CN219477087U - USB device and electronic equipment - Google Patents

Abstract

The application provides a USB device and electronic equipment, this electronic equipment includes: a frame having an opening formed in a wall thereof; the USB device comprises a body and a pin unit, wherein an elastic sealing ring is arranged on one side, close to the pin unit, of the body; the USB device is mounted on the frame, the pin unit is located in the opening, and the elastic sealing ring and the wall of the opening form a seal. The Z-direction sealing can be provided in the opening hole for the USB device on the frame of the electronic equipment, so that the positioning structure of the frame and the USB device is simplified, the installation and the disassembly of the USB device are facilitated, and the electronic equipment is light and thin.

Description

USB device and electronic equipment

Technical Field

The application relates to the technical field of electronics, in particular to a USB device and electronic equipment.

Background

Electronic devices such as cell phones are typically configured with a USB (Universal Serial Bus (universal serial bus)) interface such as Type-C, through which the cell phone may be provided with functions such as charging, data transfer, etc. Since the USB interface needs to connect a device (e.g., a charger, a mobile phone, etc.) external to the apparatus and a device (e.g., a processor, a battery, etc.) internal to the apparatus, the USB interface portion (e.g., a pin portion) is located outside the electronic apparatus and the portion (e.g., a USB chip portion) is located inside the electronic apparatus, which results in that the USB interface must satisfy certain waterproof requirements for the electronic apparatus having a waterproof function. However, as the weight requirements of users on products are increased, the weight reduction of the products is more and more important, and the weight reduction of the whole machine presents higher challenges for realizing the waterproof function of the products.

Disclosure of Invention

In order to solve the technical problems, the application provides a USB device and electronic equipment. In the electronic equipment, the Z-direction sealing is provided in the opening for the USB device on the frame, so that the positioning structure of the frame and the USB device is simplified, the installation and the disassembly of the USB device are facilitated, and the electronic equipment is light and thin.

In a first aspect, the present application provides an electronic device, comprising: a frame having an opening formed in a wall thereof;

the USB device comprises a body and a pin unit, wherein an elastic sealing ring is arranged on one side, close to the pin unit, of the body;

the USB device is mounted on the frame, the pin unit is located in the opening, and the elastic sealing ring and the wall of the opening form a seal.

According to the first aspect, the elastic sealing ring is added on the USB device, when the USB device is mounted on the frame, the elastic sealing ring and the hole wall of the hole in the frame are extruded to form Z-direction sealing, so that the frame and the USB device do not need to be provided with positioning features and limiting features, the disassembly and the installation of the USB device are convenient, the structural complexity of the frame and the USB device is reduced, the space occupation is reduced, and the electronic equipment is light and thin.

According to a first aspect, or any implementation manner of the first aspect, the elastic sealing ring is formed on the body of the USB device by injection molding.

According to a first aspect, or any implementation manner of the first aspect, the elastic sealing ring is sleeved on the body of the USB device.

According to the first aspect, or any implementation manner of the first aspect, a first circuit board and a second circuit board are further mounted on the frame, and the USB device is disposed on the second circuit board.

According to the first aspect, or any implementation manner of the first aspect, a first circuit board and a second circuit board are further installed on the frame;

the USB device further comprises a flexible circuit board, wherein the body is fixedly connected with the flexible circuit board, and the flexible circuit board is connected with the first circuit board or the second circuit board.

According to a first aspect, or any implementation manner of the first aspect, the USB device further includes a stiffener, where the stiffener is disposed in a region where the flexible circuit board overlaps the body, and the flexible circuit board is located between the body and the stiffener.

In a second aspect, the present application provides a USB device comprising a body, and a pin unit coupled to the body;

the elastic sealing ring is arranged on one side of the body, which is close to the pin unit.

According to a second aspect, or any implementation manner of the second aspect, the elastic sealing ring is formed on the body of the USB device by injection molding.

According to a second aspect, or any implementation manner of the second aspect, the elastic sealing ring is sleeved on the body of the USB device.

According to a second aspect, or any implementation manner of the second aspect above, the method further includes: the flexible circuit board is fixedly connected with the body;

the stiffening plate is arranged in the overlapping area of the flexible circuit board and the body, and the flexible circuit board is positioned between the body and the stiffening plate.

Drawings

Fig. 1 is a schematic structural view of an electronic device exemplarily shown;

fig. 2 is a schematic structural view of a middle frame of an electronic device exemplarily shown;

FIG. 3 is a cross-sectional view of the middle frame of FIG. 2 taken along the direction A-A, shown schematically;

FIG. 4 is an enlarged partial cross-sectional view of an exemplary middle frame having a first waterproof structure in the direction A-A, with the USB interface in the installation process;

fig. 5 is an enlarged partial cross-sectional view of an exemplary middle frame having a second waterproof structure in the A-A direction, in which a USB interface has been mounted on the middle frame;

FIG. 6 is an enlarged partial cross-sectional view of a middle frame having a third waterproof structure in the direction A-A, according to an embodiment of the present application, in which a USB interface has been mounted on the middle frame;

FIG. 7 is an enlarged partial cross-sectional view of a middle frame having a third waterproof structure in the direction A-A according to another embodiment of the present application, in which a USB interface has been mounted on the middle frame;

FIG. 8 is a schematic diagram of a USB device according to an embodiment of the present application;

FIG. 9 is a schematic diagram of a USB device according to an embodiment of the present application;

fig. 10 is a schematic structural diagram of a USB device according to an embodiment of the present application.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

The term "and/or" is herein merely an association relationship describing an associated object, meaning that there may be three relationships, e.g., a and/or B, may represent: a exists alone, A and B exist together, and B exists alone.

The terms first and second and the like in the description and in the claims of embodiments of the present application are used for distinguishing between different objects and not necessarily for describing a particular sequential order of objects. For example, the first target object and the second target object, etc., are used to distinguish between different target objects, and are not used to describe a particular order of target objects.

In the embodiments of the present application, words such as "exemplary" or "such as" are used to mean serving as examples, illustrations, or descriptions. Any embodiment or design described herein as "exemplary" or "for example" should not be construed as preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "such as" is intended to present related concepts in a concrete fashion.

In the description of the embodiments of the present application, unless otherwise indicated, the meaning of "a plurality" means two or more. For example, the plurality of processing units refers to two or more processing units; the plurality of systems means two or more systems.

The embodiment of the application provides a terminal device, which can be an electronic device integrated with devices such as a USB interface, such as a mobile phone, a tablet personal computer, a personal digital assistant (personal digital assistant, PDA), a vehicle-mounted computer and the like. The embodiment of the application is not limited to the specific form of the electronic device. As shown in fig. 1, the following description will take a mobile phone as an example of the terminal device for convenience of description.

For the sake of clarity in describing the following structural features and the positional relationships of the structural features, the positional relationships of the structures in the mobile phone are specified in the X-axis direction, the Y-axis direction, and the Z-axis direction. As shown in fig. 2, the X-axis direction is the width direction of the mobile phone, the Y-axis direction is the length direction of the mobile phone, and the Z-axis direction is the thickness direction of the mobile phone.

As shown in fig. 1, the mobile phone 100 includes a display 10, a center 20, and a rear case (not shown). The display screen 10, the middle frame 20 and the rear housing may enclose a receiving cavity. Various electronic devices, such as a circuit board, a battery, a USB device, etc., may be mounted in the receiving cavity, and these electronic devices are generally fixed on the middle frame 20 or fixed by depending from the middle frame 20. The middle frame 20 and the rear case may take various suitable shapes and structures as needed, and are not particularly limited herein.

As shown in fig. 2, a circuit board is mounted on the center frame 20, and an exemplary circuit board includes a main board 21 and a sub-board (or small board) 22. The main board 21 is provided with main chips of the mobile phone 100 such as an SOC (system on a chip), a memory chip, a camera chip, and the like. The sub-board (or small board) 22 is provided with other chips or electronic devices required for the mobile phone, such as a display chip or a power management chip. The main board 21 and the sub-board 22 may be electrically connected and communicate through a connector such as a flat cable.

A USB interface 23 is mounted on the sub-board 22. The USB interface 23 is, for example, a Type-C USB interface, which is used to connect with the external USB data line 40, so that the mobile phone 100 is electrically connected or in communication with an external charger or other terminal, so as to perform charging or data interaction with an external device.

As shown in fig. 1 and 3, an opening 30 is further provided on the middle frame 20, and the USB interface 23 extends pins of the USB interface 23 from the inside of the accommodating cavity to the outside of the cavity through the opening 30 so as to be connected to the external USB data line 40. The cross section of the opening 30 is, for example, a shape of a middle rectangle plus two ends semicircle. The cross-sectional shape of the opening 30 is a planar shape taken along a cross-sectional plane perpendicular to the longitudinal direction Y of the cellular phone.

For electronic devices with waterproof function, the USB interface 23 must meet certain waterproof requirements, that is, certain waterproof requirements need to be met at the opening 30. As shown in fig. 3, a waterproof structure is generally added to the middle frame 20 and the USB interface 23 at the B position (also referred to as a sealing position) where the opening 30 and the accommodating cavity interface, so that the USB interface 23 meets the waterproof requirement, and external moisture is prevented from entering the interior of the mobile phone 100 (i.e. the accommodating cavity) through the opening 30, and damaging electronic devices inside the mobile phone 100.

The waterproof structure of the middle frame 20 and the USB interface 23 of the mobile phone 100 in the sealed position will be described in detail with reference to fig. 4 and 5.

The waterproof structure of the middle frame 20 and the USB interface 23 of the mobile phone 100 at the sealing position B is a Y-direction sealing structure. The first way is shown in fig. 4, where a sealing feature, such as a step structure, a groove structure or other structures, is formed on the middle frame 20 at the sealing position B, and a sealing soft gel 231 is formed on the USB interface 23, and the sealing soft gel 231 may be formed on the USB interface 23 by dispensing or the like. When the USB interface 23 is inserted into the opening 30, the seal soft glue 231 forms an interference fit with the sealing feature of the middle frame, so that the USB interface 23 and the opening 30 are sealed at the sealing position B, and a sealing environment is provided for the internal accommodating cavity. And in order to form an interference fit between the seal cushion 231 and the seal features of the middle frame 20, locating features are formed at the C1 and D2 positions of the middle frame 20, and limit features are formed at the C2 and D2 positions of the USB interface 23, when the USB interface 23 is inserted into the opening 30, the locating features and limit features at the C1 and C2 and D1 and D2 positions provide a force in the Y direction such that the seal cushion 231 forms an interference fit with the seal features of the middle frame 20. The manner in which the locating features and the spacing features at the C1 and C2 and D1 and D2 positions mate may be referred to as the corresponding features at the C and D positions in fig. 5. This manner of achieving an interference fit by Y-direction force to achieve a seal is referred to herein as a Y-direction seal.

Although this way, the USB interface 23 and the opening 30 can be sealed at the sealing position B, since the USB interface 23 needs to be welded to the sub-board 22 during the assembly process, and the sub-board 22 has a large size relative to the USB interface 23, only an oblique insertion manner can be adopted during the insertion of the USB interface 23 into the opening 30, and since the positioning feature and the limiting feature are very inconvenient for installing the USB interface 23 or removing the USB interface 23, the sub-board is easily damaged, resulting in partial area damage. In addition, along with the requirement of light and thin mobile phones, the positioning features arranged on the middle frame bring more difficulties to the layout and installation of circuit boards and devices in the mobile phones.

The second mode is shown in fig. 5, where sealing is achieved by attaching sealing foam 232 between the middle frame 20 and the USB interface 23 at the sealing position B, and a sealing environment is provided for the internal accommodating cavity. And similar to that shown in fig. 4, locating features and limiting features are formed on the middle frame 20 and the USB interface 23 at the C and D positions, respectively, and when the USB interface 23 is inserted into the opening 30, the locating features and limiting features at the C and D positions provide Y-directional force, so that the sealing foam 232 is attached more firmly at the sealing position B, and further, the sealing effect of the USB interface 23 and the opening 30 at the sealing position B is better. In addition, in order to facilitate the installation of the USB interface 23 into the opening 30 of the middle frame 20, the USB interface 23 is first soldered to the flexible circuit board 233, and after the USB interface 23 is installed into the opening 30 of the middle frame 20, the flexible circuit board 233 is then connected to the main board 21 or the sub-board 22. Thus, since the USB interface 23 does not need to be welded to the sub-board 22 first, the USB interface 23 is relatively easy to install because it is not fixed to the sub-board 22 during the installation of the USB interface 23. However, due to the existence of the above-mentioned limiting feature and the locating feature, the sealing manner still has the problem of difficult disassembly, and the requirements of the above-mentioned locating feature and the locating feature result in complicated manufacturing processes of the middle frame 20 and the USB interface 23, and occupy the internal space of the mobile phone, which is disadvantageous for the light and thin mobile phone.

The embodiment of the application provides a sealing structure for a USB interface based on the above description, which makes the installation and the disassembly of the USB interface easier, and can reduce the occupation of the internal space, thereby being beneficial to the light and thin requirements of a mobile phone.

As shown in fig. 6, an elastic sealing ring 234 is disposed at a position of the USB interface 23 corresponding to the sealing position B, and the size of the elastic sealing ring 234 is larger than the gap between the middle frame 20 and the USB interface 23 at the sealing position B after the USB interface 23 is inserted into the opening 30, so that when the USB interface 23 is inserted into the opening 30, the middle frame 20 and the elastic sealing ring 234 are mutually pressed in the Z direction at the sealing position B, thereby realizing sealing. This sealing is referred to herein as a Z-seal, since it is achieved by a force in the Z-direction. In contrast to the Y-seal shown in fig. 4 and 5, the Z-seal does not require Y-forces and therefore does not require locating features and stop features on the center 20 and USB interface 23, as shown in the dashed areas of fig. 6, and does not require locating features and stop features on the center 20 and USB interface 23 as shown in fig. 4 and 5. Thus, the USB interface 23 is easier to mount and dismount, the manufacturing complexity of the middle frame 20 and the USB interface 23 is greatly reduced, the cost is reduced, the occupation of the internal space of the mobile phone 100 is reduced, and the mobile phone is further light and thin.

Similar to that shown in fig. 5, in the solution shown in fig. 6, in order to facilitate the installation of the USB interface 23 into the opening 30 of the middle frame 20, the USB interface 23 is first soldered to the flexible circuit board 233, and after the USB interface 23 is installed into the opening 30 of the middle frame 20, the flexible circuit board 233 is connected to the main board 21 or the sub-board 22. Thus, since the USB interface 23 does not need to be welded to the sub-board 22 first, the USB interface 23 is relatively easy to install because it is not fixed to the sub-board 22 during the installation of the USB interface 23. And due to the existence of the flexible circuit board 233, the USB interface 23 can be directly connected and communicated with a chip (for example, SOC) on the main board 21 through the flexible circuit board 233 as required, without being connected to the sub-board 22 first, and then communicated with the chip on the main board 21 through the sub-board 22.

It should be appreciated that although USB interface 23 may be directly connected to and communicate with a chip on motherboard 21 via flexible circuit board 233, this is not required, and in other embodiments, it is also possible that USB interface 23 may be communicatively connected to sub-board 22 via flexible circuit board 233, and then to communicate with a chip on motherboard 21 via sub-board 22.

As shown in fig. 7, an elastic sealing ring 234 is disposed at a position of the USB interface 23 corresponding to the sealing position B, and the size of the elastic sealing ring 234 is larger than the gap between the middle frame 20 and the USB interface 23 at the sealing position B after the USB interface 23 is inserted into the opening 30, so that when the USB interface 23 is inserted into the opening 30, the middle frame 20 and the elastic sealing ring 234 are mutually pressed in the Z direction at the sealing position B, thereby realizing sealing. This sealing is referred to herein as a Z-seal, since it is achieved by a force in the Z-direction. In contrast to the Y-seal shown in fig. 4 and 5, the Z-seal does not require Y-forces and therefore does not require locating features and stop features on the center 20 and USB interface 23, as shown in the dashed areas of fig. 7, and does not require locating features and stop features on the center 20 and USB interface 23 as shown in fig. 4 and 5. Thus, the USB interface 23 is easier to mount and dismount, the manufacturing complexity of the middle frame 20 and the USB interface 23 is greatly reduced, the cost is reduced, the occupation of the internal space of the mobile phone 100 is reduced, and the mobile phone is further light and thin.

Unlike the solution shown in fig. 6, in which the USB interface 23 is connected to the sub-board 22, the positioning features and the limiting features shown in fig. 4 and 5 are not provided on the middle frame 20 and the USB interface 23, so that the USB interface 23 can be easily installed into the opening 30 by being inserted obliquely at the time of installation even if the USB interface 23 is connected to the sub-board 22.

It should be understood that the specific structure of the middle frame 20 and the USB interface 23 shown in fig. 6 and 7 is not limiting of the present application, but is merely exemplary. The core of the application is that the Z-direction seal is adopted between the USB interface 23 and the middle frame 20, so that the positioning feature and the limiting feature do not need to be manufactured on the middle frame 20 and the USB interface 23, the USB interface can be conveniently installed and detached, the manufacturing complexity of the middle frame 20 and the USB interface 23 is greatly reduced, the cost is reduced, the occupation of the internal space of the mobile phone 100 is reduced, and the mobile phone is further thinned.

FIG. 8 is a schematic diagram of a USB device according to an embodiment of the present application; FIG. 9 is a schematic diagram of a USB device according to an embodiment of the present application; fig. 10 is a schematic structural diagram of a USB device according to an embodiment of the present application.

As shown in fig. 8 to 10, the USB device 200 provided in the embodiment of the present application includes a device body 201, a pin unit 202, a mounting portion 203, an elastic seal ring 204, a flexible circuit board 205, and a stiffener 206. The device body 201 includes portions such as wires, chips, a case, and the like. The pin unit 202 includes a plurality of USB pins. The pin unit 202 is fixedly connected with the body 201. The mounting portion 203 is provided on the body 201 for mounting the USB device in the electronic apparatus and is connected to a frame of the electronic apparatus (for example, a center frame of a cellular phone), thereby fixing the USB device to the frame of the electronic apparatus. The elastic sealing ring 204 is disposed on one side of the body 201 near the pin unit 202. The elastic seal ring is made of an elastic material such as rubber. It may be formed on the body 201 by injection molding, may be sleeved on the body 201, or may be formed on the body 201 in other manners. The elastomeric seal 204 is used to form a seal with an opening in a USB device in an electronic device. The body 201 and the flexible circuit board 205 are connected together by soldering or the like. The stiffening plate 206 is disposed in an overlapping region of the body 201 and the flexible circuit board 205, and the flexible circuit board 205 is disposed between the body 201 and the stiffening plate 206, and provides support performance for the flexible circuit board 205 through the stiffening plate 206. The stiffening plate 206 may be made of various materials having a certain rigidity, such as various metal materials. Illustratively, the stiffening plate 206 may be a steel plate in embodiments of the present application. The stiffener 206 may be attached to the flexible circuit board 205 and the body 201 by means such as welding, adhesive, or the like.

The above embodiments are merely for illustrating the technical solution of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims (10)

1. An electronic device, comprising:

a frame having an opening formed in a wall thereof;

the USB device comprises a body and a pin unit, wherein an elastic sealing ring is arranged on one side, close to the pin unit, of the body;

the USB device is mounted on the frame, the pin unit is located in the opening, and the elastic sealing ring and the wall of the opening form a seal.

2. The electronic device of claim 1, wherein the elastic sealing ring is formed on the body of the USB device by injection molding.

3. The electronic device of claim 1, wherein the elastic sealing ring is sleeved on the body of the USB device.

4. The electronic device of any one of claims 1-3, wherein a first circuit board and a second circuit board are also mounted on the frame, the USB device being disposed on the second circuit board.

5. The electronic device of any one of claims 1-3, wherein a first circuit board and a second circuit board are also mounted on the frame;

the USB device further comprises a flexible circuit board, wherein the body is fixedly connected with the flexible circuit board, and the flexible circuit board is connected with the first circuit board or the second circuit board.

6. The electronic device of claim 5, wherein the USB device further comprises a stiffener disposed in an area where the flexible circuit board overlaps the body, the flexible circuit board being located between the body and the stiffener.

7. A USB device, comprising:

a body, and a pin unit connected with the body;

the elastic sealing ring is arranged on one side of the body, which is close to the pin unit.

8. The USB device of claim 7, wherein the elastomeric seal ring is formed on the body of the USB device by injection molding.

9. The USB device of claim 7, wherein the resilient sealing ring is sleeved over a body of the USB device.

10. The USB device of claim 7, further comprising:

the flexible circuit board is fixedly connected with the body;

the stiffening plate is arranged in the overlapping area of the flexible circuit board and the body, and the flexible circuit board is positioned between the body and the stiffening plate.