CN220156721U - Connection structure and electronic equipment - Google Patents

Abstract

The utility model provides a connecting structure and electronic equipment, wherein the connecting structure comprises a first structural component, a circuit board component, a first connecting piece, a second connecting piece and a grounding gasket, the first structural component comprises a first part and a second part which are connected, a first through hole is formed through the first part, a second through hole is formed through the second part and the circuit board component, and the aperture of the second through hole is larger than that of the first through hole; the first connecting piece stretches into the first through hole, and the second connecting piece stretches into the second through hole and is connected with the first structural member to lock and attach the first structural member, the circuit board member and the grounding gasket; the grounding gasket is contacted with the first structural component and is electrically connected with the circuit board component, so that the circuit board component is grounded. The connection structure provided by the utility model can realize multi-layer connection in structure, and simultaneously provides a brand-new grounding scheme, thereby being beneficial to realizing miniaturization and light weight of electronic equipment.

Description

Connection structure and electronic equipment

Technical Field

The present utility model relates to the field of electronic devices, and in particular, to a connection structure and an electronic device using the same.

Background

Along with the pursuit of multifunctional, portable, small and light and thin electronic products, the current electronic products (such as mobile phones, tablet computers, notebook computers, electronic readers, digital cameras, wearable devices and the like) are increasingly developing towards the trend of light, thin, small and multifunctional.

In the prior art, in structural design, more and more functional parts are required to be connected. However, the existing connecting mode of the functional pieces occupies larger space, the connecting strength of the multi-layer functional pieces is lower, and the connecting parts are easy to break; moreover, the grounding space of the functional piece is required to be reserved independently, so that the occupation of the space is further increased. Therefore, how to package more and more functional components in a small space has become a great difficulty in structural design of the existing electronic products.

Disclosure of Invention

In view of this, in order to solve at least one of the above drawbacks, embodiments of the present utility model provide a connection structure and an electronic device using the same, where the connection structure can achieve direct locking of a multi-layer structural member, saving space, and being beneficial to improving the internal space utilization of the electronic device; and this connection structure can directly realize the ground connection, need not to set up the ground connection function spare alone, also need not alone to reserve the ground connection space, is favorable to further reducing connection structure's volume, reduces connection structure's space occupation.

A first aspect of an embodiment of the present utility model provides a connection structure, including:

the circuit board comprises a first structural component and a circuit board component which are arranged in a stacked manner, wherein the surface of the first structural component, which is away from the circuit board component, forms a first surface, the surface of the circuit board component, which is away from the first structural component, forms a second surface, the circuit board component comprises a first part and a second part which are connected, a first through hole is formed through the first part, a second through hole is formed through the second part and the circuit board component, the first through hole and the second through hole are coaxial and are communicated with each other, the aperture of the second through hole is larger than that of the first through hole, and the direction from the first surface to the second surface is defined as the first direction;

the first connecting piece stretches into the first through hole;

the second connecting piece stretches into the second through hole, and the first connecting piece is connected with the second connecting piece to lock and attach the first structural component and the circuit board component;

the connecting structure further comprises a grounding gasket, the grounding gasket is located on the surface, close to the circuit board assembly, of the first structural assembly, the second connecting piece penetrates through the grounding gasket, the grounding gasket is electrically connected with the circuit board assembly and is in contact with the first structural assembly, and therefore the circuit board assembly is grounded through the first structural assembly.

The locking attachment of the multilayer structure is realized by adopting the matching of the first connecting piece and the second connecting piece, and the structural design space is saved in a framework mode; moreover, through increasing the grounding gasket between circuit board subassembly and first structural component, can provide brand-new ground scheme when realizing structural multilayer connection, avoided extra occupation space to set up the grounding structure, be favorable to realizing miniaturization and frivolity of electronic equipment. In addition, the first connecting piece is arranged to not completely penetrate through the first structural component, so that the strength of the first structural component at the connecting position can be improved, and the grounding stability of the grounding gasket and the first structural component is also improved.

With reference to the first aspect, in some possible embodiments, the first structural component includes a middle frame and a first structural member that are stacked, the middle frame is disposed near the circuit board component, the first structural member is disposed away from the circuit board component, a surface of the first structural member that is away from the middle frame forms the first surface, a portion of the middle frame corresponding to the first through hole forms the first portion, and a portion of the middle frame corresponding to the second through hole forms the second portion.

According to the application of the connection structure at different positions in the electronic equipment, the first structural component can have different structures and functions, in the embodiment, the middle frame and the circuit board component are locked and attached through the first connecting piece and the second connecting piece, the grounding of the circuit board component is realized through the contact of the grounding gasket and the middle frame, the structural design space is saved in a framework mode, and the miniaturization and the light and thin of the electronic equipment are facilitated.

With reference to the first aspect, in some possible embodiments, in a second direction perpendicular to the first direction, a dimension of the second portion at the periphery of the second through hole is larger than a dimension of the first portion at the periphery of the first through hole.

The wall thickness of the second part positioned at the periphery of the second through hole is designed to be larger, so that the first connecting piece does not penetrate through the whole middle frame, the surface of the second part, which is away from the first part, has a larger area, on one hand, the strength of the connecting structure at the connecting position can be improved, and the risk of unexpected fracture at the connecting position is reduced; on the other hand, the contact area between the second part and the grounding gasket can be increased, and the grounding stability of the grounding gasket can be further improved.

With reference to the first aspect, in some possible embodiments, in the first direction, a total thickness of the middle frame is set to L, and a thickness of the second portion is set to L1, then: l1 is less than or equal to 1/4L and less than or equal to 1/2L.

By setting the thickness of the second portion to satisfy the above relation, the degree of connection firmness of the first connecting piece and the middle frame can be ensured, and also, the second portion can be ensured to have a sufficient wall thickness to improve the strength of the middle frame at the connection position, and in addition, the second portion can be ensured to have a sufficient contact area with the grounding pad to improve the grounding stability.

With reference to the first aspect, in some possible embodiments, an outer diameter of the second connecting member is smaller than an inner diameter of the first connecting member, and the second connecting member extends into the first connecting member to be in threaded connection with the second connecting member. Specifically, the first connecting piece is a spot welding nut or a spot welding riveting nut, and the second connecting piece is a screw.

Through the cooperation of spot welding riveting nut or spot welding nut and screw, can carry out effective lock with multilayer structure and attach, improve connection structure's connection stability, be favorable to reducing connection structure's thickness simultaneously.

With reference to the first aspect, in some possible embodiments, a surface of the first connector facing away from the second connector is flush with the first surface, and a surface of the second connector facing away from the first connector is flush with the second surface.

The surfaces of the first connecting piece and the second connecting piece are arranged to be flush with the first surface and the second surface respectively, so that the flatness of the appearance of the connecting structure is improved, and the thickness of the connecting structure is reduced.

With reference to the first aspect, in some possible embodiments, the circuit board assembly includes a second structural member and a circuit board that are stacked, the circuit board is disposed near the first structural member, the second structural member faces away from the first structural member, the second structural member includes a second structural member body and a reinforcing sheet embedded in the second structural member body, and the reinforcing sheet is located at a periphery of the second through hole.

Through increase the reinforcement piece in this internal at second through-hole peripheral second structure, can improve trompil department connection structure's intensity, reduce connection structure and take place unexpected fracture's risk in the junction.

A second aspect of an embodiment of the present utility model provides another connection structure, including:

the circuit board comprises a first structure component and a circuit board component which are arranged in a stacked manner, wherein a first through hole is formed through the first structure component, a second through hole is formed through the circuit board component, the first through hole and the second through hole are coaxial and communicated with each other, and the aperture of the second through hole is larger than that of the first through hole;

the first connecting piece stretches into the first through hole;

the second connecting piece stretches into the second through hole, and the first connecting piece is connected with the second connecting piece to lock and attach the first structural component and the circuit board component;

the connecting structure further comprises a grounding gasket, the grounding gasket is contacted with the end face, close to the circuit board assembly, of the first connecting piece, the second connecting piece penetrates through the grounding gasket, and the grounding gasket is electrically connected with the circuit board assembly, so that the circuit board assembly is grounded through the first connecting piece and the first structural assembly.

The locking attachment of the multilayer structure is realized by adopting the matching of the first connecting piece and the second connecting piece, and the structural design space is saved in a framework mode; moreover, through setting up the grounding gasket in the second through-hole to make grounding gasket pass through first connecting piece and second connecting piece locking, can provide brand-new ground scheme when realizing structural multilayer connection, avoided extra occupation space to set up ground structure, be favorable to realizing electronic equipment's miniaturization and frivolity.

With reference to the second aspect, in some possible embodiments, the grounding pad includes a first portion located in the second through hole and a second portion located on a surface of the circuit board assembly, the first portion and the second portion being connected to each other, the second portion being configured to be electrically connected to the circuit board assembly, the first portion being configured to abut against the first connector; the second connecting piece comprises a second connecting portion and a second clamping portion which are connected with each other, the second connecting portion stretches into the first through hole, the second clamping portion is located in the second through hole, and the first portion is located between the second clamping portion and the first connecting piece.

Through the structural design of the second connecting piece and the grounding gasket, the circuit board assembly can be electrically connected with the first structural assembly through the grounding gasket and the first connecting piece, and stable grounding is further achieved.

With reference to the second aspect, in some possible embodiments, the first structural component includes a first structural member body and a metal sheet embedded in the first structural member body, the first through hole further penetrates the metal sheet, and the first connecting member is in contact with the metal sheet.

The metal sheet is buried in the first structural member body and is contacted with the first connecting piece, so that the grounding of the circuit board assembly is facilitated; in addition, through increasing the sheetmetal at the periphery of first through-hole, can also improve the intensity of trompil department connection structure, reduce the risk of taking place unexpected fracture.

With reference to the second aspect, in some possible embodiments, the circuit board assembly includes a first circuit board and a second circuit board that are stacked, where the first circuit board is disposed near the first structural assembly, and the first circuit board and the second circuit board are bonded by a glue layer.

The multi-layer circuit board and the first structural component can be directly locked through the first connecting piece and the second connecting piece, and the thickness of the connecting structure can be effectively reduced.

A third aspect of the embodiment of the present utility model provides an electronic device, which includes the connection structure according to the first and second aspects of the embodiment of the present utility model.

The connecting structure of the first aspect and the second aspect of the embodiments of the present utility model is beneficial to reducing the space occupied by the connecting structure, improving the space utilization rate of the electronic device, and further beneficial to lightening and miniaturizing the electronic device.

Drawings

Fig. 1 is a schematic structural diagram of a connection structure according to an embodiment of the present utility model.

Fig. 2 is a schematic view of an application scenario of the connection structure in fig. 1.

Fig. 3 is a schematic structural diagram of a connection structure according to another embodiment of the present utility model.

Fig. 4 is a schematic view of an application scenario of the connection structure in fig. 3.

Fig. 5 is a schematic structural diagram of an electronic device according to an embodiment of the present utility model.

Description of the main reference signs

Connection structure 100,200

First structural component 1,1a

First surface 101,101a

Second surfaces 102,102a

First through holes 103,103a

Second through holes 104,104a

First portion 11,23

Second portions 12,24

First step portions 13,17a

Third through holes 14,15a

Second step portions 15,26

The first structural member body 11a

Sheet metal 13a

Middle frame 3

First structural member 4

Grounding pads 5,5a

First portion 51

Second portion 52

First connecting piece 6,6a

First connecting portions 61,61a

First engaging portions 63,63a

Second connecting piece 7,7a

Second connection portions 71,71a

Second engaging portions 73,73a

Circuit board assembly 2,2a

Second structural member 8

Second structural member body 81

Reinforcing sheet 83

Fourth through hole 85,25

Third step portion 87

Circuit board 9

First circuit board 21

Second circuit board 22

Electronic device 300

First direction a

Second direction b

Detailed Description

Embodiments of the present utility model will be described below with reference to the accompanying drawings in the embodiments of the present utility model.

The terminology used in the following examples is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used in the specification of the utility model and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include, for example, "one or more" such forms of expression, unless the context clearly indicates to the contrary.

Reference in the specification to "one embodiment" or "some embodiments" or the like means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the utility model. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," and the like in the specification are not necessarily all referring to the same embodiment, but mean "one or more but not all embodiments" unless expressly specified otherwise. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless expressly specified otherwise.

Because the existing electronic product occupies larger space in the connection mode of the multi-layer functional piece when the structure is designed, the connection strength is lower, and the connection part is easy to break; moreover, the grounding space of the functional piece is required to be reserved independently, so that the occupation of the space is further increased.

Therefore, the embodiment of the utility model provides a connection structure which can be applied to electronic equipment, wherein the electronic equipment comprises, but is not limited to, terminal equipment such as mobile phones, mobile power supplies, portable computers, tablet computers, electronic readers, notebook computers, digital cameras, wearable equipment, vehicle-mounted terminals and the like. The connecting structure can realize locking connection of the multi-layer structural member, saves space and has stronger connection stability; moreover, the connection structure can simultaneously realize the grounding requirement, does not need to independently occupy space to set the grounding structure, further saves space, and is favorable for lightening and thinning and miniaturization of electronic equipment.

Embodiments of the present utility model will be described below with reference to the accompanying drawings in the embodiments of the present utility model.

Example 1

Referring to fig. 1, an embodiment of the present utility model provides a connection structure 100, where the connection structure 100 includes a first structural component 1 and a circuit board component 2 stacked in sequence, a surface of the first structural component 1 facing away from the circuit board component 2 forms a first surface 101, and a surface of the circuit board component 2 facing away from the first structural component 1 forms a second surface 102. Along a first direction a (defining the direction from the first surface 101 to the second surface 102 as first direction a), the first structural component 1 comprises a first portion 11 and a second portion 12 connected. A first through hole 103 is formed through the first portion 11, a second through hole 104 is formed through the second portion 12 and the circuit board assembly 2, and the first through hole 103 and the second through hole 104 are coaxial and communicate with each other, and the aperture of the second through hole 104 is larger than the aperture of the first through hole 103. The connection structure 100 further comprises a first connection member 6 and a second connection member 7, wherein the first connection member 6 extends into the first through hole 103 from one side of the first surface 101, the second connection member 7 extends into the second through hole 104 from one side of the second surface 102, and the first connection member 6 is connected with the second connection member 7 to lock and attach the first structural component 1 and the circuit board component 2.

The connection structure 100 further includes a grounding pad 5, where the grounding pad 5 is located on a surface of the first structural component 1 near the circuit board component 2. The second connector 7 also extends through the grounding pad 5. The grounding pad 5 is electrically connected with the circuit board assembly 2 and contacts with the first structural assembly 1, so as to realize stable grounding of the circuit board assembly 2.

Referring to fig. 1 and fig. 2 in combination, the first structural component 1 may have different structures and functions according to the specific location of the connection structure 100 in the electronic device. In some embodiments, the first structural component 1 comprises a stacked middle frame 3 and a first structural member 4, the middle frame 3 being arranged close to the circuit board assembly 2, the first structural member 4 being arranged away from the circuit board assembly 2, a surface of the first structural member 4 facing away from the middle frame 3 constituting the first surface 101. The portion of the middle frame 3 corresponding to the first through hole 103 forms the first portion 11, and the portion of the middle frame 3 corresponding to the second through hole 104 forms the second portion 12. As shown in fig. 2, a specific application scenario of the connection structure 100 is shown.

In some embodiments, in the middle frame 3, a first step 13 is formed between a side wall of the first portion 11 corresponding to the first through hole 103 and a side wall of the second portion 12 corresponding to the second through hole 104, the end surface of the first connector 6, which is close to the circuit board assembly 2, abuts against the first step 13, and the ground pad 5 abuts against a surface of the second portion 12 facing away from the first portion 11. In the second direction b (defining the radial direction of the first through hole 103 as the second direction b), the second portion 12 of the periphery of the second through hole 104 has a larger size than the first portion 11 of the periphery of the first through hole 103. By designing the wall thickness of the second portion 12 located at the periphery of the second through hole 104 to be larger, the first connecting piece 6 does not penetrate through the whole middle frame 3, so that the surface of the second portion 12 facing away from the first step portion 13 has a larger area, on one hand, the strength of the connecting structure 100 at the connecting position can be improved, and the risk of unexpected fracture at the connecting position is reduced; on the other hand, the contact area of the second portion 12 with the grounding pad 5 can be increased, thereby improving the grounding stability of the grounding pad 5.

In some embodiments, in the first direction a, the total thickness of the middle frame 3 is L, and the thickness of the second portion 12 is L1, then: l1 is less than or equal to 1/4L and less than or equal to 1/2L. By setting the thickness of the second portion 12 to satisfy the above relation, the connection firmness of the first connecting member 6 and the center 3 can be ensured, and also, a sufficient wall thickness of the second portion 12 can be ensured to increase the strength of the center 3 at the connection, and further, a sufficient contact area of the second portion 12 and the grounding pad 5 can be ensured to increase the grounding stability.

As shown in fig. 2, in some embodiments, the first structural member 4 may be a bottom metal sheet of the middle frame 3, which mainly plays a role in supporting and reinforcing, and may improve the strength of the connection structure 100 at the connection location, and reduce the risk of accidental breakage of the middle frame 3 at the connection location.

As shown in fig. 1, in some embodiments, the first structural component 1 further has a third through hole 14, and the third through hole 14 is located outside the first through hole 103 and is disposed coaxially and in communication with the first through hole 103. A second step 15 is formed between the sidewall corresponding to the third through hole 14 and the sidewall corresponding to the first through hole 103. The first connecting member 6 includes a first connecting portion 61 extending into the first through hole 103 and a first engaging portion 63 located in the third through hole 14. The surface of the first engaging portion 63 near the first connecting portion 61 abuts against the second step portion 15, so as to limit the first connecting member 6. In some embodiments, the surface of the first engaging portion 63 facing away from the first connecting portion 61 is flush with the first surface 101, so as to improve the flatness of the appearance of the connecting structure 100, and also facilitate reducing the thickness of the connecting structure 100.

Referring to fig. 1 and fig. 2 in combination, the circuit board assembly 2 includes a second structural member 8 and a circuit board 9 that are stacked, the circuit board 9 is disposed near the first structural member 1, and the second structural member 8 is disposed away from the first structural member 1. In some embodiments, when the connection structure 100 is applied to a mobile phone, the circuit board 9 may be a small board in the mobile phone, and the second structural member 8 may be a small board support.

In some embodiments, the second structural member 8 includes a second structural member body 81 and a reinforcing sheet 83 embedded in the second structural member body 81, wherein the reinforcing sheet 83 is located at the periphery of the second through hole 104, and by adding the reinforcing sheet 83 in the second structural member body 81 at the periphery of the second through hole 104, the strength of the connection structure 100 at the opening can be improved, and the risk of accidental breakage can be reduced.

In some embodiments, the material of the second structural member body 81 may be plastic, and the reinforcing sheet 83 may be a metal sheet, specifically a steel sheet. The reinforcing sheet 83 may be embedded in the second structural member body 81 by an in-mold injection molding process.

The second structural member body 81 is provided with a fourth through hole 85, wherein the fourth through hole 85 is sleeved outside the second through hole 104, and is coaxial with and communicated with the second through hole 104. A third step 87 is formed between the sidewall of the second structural member body 81 corresponding to the fourth through hole 85 and the sidewall of the second structural member body 81 corresponding to the second through hole 104. The second connecting piece 7 includes a second connecting portion 71 extending into the second through hole 104 and a second engaging portion 73 located in the fourth through hole 85, where the surface of the second engaging portion 73 near the second connecting portion 71 abuts against the third step portion 87, so as to limit the second connecting piece 7. In some embodiments, the surface of the second engaging portion 73 facing away from the second connecting portion 71 is flush with the second surface 102, so as to improve the flatness of the appearance of the connecting structure 100, and also facilitate reducing the thickness of the connecting structure 100. In some embodiments, the reinforcing sheet 83 extends into the third step 87, and the third step 87 may have a reduced thickness due to the fourth through hole 85, so that there may be a risk of strength decrease at the third step 87, and strength of the third step 87 may be improved by extending the reinforcing sheet 83 to the third step 87.

Referring to fig. 1 and fig. 2 in combination, in some embodiments, the first connecting portion 61 of the first connecting member 6 may have a hollow column structure, the second connecting portion 71 of the second connecting member 7 may have a column shape, an outer diameter of the second connecting portion 71 is smaller than an inner diameter of the first connecting portion 61, and the second connecting portion 71 extends into the first connecting portion 61 to be connected with the first connecting portion 61.

In some embodiments, the first connector 6 may be a nut and the second connector 7 may be a screw. The first connecting portion 61 is provided with an internal thread, the second connecting portion 71 is provided with an external thread, and the first connecting portion 61 and the second connecting portion 71 are connected by threads. In some embodiments, the first connecting piece 6 may be a spot welding riveting nut or a spot welding nut, and through the cooperation of the spot welding riveting nut and the screw, the multi-layer structural member may be effectively locked and attached, so as to improve the connection stability of the connection structure 100, and simultaneously facilitate reducing the thickness of the connection structure 100.

According to the connecting structure 100 provided by the embodiment of the utility model, the locking attachment of the multi-layer structure is realized by adopting the matching of the first connecting piece 6 and the second connecting piece 7, and the structural design space is saved in a framework mode; moreover, by adding the grounding gasket 5 between the circuit board assembly 2 and the first structural assembly 1 (specifically, the middle frame 3), a brand new grounding scheme can be provided while realizing structural multi-layer connection, and the additional occupied space is avoided to set a grounding structure, so that the miniaturization and the light weight of the electronic equipment are facilitated. In addition, the first connecting piece 6 is not arranged to completely penetrate through the first structural component 1 (specifically, the middle frame 3), so that the strength of the first structural component 1 (specifically, the middle frame 3) at the connecting position can be improved, and meanwhile, the grounding stability of the grounding gasket 5 and the middle frame 3 is also improved.

Example 2

Referring to fig. 3 and 4, the embodiment of the present utility model further provides a connection structure 200, where the connection structure 200 includes a first structural component 1a and a circuit board component 2a stacked in sequence. The surface of the first structural component 1a facing away from the circuit board component 2a forms a first surface 101a, and the surface of the circuit board component 2a facing away from the first structural component 1a forms a second surface 102a. The connection structure 200 further includes a first through hole 103a penetrating the first structural component 1a and a second through hole 104a penetrating the circuit board component 2a. The first through hole 103a and the second through hole 104a are coaxial and are communicated with each other, and the aperture of the second through hole 104a is larger than that of the first through hole 103 a. The connection structure 200 further includes a first connecting member 6a and a second connecting member 7a, the first connecting member 6a extends into the first through hole 103a from the first surface 101a side, the second connecting member 7a extends into the second through hole 104a from the second surface 102a side, and the first connecting member 6a is connected with the second connecting member 7a to lock the first structural component 1a and the circuit board component 2a.

The connection structure 200 further includes a grounding pad 5a, and the grounding pad 5a contacts with the end surface of the first connection member 6a near the circuit board assembly 2a. Wherein the second connecting piece 7a penetrates through the grounding pad 5a and is connected with the first connecting piece 6 a. The grounding pad 5a is electrically connected with the circuit board assembly 2a, so that the circuit board assembly 2a is stably grounded through the first connecting piece 6a and the first structural assembly 1 a.

The grounding pad 5a includes a first portion 51 located in the second through hole 104a and a second portion 52 located on the second surface 102a, and the first portion 51 and the second portion 52 are connected to each other. The second portion 52 is configured to electrically connect with the circuit board assembly 2a, the first portion 51 is configured to abut against the first connecting member 6a, and the first connecting member 6a is further in contact with the first structural assembly 1a, so as to implement grounding of the circuit board assembly 2a.

As shown in fig. 4, the first structural component 1a may be a housing of an electronic device, such as a housing of a mobile phone, according to a specific position of the connection structure 200 in the electronic device.

The first structural component 1a comprises a first structural component body 11a and a metal sheet 13a embedded in the first structural component body 11a, the first through hole 103a also penetrates through the metal sheet 13a, and the first connecting piece 6a is in contact with the metal sheet 13a, so that the grounding of the circuit board component 2a is realized. In addition, by adding the metal sheet 13a to the periphery of the first through hole 103a, the strength of the connection structure 200 at the opening can be improved, and the risk of accidental breakage can be reduced.

In some embodiments, the material of the first structural member body 11a may be plastic, and the metal sheet 13a may be a steel sheet. The sheet metal 13a may be embedded in the first structural member body 11a by an in-mold injection molding process.

The first structural member body 11a is provided with a third through hole 15a, wherein the third through hole 15a is sleeved outside the first through hole 103a and is coaxial with and communicated with the first through hole 103 a. A first step 17a is formed between the sidewall of the first structural member body 11a corresponding to the third through hole 15a and the sidewall of the first structural member body 11a corresponding to the first through hole 103 a. The first connecting piece 6a comprises a first connecting portion 61a extending into the first through hole 103a and a first clamping portion 63a located in the third through hole 15a, wherein the surface, close to the first connecting portion 61a, of the first clamping portion 63a is abutted against the first step portion 17a, and therefore limiting of the first connecting piece 6a is achieved. In some embodiments, the surface of the first engaging portion 63a facing away from the first connecting portion 61a is flush with the first surface 101a, so as to improve the flatness of the appearance of the connecting structure 200, and facilitate reducing the thickness of the connecting structure 200. In some embodiments, the metal sheet 13a extends into the first step 17a, and the first step 17a is thinned due to the third through hole 15a, so that there may be a risk of strength degradation at the first step 17a, and strength of the first step 17a is improved by extending the metal sheet 13a to the first step 17a. In addition, by extending the metal sheet 13a to the first step portion 17a, the metal sheet 13a is exposed at the first through hole 103a so as to be in contact with the second connection member 7a.

Referring again to fig. 3, the circuit board assembly 2a includes a first circuit board 21 and a second circuit board 22 that are stacked, the first circuit board 21 is disposed near the first structural assembly 1a, and a surface of the second circuit board 22 facing away from the first circuit board 21 forms a second surface 102a. In some embodiments, the first circuit board 21 and the second circuit board 22 are bonded by a glue layer. In some embodiments, the first circuit board 21 is a flexible circuit board (Flexible Printed Circuit, FPC) and the second circuit board 22 may be a printed circuit board (Printed Circuit Board, PCB).

Along a first direction a (the direction from the first surface 101a to the second surface 102a is defined as the first direction a), the second circuit board 22 includes a first portion 23 and a second portion 24 connected, where the first portion 23 is disposed near the first circuit board 21, the second portion 24 has a fourth through hole 25, the fourth through hole 25 is sleeved outside the second through hole 104a, and the fourth through hole 25 is coaxial with and communicates with the second through hole 104a. A second step 26 is formed between the sidewall of the first portion 23 corresponding to the second through hole 104a and the sidewall of the second portion 24 corresponding to the fourth through hole 25. The second portion 52 of the grounding pad 5a is located in the fourth through hole 25, and the second portion 52 abuts against the second step portion 26, so as to electrically connect the grounding pad 5a and the second circuit board 22. The first portion 51 of the grounding pad 5a is located in the second through hole 104a corresponding to the first portion 23, and the first portion 51 is located between the first connecting piece 6a and the second connecting piece 7a, and the circuit board assembly 2a is stably grounded through connection of the first connecting piece 6a and the second connecting piece 7a.

Referring to fig. 3 again, the second connecting piece 7a includes a second connecting portion 71a and a second engaging portion 73a, wherein the second connecting portion 71a extends into the first connecting portion 61a to connect with the first connecting portion 61 a. The second engagement portion 73a is located in the second through hole 104a and abuts against the first portion 51 of the grounding pad 5 a.

In some embodiments, the first connection portion 61a of the first connection member 6a is provided with an internal thread, the second connection portion 71a of the second connection member 7a is provided with an external thread, and the first connection portion 61a and the second connection portion 71a may be connected by threads. In some embodiments, the first connecting piece 6a may be a spot-welded riveting nut or a spot-welded nut, the second connecting piece 7a may be a screw, and the cooperation of the spot-welded nut and the screw may implement locking between the structural members with a smaller thickness, which is beneficial to reducing the thickness of the connecting structure 200.

According to the connecting structure 200 provided by the embodiment of the utility model, through the matched connection of the first connecting piece 6a and the second connecting piece 7a, the locking attachment of the first structural component 1a and the circuit board component 2a can be realized; by adding the grounding pad 5a, the grounding requirement of the circuit board assembly 2a can be simultaneously realized, which is beneficial to reducing the occupied space of the connecting structure 200 and further beneficial to realizing the light weight and the miniaturization of the electronic equipment.

Referring to fig. 5, an embodiment of the present utility model further provides an electronic device 300. The electronic device 300 may be, for example, a terminal consumer product or a 3C electronic product (computer), a communication, a consumer (consumer) electronic product, for example, a mobile phone, a mobile power supply, a portable device, a tablet computer, an electronic reader, a notebook computer, a digital camera, a wearable device, a vehicle-mounted terminal, a headset, and the like. The electronic device 300 may, in turn, be a mobile device, for example. The moving device may be, for example, a vehicle, an electric skateboard, an electric bicycle, or the like.

The electronic device 300 to which the connection structure 100 provided in the foregoing embodiment is applied may be a folding electronic device, for example, a folding mobile phone. The folding electronic device is small in size, and space in structural design is more intense, and the adoption of the connecting structure 100 can effectively connect with the ground while locking various structural members, so that space is saved in multiple directions, meanwhile, the wall thickness of the middle frame is increased, and the integral structure of the electronic device 300 is stabilized.

In addition, the electronic device 300 to which the connection structure 200 provided in the foregoing embodiment is applied may be a bar electronic device, such as a bar mobile phone. The adoption of the connecting structure 200 can lock various structural members and effectively connect with the ground, and the thickness of the connecting structure 200 can be further reduced, so that the space occupied in the thickness direction of the electronic equipment 300 is saved.

It should be noted that the above is only a specific embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present utility model, and the changes or substitutions are covered by the scope of the present utility model; the embodiments of the present utility model and features in the embodiments may be combined with each other without conflict. Therefore, the protection scope of the utility model is subject to the protection scope of the claims.

Claims (14)

1. A connection structure, characterized by comprising:

the circuit board comprises a first structural component and a circuit board component which are arranged in a stacked manner, wherein the surface of the first structural component, which is away from the circuit board component, forms a first surface, the surface of the circuit board component, which is away from the first structural component, forms a second surface, the circuit board component comprises a first part and a second part which are connected, a first through hole is formed through the first part, a second through hole is formed through the second part and the circuit board component, the first through hole and the second through hole are coaxial and are communicated with each other, the aperture of the second through hole is larger than that of the first through hole, and the direction from the first surface to the second surface is defined as the first direction;

the first connecting piece stretches into the first through hole;

the second connecting piece stretches into the second through hole, and the first connecting piece is connected with the second connecting piece to lock and attach the first structural component and the circuit board component;

the connecting structure further comprises a grounding gasket, the grounding gasket is located on the surface, close to the circuit board assembly, of the first structural assembly, the second connecting piece penetrates through the grounding gasket, the grounding gasket is electrically connected with the circuit board assembly and is in contact with the first structural assembly, and therefore the circuit board assembly is grounded through the first structural assembly.

2. The connection structure according to claim 1, wherein the first structural component includes a middle frame and a first structural member stacked, the middle frame is disposed near the circuit board component, the first structural member is disposed away from the circuit board component, a surface of the first structural member away from the middle frame forms the first surface, a portion of the middle frame corresponding to the first through hole forms the first portion, and a portion of the middle frame corresponding to the second through hole forms the second portion.

3. The connection structure according to claim 2, wherein a size of the second portion located at the periphery of the second through hole is larger than a size of the first portion located at the periphery of the first through hole in a second direction perpendicular to the first direction.

4. A connection according to claim 3, wherein in the first direction, the total thickness of the middle frame is L and the thickness of the second portion is L1, the following is satisfied: l1 is less than or equal to 1/4L and less than or equal to 1/2L.

5. The connection according to claim 1, wherein the second connector has an outer diameter smaller than an inner diameter of the first connector, and the second connector extends into the first connector to be screwed with the second connector.

6. The connection of claim 5, wherein the first connection is a spot weld nut and the second connection is a screw.

7. The connection structure of claim 5, wherein the first connection member is a spot welded rivet nut and the second connection member is a screw.

8. The connection according to claim 1, wherein a surface of the first connector facing away from the second connector is flush with the first surface and a surface of the second connector facing away from the first connector is flush with the second surface.

9. The connection structure of claim 1, wherein the circuit board assembly includes a second structural member and a circuit board that are stacked, the circuit board is disposed adjacent to the first structural member, the second structural member is disposed away from the first structural member, the second structural member includes a second structural member body and a reinforcing sheet embedded in the second structural member body, and the reinforcing sheet is located at a periphery of the second through hole.

10. A connection structure, characterized by comprising:

the circuit board comprises a first structure component and a circuit board component which are arranged in a stacked manner, wherein a first through hole is formed through the first structure component, a second through hole is formed through the circuit board component, the first through hole and the second through hole are coaxial and communicated with each other, and the aperture of the second through hole is larger than that of the first through hole;

the first connecting piece stretches into the first through hole;

the second connecting piece stretches into the second through hole, and the first connecting piece is connected with the second connecting piece to lock and attach the first structural component and the circuit board component;

the connecting structure further comprises a grounding gasket, the grounding gasket is contacted with the end face, close to the circuit board assembly, of the first connecting piece, the second connecting piece penetrates through the grounding gasket, and the grounding gasket is electrically connected with the circuit board assembly, so that the circuit board assembly is grounded through the first connecting piece and the first structural assembly.

11. The connection structure of claim 10, wherein the ground pad includes a first portion located within the second through hole and a second portion located on a surface of the circuit board assembly, the first portion and the second portion being connected to each other, the second portion being for electrical connection with the circuit board assembly, the first portion being for abutment with the first connector;

the second connecting piece comprises a second connecting portion and a second clamping portion which are connected with each other, the second connecting portion stretches into the first through hole, the second clamping portion is located in the second through hole, and the first portion is located between the second clamping portion and the first connecting piece.

12. The connection structure of claim 11, wherein the first structural component comprises a first structural member body and a metal sheet embedded in the first structural member body, the first through hole further extending through the metal sheet, the first connection member being in contact with the metal sheet.

13. The connection structure of claim 11, wherein the circuit board assembly comprises a first circuit board and a second circuit board stacked together, the first circuit board being disposed adjacent to the first structure assembly, the first circuit board being bonded to the second circuit board by a glue layer.

14. An electronic device comprising a connection structure as claimed in any one of claims 1 to 13.