CN220182089U

CN220182089U - Silicon wafer receiving equipment

Info

Publication number: CN220182089U
Application number: CN202321367777.2U
Authority: CN
Inventors: 卞海峰; 李昶; 刘世挺; 闫东; 顾晓奕
Original assignee: Wuxi Autowell Technology Co Ltd
Current assignee: Wuxi Autowell Technology Co Ltd
Priority date: 2023-06-01
Filing date: 2023-06-01
Publication date: 2023-12-15
Anticipated expiration: 2033-06-01

Abstract

The utility model discloses silicon wafer receiving equipment, which comprises a main conveying unit, a picking unit and a discharging unit, wherein the discharging unit comprises a receiving unit and a storage unit, the receiving unit is arranged corresponding to the end part of the picking unit and is provided with at least two release positions, the receiving unit comprises at least two first conveying belts and first adsorption components which are arranged in parallel, the first adsorption components are long-strip-shaped and extend along the conveying direction of the first conveying belts, the first adsorption components are configured to adsorb silicon wafers in a non-contact manner and keep the silicon wafers on the first conveying belts, and the first conveying belts are configured to drive the kept silicon wafers to move to any release position; and a storage carrier is arranged below each release position in a one-to-one correspondence manner, and at least one storage carrier is configured to be capable of lifting and transversely moving relative to the other storage carriers. The silicon wafer receiving equipment realizes automatic sorting and receiving of the silicon wafers, improves the receiving efficiency of the silicon wafers, and further improves the sorting efficiency of the silicon wafers.

Description

Silicon wafer receiving equipment

Technical Field

The utility model belongs to the technical field of silicon wafer processing, and particularly relates to silicon wafer receiving equipment.

Background

After the silicon wafers are sorted and detected by a sorting machine, the silicon wafers are sorted and received according to the sorted grades, so that the silicon wafers with different grades are received into different material boxes. Along with the continuous improvement of the productivity of the sorting machine, the current productivity requirement on the receiving equipment of the discharging area of the sorting machine is higher, the productivity of the traditional silicon wafer receiving equipment is lower, and the current productivity requirement cannot be met.

Disclosure of Invention

The utility model aims to provide silicon wafer receiving equipment, which solves the problem of low productivity of the silicon wafer receiving equipment in the prior art.

To achieve the purpose, the utility model adopts the following technical scheme:

the silicon wafer receiving equipment comprises a main conveying unit, a picking unit and a blanking unit, wherein the main conveying unit is provided with a plurality of changing positions along a first direction, the picking unit is arranged above each changing position, the blanking unit is correspondingly arranged at two ends of each picking unit, and the picking unit is configured to adsorb silicon wafers at the changing positions in a non-contact manner and convey the silicon wafers to the blanking unit at one of two ends of the picking unit in a reversing manner along a direction perpendicular to the first direction; wherein:

the blanking unit comprises a receiving unit and a stock unit, the receiving unit is arranged corresponding to the end part of the pick-up unit, the receiving unit is provided with at least two release positions along the direction perpendicular to the first direction, the receiving unit comprises at least two first conveying belts which are arranged in parallel and first adsorption components which are in one-to-one correspondence with the first conveying belts, the first adsorption components are long-strip-shaped and extend along the conveying direction of the first conveying belts, the first adsorption components are configured to adsorb silicon wafers in a non-contact manner so that the silicon wafers are kept on the first conveying belts under the action of negative pressure, and the first conveying belts are configured to drive the kept silicon wafers to move to any release positions;

the storage units comprise storage carriers with the same quantity as the release positions, the storage carriers are arranged below each release position in a one-to-one correspondence mode, and at least one storage carrier is configured to be capable of lifting and transversely moving relative to other storage carriers.

The automatic sorting and collecting of the silicon wafers are realized by matching the main conveying unit, the picking unit and the blanking unit, and the sorting efficiency of the silicon wafers is improved; the first adsorption component on the receiving unit is in a strip shape and is arranged along the conveying direction of the first conveying belt, and the adsorption force is generated around the conveying belt along the conveying direction, so that the silicon wafer is not easy to deform during adsorption, and the conveying stability is improved; at least two release positions are arranged on the receiving unit, the storage units comprise storage carriers with the same quantity as the release positions, at least one of the storage carriers can be lifted and horizontally moved relative to the other storage carriers, the material receiving efficiency of the discharging unit is improved, and the productivity of silicon wafer material receiving equipment is further improved.

Optionally, the pick-up unit includes at least two parallel second conveyer belts and a sucker located between the two second conveyer belts, an adsorption surface of the sucker is higher than a conveying surface of the second conveyer belts, the sucker is configured to adsorb the silicon wafer in a non-contact manner to enable the silicon wafer to be kept on the second conveyer belts under the action of negative pressure, and the second conveyer belts are configured to drive the kept silicon wafer to move onto the first conveyer belts.

The suction disc is used for realizing non-contact adsorption and maintenance of the silicon wafers with the changed positions on the second conveying belt, and the second conveying belt is used for realizing the transfer of the held silicon wafers to the first conveying belt.

Optionally, the pick-up unit includes at least two parallel second conveyer belts and second adsorption components corresponding to the second conveyer belts one by one, the second adsorption components are long and extend along the conveying direction of the second conveyer belts, the second adsorption components are configured to adsorb the silicon wafers in a non-contact manner to enable the silicon wafers to be kept on the second conveyer belts under the action of negative pressure, and the second conveyer belts are configured to drive the kept silicon wafers to move onto the first conveyer belts.

The silicon wafer with the change bit is adsorbed and kept on the second conveying belt in a non-contact manner through the second adsorption component, the held silicon wafer is transferred to the first conveying belt through the second conveying belt, meanwhile, the second adsorption component is arranged to be in a strip shape, and the conveying direction of the second conveying belt extends, so that the adsorption force of the second adsorption component is generated around the conveying belt along the conveying direction, the silicon wafer is not easy to deform during adsorption, the conveying stability of the pick-up unit is improved, and the receiving efficiency of the silicon wafer is improved.

Optionally, the first adsorption component comprises a base and a drainage piece, wherein the base is installed close to the corresponding first conveying belt and is at least used for supporting the conveying surface of the first conveying belt; the drainage piece is arranged on the base, an air cavity is arranged between the drainage piece and the base, an air outlet end communicated with the air cavity is formed between the drainage piece and the base, compressed air enters the air cavity through the air inlet and flows out of the air outlet end through the air cavity, and the silicon wafer is held on the conveying surface of the first conveying belt in a non-contact mode through negative pressure generated based on Bernoulli effect.

Through the cooperation of base and drainage piece, can form the negative pressure based on Bernoulli effect, realized keeping the silicon chip non-contact on the conveying face of first conveyer belt, the base can play the supporting role to the conveying face of first conveyer belt simultaneously, has improved the stationarity that first conveyer belt carried.

Optionally, the material receiving unit is provided with a first release position and a second release position which are sequentially arranged along a direction perpendicular to the first direction, and the first release position is close to the main conveying unit;

the storage unit comprises a first storage carrier and a second storage carrier, the first storage carrier is used for storing the silicon wafers released through the first release position, and the second storage carrier is used for storing the silicon wafers released through the second release position; the first stock carrier is configured to be capable of lifting and traversing relative to the second stock carrier.

The receiving unit is provided with a first release position and a second release position, the storage unit is provided with a first storage carrier and a second storage carrier corresponding to the two release positions, and the first storage carrier can be lifted and horizontally moved relative to the second storage carrier, so that the first storage carrier is moved to a position convenient for taking materials, the silicon wafers are conveniently collected, and the receiving efficiency of the silicon wafers is improved.

Optionally, the material storage unit further comprises a mounting frame, a first cylinder, a second cylinder, a first vertical plate and a lifting vertical plate, the first material storage carrier is arranged on the lifting vertical plate in a vertical sliding manner, the lifting vertical plate is arranged on the first vertical plate in a horizontal sliding manner, the first vertical plate is arranged on the mounting frame, the first cylinder is configured to drive the lifting vertical plate to move transversely on the first vertical plate, and the second cylinder is configured to drive the first material storage carrier to move vertically on the lifting vertical plate.

Through the cooperation of first cylinder, second cylinder, first riser and lift riser, realized that first stock carrier is sideslip and lift for second stock carrier to make first stock carrier can avoid second stock carrier and keep away from main conveying unit and be pulled out to the position of being convenient for get the material, provided a simple structure, with low costs and stock unit of being convenient for installation.

Optionally, the first vertical plate is slidably disposed on the mounting frame; the material storage unit further comprises a first synchronous belt, a first belt pulley, a second belt pulley, a first fixing piece and a second fixing piece, wherein the first belt pulley and the second belt pulley are respectively arranged at two end parts of the first vertical plate, and the first synchronous belt is sleeved on the first belt pulley and the second belt pulley;

the first side belt body of the first synchronous belt is fixedly connected to the mounting frame through a first fixing piece; the second side belt body of the first synchronous belt is fixedly connected with the lifting vertical plate through a second fixing piece;

the driving end of the first air cylinder is connected with the first vertical plate and used for driving the first vertical plate to transversely move for a first distance; the second fixing piece is used for driving the lifting vertical plate to move along the transverse direction for a second distance.

Through the cooperation of first riser, first cylinder and hold-in range drive assembly, can realize the pull to the double cylinder stroke (first distance and second distance sum promptly) of first stock carrier, provide a removal stroke big, compact structure's stock unit.

Optionally, the stock unit further includes a mounting frame, a third cylinder and a second vertical plate, the second vertical plate is disposed on the mounting frame, the second stock carrier is slidably disposed on the second vertical plate, and the third cylinder is configured to drive the second stock carrier to move laterally on the second vertical plate.

Through third cylinder and second riser cooperation, realized the sideslip of second stock carrier to make the second stock carrier can keep away from main conveying unit and be pulled out to the position of being convenient for get the material, improved unloading efficiency, simple structure, with low costs, the installation of being convenient for.

Optionally, the stock unit further includes a second synchronous belt, a third belt pulley, a fourth belt pulley, a third fixing piece and a fourth fixing piece, the third belt pulley and the fourth belt pulley are respectively installed at two ends of the second vertical plate, and the second synchronous belt is sleeved on the third belt pulley and the fourth belt pulley;

the first side belt body of the second synchronous belt is fixedly connected to the mounting frame through a third fixing piece; the second side belt body of the second synchronous belt is fixedly connected with a second stock carrier through a fourth fixing piece;

the driving end of the third air cylinder is connected with the second vertical plate and used for driving the second vertical plate to transversely move for a third distance; the fourth fixing piece is used for driving the second stock carrier to move along the transverse direction for a fourth distance.

Through the cooperation of the third cylinder, the second vertical plate and the synchronous belt transmission assembly, the double cylinder stroke (namely the sum of the third distance and the fourth distance) of the second stock carrier can be pulled, and the stock unit with large moving stroke and compact structure is provided.

Optionally, the stock unit further comprises a back-blowing assembly, wherein the back-blowing assembly is located below the release position and is configured to blow air towards the released silicon wafer.

The back-blowing assembly blows air towards the released silicon wafer to buffer the released silicon wafer, so that the silicon wafer is prevented from striking the stock carrier or the silicon wafer in the stock carrier, edge breakage occurs, and the defect rate of silicon wafer processing is reduced.

Drawings

FIG. 1 is a schematic structural diagram of a silicon wafer receiving device according to an embodiment of the present utility model;

FIG. 2 is a schematic perspective view of a single bit change of a silicon wafer receiving device according to an embodiment of the present utility model;

FIG. 3 is a schematic front view of a single bit change of a silicon wafer receiving device according to an embodiment of the present utility model;

fig. 4 is a schematic perspective view of a first embodiment of a pickup unit according to an embodiment of the present utility model;

fig. 5 is a schematic perspective view of a second implementation of a pick-up unit provided by an embodiment of the present utility model;

FIG. 6 is a schematic perspective view of a first adsorption module according to an embodiment of the present utility model;

fig. 7 is a schematic perspective view of a first view angle of a stock unit according to an embodiment of the present utility model;

fig. 8 is a schematic perspective view of a second view angle of a stock unit according to an embodiment of the present utility model;

fig. 9 is a schematic perspective view of a driving manner of a first stock carrier according to an embodiment of the present utility model;

fig. 10 is a schematic perspective view of a first view angle of a first driving mode of a second stock carrier according to an embodiment of the present utility model;

fig. 11 is a schematic perspective view of a second view angle of a first driving mode of a second stock carrier according to an embodiment of the present utility model.

The following reference numerals are included in fig. 1 to 11:

a main conveying unit 10;

a pickup unit 20, a second conveyor belt 21, suction cups 22, and a second suction unit 23;

the material receiving unit 30, the first conveying belt 31, the first adsorption component 32, the base 320, the drainage piece 321, the air inlet 322, the air outlet end 323, the first release position 33 and the second release position 34;

a stock unit 40, a first stock carrier 41, a second stock carrier 42, a mounting frame 43, a first cylinder 44, a second cylinder 45, a first vertical plate 46, a lifting vertical plate 47, a third cylinder 48 and a second vertical plate 49;

a first timing belt 50, a first fixing member 51, a second timing belt 52, a third pulley 53, a fourth pulley 54, a third fixing member 55, and a fourth fixing member 56; blowback assembly 60.

Detailed Description

In order that the above-recited objects, features and advantages of the present utility model will become more readily apparent, a more particular description of the utility model will be rendered by reference to the appended drawings and appended detailed description.

Accordingly, the present utility model provides a silicon wafer receiving apparatus, as shown in fig. 1 to 3, the silicon wafer receiving apparatus provided in the embodiment of the present utility model includes a main conveying unit 10, a pickup unit 20 and a blanking unit, the main conveying unit 10 is provided with a plurality of changing positions along a first direction, each changing position is provided with the pickup unit 20 above, two ends of each pickup unit 20 are correspondingly provided with the blanking unit, the pickup unit 20 is configured to adsorb silicon wafers at the changing positions in a non-contact manner and to transfer the silicon wafers to the blanking unit of one of two ends of the pickup unit 20 along a direction perpendicular to the first direction; wherein:

the blanking unit comprises a receiving unit 30 and a stock unit 40, the receiving unit 30 is arranged corresponding to the end part of the pick-up unit 20, the receiving unit 30 is provided with at least two release positions along the direction perpendicular to the first direction, the receiving unit 30 comprises at least two first conveying belts 31 which are arranged in parallel and first adsorption assemblies 32 which are in one-to-one correspondence with the first conveying belts 31, the first adsorption assemblies 32 are in a strip shape and extend along the conveying direction of the first conveying belts 31, the first adsorption assemblies 32 are configured to adsorb silicon wafers in a non-contact manner so that the silicon wafers are kept on the first conveying belts 31 under the action of negative pressure, and the first conveying belts 31 are configured to drive the kept silicon wafers to move to any release position;

the stock unit 40 includes the same number of stock carriers as the number of release positions, and stock carriers are disposed under each release position in a one-to-one correspondence, and at least one of the stock carriers is configured to be capable of lifting and traversing relative to the other stock carriers.

As can be seen, the main conveying unit 10 conveys the silicon wafer to the position right below the picking unit 20 along the first direction, the picking unit 20 adsorbs the silicon wafer to pick up and conveys the silicon wafer to the receiving unit 30 at one of two ends of the picking unit 20, the first conveying belt 31 of the receiving unit 30 drives the held silicon wafer to move to any release position and releases the held silicon wafer to the corresponding stock carrier, so that automatic sorting and collecting of the silicon wafer are realized, and sorting efficiency of the silicon wafer is improved; the first adsorption component 32 on the receiving unit 30 is in a strip shape and is arranged along the conveying direction of the first conveying belt 31, and the adsorption force is generated around the conveying belt along the conveying direction, so that the silicon wafer is not easy to deform during adsorption, and the conveying stability is improved; at least two release positions are arranged on the receiving unit 30, the storage units 40 are provided with storage carriers with the same number as the release positions, at least one of the storage carriers can be lifted and horizontally moved relative to the other storage carriers, the material receiving efficiency of the discharging unit is improved, and the productivity of the silicon wafer material receiving equipment is further improved.

Referring to fig. 4, as an embodiment, the pick-up unit 20 includes at least two second conveyor belts 21 disposed in parallel and a suction cup 22 disposed between the two second conveyor belts 21, the suction surface of the suction cup 22 is higher than the conveying surface of the second conveyor belt 21, the suction cup 22 is configured to non-contact suction the silicon wafer to hold the silicon wafer on the second conveyor belt 21 under the negative pressure, and the second conveyor belt 21 is configured to drive the held silicon wafer to move onto the first conveyor belt 31.

It can be seen that the suction cup 22 realizes non-contact suction and holding of the wafer with the changing position on the second conveyor belt 21, and the second conveyor belt 21 realizes transfer of the held wafer to the first conveyor belt 31, and a pickup unit 20 with simple structure, low cost and high working efficiency is provided.

Referring to fig. 5, as an embodiment, the pick-up unit 20 includes at least two parallel second conveyor belts 21 and second adsorption assemblies 23 corresponding to the second conveyor belts 21 one by one, the second adsorption assemblies 23 are elongated and extend along the conveying direction of the second conveyor belts 21, the second adsorption assemblies 23 are configured to adsorb the silicon wafer in a non-contact manner so as to keep the silicon wafer on the second conveyor belts 21 under the action of negative pressure, and the second conveyor belts 21 are configured to drive the held silicon wafer to move onto the first conveyor belts 31.

Therefore, the silicon wafer with the changing position is adsorbed and kept on the second conveying belt 21 in a non-contact manner through the second adsorption assembly 23, the held silicon wafer is transferred to the first conveying belt 31 through the second conveying belt 21, and meanwhile, the second adsorption assembly 23 is arranged in a strip shape and the conveying direction of the second conveying belt 21 extends, so that the adsorption force of the second adsorption assembly 23 is generated around the conveying belt along the conveying direction, the silicon wafer is not easy to deform during adsorption, the conveying stability of the pick-up unit 20 is improved, and the receiving efficiency of the silicon wafer is improved.

Referring to fig. 6, as an embodiment, the first adsorption assembly 32 includes a base 320 and a drainage member 321, where the base 320 is installed near the corresponding first conveyor belt 31 and is at least used for supporting the conveying surface of the first conveyor belt 31; the drainage member 321 is mounted on the base 320, an air cavity is arranged between the drainage member 321 and the base 320, an air outlet end 323 communicated with the air cavity is formed between the drainage member 321 and the base 320, compressed air enters the air cavity through the air inlet 322, and then flows out of the air outlet end 323 through the air cavity to keep the silicon wafer on the conveying surface of the first conveying belt 31 in a non-contact manner based on negative pressure generated by Bernoulli effect.

Specifically, the base 320 and the drainage member 321 are both in a strip-shaped structure, and the air inlet 322, the air cavity and the air outlet end 323 are provided with a plurality of air inlets and uniformly distributed along the conveying direction of the conveying surface of the first conveying belt 31 at intervals.

Therefore, through the cooperation of the base 320 and the drainage piece 321, negative pressure based on Bernoulli effect can be formed, so that the silicon wafer is kept on the conveying surface of the first conveying belt 31 in a non-contact manner, and meanwhile, the base 320 can play a supporting role on the conveying surface of the first conveying belt 31, and the conveying stability of the first conveying belt 31 is improved.

The structure of the second adsorption assembly 23 is the same as that of the first adsorption assembly 32, and will not be described here.

Referring again to fig. 3, as an embodiment, the receiving unit 30 has a first release position 33 and a second release position 34 sequentially arranged along a direction perpendicular to the first direction, wherein the first release position 33 is close to the main conveying unit 10;

the stock unit 40 includes a first stock carrier 41 and a second stock carrier 42, the first stock carrier 41 is used for storing the silicon wafer released by the first release position 33, and the second stock carrier 42 is used for storing the silicon wafer released by the second release position 34; the first stock carrier 41 is configured to be movable up and down and laterally relative to the second stock carrier 42.

As can be seen, the material receiving unit 30 is provided with a first release position 33 and a second release position 34, the material storing unit 40 is provided with a first material storing carrier 41 and a second material storing carrier 42 corresponding to the two release positions, and double-station material receiving is realized through the cooperation of the two release positions and the two material storing carriers, so that the material receiving efficiency of the silicon wafer is improved; meanwhile, the first stock carrier 41 is arranged to be capable of lifting and transversely moving relative to the second stock carrier 42, so that the first stock carrier 41 is moved to a position convenient for taking materials, and silicon wafers are convenient to collect.

Referring to fig. 7 to 9, as an embodiment, the stock unit 40 further includes a mounting frame 43, a first cylinder 44, a second cylinder 45, a first vertical plate 46, and a lifting vertical plate 47, the first stock carrier 41 is vertically slidably disposed on the lifting vertical plate 47, the lifting vertical plate 47 is laterally slidably disposed on the first vertical plate 46, the first vertical plate 46 is disposed on the mounting frame 43, the first cylinder 44 is used for driving the lifting vertical plate 47 to move laterally on the first vertical plate 46, and the second cylinder 45 is configured to drive the first stock carrier 41 to move vertically on the lifting vertical plate 47.

Specifically, when the first stock carrier 41 receives a material, the first cylinder 44 drives the first stock carrier 41 to move to a position right below the first release position 33, and then the second cylinder 45 drives the first stock carrier 41 to rise to a high-level state so as to receive the silicon wafer released at the first release position 33; when the first stock carrier 41 is full, the second cylinder 45 drives the first stock carrier 41 to descend to the low position, and the first cylinder 44 drives the lifting vertical plate 47 to move away from the main conveying unit 10 in the transverse direction, so as to draw the first stock carrier 41 to a position convenient for material collection.

It can be seen that, through the cooperation of the first cylinder 44, the second cylinder 45, the first vertical plate 46 and the lifting vertical plate 47, the transverse movement and lifting of the first stock carrier 41 relative to the second stock carrier 42 are realized, so that the first stock carrier 41 can avoid the second stock carrier 42 and be pulled out to a position convenient for material taking away from the main conveying unit 10, and the stock unit 40 with simple structure, low cost and convenient installation is provided.

As one embodiment, the first riser 46 is slidably disposed on the mounting frame 43; the stock unit 40 includes a first synchronous belt 50, a first belt pulley, a second belt pulley, a first fixing member 51 and a second fixing member, the first belt pulley and the second belt pulley are respectively mounted at two ends of the first vertical plate 46, and the first synchronous belt 50 is sleeved on the first belt pulley and the second belt pulley;

the first side belt body of the first synchronous belt 50 is fixedly connected to the mounting frame 43 through a first fixing member 51; the second side belt body of the first synchronous belt 50 is fixedly connected with the lifting vertical plate 47 through a second fixing piece;

the driving end of the first cylinder 44 is connected with the first vertical plate 46 and is used for driving the first vertical plate 46 to move along the transverse direction for a first distance; the second fixing member is used to drive the lifting stand 47 to move laterally a second distance.

Specifically, the first cylinder 44 and the second cylinder 45 are rodless cylinders.

It can be seen that, through the cooperation of the first vertical plate 46, the first cylinder 44 and the synchronous belt transmission assembly, the drawing of the double cylinder stroke (i.e. the sum of the first distance and the second distance) of the first stock carrier 41 can be realized, and meanwhile, the ineffective area generated by the use of the cylinders can be reduced, so that a stock unit with large moving stroke and compact structure is provided.

Referring to fig. 7, 8, 10 and 11, as an embodiment, the stock unit 40 further includes a mounting frame 43, a third cylinder 48 and a second vertical plate 49, the second vertical plate 49 is disposed on the mounting frame 43, the second stock carrier 42 is slidably disposed on the second vertical plate 49, and the third cylinder 48 drives the second stock carrier 42 to move laterally on the second vertical plate 49.

Specifically, when the second stock carrier 42 receives the material, the third cylinder 48 drives the second stock carrier 42 to move to a position right below the second release position 34 along a direction laterally close to the main conveying unit 10 so as to receive the silicon wafer released at the second release position 34, and when the second stock carrier 42 is full, the third cylinder 48 drives the second stock carrier 42 to move to a receiving position convenient for receiving the material along a direction laterally far away from the main conveying unit 10.

Specifically, the third cylinder 48 is a rodless cylinder.

Through the cooperation of third cylinder 48 and second riser 49, realized the sideslip of second stock carrier 42 to make second stock carrier 42 can keep away from main conveying unit 10 and be pulled out to the position of being convenient for get the material, can reduce simultaneously because of the invalid region that the use of cylinder produced, improved unloading efficiency, simple structure, with low costs, the installation of being convenient for.

As an embodiment, the stock unit 40 further includes a second timing belt 52, a third pulley 53, a fourth pulley 54, a third fixing member 55, and a fourth fixing member 56, the third pulley 53 and the fourth pulley 54 are respectively mounted at both ends of the second riser 49, and the second timing belt 52 is sleeved on the third pulley 53 and the fourth pulley 54;

the first side belt body of the second synchronous belt 52 is fixedly connected to the mounting frame 43 through a third fixing member 55; the second side belt body of the second synchronous belt 52 is fixedly connected with the second stock carrier 42 through a fourth fixing piece 56;

the driving end of the third cylinder 48 is connected with the second vertical plate 49 and is used for driving the second vertical plate 49 to move transversely for a third distance; the fourth fixing element 56 is configured to drive the second stock carrier 42 to move along the transverse direction by a fourth distance.

It can be seen that, through the cooperation of the third cylinder 48, the second riser 49 and the synchronous belt transmission assembly, the drawing of the double cylinder stroke (i.e. the sum of the third distance and the fourth distance) of the second stock carrier 42 can be realized, the invalid area generated by the use of the cylinders can be reduced, and a stock unit with large moving stroke and compact structure is provided.

Referring again to fig. 2, as an embodiment, the stock unit 40 further includes a blowback assembly 60, the blowback assembly 60 being positioned below the release position and configured to blow air toward the released silicon wafer.

Therefore, the blowback assembly 60 blows air towards the released silicon wafer to buffer the released silicon wafer, so as to prevent the silicon wafer from striking the stock carrier or the silicon wafer in the stock carrier, and the edge breakage is avoided, thereby being beneficial to reducing the defective rate of silicon wafer processing.

The silicon wafer receiving equipment provided by the embodiment has at least the following advantages:

1) The automatic sorting and collecting of the silicon wafers are realized, and the sorting efficiency of the silicon wafers is improved.

2) The receiving unit is provided with at least two release positions, the storage unit comprises storage carriers with the same quantity as the release positions, at least one of the storage carriers can be lifted and horizontally moved relative to the other storage carriers, the material receiving efficiency of the discharging unit can be improved, and the productivity of silicon wafer material receiving equipment is further improved.

3) The adsorption components of the receiving unit and the picking unit are of long strip structures extending along the conveying direction, so that the silicon wafers are not easy to deform during adsorption, and the conveying stability is improved.

4) The first material storage carrier adopts a drawable structure capable of lifting and transversely moving, and the second material storage carrier adopts a drawable structure capable of transversely moving, so that the silicon wafer is convenient to collect, and the material collection efficiency of the silicon wafer is improved.

5) The first material storage carrier and the second material storage carrier are driven by the air cylinder and have the drawing distance of double air cylinder travel, so that the whole structure is compact.

The above embodiments merely illustrate the basic principles and features of the present utility model, and the present utility model is not limited to the above examples, but can be variously changed and modified without departing from the spirit and scope of the present utility model, which is within the scope of the present utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The silicon wafer receiving equipment is characterized by comprising a main conveying unit, a picking-up unit and a blanking unit, wherein the main conveying unit is provided with a plurality of changing positions along a first direction, the picking-up unit is arranged above each changing position, the blanking unit is correspondingly arranged at two ends of each picking-up unit, and the picking-up unit is configured to adsorb silicon wafers at the changing positions in a non-contact manner and convey the silicon wafers to the blanking unit at one of the two ends of the picking-up unit in a direction perpendicular to the first direction in a changing manner; wherein:

the blanking unit comprises a receiving unit and a stock unit, the receiving unit is arranged corresponding to the end part of the pick-up unit, the receiving unit is provided with at least two release positions along the direction perpendicular to the first direction, the receiving unit comprises at least two first conveying belts which are arranged in parallel and first adsorption components which are in one-to-one correspondence with the first conveying belts, the first adsorption components are strip-shaped and extend along the conveying direction of the first conveying belts, the first adsorption components are configured to adsorb silicon wafers in a non-contact manner so that the silicon wafers are kept on the first conveying belts under the action of negative pressure, and the first conveying belts are configured to drive the kept silicon wafers to move to any release positions;

2. The silicon wafer collecting apparatus according to claim 1, wherein the pick-up unit comprises at least two second conveyor belts arranged in parallel and a suction cup arranged between the two second conveyor belts, an adsorption surface of the suction cup being higher than a conveying surface of the second conveyor belts, the suction cup being configured to contactlessly adsorb the silicon wafer to hold the silicon wafer on the second conveyor belts under a negative pressure, the second conveyor belts being configured to drive the held silicon wafer to move onto the first conveyor belts.

3. The silicon wafer collecting device according to claim 1, wherein the pick-up unit comprises at least two second conveyor belts arranged in parallel and second adsorption assemblies corresponding to the second conveyor belts one by one, the second adsorption assemblies are long-strip-shaped and extend along the conveying direction of the second conveyor belts, the second adsorption assemblies are configured to adsorb the silicon wafer in a non-contact manner so that the silicon wafer is kept on the second conveyor belts under the action of negative pressure, and the second conveyor belts are configured to drive the kept silicon wafer to move onto the first conveyor belts.

4. The silicon wafer receiving apparatus according to claim 1, wherein the first adsorption assembly comprises a base and a drainage member, the base being mounted adjacent to a corresponding first conveyor belt and at least for supporting a conveying surface of the first conveyor belt; the drainage piece is arranged on the base, an air cavity is formed between the drainage piece and the base, an air outlet end communicated with the air cavity is formed between the drainage piece and the base, compressed air enters the air cavity through the air inlet, and then flows out of the air outlet end through the air cavity so as to keep the silicon wafer on the conveying surface of the first conveying belt in a non-contact manner based on negative pressure generated by Bernoulli effect.

5. The silicon wafer receiving device according to claim 1, wherein the receiving unit has a first release position and a second release position which are sequentially arranged along a direction perpendicular to the first direction, and the first release position is close to the main conveying unit;

the storage unit comprises a first storage carrier and a second storage carrier, the first storage carrier is used for storing the silicon wafers released through the first release position, and the second storage carrier is used for storing the silicon wafers released through the second release position; the first stock carrier is configured to be liftable and laterally movable relative to the second stock carrier.

6. The silicon wafer receiving apparatus of claim 5, wherein the stock unit further comprises a mounting frame, a first cylinder, a second cylinder, a first vertical plate, and a lifting vertical plate, the first stock carrier is vertically slidably disposed on the lifting vertical plate, the lifting vertical plate is horizontally slidably disposed on the first vertical plate, the first vertical plate is disposed on the mounting frame, the first cylinder is configured to drive the lifting vertical plate to move horizontally on the first vertical plate, and the second cylinder is configured to drive the first stock carrier to move vertically on the lifting vertical plate.

7. The silicon wafer receiving device according to claim 6, wherein the first vertical plate is slidably disposed on the mounting frame; the material storage unit further comprises a first synchronous belt, a first belt pulley, a second belt pulley, a first fixing piece and a second fixing piece, wherein the first belt pulley and the second belt pulley are respectively arranged at two end parts of the first vertical plate, and the first synchronous belt is sleeved on the first belt pulley and the second belt pulley;

the first side belt body of the first synchronous belt is fixedly connected to the mounting frame through the first fixing piece; the second side belt body of the first synchronous belt is fixedly connected with the lifting vertical plate through the second fixing piece;

the driving end of the first air cylinder is connected with the first vertical plate and used for driving the first vertical plate to move transversely for a first distance; the second fixing piece is used for driving the lifting vertical plate to move transversely for a second distance.

8. The silicon wafer receiving apparatus of claim 5, wherein the stock unit further comprises a mounting bracket, a third cylinder and a second riser, the second riser is disposed on the mounting bracket, the second stock carrier is slidably disposed on the second riser, and the third cylinder is configured to drive the second stock carrier to move laterally on the second riser.

9. The silicon wafer receiving device according to claim 8, wherein the stock unit further comprises a second synchronous belt, a third belt pulley, a fourth belt pulley, a third fixing piece and a fourth fixing piece, the third belt pulley and the fourth belt pulley are respectively arranged at two ends of the second vertical plate, and the second synchronous belt is sleeved on the third belt pulley and the fourth belt pulley;

the first side belt body of the second synchronous belt is fixedly connected to the mounting frame through the third fixing piece; the second side belt body of the second synchronous belt is fixedly connected with the second stock carrier through the fourth fixing piece;

10. The silicon wafer handling apparatus of any one of claims 1-9, wherein the stock unit further comprises a blowback assembly positioned below the release position and configured to blow air toward the released silicon wafer.