection, through setting up four clamping blocks 9 in the inside of spacing groove 10, clamping blocks 9 are connected through spring 13 and the inside of workstation 1 simultaneously, make the staff carry out the position shrink with clamping blocks 9 through the mode of pressing, tension through spring 13 when clamping blocks 9 do not receive external force can make clamping blocks 9 through guide rail 7 to spacing groove 10 central part removal, thereby can carry out quick fixation to the carborundum semiconductor chip that places in spacing groove 10 inside.
In order to enable the clamping block 9 to be connected with the inside of the workbench 1 through the spring 13, as shown in fig. 1-4, at least four telescopic chambers 12 used for clamping the block 9 to move are formed in the workbench 1, the telescopic chambers 12 are located in the limiting grooves 10, push rods 11 are fixedly connected to one sides, close to the telescopic chambers 12, of the clamping block 9, the push rods 11 are slidably connected with the telescopic chambers 12, one ends, far away from the clamping block 9, of the push rods 11 are fixedly connected with the spring 13, one ends, far away from the push rods 11, of the spring 13 are fixedly connected with the inner walls of the telescopic chambers 12, one ends, close to the clamping block 9, of the spring 13 are fixedly connected with the spring 13 through the push rods 11, the spring 13 can enable the clamping block 9 to move in position through the push rods 11, the push rods 11 can move in the telescopic chambers 12, and no limit is caused to the clamping block 9.
In order to be able to place the silicon carbide semiconductor chip, avoid the silicon carbide semiconductor chip to directly contact with the clamping block 9, as shown in fig. 1-3, be connected with the placing tray 6 that is used for the silicon carbide semiconductor chip to place in the spacing groove 10 can be dismantled, placing tray 6 is through clamping block 9 and spacing groove 10 internal connection, through placing a placing tray 6 in the inside of spacing groove 10, the staff can place the silicon carbide semiconductor chip inside placing tray 6 for the silicon carbide semiconductor chip is not direct with clamping block 9 contact, avoids clamping block 9 to cause the damage to the silicon carbide semiconductor chip at the in-process of pressing from both sides tightly.
Example 2
In order to cut a silicon carbide semiconductor chip, as shown in fig. 1 to 2, a cutter 2 for cutting the silicon carbide semiconductor chip is fixedly mounted on the upper end of a table 1, and the silicon carbide semiconductor chip placed in a placing tray 6 can be cut by the cutter 2 provided on the upper end of the table 1.
In order to avoid the cutter 2 to influence staff around when cutting silicon carbide semiconductor chips, as shown in fig. 1-2, the workstation 1 upper end can be dismantled and is connected with protection casing 3, protection casing 3 is used for dustproof protection, protection casing 3 has grafting groove 5 through grafting piece 4, the upper end at workstation 1 is seted up to grafting groove 5, the quantity of grafting groove 5 and grafting piece 4 is four, protection casing 3 is located the top of spacing groove 10, can effectively avoid cutter 2 to cause the influence to staff around when carrying out the work through the protection casing 3 that sets up in the top of workstation 1, and protection casing 3 is connected with workstation 1 through the mode of grafting, make the staff just can dismantle it when not needing to use protection casing 3.
Working principle: through set up four clamping blocks 9 in the inside of spacing groove 10, clamping block 9 is connected through the inside of spring 13 and workstation 1 simultaneously, make the staff carry out the position shrink with clamping block 9 through the mode of pressing down, tension through spring 13 can make clamping block 9 pass through guide rail 7 to spacing groove 10 central part removal when clamping block 9 does not receive external force, thereby can carry out quick fixed to the carborundum semiconductor chip of placing in spacing groove 10 inside, simultaneously through place a place dish 6 in the inside of spacing groove 10, the staff can place carborundum semiconductor chip inside place the dish 6, make carborundum semiconductor chip not direct with clamping block 9 contact, avoid clamping block 9 to cause the damage to carborundum semiconductor chip at the in-process of pressing from both sides tightly.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (6)
1. The utility model provides a cutting frock is used in carborundum semiconductor chip processing, includes workstation (1), and set up in spacing groove (10) of workstation (1) upper end, its characterized in that, spacing groove (10) inside slip sets up four at least clamping blocks (9) that are used for carborundum semiconductor chip quick fixation, set up two at least guide rail (7) that are used for clamping block (9) to remove in spacing groove (10), just clamping block (9) set up respectively spacing groove (10) inside four corners, clamping block (9) all through spring (13) with workstation (1) internal connection.
2. The cutting tool for silicon carbide semiconductor chip processing according to claim 1, wherein at least four telescopic chambers (12) for moving the clamping blocks (9) are formed in the workbench (1), the telescopic chambers (12) are all located in the limiting groove (10), and push rods (11) are fixedly arranged on one sides, close to the telescopic chambers (12), of the clamping blocks (9).
3. The cutting tool for silicon carbide semiconductor chip processing according to claim 2, wherein the push rod (11) is slidably connected with the telescopic chamber (12), one end of the push rod (11) away from the clamping block (9) is fixedly connected with the spring (13), and one end of the spring (13) away from the push rod (11) is fixedly connected with the inner wall of the telescopic chamber (12).
4. The cutting tool for processing the silicon carbide semiconductor chip according to claim 1, wherein a placing disc (6) for placing the silicon carbide semiconductor chip is detachably connected in the limiting groove (10), and the placing disc (6) is connected with the inside of the limiting groove (10) through the clamping block (9).
5. The cutting tool for processing the silicon carbide semiconductor chip according to claim 1, wherein a cutting machine (2) for cutting the silicon carbide semiconductor chip is arranged at the upper end of the workbench (1).
6. The cutting tool for processing the silicon carbide semiconductor chip according to claim 1, wherein a protective cover (3) is detachably connected to the upper end of the workbench (1), the protective cover (3) is used for dust protection, the protective cover (3) is inserted with an inserting groove (5) through an inserting block (4), the inserting groove (5) is formed in the upper end of the workbench (1), the number of the inserting groove (5) and the number of the inserting blocks (4) are four, and the protective cover (3) is located above the limiting groove (10).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202321599296.4U CN220198151U (en) | 2023-06-21 | 2023-06-21 | Cutting tool for processing silicon carbide semiconductor chip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202321599296.4U CN220198151U (en) | 2023-06-21 | 2023-06-21 | Cutting tool for processing silicon carbide semiconductor chip |
Publications (1)
Publication Number | Publication Date |
---|---|
CN220198151U true CN220198151U (en) | 2023-12-19 |
Family
ID=89152499
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202321599296.4U Active CN220198151U (en) | 2023-06-21 | 2023-06-21 | Cutting tool for processing silicon carbide semiconductor chip |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN220198151U (en) |
-
2023
- 2023-06-21 CN CN202321599296.4U patent/CN220198151U/en active Active
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