CN220156721U - Connection structures and electronic equipment - Google Patents

Abstract

The utility model provides a connecting structure and electronic equipment, wherein the connecting structure comprises a first structural component, a circuit board component, a first connecting piece, a second connecting piece and a grounding gasket, the first structural component comprises a first part and a second part which are connected, a first through hole is formed through the first part, a second through hole is formed through the second part and the circuit board component, and the aperture of the second through hole is larger than that of the first through hole; the first connecting piece stretches into the first through hole, and the second connecting piece stretches into the second through hole and is connected with the first structural member to lock and attach the first structural member, the circuit board member and the grounding gasket; the grounding gasket is contacted with the first structural component and is electrically connected with the circuit board component, so that the circuit board component is grounded. The connection structure provided by the utility model can realize multi-layer connection in structure, and simultaneously provides a brand-new grounding scheme, thereby being beneficial to realizing miniaturization and light weight of electronic equipment.

Description

Connection structures and electronic equipment

Technical field

The present application relates to the technical field of electronic equipment, and in particular, to a connection structure and an electronic equipment using the connection structure.

Background technique

As people pursue electronic products with multiple functions, portability, compactness and thinness, existing electronic products (such as mobile phones, tablets, laptops, e-readers, digital cameras and wearable devices, etc.) are becoming more and more thin and light. development trend of miniaturization, miniaturization and multi-functionality.

In the structural design of existing electronic products, an increasing number of functional parts need to be connected. However, the existing connection method of functional parts takes up a lot of space, the connection strength of multi-layer functional parts is low, and the connections are easy to break; moreover, a separate grounding space needs to be reserved for the grounding of functional parts, which further increases the space occupied. Therefore, how to package more and more functional parts in a small space has become a major difficulty in the structural design of existing electronic products.

Utility model content

In view of this, in order to solve at least one of the above defects, embodiments of the present application provide a connection structure and an electronic device using the connection structure. The connection structure can realize direct locking of multi-layer structural parts, save space, and have It is beneficial to improve the utilization rate of the internal space of electronic equipment; and the connection structure can directly realize grounding, without the need to separately set up a grounding function piece, and does not need to reserve a separate grounding space, which is conducive to further reducing the volume of the connection structure and reducing the space occupied by the connection structure.

The first aspect of the embodiment of the present application provides a connection structure, including:

A first structural component and a circuit board component are stacked, the surface of the first structural component facing away from the circuit board component forms a first surface, and the surface of the circuit board component facing away from the first structural component forms a second surface, Along the first direction, the first structural component includes a first part and a second part connected, a first through hole is formed through the first part, and a second through hole is formed through the second part and the circuit board assembly. through hole, and the first through hole and the second through hole are coaxial and connected with each other, and the diameter of the second through hole is larger than the diameter of the first through hole, defined from the first surface to The direction of the second surface is the first direction;

A first connecting piece, the first connecting piece extends into the first through hole;

A second connecting piece extends into the second through hole, and the first connecting piece is connected to the second connecting piece to lock the first structural component and the circuit board component. ;

The connection structure also includes a ground pad, the ground pad is located on a surface of the first structural component close to the circuit board assembly, and the second connection member penetrates the ground pad, wherein the ground pad The piece is electrically connected to the circuit board component and contacts the first structural component, so that the circuit board component is grounded through the first structural component.

By using the cooperation of the first connector and the second connector to realize the locking of the multi-layer structure, the architectural method saves structural design space; moreover, by adding a grounding pad between the circuit board component and the first structural component, the While realizing multi-layer connections on the structure, it also provides a new grounding scheme, which avoids the need for extra space to set up a grounding structure, which is conducive to the miniaturization and thinning of electronic equipment. In addition, arranging the first connecting member not to completely penetrate the first structural component can improve the strength of the first structural component at the connection point, and also improve the grounding stability of the grounding pad and the first structural component.

In connection with the first aspect, in some possible embodiments, the first structural component includes a stacked middle frame and a first structural member, the middle frame is disposed close to the circuit board assembly, and the first structural member is away from the circuit board. The assembly is configured, the surface of the first structural member facing away from the middle frame constitutes the first surface, the part of the middle frame corresponding to the first through hole constitutes the first part, the middle frame corresponds to the A portion of the second through hole constitutes the second portion.

According to the application of the connecting structure in different parts of the electronic device, the first structural component can have different structures and functions. In this embodiment, the middle frame and the circuit board assembly are locked through the first connector and the second connector. The circuit board component is grounded through contact between the grounding pad and the middle frame. The architecture saves structural design space and is conducive to miniaturization and thinning of electronic equipment.

In conjunction with the first aspect, in some possible embodiments, along a second direction perpendicular to the first direction, the size of the second portion located at the periphery of the second through hole is larger than that at the periphery of the first through hole. the dimensions of the first part.

By designing the wall thickness of the second part located at the periphery of the second through hole to be larger, the first connecting member does not penetrate the entire middle frame, so that the surface of the second part away from the first part has a larger area. On the one hand, It can improve the strength of the connection structure at the connection point and reduce the risk of accidental breakage of the connection point; on the other hand, it can increase the contact area between the second part and the grounding pad, thereby improving the grounding stability of the grounding pad.

Combined with the first aspect, in some possible embodiments, along the first direction, the total thickness of the middle frame is set to L, and the thickness of the second part is set to L1, then it satisfies: 1/4L≤L1 ≤1/2L.

By setting the thickness of the second part to satisfy the above relationship, the firmness of the connection between the first connecting piece and the middle frame can be ensured, and it can also ensure that the second part has sufficient wall thickness to improve the strength of the middle frame at the connection. In addition, , also ensure that the second part has sufficient contact area with the ground pad to improve ground stability.

In conjunction with the first aspect, in some possible embodiments, the outer diameter of the second connecting member is smaller than the inner diameter of the first connecting member, and the second connecting member extends into the first connecting member and is in contact with the first connecting member. The second connecting piece is threaded. Specifically, the first connecting member is a spot welding nut or a spot welding riveting nut, and the second connecting member is a screw.

By spot welding riveting nuts or the combination of spot welding nuts and screws, multi-layer structural parts can be effectively locked, improving the connection stability of the connection structure, and at the same time helping to reduce the thickness of the connection structure.

In conjunction with the first aspect, in some possible embodiments, the surface of the first connecting piece facing away from the second connecting piece is flush with the first surface, and the second connecting piece faces away from the first connecting piece. The surface is flush with the second surface.

By arranging the surfaces of the first connecting piece and the second connecting piece to be flush with the first surface and the second surface respectively, the smoothness of the appearance of the connecting structure is improved, and at the same time it is beneficial to reduce the thickness of the connecting structure.

In conjunction with the first aspect, in some possible embodiments, the circuit board assembly includes a stacked second structural member and a circuit board, the circuit board is disposed close to the first structural assembly, and the second structural member is away from The first structural component is configured, and the second structural member includes a second structural member body and a reinforcing piece embedded in the second structural member body, and the reinforcing piece is located between the second through hole and Periphery.

By adding reinforcing pieces in the body of the second structural member around the edge of the second through hole, the strength of the connection structure at the opening can be increased and the risk of accidental breakage of the connection structure at the connection point can be reduced.

The second aspect of the embodiment of the present application provides another connection structure, including:

A first structural component and a circuit board component are stacked, a first through hole is formed through the first structural component, a second through hole is formed through the circuit board component, and the first through hole and the The second through holes are coaxial and connected with each other, and the aperture of the second through hole is larger than the aperture of the first through hole;

A first connecting piece, the first connecting piece extends into the first through hole;

A second connecting piece extends into the second through hole, and the first connecting piece is connected to the second connecting piece to lock the first structural component and the circuit board component. ;

The connection structure also includes a ground pad, the ground pad is in contact with the end surface of the first connector close to the circuit board assembly, and the second connector penetrates the ground pad, wherein the ground pad The gasket is electrically connected to the circuit board assembly, so that the circuit board assembly is grounded through the first connector and the first structural component.

By using the cooperation of the first connector and the second connector to realize the locking of the multi-layer structure, the architectural method saves structural design space; furthermore, by setting the ground pad in the second through hole, and allowing the ground pad to pass through the second through hole. The locking of the first connecting piece and the second connecting piece can not only achieve multi-layer connection in the structure, but also provide a new grounding solution, avoiding the need for extra space to set up a grounding structure, which is conducive to the miniaturization and thinning of electronic equipment.

In conjunction with the second aspect, in some possible embodiments, the ground pad includes a first portion located within the second through hole and a second portion located on the surface of the circuit board assembly, and the first portion The second part is connected to each other, the second part is used to electrically connect with the circuit board assembly, the first part is used to abut with the first connecting member; the second connecting member includes A second connecting part and a second engaging part are connected to each other, the second connecting part extends into the first through hole, the second engaging part is located in the second through hole, and the first The portion is located between the second engaging portion and the first connecting piece.

Through the structural design of the second connector and the ground pad, the circuit board assembly can be electrically connected to the first structural component through the ground pad and the first connector, thereby achieving stable grounding.

In conjunction with the second aspect, in some possible embodiments, the first structural component includes a first structural member body and a metal sheet embedded in the first structural member body, and the first through hole also penetrates The metal piece, the first connecting piece is in contact with the metal piece.

By burying a metal sheet in the body of the first structural member and bringing the metal sheet into contact with the first connector, it is easy to realize the grounding of the circuit board assembly; in addition, by adding a metal sheet around the edge of the first through hole, the opening can also be improved. The strength of the connection structure at the hole reduces the risk of accidental breakage.

In conjunction with the second aspect, in some possible embodiments, the circuit board assembly includes a first circuit board and a second circuit board arranged in a stack, the first circuit board is arranged close to the first structural component, and the third circuit board A circuit board and the second circuit board are bonded through an adhesive layer.

The multi-layer circuit board and the first structural component can be directly locked through the first connector and the second connector, which can effectively reduce the thickness of the connection structure.

The third aspect of the embodiment of the present application provides an electronic device, which includes the connection structure described in the first and second aspects of the embodiment of the present application.

Adopting the connection structures described in the first aspect and the second aspect of the embodiments of the present application is beneficial to reducing the space occupied by the connection structure, improving the space utilization rate of the electronic device, and thereby being beneficial to the thinning and miniaturization of the electronic device.

Description of the drawings

Figure 1 is a schematic structural diagram of a connection structure provided by an embodiment of the present application.

Figure 2 is a schematic structural diagram of the application scenario of the connection structure in Figure 1.

Figure 3 is a schematic structural diagram of a connection structure provided by another embodiment of the present application.

Figure 4 is a schematic structural diagram of the application scenario of the connection structure in Figure 3.

FIG. 5 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.

Description of main component symbols

Connection structure 100,200

First structural component 1,1a

First surface 101,101a

Second surface 102,102a

First through hole 103,103a

Second through hole 104,104a

Part 1 11,23

Part 2 12,24

First step 13,17a

Third through hole 14,15a

Second step 15,26

First structural member body 11a

metal sheet 13a

middle frame 3

First structural member 4

Ground pad 5,5a

Part 1 51

Part 2 52

First connection piece 6,6a

First connection part 61,61a

First engaging part 63,63a

Second connection piece 7,7a

Second connection part 71,71a

Second engagement part 73,73a

Circuit board assembly 2,2a

Second structural member 8

Second structural member body 81

Reinforcement film 83

Fourth through hole 85,25

The third step 87

circuit board 9

First circuit board 21

Second circuit board 22

Electronic equipment 300

first direction a

Second direction b

Detailed ways

The embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.

The terminology used in the following examples is for the purpose of describing specific embodiments only and is not intended to limit the application. As used in the specification and appended claims of this application, the singular expressions "a", "an", "said", "above", "the" and "the" are intended to also Expressions such as "one or more" are included unless the context clearly indicates otherwise.

Reference in this specification to "one embodiment" or "some embodiments" or the like means that a particular feature, structure or characteristic described in connection with the embodiment is included in one or more embodiments of the application. Therefore, the phrases "in one embodiment", "in some embodiments", "in other embodiments", "in other embodiments", etc. appearing in different places in this specification are not necessarily References are made to the same embodiment, but rather to "one or more but not all embodiments" unless specifically stated otherwise. The terms “including,” “includes,” “having,” and variations thereof all mean “including but not limited to,” unless otherwise specifically emphasized.

Due to the structural design of existing electronic products, the connection method of multi-layer functional parts takes up a large space, the connection strength is low, and the connections are easy to break; moreover, the grounding of functional parts requires a separate grounding space, which further increases the Occupation of space.

To this end, embodiments of the present application provide a connection structure that can be applied to electronic devices, including but not limited to mobile phones, mobile power supplies, portable machines, tablet computers, e-readers, notebook computers, Digital cameras, wearable devices, vehicle-mounted terminals and other terminal equipment. This connection structure can realize the locking connection of multi-layer structural parts, saving space and making the connection more stable. Moreover, this connection structure can meet the grounding requirement at the same time, without occupying a separate space to set up a grounding structure, which further saves space and is beneficial to electronics. Thinness and miniaturization of equipment.

The embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.

Example 1

Please refer to Figure 1. An embodiment of the present application provides a connection structure 100. The connection structure 100 includes a first structural component 1 and a circuit board component 2 stacked in sequence. The first structural component 1 is away from the circuit board component. The surface of 2 constitutes the first surface 101, and the surface of the circuit board component 2 facing away from the first structural component 1 constitutes the second surface 102. Along the first direction a (the direction from the first surface 101 to the second surface 102 is defined as the first direction a), the first structural component 1 includes a connected first part 11 and a second part 12 . A first through hole 103 is formed through the first part 11 , a second through hole 104 is formed through the second part 12 and the circuit board assembly 2 , and the first through hole 103 and the second The through holes 104 are coaxial and connected with each other, and the diameter of the second through hole 104 is larger than the diameter of the first through hole 103 . The connection structure 100 also includes a first connection member 6 and a second connection member 7. The first connection member 6 extends into the first through hole 103 from one side of the first surface 101, and the second connection member 7 7 extends into the second through hole 104 from one side of the second surface 102, and the first connecting member 6 is connected to the second connecting member 7 to lock the first structural component 1 and the Circuit board assembly 2.

The connection structure 100 further includes a ground pad 5 , which is located on a surface of the first structural component 1 close to the circuit board component 2 . The second connecting member 7 also penetrates the ground pad 5 . The grounding pad 5 is electrically connected to the circuit board assembly 2 and in contact with the first structural component 1 to achieve stable grounding of the circuit board assembly 2 .

Please refer to FIG. 1 and FIG. 2 together. Depending on the specific position of the connection structure 100 in the electronic device, the first structural component 1 may have different structures and functions. In some embodiments, the first structural component 1 includes a stacked middle frame 3 and a first structural member 4. The middle frame 3 is disposed close to the circuit board assembly 2, and the first structural member 4 is disposed away from the circuit board assembly 2. The third structural member 4 is disposed away from the circuit board assembly 2. The surface of a structural member 4 facing away from the middle frame 3 constitutes the first surface 101 . The part of the middle frame 3 corresponding to the first through hole 103 forms the first part 11 , and the part of the middle frame 3 corresponding to the second through hole 104 forms the second part 12 . As shown in Figure 2, a specific application scenario of the connection structure 100 is shown.

In some embodiments, in the middle frame 3 , between the side wall of the first part 11 corresponding to the first through hole 103 and the side wall of the second part 12 corresponding to the second through hole 104 A first step portion 13 is formed, the end surface of the first connector 6 close to the circuit board assembly 2 is in contact with the first step portion 13 , and the ground pad 5 and the second part 12 are away from the first part 11 surface contact. Along the second direction b (the radial direction of the first through hole 103 is defined as the second direction b), the size of the second part 12 of the periphery of the second through hole 104 is larger than the size of the first part 11 of the periphery of the first through hole 103 . By designing the wall thickness of the second part 12 located around the second through hole 104 to be larger, the first connecting member 6 does not penetrate the entire middle frame 3 , so that the second part 12 is away from the first step part 13 The surface has a larger area. On the one hand, the strength of the connection structure 100 at the connection can be improved and the risk of accidental breakage of the connection can be reduced. On the other hand, the contact area between the second part 12 and the grounding pad 5 can be increased, thereby improving the Grounding stability of grounding pad 5.

In some embodiments, along the first direction a, the total thickness of the middle frame 3 is set to L, and the thickness of the second part 12 is set to L1, then: 1/4L≤L1≤1/2L . By setting the thickness of the second part 12 to satisfy the above relationship, the firmness of the connection between the first connecting member 6 and the middle frame 3 can be ensured, and it can also be ensured that the second part 12 has sufficient wall thickness to improve the connection between the middle frame 3 In addition, it also ensures that the second part 12 has sufficient contact area with the grounding pad 5 to improve grounding stability.

As shown in Figure 2, in some embodiments, the first structural member 4 can be the bottom metal sheet of the middle frame 3, which mainly plays a role of support and reinforcement. It can improve the strength of the connection structure 100 at the connection point and reduce the weight of the middle frame. 3Risk of accidental breakage at the connection.

As shown in Figure 1, in some embodiments, the first structural component 1 also has a third through hole 14. The third through hole 14 is located outside the first through hole 103 and is coaxial and connected with the first through hole 103. set up. A second step portion 15 is formed between the side wall corresponding to the third through hole 14 and the side wall corresponding to the first through hole 103 . The first connecting member 6 includes a first connecting portion 61 extending into the first through hole 103 and a first engaging portion 63 located in the third through hole 14 . The surface of the first engaging portion 63 close to the first connecting portion 61 is in contact with the second step portion 15 to limit the position of the first connecting member 6 . In some embodiments, the surface of the first engaging portion 63 away from the first connecting portion 61 is flush with the first surface 101 , thereby improving the smoothness of the appearance of the connecting structure 100 and at the same time helping to reduce the size of the connecting structure 100 thickness of.

Please refer to Figure 1 and Figure 2 together. The circuit board assembly 2 includes a stacked second structural member 8 and a circuit board 9. The circuit board 9 is disposed close to the first structural component 1, and the second structural member 8 is away from the first structural component 1. Structural component 1 settings. In some embodiments, when the connection structure 100 is applied to a mobile phone, the circuit board 9 may be a small board in the mobile phone, and the second structural member 8 may be a small board bracket.

In some embodiments, the second structural member 8 includes a second structural member body 81 and a reinforcing piece 83 embedded in the second structural member body 81 , wherein the reinforcing piece 83 is located in the second passage. At the periphery of the hole 104, by adding reinforcing pieces 83 in the second structural member body 81 at the periphery of the second through hole 104, the strength of the connection structure 100 at the opening can be increased and the risk of accidental breakage can be reduced.

In some embodiments, the second structural member body 81 may be made of plastic, and the reinforcing sheet 83 may be a metal sheet, specifically a steel sheet. The reinforcing piece 83 can be embedded in the second structural member body 81 through an in-mold injection molding process.

The second structural member body 81 is provided with a fourth through hole 85 , wherein the fourth through hole 85 is sleeved on the outside of the second through hole 104 , and is coaxially and connected with the second through hole 104 . A third step portion 87 is formed between the side wall of the second structural member body 81 corresponding to the fourth through hole 85 and the side wall of the second structural member body 81 corresponding to the second through hole 104 . The second connecting member 7 includes a second connecting portion 71 extending into the second through hole 104 and a second engaging portion 73 located in the fourth through hole 85 , wherein the second engaging portion 73 is close to the The surface of the second connecting portion 71 is in contact with the third step portion 87 , thereby limiting the position of the second connecting member 7 . In some embodiments, the surface of the second engaging portion 73 away from the second connecting portion 71 is flush with the second surface 102 , thereby improving the smoothness of the appearance of the connecting structure 100 and at the same time helping to reduce the size of the connecting structure 100 thickness of. In some embodiments, the reinforcing piece 83 extends into the third step portion 87 . Due to the presence of the fourth through hole 85 , the thickness of the third step portion 87 becomes thinner, so that the third step portion 87 may exist. By extending the reinforcing piece 83 to the third step portion 87 , the strength of the third step portion 87 is improved.

Please refer to FIG. 1 and FIG. 2 together. In some embodiments, the first connecting part 61 of the first connecting part 6 may be a hollow columnar structure, and the second connecting part 71 of the second connecting part 7 It may be columnar, and the outer diameter of the second connecting part 71 is smaller than the inner diameter of the first connecting part 61 . The second connecting part 71 extends into the first connecting part 61 to be connected with the first connecting part 61 .

In some embodiments, the first connecting member 6 may be a nut, and the second connecting member 7 may be a screw. The first connection part 61 is provided with internal threads, and the second connection part 71 is provided with external threads. The first connection part 61 and the second connection part 71 are connected through threads. In some embodiments, the first connector 6 may be a spot welding riveting nut or a spot welding nut. Through the cooperation of the spot welding riveting nut and screws, the multi-layer structural parts can be effectively locked, thereby improving the performance of the connection structure 100 . The connection stability is improved and the thickness of the connection structure 100 is reduced.

The connection structure 100 provided by the embodiment of the present application realizes the locking of the multi-layer structure by using the cooperation of the first connector 6 and the second connector 7, and the architectural method saves structural design space; moreover, by connecting the circuit board assembly 2 and the third Adding a grounding pad 5 between the structural components 1 (specifically, the middle frame 3) can not only achieve multi-layer connection on the structure, but also provide a new grounding scheme, avoid additional space occupied and set up a grounding structure, and is conducive to the realization of electronic Miniaturization and thinning of equipment. In addition, arranging the first connecting member 6 so as not to completely penetrate the first structural component 1 (specifically, the middle frame 3) can improve the strength of the first structural component 1 (specifically, the middle frame 3) at the connection point, while also improving the The grounding stability of the grounding pad 5 and the middle frame 3.

Example 2

Referring to Figures 3 and 4, an embodiment of the present application also provides a connection structure 200. The connection structure 200 includes a first structural component 1a and a circuit board component 2a stacked in sequence. The surface of the first structural component 1a facing away from the circuit board component 2a forms a first surface 101a, and the surface of the circuit board component 2a facing away from the first structural component 1a forms a second surface 102a. The connection structure 200 further includes a first through hole 103a penetrating the first structural component 1a and a second through hole 104a penetrating the circuit board assembly 2a. The first through hole 103a and the second through hole 104a are coaxial and connected with each other, and the diameter of the second through hole 104a is larger than the diameter of the first through hole 103a. The connection structure 200 also includes a first connection part 6a and a second connection part 7a. The first connection part 6a extends into the first through hole 103a from one side of the first surface 101a. The second connection part 7a 7a extends into the second through hole 104a from one side of the second surface 102a, and the first connector 6a is connected to the second connector 7a to lock the first structural component 1a and the circuit board component 2a .

The connection structure 200 further includes a grounding pad 5a, which is in contact with the end surface of the first connecting member 6a close to the circuit board assembly 2a. The second connecting member 7a penetrates the ground pad 5a and is connected to the first connecting member 6a. The grounding pad 5a is electrically connected to the circuit board assembly 2a, so that the circuit board assembly 2a can be stably grounded through the first connector 6a and the first structural component 1a.

The ground pad 5a includes a first part 51 located in the second through hole 104a and a second part 52 located on the second surface 102a. The first part 51 and the second part 52 are connected to each other. . The second part 52 is used to achieve electrical connection with the circuit board assembly 2a. The first part 51 is used to achieve contact with the first connector 6a. The first connector 6a further It is in contact with the first structural component 1a, thereby achieving the grounding of the circuit board component 2a.

As shown in FIG. 4 , depending on the specific location of the connection structure 200 in the electronic device, the first structural component 1 a may be a casing of the electronic device, such as a casing of a mobile phone.

The first structural component 1a includes a first structural member body 11a and a metal sheet 13a embedded in the first structural member body 11a. The first through hole 103a also penetrates the metal sheet 13a, and the first connecting member 6a and The metal pieces 13a are in contact, thereby achieving grounding of the circuit board assembly 2a. In addition, by adding a metal sheet 13a around the first through hole 103a, the strength of the connection structure 200 at the opening can also be improved and the risk of accidental breakage can be reduced.

In some embodiments, the material of the first structural member body 11a may be plastic, and the metal sheet 13a may be specifically a steel sheet. The metal sheet 13a can be embedded in the first structural member body 11a through an in-mold injection molding process.

The first structural member body 11a is provided with a third through hole 15a, wherein the third through hole 15a is sleeved on the outside of the first through hole 103a, and is coaxially and connected with the first through hole 103a. A first step portion 17a is formed between the side wall of the first structural member body 11a corresponding to the third through hole 15a and the side wall of the first structural member body 11a corresponding to the first through hole 103a. The first connecting member 6a includes a first connecting portion 61a extending into the first through hole 103a and a first engaging portion 63a located in the third through hole 15a, wherein the first engaging portion 63a is close to the The surface of the first connecting portion 61a is in contact with the first step portion 17a, thereby limiting the position of the first connecting member 6a. In some embodiments, the surface of the first engaging portion 63a facing away from the first connecting portion 61a is flush with the first surface 101a, thereby improving the smoothness of the appearance of the connecting structure 200 and conducive to reducing the size of the connecting structure 200. thickness of. In some embodiments, the metal sheet 13a extends into the first step portion 17a. Due to the presence of the third through hole 15a, the thickness of the first step portion 17a becomes thinner, so that there may be a gap between the first step portion 17a and the first step portion 17a. By extending the metal sheet 13a to the first step portion 17a, the strength of the first step portion 17a is improved. In addition, by extending the metal piece 13a to the first step portion 17a, the metal piece 13a is conveniently exposed in the first through hole 103a, and then contacts the second connector 7a.

Please refer to Figure 3 again. The circuit board assembly 2a includes a stacked first circuit board 21 and a second circuit board 22. The first circuit board 21 is disposed close to the first structural component 1a, and the second circuit board 22 is away from the first circuit board 21. The surface constitutes the second surface 102a. In some embodiments, the first circuit board 21 and the second circuit board 22 are bonded through an adhesive layer. In some embodiments, the first circuit board 21 is a flexible printed circuit (FPC), and the second circuit board 22 may be a printed circuit board (PCB).

Along the first direction a (the direction from the first surface 101a to the second surface 102a is defined as the first direction a), the second circuit board 22 includes a first part 23 and a second part 24 that are connected, wherein the first part 23 is close to the first part 23 and the second part 24 . A circuit board 21 is provided, the second part 24 has a fourth through hole 25, the fourth through hole 25 is sleeved on the outside of the second through hole 104a, and the fourth through hole 25 is connected to the fourth through hole 25. The second through holes 104a are coaxial and connected. A second step portion 26 is formed between the side wall of the first portion 23 corresponding to the second through hole 104 a and the side wall of the second portion 24 corresponding to the fourth through hole 25 . The second portion 52 of the ground pad 5 a is located in the fourth through hole 25 , and the second portion 52 is in contact with the second step portion 26 to achieve electrical connection between the ground pad 5 a and the second circuit board 22 . The first part 51 of the ground pad 5a is located in the second through hole 104a corresponding to the first part 23, and the first part 51 is located between the first connecting member 6a and the second connecting member 7a, and passes through the first connecting member 6a. The connection between the connecting piece 6a and the second connecting piece 7a realizes stable grounding of the circuit board assembly 2a.

Please refer to FIG. 3 again. The second connecting part 7a includes a connected second connecting part 71a and a second engaging part 73a. The second connecting part 71a extends into the first connecting part 61a and connects with the first connecting part 71a. The connection part 61a is connected. The second engaging portion 73a is located in the second through hole 104a and contacts the first portion 51 of the ground pad 5a.

In some embodiments, the first connecting part 61a of the first connecting part 6a is provided with internal threads, and the second connecting part 71a of the second connecting part 7a is provided with external threads. The first connecting part 61a and the second connecting part 71a can be Through threaded connection. In some embodiments, the first connecting member 6a can be a spot welding riveting nut or a spot welding nut, and the second connecting member 7a can be a screw. The cooperation between the spot welding nut and the screw can achieve locking between thin structural members. Attached, it is beneficial to reduce the thickness of the connection structure 200.

The connection structure 200 provided in the embodiment of the present application can realize the locking of the first structural component 1a and the circuit board component 2a through the mating connection of the first connector 6a and the second connector 7a; by adding the grounding pad 5a, it can At the same time, realizing the grounding requirement of the circuit board assembly 2a is conducive to reducing the space occupied by the connection structure 200, which is conducive to realizing the thinning and miniaturization of electronic equipment.

Referring to Figure 5, an embodiment of the present application also provides an electronic device 300. The electronic device 300 may be, for example, a terminal consumer product or a 3C electronic product (computer, communication, consumer electronic product), and may be, for example, a mobile phone, a mobile power supply, a portable machine, a tablet computer, or an electronic product. Readers, laptops, digital cameras, wearable devices, vehicle-mounted terminals, and headsets and other devices. The electronic device 300 may also be a mobile device. The mobile device may be a vehicle, an electric skateboard, an electric bicycle, etc., for example.

The electronic device 300 applying the connection structure 100 provided by the foregoing embodiments may be a foldable electronic device, such as a foldable mobile phone. Due to the small size of foldable electronic devices, the space in structural design is even tighter. Using the aforementioned connection structure 100 can effectively ground various structural parts while locking them, saving space in multiple directions, while increasing the wall thickness of the middle frame. Stabilize the overall structure of the electronic device 300.

In addition, the electronic device 300 applying the connection structure 200 provided by the foregoing embodiments may be a straight electronic device, such as a straight mobile phone. Using the aforementioned connection structure 200 can effectively ground various structural components while locking them, and can further reduce the thickness of the connection structure 200 and save the space occupied in the thickness direction of the electronic device 300 .

It should be noted that the above are only specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Any person familiar with the technical field can easily think of changes or replacements within the technical scope disclosed in the present application. , are all covered by the protection scope of this application; without conflict, the implementation modes and features in the implementation modes of this application can be combined with each other. Therefore, the protection scope of this application should be subject to the protection scope of the claims.

Claims (14)

1. A connection structure, characterized by comprising:

the circuit board comprises a first structural component and a circuit board component which are arranged in a stacked manner, wherein the surface of the first structural component, which is away from the circuit board component, forms a first surface, the surface of the circuit board component, which is away from the first structural component, forms a second surface, the circuit board component comprises a first part and a second part which are connected, a first through hole is formed through the first part, a second through hole is formed through the second part and the circuit board component, the first through hole and the second through hole are coaxial and are communicated with each other, the aperture of the second through hole is larger than that of the first through hole, and the direction from the first surface to the second surface is defined as the first direction;

the first connecting piece stretches into the first through hole;

the second connecting piece stretches into the second through hole, and the first connecting piece is connected with the second connecting piece to lock and attach the first structural component and the circuit board component;

the connecting structure further comprises a grounding gasket, the grounding gasket is located on the surface, close to the circuit board assembly, of the first structural assembly, the second connecting piece penetrates through the grounding gasket, the grounding gasket is electrically connected with the circuit board assembly and is in contact with the first structural assembly, and therefore the circuit board assembly is grounded through the first structural assembly.

2. The connection structure according to claim 1, wherein the first structural component includes a middle frame and a first structural member stacked, the middle frame is disposed near the circuit board component, the first structural member is disposed away from the circuit board component, a surface of the first structural member away from the middle frame forms the first surface, a portion of the middle frame corresponding to the first through hole forms the first portion, and a portion of the middle frame corresponding to the second through hole forms the second portion.

3. The connection structure according to claim 2, wherein a size of the second portion located at the periphery of the second through hole is larger than a size of the first portion located at the periphery of the first through hole in a second direction perpendicular to the first direction.

4. A connection according to claim 3, wherein in the first direction, the total thickness of the middle frame is L and the thickness of the second portion is L1, the following is satisfied: l1 is less than or equal to 1/4L and less than or equal to 1/2L.

5. The connection according to claim 1, wherein the second connector has an outer diameter smaller than an inner diameter of the first connector, and the second connector extends into the first connector to be screwed with the second connector.

6. The connection of claim 5, wherein the first connection is a spot weld nut and the second connection is a screw.

7. The connection structure of claim 5, wherein the first connection member is a spot welded rivet nut and the second connection member is a screw.

8. The connection according to claim 1, wherein a surface of the first connector facing away from the second connector is flush with the first surface and a surface of the second connector facing away from the first connector is flush with the second surface.

9. The connection structure of claim 1, wherein the circuit board assembly includes a second structural member and a circuit board that are stacked, the circuit board is disposed adjacent to the first structural member, the second structural member is disposed away from the first structural member, the second structural member includes a second structural member body and a reinforcing sheet embedded in the second structural member body, and the reinforcing sheet is located at a periphery of the second through hole.

10. A connection structure, characterized by comprising:

the circuit board comprises a first structure component and a circuit board component which are arranged in a stacked manner, wherein a first through hole is formed through the first structure component, a second through hole is formed through the circuit board component, the first through hole and the second through hole are coaxial and communicated with each other, and the aperture of the second through hole is larger than that of the first through hole;

the first connecting piece stretches into the first through hole;

the second connecting piece stretches into the second through hole, and the first connecting piece is connected with the second connecting piece to lock and attach the first structural component and the circuit board component;

the connecting structure further comprises a grounding gasket, the grounding gasket is contacted with the end face, close to the circuit board assembly, of the first connecting piece, the second connecting piece penetrates through the grounding gasket, and the grounding gasket is electrically connected with the circuit board assembly, so that the circuit board assembly is grounded through the first connecting piece and the first structural assembly.

11. The connection structure of claim 10, wherein the ground pad includes a first portion located within the second through hole and a second portion located on a surface of the circuit board assembly, the first portion and the second portion being connected to each other, the second portion being for electrical connection with the circuit board assembly, the first portion being for abutment with the first connector;

the second connecting piece comprises a second connecting portion and a second clamping portion which are connected with each other, the second connecting portion stretches into the first through hole, the second clamping portion is located in the second through hole, and the first portion is located between the second clamping portion and the first connecting piece.

12. The connection structure of claim 11, wherein the first structural component comprises a first structural member body and a metal sheet embedded in the first structural member body, the first through hole further extending through the metal sheet, the first connection member being in contact with the metal sheet.

13. The connection structure of claim 11, wherein the circuit board assembly comprises a first circuit board and a second circuit board stacked together, the first circuit board being disposed adjacent to the first structure assembly, the first circuit board being bonded to the second circuit board by a glue layer.

14. An electronic device comprising a connection structure as claimed in any one of claims 1 to 13.