CN220189582U - Semiconductor vertical furnace crystal boat - Google Patents
Semiconductor vertical furnace crystal boat Download PDFInfo
- Publication number
- CN220189582U CN220189582U CN202320073452.7U CN202320073452U CN220189582U CN 220189582 U CN220189582 U CN 220189582U CN 202320073452 U CN202320073452 U CN 202320073452U CN 220189582 U CN220189582 U CN 220189582U
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- CN
- China
- Prior art keywords
- column
- end disc
- supporting groove
- groove
- columns
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 18
- 239000013078 crystal Substances 0.000 title claims abstract description 6
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 abstract description 10
- 230000001965 increasing effect Effects 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 238000005452 bending Methods 0.000 abstract description 2
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 238000004381 surface treatment Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 43
- 238000009434 installation Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a semiconductor vertical furnace crystal boat, which comprises an upper end disc, a lower end disc, a supporting groove column, a connecting column and transverse reinforcing ribs, wherein the upper end disc is provided with a plurality of grooves; the supporting groove column and the connecting column are vertically connected between the upper end disc and the lower end disc, the transverse reinforcing ribs are connected with the supporting groove column and the connecting column, and the supporting groove column is provided with uniform groove teeth. According to the utility model, the torsion resistance or bending resistance of the support groove column, the connection column and the transverse reinforcing ribs is achieved, the effect of increasing the overall strength of the boat support is achieved, the deformation risk of the boat support at high temperature can be effectively reduced, the influence of wafer sliding and wafer warping in the process is reduced through groove tooth inclined surface treatment, the wafer scratch condition is reduced, the process productivity is improved, the stability and the reliability are enhanced, and the service life of the wafer boat is prolonged.
Description
Technical Field
The utility model relates to the field of semiconductor manufacturing, in particular to a semiconductor vertical furnace crystal boat for heat treatment of a semiconductor vertical furnace.
Background
In the process of a semiconductor vertical furnace, a wafer boat is generally used to carry wafers, so that the wafers enter the vertical furnace body and undergo a process reaction. The wafer boat is used as a device for carrying wafers, and the stability of the wafer boat needs to be ensured. Under the condition of high temperature, for example, when the process temperature reaches 800-1300 ℃, the wafer boat can deform due to the factors of materials, structures and the like, after the wafer boat deforms, the wafer is easy to deviate and suspend, so that the problem of wafer scratch is easy to occur, and the larger the contact area between the wafer and the tooth slot on the support column of the wafer boat is, the probability of wafer scratch after the wafer boat deforms is increased, and the process effect of the wafer can be adversely affected. The existing vertical furnace wafer boat has the defects of insufficient welding strength, easy deformation under high-temperature load, easy wafer scratch and the like.
Disclosure of Invention
The utility model provides a semiconductor vertical furnace wafer boat with reasonable structure, which aims at the defects of insufficient welding strength, easy deformation under high temperature load, easy wafer scratch and the like of the existing vertical furnace wafer boat, and improves the deformation resistance strength and the whole stability and reliability of the wafer boat by reinforcing the whole supporting structure, and simultaneously adopts oblique angle treatment at the groove teeth, thereby reducing the contact area of the wafer, reducing the scratch probability, reducing the influence caused by wafer warpage and enabling the process to be carried out smoothly.
The technical scheme adopted by the utility model is as follows:
a semiconductor vertical furnace crystal boat comprises an upper end disc, a lower end disc, a supporting groove column, a connecting column and transverse reinforcing ribs; the supporting groove column and the connecting column are vertically connected between the upper end disc and the lower end disc, the transverse reinforcing ribs are connected with the supporting groove column and the connecting column, and the supporting groove column is provided with uniform groove teeth.
As a further improvement of the above technical scheme:
the supporting groove column and the connecting column form a frame structure with the upper end disc and the lower end disc.
The upper end disc and the lower end disc are kept parallel and concentric, and the upper end disc and the lower end disc are circular plates with central through holes.
The bottom of the lower end disc adopts a step structure, and a positioning block is arranged in the step structure.
The transverse reinforcing ribs are connected between the supporting groove columns and the connecting columns adjacent to the supporting groove columns or between the supporting groove columns and the connecting columns far away from the supporting groove columns.
The groove teeth of the supporting groove column adopt inclined planes, and the inclination of one side or two sides of each groove tooth is 3 degrees to 10 degrees.
The number of the transverse reinforcing ribs between each group of the connected supporting groove columns and the connecting columns is 1-6.
The gap between the connecting column and the supporting groove column is smaller than 3mm.
The connecting column and the supporting groove column are cylindrical.
The number of the supporting groove columns is 4, and the number of the connecting columns is 4.
The beneficial effects of the utility model are as follows:
the utility model adopts the dual support connection of the support groove column and the connecting column, forms a frame structure with the upper disc and the lower disc, increases the stability, prevents the deformation of the frame under high temperature deformation by connecting the support groove column and the connecting column through the transverse reinforcing rib, achieves the effect of increasing the integral strength of the boat support through the torsion resistance or bending resistance of the support groove column and the connecting column and the transverse reinforcing rib, can effectively reduce the deformation risk under high temperature, and enhances the stability and the reliability and the service life of the boat.
The utility model adopts the groove teeth on the supporting groove columns to conduct bevel treatment, the contact surface of the wafer and the groove teeth uses the inclined surface, the contact area of the wafer and the groove is reduced, the scratch risk is reduced, the influence caused by the sliding of the wafer and the warping of the wafer is reduced in the process through the bevel treatment of the groove teeth, the scratch condition of the wafer is reduced, and the process productivity and the yield are improved. The lower disc is positioned in a step manner, so that the stability of the wafer boat is improved, and the wafer boat is prevented from being inclined due to the instability of the lifting system, so that the wafer is shifted to generate scratches.
Drawings
Fig. 1 is a perspective view of the present utility model.
Fig. 2 is a front view of the present utility model.
Fig. 3 is a cross-sectional view of the present utility model.
Fig. 4 is a schematic illustration of the slot shape of the slot tooth of the present utility model.
Fig. 5 is a cross-sectional view of a wafer placed in a tooth slot.
In the figure: 1. an upper end disc; 2. a lower end disc; 3. supporting the grooved column; 4. a connecting column; 5. transverse reinforcing ribs.
Detailed Description
The following describes specific embodiments of the present utility model with reference to the drawings.
As shown in fig. 1 to 5, the boat for the vertical semiconductor furnace according to the present utility model comprises an upper end disk 1, a lower end disk 2, a supporting slot column 3, a connecting column 4, and a transverse reinforcing rib 5, wherein the upper end disk 1 and the lower end disk 2 are supported and connected by using the supporting slot column 3 and the connecting column 4, and the upper end disk 1 and the lower end disk 2 are positioned at two ends of the supporting slot column 3 and the connecting column 4 and are vertically connected with the same, and the upper disk and the lower disk are kept parallel. The upper end disc 1 and the lower end disc 2 are vertically connected with the supporting groove column 3 and the connecting column 4 to form a frame structure.
The upper end disc 1 is a circular plate with a central through hole, and the thickness of the plate is 5-10mm. The lower end disc 2 is a circular plate with a central through hole, the bottom of the lower end disc 2 adopts a step structure, and a positioning block is arranged in the step structure. The lower end disc 2 adopts a step structure and is provided with a positioning block, so that the stability of the wafer boat can be improved, and the wafer boat is prevented from tilting due to instability of a lifting system.
Preferably, the connecting column 4 and the supporting groove column 3 are standard cylinders. The number of the supporting groove columns 3 is 4, and the number of the connecting columns 4 is 4. The connecting columns 4 are positioned beside the supporting groove columns 3, and the number of the connecting columns corresponds to that of the supporting grooves. The transverse reinforcing ribs 5 are connected with the supporting groove columns 3 and the connecting columns 4, and the number of the transverse reinforcing ribs 5 between each group of the connected supporting groove columns 3 and the connecting columns 4 is 1-6. As various embodiments, the transverse reinforcing rib 5 is connected between the support groove column 3 and the connection column 4 adjacent to the support groove column 3, or may be connected between the support groove column 3 and the connection column 4 distant from the support groove column 3.
The position of the supporting groove column 3 is based on the wafer size, the supporting groove column 3 is distributed between the upper disc and the lower disc to form a front end opening and a rear end installation opening, the front end opening is larger than the rear end installation opening, and the wafer is placed into the wafer boat from the front end opening. Preferably, the gap between the connecting column 4 and the supporting groove column 3 is smaller than 3mm, and 2-6 transverse reinforcing ribs 5 are used for connecting the supporting groove column 3 at the front end opening and the connecting column 4 at the rear end installation opening.
The number of grooves for supporting the grooved post 3 is 5 or more. The groove width of the supporting groove column 3 is 4-6mm. The directions of the groove teeth of the supporting groove columns 3 are distributed according to the wafer size, so that the wafer is kept stably placed. The groove teeth of the supporting groove column 3 are inclined to form an opening angle, and the inclination of one side or two sides of each groove tooth is 3 degrees to 10 degrees.
The utility model adopts double supports to connect the upper end surface and the lower end surface to form a frame structure, and adds transverse reinforcing ribs, thereby effectively enhancing the stability of the whole mechanism, effectively reducing the deformation risk at high temperature, enhancing the stability and the reliability and prolonging the service life. The utility model adopts the uniformly distributed groove teeth, the groove shape is in an oblique angle shape, the release of the groove shape from the wafer is reduced, thereby reducing the scratch risk of the wafer, and simultaneously, the stability of placing the wafer is increased, so that the process gas and the wafer can be fully contacted.
The above description is illustrative of the utility model and is not intended to be limiting, and the utility model may be modified in any form without departing from the spirit of the utility model.
Claims (8)
1. A semiconductor vertical furnace crystal boat is characterized in that: comprises an upper end disc (1), a lower end disc (2), a supporting groove column (3), a connecting column (4) and a transverse reinforcing rib (5); the support groove columns (3) and the connecting columns (4) are vertically connected between the upper end disc (1) and the lower end disc (2), the transverse reinforcing ribs (5) are connected with the support groove columns (3) and the connecting columns (4), and the support groove columns (3) and the connecting columns (4) are circumferentially distributed around the upper end disc (1) and the lower end disc (2);
the supporting groove columns (3) are uniformly provided with groove teeth, the groove teeth adopt inclined planes, and the inclination of one side or two sides of each groove tooth is 3-10 degrees;
the bottom of the lower end disc (2) adopts a step structure, and a positioning block is arranged in the step structure.
2. The semiconductor vertical furnace boat according to claim 1, wherein: the supporting groove column (3), the connecting column (4), the upper end disc (1) and the lower end disc (2) form a frame structure.
3. The semiconductor vertical furnace boat according to claim 1, wherein: the upper end disc (1) and the lower end disc (2) are kept parallel and concentric, and the upper end disc (1) and the lower end disc (2) are circular plates with central through holes.
4. The semiconductor vertical furnace boat according to claim 1, wherein: the transverse reinforcing rib (5) is connected between the supporting groove column (3) and the connecting column (4) adjacent to the supporting groove column (3), or between the supporting groove column (3) and the connecting column (4) far away from the supporting groove column (3).
5. The semiconductor vertical furnace boat according to claim 1, wherein: the number of the transverse reinforcing ribs (5) between each group of the connected supporting groove columns (3) and the connecting columns (4) is 1-6.
6. The semiconductor vertical furnace boat according to claim 1, wherein: the gap between the connecting column (4) and the supporting groove column (3) is smaller than 3mm.
7. The semiconductor vertical furnace boat according to claim 1, wherein: the connecting column (4) and the supporting groove column (3) are cylindrical.
8. The semiconductor vertical furnace boat according to claim 1, wherein: the number of the supporting groove columns (3) is 4, and the number of the connecting columns (4) is 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320073452.7U CN220189582U (en) | 2023-01-10 | 2023-01-10 | Semiconductor vertical furnace crystal boat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320073452.7U CN220189582U (en) | 2023-01-10 | 2023-01-10 | Semiconductor vertical furnace crystal boat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220189582U true CN220189582U (en) | 2023-12-15 |
Family
ID=89103880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320073452.7U Active CN220189582U (en) | 2023-01-10 | 2023-01-10 | Semiconductor vertical furnace crystal boat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220189582U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117438351A (en) * | 2023-12-20 | 2024-01-23 | 无锡松煜科技有限公司 | Vertical crystal boat for heat treatment of semiconductor vertical furnace |
-
2023
- 2023-01-10 CN CN202320073452.7U patent/CN220189582U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117438351A (en) * | 2023-12-20 | 2024-01-23 | 无锡松煜科技有限公司 | Vertical crystal boat for heat treatment of semiconductor vertical furnace |
| CN117438351B (en) * | 2023-12-20 | 2024-03-19 | 无锡松煜科技有限公司 | Vertical crystal boat for heat treatment of semiconductor vertical furnace |
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