CN217240720U

CN217240720U - Flexible circuit board module and terminal

Info

Publication number: CN217240720U
Application number: CN202220197002.4U
Authority: CN
Inventors: 赵薇; 王星; 黄振
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2022-01-21
Filing date: 2022-01-21
Publication date: 2022-08-19
Anticipated expiration: 2032-01-21

Abstract

The embodiment of the application provides a flexible circuit board module and a terminal, relates to the technical field of circuits, can reduce the number of connector pins when a flexible circuit board is electrically connected with a printed circuit board through a connector, reduces the layout and wiring space on the printed circuit board, relieves the layout pressure of the printed circuit board, and reduces the cost. The flexible circuit board module comprises a functional device and a flexible circuit board; the functional device is arranged on the flexible circuit board and electrically connected with the flexible circuit board.

Description

Flexible circuit board module and terminal

Technical Field

The application relates to the technical field of circuits, in particular to a flexible circuit board module and a terminal.

Background

In current mobile terminals, such as mobile phones, some functional devices disposed on a Printed Circuit Board (PCB) need to perform signal transmission through a Flexible Printed Circuit (FPC) to implement corresponding functions thereof. The FPC is connected to the PCB by using a connector such as a Board To Board (BTB) connector. And the transmission of electric signals between the FPC and the PCB is realized through the BTB connector.

However, at present, there is a problem that the arrangement position of the functional device is not reasonable, so that the BTB is not reasonably utilized, and the layout space of the terminal is wasted.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the application provides a flexible circuit board module and a terminal. The area of the PCB can be reduced, and the cost is reduced.

In a first aspect, an embodiment of the present application provides a flexible circuit board module, which includes a functional device and a flexible circuit board; the functional device is arranged on the flexible circuit board and electrically connected with the flexible circuit board.

Through setting up the functional device on flexible circuit board, compare in setting up the functional device on PCB, need not flexible circuit board and be connected its transmission of signal through connector and PCB electricity, reduced the quantity of connector pin when flexible circuit board passes through the connector and is connected with PCB electricity, reduced PCB overall arrangement on the PCB and walked the line space, alleviated PCB overall arrangement pressure, the cost is reduced.

In some possible implementations, the flexible circuit board includes a plurality of flexible traces, each of the flexible traces including a solder joint; each welding point is provided with a connecting point, and the welding point is electrically connected with the connecting point; the functional device comprises a plurality of functional pins, and the functional pins are electrically connected with the connecting points in a one-to-one correspondence manner, so that the functional device is electrically connected with the flexible circuit board. For example, the functional device can be electrically connected with the flexible circuit board by adopting a welding mode, and the method is simple and has a small thickness.

In some possible implementations, the functional device includes a display driving module disposed on the flexible circuit board. Therefore, when the display panel is driven to display through the flexible circuit board module, the display driving signal can be transmitted to the display driving module without pins of the side panel connector and wiring on the side panel, and driving of the display panel is completed. Compared with the mode that the display driving module is arranged on the auxiliary plate, the number of pins of the connector on the side of the auxiliary plate and the number of wires on the auxiliary plate are reduced, and the layout space of the auxiliary plate is saved. In addition, the display driving module is not required to be arranged on the auxiliary plate, so that the layout space of the auxiliary plate can be further saved, and the cost is reduced. Especially for 5G mobile phones, 2G, 3G and 4G are required to be compatible, so that more and more devices (including 2G, 3G, 4G and 5G mobile communication modules) are arranged on a PCB, the layout pressure of a sub-board can be relieved by arranging the display driving module on the flexible circuit board, and the display driving module has high application value. In addition, the width and the routing of the electrical connection between the flexible circuit board and the connector are reduced. In addition, the transmission distance of the display driving signal is shortened, and the influence of the problems of voltage reduction and the like on the display driving signal can be avoided.

In some possible implementation manners, on the basis that the functional device includes a display driving module, the flexible circuit board further includes a fixing layer; the edge of the display driving module is provided with a fixed layer. The display driving module is better fixed on the flexible circuit board through the fixing layer, and the display driving module is prevented from being peeled off from the flexible circuit board when the terminal is subjected to a large external force. In addition, when the display driving module is arranged on the flexible circuit board in a welding mode, the flexible circuit board is prevented from deforming, and the functional pins of the display driving module are disconnected with the connection points on the flexible circuit board. In addition, the fixed layer covers the connection point on the flexible circuit board, and the connection point on the flexible circuit board is prevented from being short-circuited with other metal structures in the terminal.

In some possible implementations, on the basis that the flexible circuit board includes the fixing layer, the fixing layer is disposed around the display driving module, so that the fixing layer can fix the display driving module on the flexible circuit board in all directions.

In some possible implementations, the functional device includes an audio power amplifier module; the audio power amplifier module is arranged on the flexible circuit board. The PCB layout pressure is relieved, and the cost is reduced.

In some possible implementations, the flexible circuit board module further includes a support structure; the supporting structure is positioned on one side of the flexible circuit board, which is far away from the functional device, and the supporting structure is overlapped with the functional device along a first direction; the first direction is a direction in which the flexible circuit board points to the functional device. The flexible circuit board provided with the functional device position is supported through the supporting structure, so that the flexible circuit board provided with the functional device position cannot deform even if the terminal receives large external force, and the problem of disconnection of pins of the functional device and connection points on the flexible circuit board is solved.

In some possible implementation manners, the flexible circuit board module comprises a camera module, and the camera module comprises a flexible circuit board, a power conversion module and a camera; the power supply conversion module and the camera are arranged on the flexible circuit board; the functional device comprises a power conversion module. When the power conversion module is arranged on the flexible circuit board, the pins of the connector corresponding to the camera module only need to transmit main power supply voltage, and compared with the case that the power conversion module is arranged on the PCB, the number of the pins of the connector is reduced. And because the power conversion module is moved to the flexible circuit board in the camera module from the PCB, the layout space of the PCB is saved, the layout pressure of the PCB is relieved, and the camera module has higher application value.

In some possible implementation modes, on the basis that the flexible circuit board module comprises the camera module, the camera module comprises a protection structure, and the protection structure is used for protecting the power conversion module, so that collision between other structures in the terminal and the power conversion module is prevented, and the power conversion module is prevented from being separated from the flexible circuit board.

In some modes that can realize, on the basis that above-mentioned camera module includes protection architecture, protection architecture includes the bubble cotton, and the cotton setting all around that encircles power conversion module of bubble protects power conversion module through the bubble cotton, constitutional unit, it is with low costs.

In some possible implementation manners, on the basis that the camera module comprises the protection structure, the protection structure comprises a shielding case and the like.

In a second aspect, an embodiment of the present application provides a terminal, including the flexible circuit board module according to the first aspect. All effects of the above-mentioned flexible circuit board module can be realized.

In some possible implementations, the terminal further includes a main board, a sub-board, a first connector, and a second connector; the first connector is arranged between the mainboard and the flexible circuit board, and the flexible circuit board is electrically connected with the mainboard through the first connector; the second connector is arranged between the auxiliary board and the flexible circuit board, and the flexible circuit board is electrically connected with the auxiliary board through the second connector. Compared with the mode that the display driving module is arranged on the auxiliary board, the number of pins of the connector on the side of the auxiliary board and the number of wires on the auxiliary board are reduced, and the layout space of the auxiliary board is saved. In addition, the display driving module is not required to be arranged on the auxiliary plate, so that the layout space of the auxiliary plate can be further saved, and the cost is reduced. Especially for 5G mobile phones, 2G, 3G, and 4G are compatible, so more and more devices (including 2G, 3G, 4G, and 5G mobile communication modules) are provided on the PCB, and the arrangement pressure of the sub-board can be relieved by disposing the display driving module on the flexible circuit board, which has a high application value. In addition, the width and the routing of the flexible circuit board and the connector can be reduced. In addition, the transmission distance of the display driving signal is shortened, and the influence of the problems of voltage reduction and the like on the display driving signal can be avoided.

In some possible implementation manners, on the basis that the terminal comprises a main board, a secondary board, a first connector and a second connector, the functional device comprises a display driving module; alternatively, the functional device comprises an audio power amplifier module; alternatively, the functional device includes a display driving module and an audio power amplifier module. Further reducing the number of connector pins.

In some possible implementations, the terminal includes a main board and a third connector, and the flexible circuit board module is electrically connected with the main board through the third connector.

In some possible implementation manners, on the basis that the terminal includes the main board and the third connector, the flexible circuit board module includes a camera module, and the camera module includes a flexible circuit board, a power conversion module, and a camera; the power supply conversion module and the camera are arranged on the flexible circuit board; the functional device comprises a power conversion module. When the power conversion module is arranged on the flexible circuit board, the pins of the connector corresponding to the camera module only need to transmit the main power supply voltage, and compared with the case that the power conversion module is arranged on the PCB, the number of the pins of the connector is reduced. And because the power conversion module is moved to the flexible circuit board in the camera module from the PCB, the layout space of the PCB is saved, the layout pressure of the PCB is relieved, and the camera module has higher application value.

In some possible implementation manners, on the basis that the flexible circuit board module comprises a camera module, the terminal further comprises a middle frame; a containing groove is formed in the position, where the camera module is arranged, of the middle frame; the power conversion module is embedded in the accommodating groove. The power conversion module is protected through the accommodating groove, other structures in the terminal are prevented from colliding with the power conversion module, and the power conversion module is prevented from being separated from the flexible circuit board.

Drawings

Fig. 1 is an exploded schematic view of a terminal according to an embodiment of the present disclosure;

fig. 2 is a schematic partial structural diagram of a terminal according to an embodiment of the present disclosure;

FIG. 3 is a cross-sectional view along AA' of FIG. 2;

fig. 4 is a schematic circuit diagram of a terminal according to an embodiment of the present disclosure;

fig. 5 is a partial structural view of a terminal in the related art;

FIG. 6 is a cross-sectional view taken along direction BB' of FIG. 2;

fig. 7 is a schematic structural diagram of an FPC provided in an embodiment of the present application;

FIG. 8 is a further cross-sectional view taken along direction BB' of FIG. 2;

FIG. 9 is a schematic structural diagram of another FPC provided in the embodiments of the present application;

fig. 10 is a schematic partial structure diagram of another terminal provided in the embodiment of the present application;

fig. 11 is a schematic partial structure diagram of another terminal according to an embodiment of the present application;

FIG. 12 is a cross-sectional view taken along line CC' of FIG. 11;

fig. 13 is a schematic circuit diagram of another terminal according to an embodiment of the present disclosure;

fig. 14 is a partial configuration diagram of another terminal in the related art;

fig. 15 is a schematic partial structure diagram of another terminal according to an embodiment of the present application;

fig. 16 is a schematic view of a film structure of a terminal according to an embodiment of the present disclosure.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The term "and/or" herein is merely an association describing an associated object, meaning that three relationships may exist, e.g., a and/or B, may mean: a exists alone, A and B exist simultaneously, and B exists alone.

The terms "first" and "second," and the like, in the description and in the claims of the embodiments of the present application are used for distinguishing between different objects and not for describing a particular order of the objects. For example, the first target object and the second target object, etc. are specific sequences for distinguishing different target objects, rather than describing target objects.

In the embodiments of the present application, the words "exemplary" or "such as" are used herein to mean serving as an example, instance, or illustration. Any embodiment or design described herein as "exemplary" or "e.g.," is not necessarily to be construed as preferred or advantageous over other embodiments or designs. Rather, use of the word "exemplary" or "such as" is intended to present concepts related in a concrete fashion.

In the description of the embodiments of the present application, the meaning of "a plurality" means two or more unless otherwise specified. For example, a plurality of processing units refers to two or more processing units; the plurality of systems refers to two or more systems.

The embodiment of the application provides a flexible circuit board module and a terminal, wherein the flexible circuit board module comprises an FPC and a functional device arranged on the FPC. Through with some functional device, for example power conversion module, display driver module, audio Power Amplifier (PA) module etc. set up on FPC, compare in setting up the functional device on PCB, need not FPC and be connected the transmission that realizes its signal through connector and PCB electricity, the quantity of connector pin when having reduced FPC and being connected with PCB electricity through the connector has reduced PCB overall arrangement on the PCB and has walked the line space, has alleviated PCB layout pressure, the cost is reduced. The terminal may be a mobile phone, a notebook computer, a tablet computer, a personal digital assistant (PDA for short), a vehicle-mounted computer, a television, an intelligent wearable device (e.g., an intelligent watch), a media player, an intelligent home device, and the like, and the specific form of the terminal is not particularly limited in the embodiment of the present application. For convenience of description, in the embodiments of the present application, a terminal is a mobile phone as an example.

For the sake of clarity, the positional relationship of the respective structures in the mobile phone is defined in the X-axis direction, the Y-axis direction, and the Z-axis direction. The X-axis direction is the width direction of the mobile phone, the Y-axis direction is the length direction of the mobile phone, and the Z-axis direction (also called the first direction) is the thickness direction of the mobile phone.

The following describes an application scenario, a structure and a signal transmission principle of the flexible circuit board module provided in the embodiment of the present application with reference to a mobile phone.

Scene one

As shown in fig. 1, the cellular phone includes a display panel 10, a rear case 20, and a middle frame 30 between the display panel 10 and the rear case 20. The Display panel 10 includes, for example, a Liquid Crystal Display (LCD) panel, an Organic Light Emitting Diode (OLED) Display panel, an LED Display panel, and the like, wherein the LED Display panel includes, for example, a Micro-LED Display panel, a Mini-LED Display panel, and the like. The embodiment of the present application does not limit the type of the display panel 10.

The display panel 10, the middle frame 30 and the rear case 20 may enclose an accommodation cavity.

Referring to fig. 2 and 3, the receiving cavity is provided therein with a PCB 40, a flexible circuit board module 50, a board to board connector (BTB) 60, a battery 70, a processor 80, a charging chip 90, an audio PA module 100, and a speaker (the speaker is not shown in fig. 2 and 3).

The PCB 40 includes a main board 41 and a sub board 42. The flexible circuit board module 50 includes an FPC51 and a display driving module 52. The display driving module 52 is disposed on the FPC51 and electrically connected to the FPC 51. The processor 80 and the charging chip 90 are disposed on the main board 41. The audio PA module 100 is disposed on the sub-board 42.

One BTB connector 60 is provided between the main board 41 and the FPC51, and the FPC51 is electrically connected to the main board 41 through the BTB connector 60. Another BTB connector 60 is provided between the sub-board 42 and the FPC51, and the same FPC51 is electrically connected to the sub-board 42 through the BTB connector 60. Thereby electrically connecting the sub board 42 with the main board 41 through the FPC 51. For the sake of distinction, the BTB connector 60 disposed between the main board 41 and the FPC51 is a first BTB connector 61, and the BTB connector 60 disposed between the sub-board 42 and the FPC51 is a second BTB connector 62.

It should be noted that, in the embodiments of the present application, the BTB connector is taken as an example to connect the FPC51 and the PCB 40, but the present application is not limited thereto, and any connector that can electrically connect the FPC51 and the PCB 40 is within the scope of the present application. The following scenarios are the same and are not described again.

Referring to fig. 4, the charging chip 90 is electrically connected to the battery 70, the processor 80, the display driving module 52, the display panel 10, the audio PA module 100, and the like. The charging chip 90 receives the input of the battery 70 and supplies power to the processor 80, the display driving module 52, the display panel 10, the audio PA module 100, and the like. The audio PA module 100 is electrically connected to the speaker 110 through traces on the sub-board 42. The audio PA module 100 processes the received audio signal and transmits the processed audio signal to the speaker 110 to sound the speaker 110. The display driving module 52 is electrically connected to the display panel 10 and the processor 80, respectively. The processor 80 sends the display driving signal to the display driving module 52 to make the display driving module 52 drive the display panel 10 to display.

The following describes how to reduce the number of connector pins and reduce the PCB layout and trace space when the display driver module 52 is disposed on the FPC 51.

With reference to fig. 2, the charging chip 90 disposed on the motherboard 41 transmits the power supply signal to the display driving module 52 through the traces on the motherboard 41, the pins of the first BTB connector 61, and the traces on the FPC51 to supply power to the display driving module 52. The processor 80 transmits the display driving signals to the display driving module 52 through other traces on the main board 41, other pins of the first BTB connector 61, and other traces on the FPC 51. The display driving module 52 drives the display panel 10 to display based on the display driving signal.

It should be noted here that the power supply signal provided by the charging chip 90 can not only power the display driving module 52, but also power the audio PA module 100. Therefore, the power supply signal also needs to be transmitted to the audio PA module 100 located on the sub board 42 through the traces on the FPC51, the first pin of the second BTB connector 62, and the traces on the sub board 42 to supply power to the audio PA module 100. The first pin may be one pin or a plurality of pins.

Since the display driving module 52 is disposed on the FPC51, the display driving signal can be transmitted to the display driving module 52 without passing through the pins of the second BTB connector 62 on the side of the sub-board 42 and the traces on the sub-board 42, so as to complete the driving of the display panel 10. Compared with the case that the display driving module 52 is arranged on the sub-board 42, the number of pins of the second BTB connector 62 on the side of the sub-board 42 and the number of wires on the sub-board 42 are reduced, and layout space of the sub-board 42 is saved. In addition, since the display driving module 52 is not required to be provided on the sub-board 42, the layout space of the sub-board 42 can be further saved, and the cost can be reduced. Especially for 5G mobile phone, because 2G, 3G, 4G are required to be compatible, more and more devices on PCB (including 2G, 3G, 4G, 5G mobile communication module) are required, and the arrangement of the display driver module 52 on the FPC51 can relieve the layout pressure of the sub-board 42, which has high application value. In addition, the width and routing of the electrical connection of the FPC51 and the second BTB connector 62 may also be reduced. In addition, the transmission distance of the display driving signal is shortened, and the influence of the problems of voltage reduction and the like on the display driving signal can be avoided.

This advantageous effect is explained below by comparison with the related art.

Referring to fig. 5, the display driving module 52 is disposed on the sub-plate 42. To drive the display panel 10, the charging chip 90 needs to send a power supply signal to the display driving module 52 through a trace on the main board 41, a pin of the first BTB connector 61, a trace on the FPC51, a first pin of the second BTB connector 62, and a trace on the sub-board 42 to supply power to the display driving module 52 and also supply power to the audio PA module 100. The processor 10 needs to transmit the display driving signal to the display driving module 52 through the traces on the main board 41, the other pins of the first BTB connector 61, the traces on the FPC51, the second pins of the second BTB connector 62, and the traces on the sub-board 42. The second pin may be one pin or a plurality of pins. The display driving module 52 drives the display panel 10 to display through other traces on the sub-board 42, the third pin of the second BTB connector 62 and the traces on the FPC51 based on the display driving signal. The third pin may be one pin or a plurality of pins. As can be seen, fig. 5 requires more pins of the second BTB connector 62 (the second pin for receiving the display driving signal and the third pin for driving the display of the display panel 10) and traces on the sub-board 42 (the traces for receiving the display driving signal and the traces for driving the display of the display panel 10). In this way, not only are the pins of the second BTB connector 62 increased, i.e., the second pin and the third pin, wasted the routing space of the FPC51 and the routing space of the sub board 42, but also the layout space of the sub board 42 is occupied.

For the position where the display driving module 52 is disposed on the FPC51, the embodiment of the present application does not limit the position where the display driving module 52 is disposed on the FPC51, and those skilled in the art can set the position according to actual situations.

In some possible implementations, referring to fig. 6, the display driving module 52 does not overlap the battery 70 along the Z-axis direction. That is, in the thickness direction of the FPC51 (thickness of the mobile phone), the display driving module 52 does not intersect with the battery 70, in other words, the orthographic projection of the display driving module 52 on the XY plane does not overlap with the orthographic projection of the battery 70 on the XY plane.

This is because: it is considered that the FPC51 needs to be electrically connected to the main board 41 through the battery 70 in a direction parallel to the XY plane. When the display driving module 52 is disposed on the FPC51, then the display driving module 52 is located between the battery 70 and the FPC 51. Thus, on the one hand, the thickness of the terminal is increased in the Z-axis direction; on the other hand, when the display driving module 52 is disposed on the FPC51, a protrusion is formed, which may press the battery 70. When the mobile phone is subjected to a large external force, for example, the mobile phone falls off, the battery 70 causes stress concentration at the position of the display driving module 52, so that the battery 70 deforms, which may cause short circuit of the positive electrode and the negative electrode of the battery 70, and cause a battery safety problem. Further, when the battery 70 is pressed, since the forces are mutual, the FPC51 is also deformed, affecting the performance of the FPC 51. Therefore, the display driving module 52 does not overlap the battery 70 in the Z-axis direction, neither increasing the thickness of the terminal nor affecting the battery 70 and the FPC 51.

In this case, with continued reference to fig. 6, the display driving module 52 is located on a side of the battery 70 facing away from the main board 41 in the Y-axis direction, i.e., the orthographic projection of the display driving module 52 on the XY plane is located on a side of the orthographic projection of the battery 70 on the XY plane facing away from the orthographic projection of the main board 41 on the XY plane.

In addition, as for the way of disposing the display driving module 70 on the FPC51, the embodiment of the present application does not limit the way of disposing the display driving module 70 on the FPC51, as long as the electrical connection between the display driving module 70 and the traces on the FPC51 can be achieved.

In some possible implementation manners, referring to fig. 7, the FPC51 includes a plurality of flexible traces 53 and a protection layer (not shown in the figure) on the flexible traces 51, the protection layer is provided with a plurality of hollow portions, the hollow portions expose portions of the flexible traces 53, and the flexible traces 53 exposed through the hollow portions are welding points. A connection point 54 is provided on each solder joint, wherein the connection point 54 is, for example, a solder point. The functional pins of the display driving module 52 and the connection points 54 may be electrically connected by means of laser, for example, to achieve the electrical connection of the display driving module 52 and the FPC 51.

Considering that the FPC51 is flexible, when the mobile phone is subjected to a large external force, such as falling, deformation may occur, and at this time, the functional pins of the display driving module 52 may be disconnected from the connection points 54 on the FPC51, which may affect signal transmission.

Based on this, in some possible implementations, referring to fig. 8, a support structure 55 is provided on a side of the FPC51 facing away from the display driving module 52 in the Z-axis direction, the support structure 55 being, for example, a steel sheet. The FPC51 provided with the position of the display driving module 52 is supported by the supporting structure 55, so that the FPC51 provided with the position of the display driving module 52 is not deformed even if the mobile phone is subjected to a large external force, and the problem that the functional pins of the display driving module 52 are disconnected from the connecting points 54 on the FPC51 is solved.

In still other possible implementations, referring to fig. 9, the fixing layer 56 is disposed on the edge of the driving module 52, and the fixing layer 56 is, for example, an insulating adhesive. The fixing layer 56 is used for better fixing the display driving module 52 on the FPC51, and prevents the display driving module 52 from being peeled off from the FPC51 when the mobile phone is subjected to a large external force, or prevents the FPC51 from deforming, and the functional pins of the display driving module 52 are disconnected from the connection points 54 on the FPC 51. In addition, the fixing layer 56 covers the connection points 54 on the FPC51, and prevents the connection points 54 on the FPC51 from being short-circuited with other metal structures inside the cellular phone 100.

In addition, the position where the fixing layer 56 is disposed on the display driving module 52 is not limited in the embodiment of the present application, and those skilled in the art can set the position according to actual situations. For example, with continued reference to FIG. 9, a fixed layer 56 is disposed around the display driver module 52. This has the advantage that the fixing layer 56 can fix the display driving module 52 to the FPC51 in all directions. Of course, the fixing layer 56 may also partially surround the display driving module 52.

With regard to the specific structure of the display driving module 52, the embodiment of the present application does not limit the specific structure of the display driving module 52 as long as it can receive the display driving signal sent by the processor 80 and drive the display panel 10 to display based on the display driving signal. The display driving module 52 includes, for example, a display driving chip and a peripheral circuit located in the display driving chip, and the specific structure and the principle of driving the display panel 10 to display may refer to the technical solution in the prior art embodiment, which is not described in detail in this embodiment of the present application.

As can be seen from the foregoing, the power supply signal provided by the charging chip 90 can simultaneously supply power to the display driving module 52 and the audio PA module 110. Therefore, although the display driving module 52 is disposed on the FPC51, the power supply signal needs to be transmitted to the audio PA module 100 on the sub-board 42 through the traces on the FPC51, the first pin of the second BTB connector 62 and the traces on the sub-board 42 to supply power to the audio PA module 100.

Based on this, in order to further reduce the number of pins of the second BTB connector 62 and the number of traces on the sub board 42, referring to fig. 10, the audio PA module 100 is also disposed on the FPC51, i.e. the flexible circuit board module 50 includes the flexible circuit board 51, the display driver module 52 and the audio PA module 100. Thus, the power supply signal can complete the power supply to the display driving module 52 and the audio PA module 110 without passing through the first pin of the second BTB connector 62 and the trace on the sub-board 42. That is, the first pin for transmitting the power supply signal in the second BTB connector 62 and the trace for transmitting the power supply signal on the sub-board 42 can be eliminated, thereby further saving the layout space of the sub-board 42.

The following describes effects achieved by disposing the display driver module 52 and the audio PA module 100 on the FPC51 in this scenario with reference to specific examples.

When the display driver module 52 and the audio PA module 100 are disposed on the sub-board 42, the charging chip 90 needs to send the power supply signal to the display driver module 52 and the audio PA module 100 through the traces on the main board 41, the pins of the first BTB connector 61, the traces on the FPC51, the first pins of the second BTB connector 62, and the traces on the sub-board 42 to supply power to the display driver module 52 and the audio PA module 100. The number of pins of the second BTB connector 62 involved in transmitting the powering signal is two and the number of traces on the sub-board 42 is two.

The processor 10 needs to transmit the display driving signal to the display driving module 52 through the traces on the main board 41, the other pins of the first BTB connector 61, the traces on the FPC51, the second pins of the second BTB connector 62, and the traces on the sub-board 42. The display driving module 52 drives the display panel 10 to display through other traces on the sub-board 42, the third pin of the second BTB connector 62 and the traces on the FPC51 based on the display driving signal. The number of pins of the second BTB connector 62 involved in transmitting the display driving signals is four, and the number of traces on the sub-board 42 is four. The display driving module 52 drives the display panel 10 to display, the number of pins of the second BTB connector 62 is six, and the number of traces on the sub-board 42 is six.

From this analysis, when the display driver module 52 and the audio PA module 100 are disposed on the sub-board 42, twelve pins of the second BTB connector 62 and 12 traces on the sub-board 42 are required, and since the power supply signal and the display driver signal are required to be transmitted to the second BTB connector 62 through the traces on the FPC51, the width of the FPC51 is about 1.3 mm. Clearly, this entails waste in terms of improper utilization of the second BTB connector 62, cost of the sub-board 42 and the FPC51, and the like.

With continued reference to fig. 9, if the display driver module 52 and the audio PA module 100 are disposed on the FPC51, the power supply signal and the display driver signal that need to flow in from the main board 41 side can be directly transmitted to the display driver module 52 and the audio PA module 100 through the traces on the FPC51 without passing through the second BTB connector 62 and the traces on the sub board 42 from the sub board 42 side. By the design, the number of the pins of the second BTB connector 62 on the side of the sub board 42 can be reduced by 12, for example, the 46-pin second BTB connector 62 can be reduced to 34-pin second BTB connector 62, the PCB layout and the wiring space on the sub board 42, the width of the FPC51 and the wiring space on the side of the FPC51 close to the second BTB connector 62 are reduced, and the invalid long-distance design of signals is avoided.

Scene two

With continued reference to fig. 1, the cellular phone includes a display panel 10, a rear case 20, and a middle frame 30 between the display panel 10 and the rear case 20. The display panel 10, the middle frame 30 and the rear case 20 may enclose an accommodation cavity.

Referring to fig. 11 and 12, the receiving cavity is provided with a PCB 40, a flexible circuit board module 50, a board to board connector (BTB) 60, a battery 70, a processor 80, a charging chip 90, and the like.

The PCB 40 includes a main board 41. The processor 80 and the charging chip 90 are disposed on the main board 41. The flexible circuit board module 50 is a camera module, and the camera module includes an FPC51, and a camera 57 and a power conversion module 58 located on the FPC 51. The power conversion module 58 may be, for example, a Low Dropout Regulator (LDO).

The camera module may be, for example, a front camera module and/or a rear camera module. When the camera module is a front camera module, the number of the front camera modules can be one or more. When the camera module is the rear camera module, the number of the rear camera module can be one or more. When the camera module is leading camera module and rear camera module, the quantity of leading camera module and rear camera module all can be one or more.

For example, with continued reference to fig. 11, the camera module is a rear camera module, and the number of rear camera modules is four. The four rear camera modules are a first camera module 501, a second camera module 502, a third camera module 503 and a fourth camera module 504, respectively. The camera 57 of the first camera module 501 is responsible for main shooting, the camera 57 of the second camera module 502 is responsible for zooming, the camera 57 of the third camera module 503 is responsible for wide-angle, and the camera 57 of the fourth camera module 504 is responsible for macro-distance and other functions.

Referring to fig. 12, one BTB connector 60 is disposed between the main board 41 and the FPC 51. In order to distinguish the BTB connector 60 in the first scene, the BTB connector 60 connecting the FPC51 in the camera module and the main board 41 is the third BTB connector 63. The FPC51 in each camera module 50 is electrically connected to the main board 41 through the third BTB connector 63. Thereby electrically connecting the camera 57 with the main board 41 through the FPC 51.

Referring to fig. 13, the charging chip 90 is electrically connected to the battery 70, the processor 80, the display panel 10, and the flexible circuit board module (camera module) 50, respectively. The charging chip 90 receives the input of the battery 70, and supplies power to the processor 80, the display panel 10, and the flexible circuit board module (camera module) 50.

It can be understood that when the camera modules 50 are powered, each camera module 50 needs at least two sets of power supply voltages. And the power supply voltages required by different camera modules 50 may be the same or different. Therefore, the main power supply voltage output by the charging chip 90 can be converted by the power conversion module 58 in the camera module 50 to supply power to the camera 57 in the camera module 50.

Illustratively, the cameras 57 in the first camera module 501 are 6400 ten thousand pixels, which require five sets of supply voltages. Therefore, the power conversion module 58 in the first camera module 501 converts the main power supply voltage output by the charging chip 90 into five sets of power supply voltages to supply power to the camera 57 in the first camera module 501. The cameras 57 in the second camera module 502 are 1600 ten thousand pixels, which require three sets of supply voltages. Therefore, the power conversion module 58 in the second camera module 502 converts the main power supply voltage output by the charging chip 90 into three sets of power supply voltages to supply power to the camera 57 in the second camera module 502. The cameras 57 in the third camera module 503 are 200 ten thousand pixels, which require two sets of supply voltages. Therefore, the power conversion module 58 in the third camera module 503 converts the main power supply voltage output by the charging chip 90 into two sets of power supply voltages to supply power to the camera 57 in the third camera module 503. The cameras 57 in the fourth camera module 504 are 200 ten thousand pixels, which require two sets of supply voltages. Therefore, the power conversion module 58 in the fourth camera module 504 converts the main power supply voltage output by the charging chip 90 into two sets of power supply voltages to supply power to the camera 57 in the fourth camera module 504.

The following is a description of how to reduce the number of connector pins and reduce the PCB layout and routing space when the power conversion module 58 is disposed on the FPC 51.

With continued reference to fig. 11, the battery 70 sends a power signal (VBUS) to the charging chip 90. The charging chip 90 converts the power signal into a main power supply voltage (for example, 5V), and transmits the main power supply voltage to the power conversion module 58 through the traces on the motherboard 41, the pins (for example, two pins) of the third BTB connector 63 corresponding to each camera module 50, and the traces on the FPC 51. The power conversion module 58 converts the main supply voltage into a plurality of supply voltages required by the camera module 50 to supply power to the camera 57.

Because the pins of the third BTB connector 63 corresponding to each camera module 50 only need to transmit the main power supply voltage (two pins are needed to transmit the main power supply voltage), the number of pins of the third BTB connector 63 is reduced compared to when the power conversion module 58 is disposed on the motherboard 41 (each camera module needs more than two pins to transmit at least two paths of power supply voltages). And because the power conversion module 58 is moved from the main board 41 to the FPC51, the layout space of the main board 41 is saved, the layout pressure of the main board 41 is relieved, and the application value is high.

This advantageous effect is explained below by comparison with the related art.

Referring to fig. 14, four power conversion modules 58 are disposed on the main board 41. The four power conversion modules 58 are a first power conversion module 581, a second power conversion module 582, a third power conversion module 583, and a fourth power conversion module 584, respectively. The battery 70 transmits a power supply signal (VBUS) to the charging chip 90. The charging chip 90 converts the power signal into a main power supply voltage (e.g., 5V), and sends the main power supply voltage to the first power conversion module 581, the second power conversion module 582, the third power conversion module 583, and the fourth power conversion module 584, respectively. The first power conversion module 581, the second power conversion module 582, the third power conversion module 583, and the fourth power conversion module 584 convert the main power supply voltage, and provide five sets of power supply voltages for the camera in the first camera module 501 through the routing on the motherboard 41, the nine pins of the third BTB connector 63 corresponding to the first camera module 501, and the routing on the FPC51 in the first camera module 501. And three groups of power supply voltages are provided for the camera 57 in the second camera module 502 through the wiring on the main board 41, the four pins of the third BTB connector 63 corresponding to the second camera module 502, and the wiring on the FPC51 in the second camera module 502. And two sets of power supply voltages are provided for the camera 57 in the third camera module 503 through the routing on the motherboard 41, the three pins of the third BTB connector 63 corresponding to the third camera module 502, and the routing on the FPC51 in the third camera module 503. And two sets of power supply voltages are provided for the camera 57 in the fourth camera module 504 through the wiring on the main board 41, the three pins of the third BTB connector 63 corresponding to the fourth camera module 504, and the wiring on the FPC51 in the fourth camera module 504. It can be seen that, in fig. 14, more pins are required for the third BTB connector 63 corresponding to each camera module 50, wherein 6 more pins are required for the third BTB connector 63 corresponding to the first camera module 501; the third BTB connector 63 corresponding to the second camera module 502 needs 2 more pins; one more pin is needed for the third BTB connector 63 corresponding to the third camera module 503; the third BTB connector 63 corresponding to the fourth camera module 504 needs to have one more pin, which wastes the routing space of the motherboard 41.

It should be noted that, the above example only takes the number of pins required by the third BTB connector 63 for supplying power to each camera module when the camera 57 in the first camera module 501 is 6400 ten thousand pixels, the camera 57 in the second camera module 502 is 1600 ten thousand pixels, the camera 57 in the third camera module 503 is 200 ten thousand pixels, and the camera 57 in the fourth camera module 504 is 200 ten thousand pixels as an example, but the present application is not limited thereto, and any scheme that the power conversion module 58 is disposed on the flexible circuit board 51 to reduce the pins of the connector when the camera module is electrically connected to the motherboard is within the protection scope of the present application.

As for the manner in which the power conversion module 58 is disposed on the FPC51, the embodiment of the present application does not limit the manner in which the power conversion module 58 is disposed on the FPC51, as long as the power conversion module 58 can be electrically connected to the traces on the FPC 51. For example, in the same manner as the scenario (fig. 7), the scenario may be referred to specifically, and is not described herein again.

Considering that the FPC51 is flexible, when the mobile phone is subjected to a large external force, such as falling, the power conversion module 58 disposed on the FPC51 may collide with other structures in the mobile phone, and thus it may occur that the power conversion module 58 is separated from the FPC 51.

Based on this, in some possible implementations, referring to fig. 15, the power conversion module 58 is provided with a protection structure 59 around its periphery. The protection structure 59 is used for protecting the power conversion module 58, preventing other structures in the mobile phone from colliding with the power conversion module 58, and preventing the power conversion module 58 from being separated from the FPC 51.

On this basis, the protective structure 59 may be, for example, a shield in one example. The power conversion module 58 is protected by a shield.

In yet another example, the protective structure 59 may be foam, for example. The power conversion module 58 is protected by foam.

In still other possible implementations, referring to fig. 15, a receiving groove 31 is formed at a position where the middle frame 30 is provided with the camera module 50. The power conversion module 58 is embedded in the accommodating groove 31. The power conversion module 58 is protected by the accommodation groove 31.

The accommodating groove 31 may or may not penetrate through the middle frame 30 in the Z-axis direction. In fig. 16, the accommodating groove 31 is not penetrated through the middle frame 30.

It should be noted that, in the above example, the functional devices are taken as the power conversion module, the display driving module, and the audio PA module, and the power conversion module, the display driving module, and the audio PA module are disposed on the FPC for example. Of course, the functional device is not limited thereto. Functional devices which are arranged on a PCB (main board and auxiliary board) and need to realize corresponding functions through the FPC can be arranged on the FPC, and the protection scope of the application is within the scope of the application.

The above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A flexible circuit board module, comprising: a functional device and a flexible circuit board; the functional device is arranged on the flexible circuit board and electrically connected with the flexible circuit board.

2. The flexible circuit board module according to claim 1, wherein the flexible circuit board comprises a plurality of flexible traces, each of the flexible traces comprising a solder joint; each welding point is provided with a connecting point, and the welding point is electrically connected with the connecting point;

the functional device comprises a plurality of functional pins, and the functional pins are electrically connected with the connecting points in a one-to-one correspondence manner, so that the functional device is electrically connected with the flexible circuit board.

3. The flexible circuit board module of claim 1, wherein the functional device comprises a display driver module disposed on the flexible circuit board.

4. The flexible circuit board module of claim 3, wherein the flexible circuit board further comprises a securing layer; the edge of the display driving module is provided with the fixing layer.

5. The flexible circuit board module according to claim 4, wherein the fixing layer is disposed around the display driving module.

6. The flexible circuit board module according to any one of claims 1-5, wherein the functional device comprises an audio power amplifier module; the audio power amplifier module is arranged on the flexible circuit board.

7. The flexible circuit board module of claim 1, wherein the flexible circuit board module further comprises a support structure; the supporting structure is positioned on one side of the flexible circuit board, which is far away from the functional device, and the supporting structure is overlapped with the functional device along a first direction;

the first direction is a direction in which the flexible circuit board points to the functional device.

8. The flexible circuit board module of claim 1, wherein the flexible circuit board module comprises a camera module comprising the flexible circuit board, a power conversion module, and a camera; the power supply conversion module and the camera are arranged on the flexible circuit board;

the functional device comprises the power supply conversion module.

9. The flexible circuit board module of claim 8, wherein the camera module comprises a protection structure for protecting the power conversion module.

10. The flexible circuit board module of claim 9, wherein the protective structure comprises foam.

11. The flexible circuit board module of claim 9, wherein the protective structure comprises a shield.

12. A terminal, characterized in that it comprises a flexible circuit board module according to any one of claims 1-11.

13. The terminal of claim 12, further comprising a main board, a sub-board, a first connector and a second connector;

the first connector is arranged between the mainboard and the flexible circuit board, and the flexible circuit board is electrically connected with the mainboard through the first connector;

the second connector is arranged between the auxiliary board and the flexible circuit board, and the flexible circuit board is electrically connected with the auxiliary board through the second connector.

14. The terminal according to claim 13, characterized in that the functional device comprises a display driver module and/or an audio power amplifier module.

15. A terminal according to claim 12, comprising a motherboard and a third connector, wherein the flexible circuit board module is electrically connected to the motherboard via the third connector.

16. The terminal of claim 15, wherein the flexible circuit board module comprises a camera module, the camera module comprising the flexible circuit board, a power conversion module, and a camera; the power conversion module and the camera are arranged on the flexible circuit board;

the functional device comprises the power supply conversion module.

17. The terminal of claim 16, further comprising a middle frame; an accommodating groove is formed in the position, where the camera module is arranged, of the middle frame; the power conversion module is embedded in the accommodating groove.