CN116544687A

CN116544687A - Plug-in structure of board-to-board connector, board-to-board connector and electronic equipment

Info

Publication number: CN116544687A
Application number: CN202310815738.2A
Authority: CN
Inventors: 张璁雨; 杨帆; 王晓岩; 罗文君
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2023-07-05
Filing date: 2023-07-05
Publication date: 2023-08-04
Anticipated expiration: 2043-07-05
Also published as: CN116544687B

Abstract

The application provides a board to board connector's grafting structure and board to board connector, electronic equipment, relate to electronic equipment technical field. The circuit board is used for solving the problems that mechanical fatigue exists in welding spots between the existing board-to-board connector and the circuit board, and the welding spots are likely to crack to open a circuit, so that the electronic equipment has functional failure. The plug-in structure comprises a plurality of pins, a base and a supporting structure. The pins are sequentially distributed at intervals and are used for being welded and fixed with the circuit board. The pins are fixed on the base. The supporting structure is arranged between the base and the circuit board and is fixed on the surface of the base facing the circuit board.

Description

Plug-in structure of board-to-board connector, board-to-board connector and electronic equipment

Technical Field

The present disclosure relates to electronic devices, and particularly to a board-to-board connector, and an electronic device.

Background

Electrical connections are typically made between components (e.g., camera modules, display modules, etc.) within the electronic device and the circuit board through board-to-board connectors (BTBs). However, there is a problem of mechanical fatigue in the solder joints between the existing board-to-board connector and the circuit board, and there is a possibility that the solder joints are cracked to cause an open circuit, so that some functional failures of the electronic device occur.

Disclosure of Invention

The embodiment of the application provides a board-to-board connector's grafting structure and board-to-board connector, electronic equipment for solve the solder joint between current board-to-board connector and the circuit board and have the mechanical fatigue problem, probably appear the solder joint fracture and lead to the open circuit, make electronic equipment appear some functional failure's problem.

In order to achieve the above purpose, the embodiments of the present application adopt the following technical solutions:

in a first aspect, a board-to-board connector plug structure is provided, the plug structure including a plurality of pins, a base, and a support structure. The pins are sequentially distributed at intervals and are used for being welded and fixed with the circuit board. The pins are fixed on the base. The supporting structure is arranged between the base and the circuit board and is fixed on the surface of the base facing the circuit board.

The board-to-board connector plug structure provided in the first aspect of the application is provided with the supporting structure between the circuit board and the base, namely the supporting structure can reduce the distance between the base and the circuit board. Therefore, when the electronic device changes the relative position of the internal component due to external impact, the circuit board may be first abutted against the supporting structure, that is, the supporting structure can support the circuit board to offset part of acting force, so that stress concentration at the end of the pin can be dispersed, and further the risk of open circuit caused by cracking of welding spots between the end of the pin and the circuit board is reduced, and the connection reliability between the circuit board and the board-to-board connector is improved.

In a possible implementation manner of the first aspect of the present application, the support structure abuts against the circuit board. In this way, the support points formed by the support structure are added between the base and the circuit board, except for the support points formed by the welding points between the pins and the circuit board. Thus, the support structure is able to share the stress concentrated at the end pads of the pins, thereby facilitating a reduction in stress concentration.

In a possible implementation manner of the first aspect of the present application, the supporting structures are symmetrically arranged along a middle line of the length direction of the board-to-board connector; and/or the support structure is symmetrical along a midline of the board-to-board connector in the width direction. Under the structure, the supporting structure forms a symmetrical structure, which is beneficial to the overall stress balance.

In a possible implementation manner of the first aspect of the present application, the support structure is provided in a plurality, and the plurality of support structures are distributed on a surface of the base facing the circuit board at intervals. With this structure, the supporting point between the circuit board and the board-to-board connector can be increased, thereby facilitating dispersion of stress to reduce stress concentration.

In a possible implementation manner of the first aspect of the present application, the supporting structures are provided with a plurality of groups, and the plurality of supporting structures are distributed along the length direction of the board-to-board connector at intervals, each group of supporting structures includes a plurality of supporting structures, and the plurality of supporting structures in each group of supporting structures are distributed along the width direction of the board-to-board connector at intervals. In this way, the plurality of support structures can be distributed in an array so as to form a plurality of support points uniformly distributed between the board-to-board connector and the circuit board.

In a possible implementation manner of the first aspect of the present application, the support structure includes an insulating layer, and the insulating layer is fixedly connected with the base. Under this structure, be favorable to reducing the relative fixed technology degree of difficulty of insulating layer and base, for example, the two can be through gluey, joint, threaded connection etc. mode fixed connection.

In a possible implementation manner of the first aspect of the present application, the insulating layer is made of the same material as the base, and the insulating layer is integrally formed with the base. Under this structure, be favorable to promoting the joint strength between insulating layer and the base to can promote overall structure's reliability.

In a possible implementation manner of the first aspect of the present application, the supporting structure includes a metal layer, and the metal layer is welded to the circuit board. With this structure, the supporting strength is facilitated to be improved by the metal material, thereby further improving the supporting reliability between the board-to-board connector and the circuit board.

In a possible implementation manner of the first aspect of the present application, the support structure further includes a metal transition layer, the metal transition layer is fixed on a surface of the base facing the circuit board, and the metal layer is fixed on a side of the metal transition layer away from the base. Under the structure, the metal transition layer can be formed on the surface of the base facing the circuit board through an electroless plating or sputtering process, so that the metal layer can be welded and fixed with the metal transition layer, and the connection strength is improved.

In a possible implementation manner of the first aspect of the present application, a plurality of clamping protrusions are provided on the base, the plurality of clamping protrusions are distributed along the edge of the metal layer at intervals, the clamping protrusions face the surface of the metal layer, and the edges of the metal layer are clamped into the clamping grooves. Under this structure, through the joint protruding with metal level joint on the base, be favorable to reducing technology degree of difficulty and cost.

In a possible implementation manner of the first aspect of the present application, two ends of at least some of the plurality of pins are welded and fixed with the circuit board. With this structure, the connection point between the board-to-board connector and the circuit board can be increased to disperse the overall structural stress, thereby facilitating the reduction of stress concentration.

In one possible implementation manner of the first aspect of the present application, the pin includes a first end, a second end, and a bending portion, along a width direction of the board-to-board connector, the bending portion is located between the first end and the second end, and the first end and the second end are welded and fixed with the circuit board. Under this structure, can increase the distance between first tip and the second tip to make the support point distribution between board to board connector and the circuit board more even, be favorable to the reliability of support more.

In a possible implementation manner of the first aspect of the present application, the pin further includes an extension portion, the extension portion is fixedly connected with the second end portion, and the extension portion extends to a side close to the first end portion, and the extension portion is welded and fixed with the circuit board. Under this structure, can increase the area of contact between board to board connector and the circuit board through the extension, further promote the support intensity between the two promptly, be favorable to further promoting the reliability of supporting.

In one possible implementation manner of the first aspect of the present application, the plurality of pins are divided into a plurality of groups, the plurality of groups of pins are sequentially distributed along a length direction of the board-to-board connector, each group of pins includes two pins, two pins in each group of pins are distributed along a width direction of the board-to-board connector, and two second ends in each group of first pins are located between two first ends.

In a possible implementation manner of the first aspect of the present application, the plug-in structure is a plug of a board-to-board connector or a socket of a board-to-board connector.

In a second aspect, a board-to-board connector plug structure is provided, the plug structure including a plurality of pins and a base. The pins are sequentially distributed at intervals, the pins are used for being welded and fixed with the circuit board, and two ends of each pin are welded and fixed with the circuit board. The pins are fixed on the base.

The board to board connector's of this application second aspect grafting structure through the both ends with partial pin all with circuit board welded fastening to increase the tie point between board to board connector and the circuit board, increased the strong point between the two promptly, thereby be favorable to sharing the atress, in order to reduce stress concentration, be favorable to promoting the mechanical fatigue reliability of solder joint department.

In one possible implementation manner of the second aspect of the present application, the pin includes a first end, a second end, and a bending portion, along a width direction of the board-to-board connector, the bending portion is located between the first end and the second end, and the first end and the second end are welded and fixed with the circuit board. Under this structure, can increase the distance between first tip and the second tip to make the support point distribution between board to board connector and the circuit board more even, be favorable to the reliability of support more.

In a possible implementation manner of the second aspect of the present application, the pin further includes an extension portion, the extension portion is fixedly connected with the second end portion, and the extension portion extends to a side close to the first end portion, and the extension portion is welded and fixed with the circuit board. Under this structure, can increase the area of contact between board to board connector and the circuit board through the extension, further promote the support intensity between the two promptly, be favorable to further promoting the reliability of supporting.

In one possible implementation manner of the second aspect of the present application, the plurality of pins are divided into a plurality of groups, the plurality of groups of pins are sequentially distributed along a length direction of the board-to-board connector, each group of pins includes two pins, two pins in each group of pins are distributed along a width direction of the board-to-board connector, and two second ends in each group of first pins are located between two first ends.

In a possible implementation manner of the second aspect of the present application, the plug-in structure is a plug of a board-to-board connector or a socket of a board-to-board connector.

In a third aspect, a board-to-board connector is provided that includes a plug and a receptacle. The plug is a plugging structure of the board-to-board connector according to any one of the technical schemes. The socket is matched with the plug in a plugging way.

In a fourth aspect, a board-to-board connector is provided that includes a receptacle and a plug. The socket is a plugging structure of the board-to-board connector according to any one of the technical schemes. The plug is in plug-in fit with the socket.

In a fifth aspect, a board-to-board connector is provided that includes a plug and a receptacle. The plug is a plugging structure of the board-to-board connector according to any one of the technical schemes. The socket is a plugging structure of the board-to-board connector according to any technical scheme; the socket is matched with the plug in a plugging way.

In a sixth aspect, an electronic device is provided that includes a housing, a circuit board, and a board-to-board connector. The circuit board is arranged in the shell. The board-to-board connector comprises the plugging structure of the board-to-board connector according to any one of the technical schemes, and pins of the board-to-board connector are welded and fixed with the circuit board.

In a seventh aspect, an electronic device is provided that includes a housing, a circuit board, and a board-to-board connector. The circuit board is arranged in the shell. The board-to-board connector comprises the plugging structure of the board-to-board connector according to any one of the first aspect, and the pins of the board-to-board connector are welded and fixed with the circuit board.

The board-to-board connector and the electronic device provided in the fourth to seventh aspects of the present application include the plugging structure of the board-to-board connector according to any one of the above technical aspects. Therefore, the same technical problems can be solved and the same technical effects can be obtained.

Drawings

Fig. 1 is a block diagram of an electronic device according to an embodiment of the present application;

fig. 2 is an exploded view of an electronic device according to an embodiment of the present application;

fig. 3 is a block diagram of a board-to-board connector according to an embodiment of the present application;

Fig. 4 is a structural diagram of connection between a motherboard and an FPC board through a board-to-board connector according to the embodiment of the present application;

fig. 5 is an effect diagram of a micro-drop simulation (plastic strain) of a plug of a board-to-board connector provided by the related art;

fig. 6 is an effect diagram of a micro-drop simulation (plastic strain) of a socket of a board-to-board connector provided by the related art;

FIG. 7 is an effect diagram of a micro-drop simulation (Mi Saisi stress) of the socket provided in FIG. 6;

fig. 8 is a front view of a plug of the board-to-board connector according to the embodiment of the present application;

FIG. 9 is a perspective view of the cross-sectional structure of the plug provided in FIG. 8;

FIG. 10 is a cross-sectional view of the plug provided in FIG. 8;

fig. 11 is a front view of another plug of the board-to-board connector provided in the embodiment of the present application;

FIG. 12 is a cross-sectional perspective view of the plug provided in FIG. 11;

fig. 13 is a front view of still another plug of the board-to-board connector provided in the embodiment of the present application;

FIG. 14 is a cross-sectional perspective view of the plug provided in FIG. 13;

FIG. 15 is a cross-sectional view of the plug provided in FIG. 13;

fig. 16 is a front view of still another plug of the board-to-board connector provided in the embodiment of the present application;

FIG. 17 is a cross-sectional perspective view of the plug provided in FIG. 16;

FIG. 18 is a cross-sectional view of the plug provided in FIG. 16;

FIG. 19 is a block diagram of a first support structure according to an embodiment of the present disclosure;

fig. 20 is an effect diagram of performing a micro-drop simulation on a first insulating layer according to an embodiment of the present application in an implementation manner of example one;

fig. 21 is an effect diagram of performing a micro-drop simulation on a first insulating layer according to an embodiment of the present application in a second implementation manner;

fig. 22 is an effect diagram of performing a micro-drop simulation on a first insulating layer according to an embodiment of the present application in an implementation manner of example three;

fig. 23 is an effect diagram of performing a micro-drop simulation on a first insulating layer according to an embodiment of the present application in a fourth implementation manner;

FIG. 24 is a block diagram of another first support structure provided in an embodiment of the present application;

FIG. 25 is a block diagram illustrating another fixing manner of the first metal layer according to the embodiment of the present application;

FIG. 26 is an effect diagram of performing a micro-drop simulation on a first metal layer according to an embodiment of the present disclosure in an implementation manner of example one;

fig. 27 is an effect diagram of performing a micro-traumatic simulation on a first metal layer according to an embodiment of the present application in a second implementation manner;

FIG. 28 is an effect diagram of a first metal layer provided in an embodiment of the present application in performing a micro-drop simulation in an implementation of example three;

Fig. 29 is an effect diagram of performing a micro-drop simulation on a first metal layer according to an embodiment of the present application in an implementation manner of example four;

fig. 30 is a block diagram of a first pin of a plug provided in the related art;

fig. 31 is a structural diagram of a first pin of a plug according to an embodiment of the present application;

fig. 32 is a block diagram of another first pin of the plug according to the embodiment of the present application;

FIG. 33 is an effect diagram of a micro-drop simulation of a plug provided in the related art (including the first pin provided in FIG. 30);

fig. 34 is a graph of a micro-drop simulation effect of a plug provided in an embodiment of the present application (including the first pin provided in fig. 31 or fig. 32);

fig. 35 is a block diagram of a receptacle of the board-to-board connector provided in the present application;

fig. 36 is a perspective view of a cross-sectional structure of the receptacle provided in fig. 35;

FIG. 37 is a cross-sectional view of the receptacle provided in FIG. 35;

fig. 38 is a block diagram of another receptacle of the board-to-board connector provided in the present application;

FIG. 39 is a cross-sectional perspective view of the receptacle provided in FIG. 38;

FIG. 40 is a cross-sectional view of the receptacle provided in FIG. 38;

fig. 41 is a block diagram of yet another receptacle of the board-to-board connector provided herein;

fig. 42 is a perspective view of a cross-sectional structure of the receptacle provided in fig. 41;

FIG. 43 is a cross-sectional view of the receptacle provided in FIG. 41;

fig. 44 is a block diagram of yet another receptacle of the board-to-board connector provided herein;

FIG. 45 is a perspective view of the cross-sectional structure of the receptacle provided in FIG. 44;

FIG. 46 is a cross-sectional view of the receptacle provided in FIG. 44;

fig. 47 is a block diagram of yet another receptacle of the board-to-board connector provided herein;

FIG. 48 is a cross-sectional view of the receptacle provided in FIG. 47;

FIG. 49 is a block diagram of a second support structure provided in an embodiment of the present application;

fig. 50 is an effect diagram of performing a micro-drop simulation on a second insulating layer according to an embodiment of the present application in an implementation manner of example five;

fig. 51 is an effect diagram of performing a micro-drop simulation on a second insulating layer according to an embodiment of the present application in a sixth implementation manner;

fig. 52 is an effect diagram of performing a micro-drop simulation on the second insulating layer according to the embodiment of the present application in an implementation manner of example seven;

fig. 53 is an effect diagram of performing a micro-drop simulation on the second insulating layer according to the embodiment of the present application in an implementation manner of example eight;

fig. 54 is an effect diagram of performing a micro-drop simulation on the second insulating layer according to the embodiment of the present application in an implementation manner of example nine;

FIG. 55 is a block diagram of another second support structure provided in an embodiment of the present application;

FIG. 56 is a block diagram of another fixing method of the second metal layer according to the embodiment of the present application;

FIG. 57 is an effect diagram of a second metal layer provided in an embodiment of the present application in performing a micro-drop simulation in an implementation manner of example five;

FIG. 58 is an effect diagram of a second metal layer provided in an embodiment of the present application performing a micro-drop simulation in an implementation of example six;

FIG. 59 is an effect diagram of a second metal layer provided in an embodiment of the present application performing a micro-drop simulation in an implementation of example seven;

FIG. 60 is an effect diagram of a second metal layer provided in an embodiment of the present application performing a micro-drop simulation in an implementation of example eight;

fig. 61 is an effect diagram of performing a micro-traumatic simulation on a second metal layer according to an embodiment of the present application in an implementation manner of example nine;

fig. 62 is a block diagram of another socket provided by the related art;

FIG. 63 is an effect diagram of a micro-sag simulation (plastic strain) of the socket provided in FIG. 62;

FIG. 64 is an effect diagram of a micro-drop simulation (Mi Saisi stress) of the receptacle provided in FIG. 62;

fig. 65 is a flow chart of a design idea of the board-to-board connector according to the embodiment of the application.

Reference numerals: 01-an electronic device; 10-a display module; 11-a light-transmitting cover plate; 12-a display screen; 20-a housing; 21-a rear cover; 22-frame; 23-middle plate; 30-an electronic device; 40-a circuit board; 41-a main board; 42-FPC board; 50-board-to-board connectors; 50 a-a plug-in structure; 51-welding spots; 52-pins; 53-a base; 54-a support structure; 100-plug; 110-a first pin; 111-a first end; 112-a second end; 113-a bend; 114-an extension; 120-a first base; 121-a first surface; 121 a-a first midline; 121 b-a second midline; 130-a first support structure; 131-a first insulating layer; 132-a first metal layer; 133-a first metal transition layer; 134-first snap-in projection; 134 a-a first snap-in groove; 200-socket; 210-a second pin; 220-a second base; 221-a second surface; 221 a-a third midline; 221 b-fourth midline; 230-a second support structure; 231-a second insulating layer; 232-a second metal layer; 233-a second metal transition layer; 234-a second snap-on tab; 234 a-second snap-in groove.

Detailed Description

The following description of the technical solutions in the embodiments of the present application will be made with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, but not all embodiments.

Hereinafter, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature.

Furthermore, in this application, directional terms "upper", "lower", etc. are defined with respect to the orientation in which the components are schematically disposed in the drawings, and it should be understood that these directional terms are relative concepts, which are used for description and clarity with respect thereto, and which may be varied accordingly with respect to the orientation in which the components are disposed in the drawings.

In the present application, unless explicitly specified and limited otherwise, the term "coupled" is to be construed broadly, and for example, "coupled" may be either fixedly coupled, detachably coupled, or integrally formed; can be directly connected or indirectly connected through an intermediate medium.

The embodiment of the application provides electronic equipment, which is one type of electronic equipment with a shooting function. In particular, the electronic device may be a portable electronic apparatus or other type of electronic apparatus. For example, the electronic device may be a cell phone, a tablet (tablet personal computer), a laptop (laptop computer), a personal digital assistant (personal digital assistant, PDA), a monitor, a camera, a personal computer, a notebook computer, a vehicle device, a wearable device, augmented reality (augmented reality) glasses, AR helmets, virtual Reality (VR) glasses, VR helmets, or the like. For convenience of explanation, the following will take an electronic device as an example of a mobile phone.

As can be seen from the above, referring to fig. 1 and 2, fig. 1 is a block diagram of an electronic device 01 according to an embodiment of the present application, and fig. 2 is an exploded view of the electronic device 01 according to an embodiment of the present application. In this embodiment, the electronic device 01 is a mobile phone, and the electronic device 01 may be approximately rectangular plate-shaped. The electronic apparatus 01 may include a display module 10, a housing 20, an electronic device 30, and a circuit board 40.

It will be appreciated that fig. 1 and 2 only schematically illustrate some of the components comprised by the electronic device 01, the actual shape, actual size, actual location and actual configuration of which are not limited by fig. 1 and 2.

The display module 10 is used for displaying images, videos, and the like. The display module 10 may include a transparent cover 11 and a display 12, and the transparent cover 11 and the display 12 (english name: panel, also referred to as display panel) are stacked together, where the transparent cover 11 and the display 12 are stacked together. The material of the transparent cover plate 11 includes, but is not limited to, glass. For example, the transparent cover plate 11 may employ a general transparent cover plate 11 for protecting the display screen 12 from damage caused by external force and for preventing dust. The light-transmitting cover plate 11 with the touch function can also be adopted, so that the electronic device 01 has the touch function, and the use of a user is more convenient. Therefore, the specific material of the light-transmitting cover plate 11 is not particularly limited in this application.

In addition, the display 12 may be a flexible display or a rigid display. For example, the display 12 may be an organic light-emitting diode (OLED) display, an active-matrix organic light-emitting diode (AMOLED) display, a mini-led (mini organic light-emitting diode) display, a micro-led (micro organic light-emitting diode) display, a micro-organic led (micro organic light-emitting diode) display, a quantum dot led (quantum dot light emitting diode, QLED) display, a liquid crystal display (liquid crystal display, LCD).

The above-described case 20 is used to protect the electronic device 30 inside the electronic apparatus 01. The housing 20 may include a rear cover 21 and a bezel 22, wherein the rear cover 21 is located at a side of the display screen 12 away from the transparent cover 11, and is stacked with and spaced apart from the transparent cover 11 and the display screen 12, and the bezel 22 is located between the transparent cover 11 and the rear cover 21. The frame 22 is fixed on the rear cover 21, and the frame 22 may be fixedly connected to the rear cover 21 by means of bonding, threaded connection, welding, clamping, etc., or the frame 22 and the rear cover 21 may be integrally formed, i.e. the frame 22 and the rear cover 21 are integrally formed. The transparent cover 11 may be fixed on the frame 22 by gluing, so that the transparent cover 11, the rear cover 21 and the frame 22 enclose a housing cavity inside the electronic device 01, and the electronic devices 30 are all disposed in the housing cavity.

In some embodiments, the housing 20 may further include a middle plate 23, where the middle plate 23 is disposed in the accommodating cavity, and the middle plate 23 is located on a side of the display screen 12 away from the transparent cover 11. The middle plate 23 is fixedly connected with the frame 22 to form a middle frame of the electronic device 01, and the middle plate 23 and the frame 22 can be fixedly connected in a manner of gluing, threaded connection, welding, clamping connection and the like, or the middle plate 23 and the frame 22 can be in an integrated structure, namely, the middle plate and the frame 22 are integrated into a whole. The middle plate 23 divides the accommodating cavity into two mutually independent spaces, one of which is located between the light-transmitting cover plate 11 and the middle plate 23, and the display screen 12 is located in the space. Another space is located between the middle plate 23 and the rear cover 21, and the circuit board 40 may be located in this space.

The electronic device 30 described above is used to realize various use functions of the electronic apparatus 01. The electronic device 30 may include a camera module, a flash module, a battery module, a speaker module, and the like. The electronic device 01 is provided with functions such as photographing, light supplementing, power supplying, and audio playing by the electronic devices 30.

The circuit board 40 is used to make electrical connection between the individual electronic devices 30. The circuit board 40 may include a first circuit board and a second circuit board. Illustratively, the first circuit board may be a motherboard 41 of the electronic device 01, and a portion of the electronic devices 30 are disposed on the motherboard 41 to achieve electrical connection between the electronic devices 30. The second circuit board may be an FPC board 42 (flexible printed circuit, flexible circuit board), and electrical connection between some electronic devices 30 not provided on the main board 41 and the main board 41 may be achieved through the FPC board 42. For example, the electronic device 30 may be a camera module, where the electronic device 30 is electrically connected to one end of the FPC board 42, and the other end of the FPC board 42 is electrically connected to the motherboard 41, so as to achieve electrical connection between the electronic device 30 and the motherboard 41. Hereinafter, description will be made taking a first circuit board as a main board 41 and a second circuit board as an FPC board 42 as an example.

The FPC board 42 and the motherboard 41 may be electrically connected by direct soldering. Alternatively, the electrical connection may be implemented by the board-to-board connector 50, referring to fig. 3, fig. 3 is a block diagram of the board-to-board connector 50 according to the embodiment of the present application. The board-to-board connector 50 can improve the assembly process of the electronic product, simplify the mass production process, and improve the production efficiency. And it has advantages such as higher connection reliability, higher transmission speed, change simple and volume are less. Accordingly, the board-to-board connector 50 is widely used in the electronic field.

The board-to-board connector 50 includes two plugging structures 50a, the plugging structures 50a may include a plurality of pins 52 and a base 53, the plurality of pins 52 are sequentially spaced apart and fixed on the base 53, and the pins 52 are used for being soldered with the circuit board 40 shown in fig. 2. Each of the plugging structures 50a is soldered to one of the circuit boards 40 via the pins 52, i.e. one of the plugging structures 50a is soldered to the main board 41, and the other plugging structure 50a is soldered to the FPC board 42. The two plugging structures 50a are plugged with each other, and the pins 52 on the two plugging structures 50a are abutted with each other, so that electrical connection is realized, and further electrical connection between the main board 41 and the FPC board 42 can be realized.

For convenience of description of the embodiments below, an XYZ coordinate system is established defining the width direction of the board-to-board connector 50 as the X-axis direction, the length direction of the board-to-board connector 50 as the Y-axis direction, and the thickness direction of the board-to-board connector 50 as the Z-axis direction. The thickness direction of the board-to-board connector 50 is the distribution direction of the two plugging structures 50a of the board-to-board connector 50, and is also the relative movement direction of the two plugging structures. In a plane perpendicular to the thickness direction of the board-to-board connector 50, the extending direction of the edge of the board-to-board connector 50 whose size is longer is the length direction, and the extending direction of the edge of the board-to-board connector 50 whose size is shorter is the thickness direction.

It will be appreciated that the XYZ coordinate system of the board-to-board connector 50 described above may be flexibly set according to actual needs, and this application is given only as a possible example and is not to be construed as a particular limitation of the present application.

In some embodiments, the two mating structures 50a of the board-to-board connector 50 may be referred to as a male and a female, respectively. Alternatively, it may be referred to as a plug and a socket. Therefore, the present application is not particularly limited thereto. The following description will take two plug structures 50a, which are called a plug and a socket, as an example.

Specifically, referring to fig. 4, fig. 4 is a structural diagram of connection between a motherboard 41 and an FPC board 42 through a board-to-board connector 50 according to the embodiment of the present application. The board-to-board connector 50 includes a plug 100 and a socket 200, wherein the plug 100 is fixedly connected to the FPC board 42, and the corresponding socket 200 is fixedly connected to the motherboard 41. In other possible examples, the plug 100 may be fixedly connected to the motherboard 41, and the corresponding jack 200 may be fixedly connected to the FPC board 42. Therefore, the present application is not particularly limited thereto.

In the following embodiments, the plug 100 is fixed to the FPC board 42, and the corresponding jack 200 is fixed to the motherboard 41.

The plug 100 includes a plurality of first pins 110 and a first base 120, the plurality of first pins 110 are fixed on the first base 120, the socket 200 includes a plurality of second pins 210 and a second base 220, and the plurality of second pins 210 are fixed on the second base 220.

The socket 200 of the board-to-board connector 50 is fixed on the motherboard 41, that is, the second pins 210 are welded and fixed with the motherboard 41 and electrically connected; the plug 100 of the board-to-board connector 50 is fixed to an end of the FPC board 42 remote from the electronic device 30 shown in fig. 2, i.e., the first pins 110 are soldered to and electrically connected with the FPC board 42. Then, the plug 100 and the socket 200 of the board-to-board connector 50 are plugged with each other, and the first pins 110 and the corresponding second pins 210 are abutted with each other, so that the FPC board 42 is electrically connected with the motherboard 41, and signals are transmitted between the electronic device 30 and the motherboard 41.

At present, referring to fig. 4, the first pins 110 on the plug 100 are soldered to the FPC board 42, and the second pins 210 on the jack 200 are soldered to the motherboard 41 between the plug 100 and the FPC board 42 and between the jack 200 and the motherboard 41. Accordingly, the support point between the plug 100 and the FPC board 42 is caused to be the solder joint 51 at the first pin 110, and the support point between the socket 200 and the motherboard 41 is caused to be the solder joint 51 at the second pin 210.

In this way, stress concentration occurs at the first pin 110 and the second pin 210. Referring to fig. 5, 6, and 7, fig. 5 is an effect diagram of the micro-drop simulation (plastic strain) of the plug 100 of the board-to-board connector 50 provided by the related art, fig. 6 is an effect diagram of the micro-drop simulation (plastic strain) of the socket 200 of the board-to-board connector 50 provided by the related art, and fig. 7 is an effect diagram of the micro-drop simulation (Mi Saisi stress) of the socket 200 provided by fig. 6. In the effect graph, dark areas (or darker areas) indicate normal stress, and light areas (or lighter areas) indicate stress concentration. And the lighter the color, the more severe the stress concentration.

As can be seen from fig. 5 to 7, the maximum cumulative plastic strain of the solder joint 51 of the plug 100 of the board-to-board connector 50 provided by the related art is 7.32E-2, the maximum cumulative plastic strain of the solder joint 51 of the socket 200 is 9.08E-2, and the maximum Mi Saisi stress of the second pin 210 of the socket 200 is 86.4Mpa. The stress concentration at the weld 51 is high and the risk of mechanical fatigue is high.

The electronic device 01 is subjected to external force impact of different degrees in daily use, for example, the device falls, bumps and the like. At this time, there is a possibility that the solder joint 51 may crack at a position where stress is concentrated to cause an open circuit, so that a part of functions of the electronic device 01 may fail (for example, the camera module may fail, so that shooting cannot be performed), which affects product quality and user experience.

Based on this, the embodiment of the present application provides a plugging structure 50a of a board-to-board connector, where the plugging structure 50a includes a plurality of pins and a base shown in fig. 3. Furthermore, the plugging structure 50a provided in the embodiment of the present application further includes a supporting structure. The plug structures 50a are exemplified as plugs and receptacles, respectively, as follows.

Referring to fig. 8, 9 and 10, fig. 8 is a front view of a plug 100 of the board-to-board connector 50 according to the embodiment of the present application, fig. 9 is a perspective view of a cross-sectional structure of the plug 100 of fig. 8, and fig. 10 is a cross-sectional view of the plug 100 of fig. 8. The plug 100 may include a plurality of first pins 110, a first base 120, and a first support structure 130.

With continued reference to fig. 8, 9 and 10, the plurality of first pins 110 are sequentially spaced apart from one another. For example, the plurality of first pins 110 may be divided into a plurality of groups, the plurality of groups of first pins 110 are sequentially and alternately distributed along the Y-axis direction, each group of first pins 110 includes two first pins 110, two first pins 110 in each group of first pins 110 are distributed along the X-axis direction, and in the XY plane, two first pins 110 in each group of first pins 110 are symmetrically arranged along a center line parallel to the Y-axis direction. One end of the first pin 110 is soldered to the FPC board 42, thereby electrically connecting the first pin. Another portion of the first pin 110 extends into the corresponding socket 200 and is electrically connected.

The surface of the first base 120 far away from the corresponding socket 200 is a first surface 121, that is, the first surface 121 faces the FPC board 42, and the plurality of first pins 110 are fixed on the first base 120. The first support structure 130 is disposed between the first surface 121 of the first base 120 and the FPC board 42, and the first support structure 130 is fixed on the first surface 121 and covers at least a portion of the first surface 121.

Based on this, when the electronic apparatus 01 is impacted, since the first support structure 130 is provided between the FPC board 42 and the first base 120, that is, the first support structure 130 can reduce the distance between the first surface 121 of the first base 120 and the FPC board 42. Therefore, when the relative position of the overall structure changes due to external impact, the FPC board 42 may be first abutted against the first support structure 130, i.e. the first support structure 130 can support the FPC board 42 to offset part of the acting force, so as to disperse the stress concentration at the end of the first pin 110, thereby being beneficial to reducing the risk of open circuit caused by cracking of the solder joint 51 between the end of the first pin 110 and the FPC board 42, and improving the connection reliability between the FPC board 42 and the plug 100.

In some embodiments, the first support structure 130 may also abut the FPC board 42. Thereby enabling the first support structure 130 to form further support for the FPC board 42, which is advantageous for further reducing the risk of cracking the solder joints 51 between the first pins 110 and the FPC board 42. In the following embodiments, the first support structure 130 is abutted against the FPC board 42.

In this way, since the first supporting structure 130 is abutted between the first base 120 and the FPC board 42, that is, except for the supporting point formed by the solder points 51 between the first pins 110 and the FPC board 42, the supporting point formed by the first supporting structure 130 is added between the first base 120 and the FPC board 42. Accordingly, the first support structure 130 is capable of sharing the stress concentrated at the end pads 51 of the first pins 110, thereby facilitating a reduction in stress concentration to reduce the risk of cracking at the pads 51 of the first pins 110 resulting in an open circuit, facilitating a lifting of the connection reliability between the plug 100 of the board-to-board connector 50 and the FPC board 42.

Wherein, in order to make the first support structure 130 form a support between the plug 100 and the FPC board 42, the overall stress is balanced. The first support structures 130 may be symmetrically disposed along a centerline (hereinafter referred to as a first centerline 121 a) of the first surface 121 that is parallel to the X-axis direction, and symmetrically disposed along a centerline (hereinafter referred to as a second centerline 121 b) of the first surface 121 that is parallel to the Y-axis direction. In this way, the first support structure 130 is better balanced between the first base 120 and the FPC board 42, so as to improve the reliability of the overall support.

In some examples, the first support structure 130 may cover the entire area of the first surface 121, or may cover only a partial area of the first surface 121. The following are each illustrated by several different implementations.

For example, referring to fig. 8-10, the first support structure 130 may be covered on the area between the two rows of the first pins 110 distributed along the Y-axis direction, and the first support structure 130 extends from one end to the other end of the plug 100 along the Y-axis direction. And, the first support structure 130 is symmetrically disposed along both the first and second midlines 121a and 121 b. Namely, the first support structures 130 are arranged in the area between any two first pins 110 distributed along the X direction, so that the stress at the welding points 51 between each group of first pins 110 and the FPC board 42 can be shared, and the reliability of the whole structure is improved.

For example, referring to fig. 11 and 12, fig. 11 is a front view of another plug 100 of the board-to-board connector 50 according to the embodiment of the present application, and fig. 12 is a cross-sectional perspective view of the plug 100 according to fig. 11. Wherein fig. 11 provides a cross-sectional view of the plug 100 that is the same as the cross-sectional structure shown in fig. 10.

In this example, the first support structure 130 may be disposed on the first surface 121 along a central region in the Y-axis direction, i.e., the first support structure 130 covers the central region of the first surface 121. And the first support structure 130 is symmetrically disposed along both the first and second midlines 121a and 121 b.

Referring to fig. 13, 14 and 15, fig. 13 is a front view of a further plug 100 of the board-to-board connector 50 according to the embodiment of the present application, fig. 14 is a perspective view of a cross-sectional structure of the plug 100 according to fig. 13, and fig. 15 is a cross-sectional view of the plug 100 according to fig. 13.

In this example, two first support structures 130 may be disposed on the first surface 121 at both end regions in the Y-axis direction, and the two first support structures 130 extend in the X-axis direction, i.e., the two first regions cover both end regions of the first surface 121 in the Y-axis direction. And, two first support structures 130 are symmetrically disposed along the first center line 121a, and each first support structure 130 is symmetrically disposed along the second center line 121 b.

Referring to fig. 16, 17 and 18, fig. 16 is a front view of a further plug 100 of the board-to-board connector 50 according to the embodiment of the present application, fig. 17 is a perspective view of a cross-sectional structure of the plug 100 of fig. 16, and fig. 18 is a cross-sectional view of the plug 100 of fig. 16.

In this example, two first support structures 130 may be disposed on the first surface 121 at intervals along both sides of the X-axis direction, and the two first support structures 130 extend from one end to the other end of the plug 100 along the Y-axis direction, that is, the two first support structures 130 cover both side regions of the first surface 121 along the X-axis direction. And, two first support structures 130 are symmetrically disposed along the second center line 121b, and each first support structure 130 is symmetrically disposed along the first center line 121 a.

In other examples, a plurality of first support structures 130 may also be disposed on the first surface 121, where the plurality of first support structures 130 are spaced apart on the first surface 121. Also, the plurality of first support structures 130 may be uniformly and regularly distributed on the first surface 121 in an array, for example. Alternatively, the plurality of first support structures 130 may be randomly distributed in an irregular manner over the first surface 121. Therefore, the present application is not particularly limited thereto.

In addition, the first support structure 130 may be made of different materials. In one possible example, referring to fig. 19, fig. 19 is a block diagram of a first support structure 130 according to an embodiment of the present application. The first support structure 130 may include a first insulating layer 131, where the first insulating layer 131 may be fixed on the first surface 121 by an adhesive, a clamping connection, or a screwing connection. Alternatively, the first insulating layer 131 may be made of the same plastic material as the first base 120, and the first insulating layer 131 and the first base 120 may be integrally formed.

Based on this, the plug 100 provided with the above-described first insulating layer 131 (the implementation includes the above-described examples one to four) is subjected to the slump simulation. Referring to fig. 20, 21, 22 and 23, fig. 20 is an effect diagram of performing a micro-drop simulation on the first insulating layer 131 provided in the embodiment of the present application in an implementation manner of example one, fig. 21 is an effect diagram of performing a micro-drop simulation on the first insulating layer 131 provided in the embodiment of the present application in an implementation manner of example two, fig. 22 is an effect diagram of performing a micro-drop simulation on the first insulating layer 131 provided in the embodiment of the present application in an implementation manner of example three, and fig. 23 is an effect diagram of performing a micro-drop simulation on the first insulating layer 131 provided in the embodiment of the present application in an implementation manner of example four.

And, the above simulation results were compared with the plug 100 (simulation result shown in fig. 5) provided in the related art, and the comparison results are shown in table 1.

TABLE 1

As can be seen from table 1, after the first insulating layer 131 made of plastic material is disposed on the first surface 121 of the plug 100, compared with the related art, plastic strain at the solder joint 51 of the first pin 110 is reduced, so that the risk of cracking the solder joint 51 to cause an open circuit is reduced.

In another possible example, referring to fig. 24, fig. 24 is a block diagram of another first support structure 130 according to an embodiment of the present application. The first support structure 130 may include a first metal layer 132, and the first metal layer 132 is welded to the FPC board 42. For example, the first metal layer 132 may be a pad, and is soldered to the FPC board 42. Therefore, the metal material has higher strength, so that the support strength is further improved. In addition, the first metal layer 132 is welded and fixed with the FPC board 42, which is beneficial to further improving the connection strength between the plug 100 and the FPC board 42.

The first metal layer 132 and the first base 120 may be fixedly connected by welding. Illustratively, the first support structure 130 may further include a first metal transition layer 133, i.e., the first metal transition layer 133 is formed on the first surface 121 of the first susceptor 120 through an electroless plating or sputtering process. Then, the first metal layer 132 is welded and fixed on the surface of the first metal transition layer 133 away from the first surface 121, so as to realize the fixed connection between the first metal layer 132 and the first base 120.

Alternatively, the first metal layer 132 and the first base 120 may be fixedly connected by a clamping manner. Referring to fig. 25, fig. 25 is a schematic diagram illustrating another fixing manner of the first metal layer 132 according to an embodiment of the present application. The first support structure 130 may further include a plurality of first clamping protrusions 134, the plurality of first clamping protrusions 134 are distributed at intervals along the edge of the first metal layer 132, the first clamping protrusions 134 face the surface of the first metal layer 132, and the edges of the first metal layer 132 are clamped into the first clamping grooves 134 a. Thereby realizing the clamping and fixing of the first metal layer 132 through the plurality of first clamping bulges 134.

Moreover, the first clamping protrusion 134 may be made of the same material as the first base 120, and the first clamping protrusion 134 may be integrally formed with the first base 120, thereby being beneficial to further improving the overall connection strength.

Based on this, the plug 100 provided with the first metal layer 132 (the implementation manner includes the first to fourth examples) is subjected to the micro-drop simulation, please refer to fig. 26, 27, 28 and 29, fig. 26 is an effect diagram of the first metal layer 132 provided in the embodiment of the present application in the first example implementation manner, fig. 27 is an effect diagram of the first metal layer 132 provided in the embodiment of the present application in the second example implementation manner, fig. 28 is an effect diagram of the first metal layer 132 provided in the embodiment of the present application in the third example implementation manner, and fig. 29 is an effect diagram of the first metal layer 132 provided in the embodiment of the present application in the fourth example implementation manner.

And, the above simulation results were compared with the plug 100 (simulation result shown in fig. 5) provided in the related art, and the comparison results are shown in table 2.

TABLE 2

As can be seen from table 2, after the first metal layer 132 made of the metal material is disposed on the first surface 121 of the plug 100 in different areas, compared with the related art, plastic strain at the solder joint 51 of the first pin 110 is advantageously reduced, so that the risk of cracking the solder joint 51 to cause an open circuit is advantageously reduced.

On the basis, in the plug 100 provided in the related art, only one end portion of the first pin 110 is used for being welded and fixed with the FPC board 42, referring to fig. 30, fig. 30 is a structural diagram of the first pin 110 of the plug 100 provided in the related art.

In order to improve the supporting strength between the plug 100 and the FPC board 42, the plug 100 provided in the embodiment of the present application may further reduce the problem of stress concentration by increasing the structure of the solder joint 51 between the first pin 110 and the FPC board 42. Referring to fig. 31, fig. 31 is a block diagram of a first pin 110 of a plug 100 according to an embodiment of the present application.

Wherein, two ends of at least part of the first pins 110 in the plurality of first pins 110 may be welded and fixed with the FPC board 42, and a middle area of the first pins 110 is used for plugging with the socket 200. To achieve an increase in the solder joint 51 between the first pin 110 of the plug 100 and the FPC board 42, stresses can be dispersed, thereby facilitating a reduction in stress concentrations, and the risk of cracking of the solder joint 51 between the first pin 110 and the FPC board 42 leading to an open circuit can be reduced.

Specifically, the first pin 110 may include a first end 111, a second end 112, and a bent portion 113, where the second end 112 is located at a side of the bent portion 113 away from the first end 111. For example, the bent portion 113 may form an approximately "U" structure, and the first end 111 and the second end 112 are respectively located at two free ends of the "U" structure, so that both the first end 111 and the second end 112 of the first pin 110 can be welded and fixed with the FPC board 42.

In this way, the pad 51 between the first pin 110 and the FPC board 42 is increased, i.e., the supporting point between the plug 100 and the FPC board 42 is increased. Therefore, when the first pin 110 is impacted by external force, the risk of stress concentration of a certain supporting point can be reduced, namely, the risk of open circuit caused by cracking of the welding point 51 between the first pin 110 and the FPC board 42 is reduced.

In some examples, referring to fig. 32, fig. 32 is a block diagram of another first pin 110 of the plug 100 according to the embodiment of the present application. The first pin 110 may further include an extension portion 114, where the extension portion 114 is fixedly connected to the second end 112, and the extension portion 114 extends to a side close to the first end 111, and the extension portion 114 is welded and fixed to the FPC board 42. That is, by providing the extension 114 at the second end 112, the contact area between the plug 100 and the FPC board 42 is advantageously further increased to increase the supporting strength, thereby further reducing the risk of solder cracking.

In addition, a part of the plurality of first pins 110 may have a structure in which both ends are welded to the FPC board 42, and another part of the plurality of first pins 110 has a structure in which one end is welded to the FPC board 42. Alternatively, all of the plurality of first pins 110 may be welded to the FPC board 42 at both ends. Therefore, the present application is not particularly limited thereto.

Based on this, the plug 100 (a structure in which only one end of the first pin 110 is soldered to the FPC board 42) provided in the related art, and the plug 100 provided with the first pin 110 (a structure in which both ends of the first pin 110 are soldered to the FPC board 42) were subjected to a slight drop simulation. Referring to fig. 33 and 34, fig. 33 is an effect diagram of a micro-drop simulation of a plug 100 (including a first pin 110 provided in fig. 30) provided in the related art, and fig. 34 is an effect diagram of a micro-drop simulation of a plug 100 (including a first pin 110 provided in fig. 31 or 32) provided in an embodiment of the present application. And, the simulation results of the two are compared, and the comparison results are shown in Table 3.

TABLE 3 Table 3

As can be seen from table 3, the two ends of the first pin 110 of the plug 100 are welded and fixed to the FPC board 42, which is advantageous to reduce the plastic strain at the solder joint 51 of the first pin 110 compared with the related art, thereby reducing the risk of cracking the solder joint 51 to cause an open circuit.

In summary, the first supporting structure 130 is disposed between the plug 100 and the FPC board 42 of the board-to-board connector 50, which is beneficial to increasing the contact area between the plug 100 and the FPC board 42, so as to increase the supporting strength, thereby reducing the occurrence of stress concentration of the solder joint 51 between the first pin 110 of the plug 100 and the FPC board 42, and reducing the risk of cracking the solder joint 51 between the first pin 110 of the plug 100 and the FPC board 42 to cause an open circuit.

To further improve the connection reliability of the board-to-board connector 50 between the FPC board 42 and the main board 41. Referring to fig. 35, 36 and 37, fig. 35 is a structural diagram of a socket 200 of the board-to-board connector 50 provided in the present application, fig. 36 is a perspective view of a cross-sectional structure of the socket 200 provided in fig. 35, and fig. 37 is a cross-sectional view of the socket 200 provided in fig. 35. The socket 200 is fixedly connected to the main board 41. The socket 200 may include a plurality of second pins 210, a second base 220, and a second support structure 230.

The plurality of second pins 210 are sequentially spaced apart from each other. For example, the plurality of second pins 210 may be divided into a plurality of groups, the plurality of groups of second pins 210 are sequentially spaced apart along the Y-axis direction, each group of second pins 210 includes two second pins 210, two second pins 210 in each group of second pins 210 are distributed along the X-axis direction, and in the XY plane, two second pins 210 in each group of second pins 210 are symmetrically arranged along a central line parallel to the Y-axis direction. One end of the second pin 210 is welded to the main board 41, so as to be electrically connected. The plug 100 is inserted into the socket 200, and the first pin 110 of the plug 100 and the second pin 210 of the socket 200 are plugged with each other, and an electrical connection is achieved.

The second surface 221 of the second base 220 away from the corresponding plug 100 is a second surface 221, that is, the second surface 221 faces the main board 41, and the plurality of second pins 210 are fixed on the first base 120. The second support structure 230 is disposed between the second surface 221 of the second base 220 and the main board 41, and the second support structure 230 is fixed on the second surface 221 and covers at least a partial area of the second surface 221.

Based on this, when the electronic apparatus 01 is impacted, since the second support structure 230 is provided between the main board 41 and the second base 220, that is, the second support structure 230 can reduce the distance between the second surface 221 of the second base 220 and the main board 41. Therefore, when the overall structure changes in relative position due to external impact, the main board 41 may be first abutted against the second supporting structure 230, i.e. the second supporting structure 230 can support the main board 41 to offset part of the acting force, so as to disperse the stress concentration at the end of the second pin 210, thereby being beneficial to reducing the risk of open circuit caused by cracking of the solder joint 51 between the end of the second pin 210 and the main board 41, and improving the connection reliability between the main board 41 and the socket 200.

In some embodiments, the second support structure 230 may also abut against the main board 41. Thereby enabling the second support structure 230 to form a further support for the motherboard 41, which is advantageous for further reducing the risk of cracking the solder joints 51 between the second pins 210 and the motherboard 41. In the following embodiments, the second support structure 230 is abutted to the main board 41.

In this way, since the second support structure 230 is abutted between the second base 220 and the motherboard 41, that is, except for the supporting point formed by the solder joint 51 between the second lead 210 and the motherboard 41, the supporting point formed by the second support structure 230 is added between the second base 220 and the motherboard 41. Accordingly, the second support structure 230 is capable of sharing the stress concentrated at the end pads 51 of the second pins 210, thereby facilitating a reduction in stress concentration to reduce the risk of cracking at the pads 51 of the second pins 210 to cause an open circuit, and facilitating a lifting of the connection reliability between the socket 200 of the board-to-board connector 50 and the motherboard 41.

Wherein, in order to make the second support structure 230 form a support between the socket 200 and the main board 41, the whole stress is balanced. With continued reference to fig. 35, 36 and 37, the second support structure 230 provided in the embodiment of the present application may be symmetrically disposed along a central line (hereinafter referred to as a third central line 221 a) parallel to the X-axis direction on the second surface 221, and symmetrically disposed along a central line (hereinafter referred to as a fourth central line 221 b) parallel to the Y-axis direction on the second surface 221. In this way, the second support structure 230 is better balanced between the second base 220 and the main board 41, so as to improve the reliability of the overall support.

In some examples, the first support structure 130 may cover the entire area of the second surface 221, or may cover only a partial area of the second surface 221. The following are each illustrated by several different implementations.

With continued reference to fig. 35, 36 and 37, the second support structure 230 may be covered on the region between the two rows of second pins 210 distributed along the Y-axis direction, and the second support structure 230 extends from one end to the other end of the socket 200 along the Y-axis direction. And, the second support structure 230 is symmetrically disposed along both the third and fourth midlines 221a and 221 b. That is, the second supporting structures 230 are disposed between any two second pins 210 distributed in the X direction, so that stress at the solder joints 51 between each group of second pins 210 and the motherboard 41 can be shared, so as to improve the reliability of the overall structure.

It should be noted that, the middle of the second surface 221 may have a partially hollowed-out area, and the second support structure 230 only covers a solid area on the second surface 221, and the hollowed-out area does not need to be provided with the second support structure 230.

For example, referring to fig. 38, 39 and 40, fig. 38 is another structure diagram of a socket 200 of the board-to-board connector 50 provided in the present application, fig. 39 is a perspective view of a cross-sectional structure of the socket 200 provided in fig. 38, and fig. 40 is a cross-sectional view of the socket 200 provided in fig. 38.

In this example, two second support structures 230 may be disposed on the second surface 221 at intervals along both sides of the X-axis direction, and the two second support structures 230 extend from one end to the other end of the socket 200 along the Y-axis direction, that is, the two first support structures 130 cover both side regions of the second surface 221 along the X-axis direction. And, two second support structures 230 are symmetrically disposed along the fourth center line 221b, and each second support structure 230 is symmetrically disposed along the third center line 221 a.

For example, referring to fig. 41, 42 and 43, fig. 41 is a structural diagram of a further receptacle 200 of the board-to-board connector 50 provided in the present application, fig. 42 is a perspective view of a cross-sectional structure of the receptacle 200 provided in fig. 41, and fig. 43 is a cross-sectional view of the receptacle 200 provided in fig. 41.

In this example, a second support structure 230 may be disposed on the second surface 221 along a central region in the X-axis direction, and the second support structure 230 extends from one end to the other end of the socket 200 along the Y-axis direction, that is, the first support structure 130 covers a central middle region of the second surface 221. And, the second support structure 230 is symmetrically disposed along both the third center and the fourth center line 221 b.

For example, referring to fig. 44, 45 and 46, fig. 44 is a structural diagram of a further receptacle 200 of the board-to-board connector 50 provided in the present application, fig. 45 is a perspective view of a cross-sectional structure of the receptacle 200 provided in fig. 44, and fig. 46 is a cross-sectional view of the receptacle 200 provided in fig. 44.

In this example, two sets of second support structures 230 may be disposed on the second surface 221 at intervals along two sides of the X-axis direction, each set of second support structures 230 includes two second support structures 230, and the two second support structures 230 in each set are distributed along the Y-axis with two ends of the second surface 221, that is, four second support structures 230 are respectively disposed in four vertex angle areas of the second surface 221. And, two sets of second support structures 230 are symmetrically disposed along the fourth center line 221b, and two second support structures 230 in each set are symmetrically disposed along the third center line 221 a.

As an example, referring to fig. 47 and 48, fig. 47 is a block diagram of a further receptacle 200 of the board-to-board connector 50 provided in the present application, and fig. 48 is a cross-sectional view of the receptacle 200 provided in fig. 47. Wherein fig. 47 provides a perspective view of a cross-sectional structure of the socket 200 identical to that shown in fig. 39.

In this example, the second support structure 230 may be disposed on the second surface 221 along a circumference of the region near the rim such that the second support structure 230 forms a ring-shaped structure on the second surface 221, i.e., the second support structure 230 covers the region near the rim on the second surface 221, and a middle region of the second surface 221 does not cover the second support structure 230. And, the second support structure 230 is symmetrically disposed along both the third and fourth midlines 221a and 221 b.

In other examples, a plurality of second support structures 230 may also be disposed on the second surface 221, the plurality of second support structures 230 being spaced apart on the second surface 221. Also, the plurality of second support structures 230 may be uniformly and regularly distributed on the second surface 221 in an array, for example. Alternatively, the plurality of second support structures 230 may be randomly distributed in an irregular manner on the second surface 221. Therefore, the present application is not particularly limited thereto.

In addition, the second support structure 230 may be made of different materials. In one possible example, referring to fig. 49, fig. 49 is a block diagram of a second support structure 230 according to an embodiment of the present application. The second support structure 230 may include a second insulating layer 231, where the second insulating layer 231 may be fixed to the second surface 221 by adhesion, clamping, or screwing. Alternatively, the second insulating layer 231 may be made of the same plastic material as the second base 220, and the second insulating layer 231 and the second base 220 may be integrally formed.

Based on this, the socket 200 provided with the above-described second insulating layer 231 (the implementation forms include the above-described examples five to nine) was subjected to the slump simulation. Referring to fig. 50, fig. 51, fig. 52, fig. 53, and fig. 54, fig. 50 is an effect diagram of performing a micro-drop simulation on the second insulating layer 231 provided in the embodiment of the present application in an implementation manner of example five, fig. 51 is an effect diagram of performing a micro-drop simulation on the second insulating layer 231 provided in the embodiment of the present application in an implementation manner of example six, fig. 52 is an effect diagram of performing a micro-drop simulation on the second insulating layer 231 provided in the embodiment of the present application in an implementation manner of example seven, fig. 53 is an effect diagram of performing a micro-drop simulation on the second insulating layer 231 provided in the embodiment of the present application in an implementation manner of example eight, and fig. 54 is an effect diagram of performing a micro-drop simulation on the second insulating layer 231 provided in the embodiment of the present application in an implementation manner of example nine.

The simulation results are shown in table 4, and the simulation results are compared with those of the socket 200 (simulation results shown in fig. 6) provided by the related art.

TABLE 4 Table 4

As can be seen from table 4, after the second insulating layer 231 made of plastic material is disposed on the second surface 221 of the socket 200 in different areas, the plastic strain at the solder joint 51 of the second lead 210 and the plastic strain at the second lead 210 can be reduced, so that the risk of cracking the solder joint 51 to cause an open circuit can be reduced.

In another possible example, referring to fig. 55, fig. 55 is a block diagram of another second support structure 230 according to an embodiment of the present application. The second support structure 230 may include a second metal layer 232, and the second metal layer 232 is welded to the motherboard 41. For example, the second metal layer 232 may be a pad, and is soldered to the motherboard 41. Therefore, the metal material has higher strength, so that the support strength is further improved. And, the second metal layer 232 is welded and fixed with the main board 41, which is beneficial to further improving the connection strength between the socket 200 and the main board 41.

The second metal layer 232 and the second base 220 may be fixedly connected by welding. For example, with continued reference to fig. 55, the second support structure 230 may further include a second metal transition layer 233, i.e., the second metal transition layer 233 is formed on the second surface 221 of the first base 120 through an electroless plating or sputtering process. Then, the second metal layer 232 is welded and fixed on the surface of the second metal transition layer 233 away from the second surface 221, so as to realize the fixed connection between the second metal layer 232 and the second base 220.

Alternatively, referring to fig. 56, fig. 56 is a structural diagram of another fixing manner of the second metal layer 232 according to the embodiment of the present application. The second metal layer 232 and the first base 120 may also be fixedly connected by a clamping manner. For example, the second support structure 230 may further include a plurality of second clamping protrusions 234, the plurality of second clamping protrusions 234 are distributed at intervals along the edge of the second metal layer 232, the second clamping protrusions 234 face the surface of the second metal layer 232, and the edge of the second metal layer 232 is clamped into the second clamping grooves 234 a. Thereby realizing the clamping and fixing of the first metal layer 132 through the plurality of second clamping bulges 234.

In addition, the second clamping protrusion 234 may be made of the same material as the second base 220, and the second clamping protrusion 234 may be integrally formed with the first base 120, so as to further improve the overall connection strength.

Based on this, the socket 200 provided with the above-described second metal layer 232 (the implementation includes the above-described examples five to nine) was subjected to the slight-drop simulation. Referring to fig. 57, 58, 59, 60 and 61, fig. 57 is an effect diagram of performing a micro-drop simulation on the second metal layer 232 provided in the embodiment of the present application in an implementation manner of example five, fig. 58 is an effect diagram of performing a micro-drop simulation on the second metal layer 232 provided in the embodiment of the present application in an implementation manner of example six, fig. 59 is an effect diagram of performing a micro-drop simulation on the second metal layer 232 provided in the embodiment of the present application in an implementation manner of example seven, fig. 60 is an effect diagram of performing a micro-drop simulation on the second metal layer 232 provided in the embodiment of the present application in an implementation manner of example eight, and fig. 61 is an effect diagram of performing a micro-drop simulation on the second metal layer 232 provided in the embodiment of the present application in an implementation manner of example nine.

The simulation results are shown in table 5, and compared with the plug 100 (simulation result shown in fig. 6) provided by the related art.

TABLE 5

As can be seen from table 5, after the second metal layer 232 made of metal material is disposed on the second surface 221 of the socket 200 in different areas, compared with the related art, the plastic strain at the solder joint 51 of the second lead 210 and the second lead 210 is reduced, so that the risk of cracking the solder joint 51 to cause an open circuit is reduced.

In addition, in the related art, there is another socket 200 of the board-to-board connector 50, referring to fig. 62, 63 and 64, fig. 62 is a structural diagram of another socket 200 provided in the related art, fig. 63 is an effect diagram of a micro-drop simulation (plastic strain) of the socket 200 provided in fig. 62, and fig. 64 is an effect diagram of a micro-drop simulation (Mi Saisi stress) of the socket 200 provided in fig. 62.

As can be seen from the above, the socket 200 is in a plug-in structure, the second pins 210 are inserted into the second base 220, and the second pins 210 have a larger deformation space. And the maximum cumulative plastic strain of the solder joint 51 of the socket 200 is 4.77E-02, and the maximum Mi Saisi stress of the second pin 210 of the socket 200 is 138.1MPa.

Based on this, the socket 200 provided in the embodiment of the present application and the socket 200 provided in the related art are subjected to a micro-drop simulation comparison, and the simulation results are shown in table 6.

TABLE 6

As can be seen from table 6, in the implementation manner of example seven, the socket 200 provided in the embodiment of the present application has a larger simulation result of plastic strain and lower benefit compared to the socket 200 with the related art plug-in structure. In other implementations, the plastic strain at the solder joint 51 of the second pin 210 and at the second pin 210 can be reduced, thereby facilitating a reduction in the risk of cracking the solder joint 51 resulting in an open circuit.

In summary, referring to fig. 65, fig. 65 is a flow chart of a design idea of the board-to-board connector 50 according to the embodiment of the application. There is a problem of stress concentration at the solder joints of the board-to-board connector 50 based on the related basis, and it is necessary to lift the mechanical fatigue reliability of the board-to-board connector 50. Accordingly, stress concentration can be dispersed by increasing the supporting area between the board-to-board connector 50 and the soldered component (i.e., the circuit board 40).

Based on this, the present application improves the first pins 110 of the plug 100 (increases the number of solder joints between the first pins 110 and the circuit board 40) by providing a first support structure 130 (including a first insulating layer 131 and a first metal layer 132) between the plug 100 and the FPC board 42. And a second support structure 230 (including a second insulating layer 231 and a second metal layer 232) is disposed between the socket 200 and the main board 41.

In this way, the number of supporting areas or supporting points between the board-to-board connector 50 and the circuit board 40 to be connected is increased, so that stress concentration at the welding points 51 between the board-to-board connector 50 and the circuit board 40 to be connected can be greatly reduced, mechanical fatigue reliability of the welding points 51 of the board-to-board connector 50 is remarkably improved, and further the risk of open circuit caused by cracking of the welding points 51 is reduced.

In the description of the present specification, a particular feature, structure, material, or characteristic may be combined in any suitable manner in one or more embodiments or examples.

The foregoing is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present application, and the changes and substitutions are intended to be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A board-to-board connector plug structure, the plug structure comprising:

the pins are sequentially distributed at intervals and are used for being welded and fixed with the circuit board;

The pins are fixed on the base;

the support structure is arranged between the base and the circuit board and is fixed on the surface of the base facing the circuit board.

2. The plug structure of claim 1, wherein the support structures are symmetrically disposed along a midline of the board-to-board connector in a length direction;

and/or the supporting structures are symmetrically arranged along the middle line of the width direction of the board-to-board connector.

3. The plug structure according to claim 1, wherein the plurality of support structures are provided, and the plurality of support structures are spaced apart on the surface of the base facing the circuit board.

4. A jack-in structure according to claim 3, wherein said support structures are provided in a plurality of groups, a plurality of said support structures being spaced apart along the length of said board-to-board connector, each group of said support structures comprising a plurality of said support structures, a plurality of said support structures of each group of said support structures being spaced apart along the width of said board-to-board connector.

5. The plug structure according to any one of claims 1 to 4, wherein the support structure comprises an insulating layer, the insulating layer being fixedly connected to the base.

6. The plug structure of claim 5, wherein the insulating layer is the same material as the base and is integrally formed with the base.

7. The plug structure according to any one of claims 1 to 4, wherein the supporting structure comprises a metal layer, and the metal layer is welded to the circuit board.

8. The plug structure of claim 7, wherein the support structure further comprises a metal transition layer secured to a surface of the base facing the circuit board, the metal layer being secured to a side of the metal transition layer facing away from the base.

9. The plug structure according to claim 7, wherein a plurality of clamping protrusions are provided on the base, the plurality of clamping protrusions are distributed at intervals along the edge of the metal layer, clamping grooves are formed in the surface of the clamping protrusions facing the metal layer, and edges of the metal layer are clamped into the clamping grooves.

10. The plugging structure according to any one of claims 1 to 4, wherein both ends of at least some of the pins are soldered to the circuit board.

11. The plug structure of claim 10, wherein the pin includes a first end, a second end, and a bent portion, the bent portion being located between the first end and the second end in a width direction of the board-to-board connector, the first end and the second end being soldered to the circuit board.

12. The socket structure of claim 11, wherein the pin further comprises an extension portion fixedly connected to the second end portion, the extension portion extending to a side near the first end portion, and the extension portion being soldered to the circuit board.

13. The mating structure of claim 11, wherein the plurality of pins are divided into a plurality of groups, the plurality of groups of pins being distributed in sequence along a length direction of the board-to-board connector, each group of pins including two of the pins, two of the pins of each group of pins being distributed along a width direction of the board-to-board connector, two of the second ends of each group of pins being located between the two first ends.

14. The plug structure according to any one of claims 1 to 4, wherein the plug structure is a plug of the board-to-board connector or a socket of the board-to-board connector.

15. A board-to-board connector plug structure, the plug structure comprising:

the pins are sequentially distributed at intervals, are used for being welded and fixed with a circuit board, and both ends of each pin are welded and fixed with the circuit board;

the base is fixed on the pins.

16. The plug structure of claim 15, wherein the pin includes a first end, a second end, and a bent portion, the bent portion being located between the first end and the second end in a width direction of the board-to-board connector, the first end and the second end being soldered to the circuit board.

17. The plug structure of claim 16, wherein the pin further comprises an extension portion fixedly connected to the second end portion, the extension portion extending to a side near the first end portion, the extension portion being soldered to the circuit board.

18. The mating structure of claim 16 or 17, wherein a plurality of said pins are divided into a plurality of groups, said groups of pins being distributed sequentially along a length of said board-to-board connector, each group of said pins including two of said pins, two of said pins of each group being distributed along a width of said board-to-board connector, two of said second ends of each group of said pins being located between two of said first ends.

19. The plug structure according to any one of claims 15 to 17, wherein the plug structure is a plug of the board-to-board connector or a socket of the board-to-board connector.

20. A board-to-board connector, characterized by comprising the plugging structure of the board-to-board connector according to any one of claims 1 to 19.

21. An electronic device, comprising:

a housing;

the circuit board is arranged in the shell;

the board-to-board connector is the board-to-board connector of claim 20, wherein pins of the board-to-board connector are soldered to the circuit board.

22. An electronic device, comprising:

a housing;

the circuit board is arranged in the shell;

a board-to-board connector comprising the plugging structure of the board-to-board connector according to any one of claims 1 to 14, wherein pins of the board-to-board connector are welded and fixed with the circuit board; the support structure of the board-to-board connector is abutted with the circuit board.