CN220155513U

CN220155513U - Wafer adsorption device

Info

Publication number: CN220155513U
Application number: CN202321328486.2U
Authority: CN
Inventors: 周知星
Original assignee: Suzhou Huilida Semiconductor Materials Co ltd
Current assignee: Suzhou Huilida Semiconductor Materials Co ltd
Priority date: 2023-05-29
Filing date: 2023-05-29
Publication date: 2023-12-08
Anticipated expiration: 2033-05-29

Abstract

The utility model discloses a wafer adsorption device which comprises a positioning frame and a vacuum chuck, wherein a positioning rod is fixed on the inner wall of the side wall of the positioning frame at equal angles, a sliding sleeve is sleeved on the outer wall of the positioning rod, the vacuum chuck is fixedly arranged on the lower surface of the sliding sleeve, an adjusting rod is movably connected to the center of the inner wall of the lower end of the positioning frame, a gear is fixedly arranged on the outer wall of the upper end of the adjusting rod, a lantern ring is sleeved on the outer wall of the adjusting rod below the gear, and a supporting rod is movably connected to the outer wall of the side of the lantern ring. The wafer adsorption device is convenient to adjust, so that wafers with different sizes are adsorbed by the device conveniently, and the universality of the device is improved.

Description

Wafer adsorption device

Technical Field

The utility model relates to the technical field of adsorption devices, in particular to a wafer adsorption device.

Background

The wafer refers to a round silicon wafer, which is often used as a carrier of a silicon semiconductor circuit, and the semiconductor feature size is smaller and smaller along with the continuous development of semiconductor technology, so that in order to ensure the use stability of the silicon semiconductor circuit, precise processing is required to be performed on the wafer through equipment, and the wafer adsorption device refers to a device for adsorbing and grabbing the wafer to move in processing equipment.

However, as disclosed in CN218471923U, although a wafer adsorbing device with an authorized announcement date of 20230210 can realize the adsorption and grabbing of wafers, the device is required to be adjusted for conveniently adsorbing wafers with different sizes due to the difference in the sizes of the wafers, and the existing wafer adsorbing device is inconvenient to adjust, so that the device is not easy to adsorb wafers with different sizes, and the use limitation of the device is increased.

Aiming at the problems, innovative design is urgently needed on the basis of the original wafer adsorption device.

Disclosure of Invention

The utility model aims to provide a wafer adsorption device, which solves the problems that the prior wafer adsorption device is inconvenient to adjust, so that wafers with different sizes are not easy to adsorb, and the use limitation of the device is increased.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a wafer adsorption equipment, includes locating frame and vacuum chuck, the inner wall equiangular fixation of locating frame lateral wall has the locating lever, and the outer wall cover of locating lever is equipped with the sliding sleeve to the lower fixed surface of sliding sleeve is provided with vacuum chuck, and the center department swing joint of locating frame lower extreme inner wall has the regulation pole moreover, the upper end outer wall fixed mounting of adjusting the pole has the gear, and the regulation pole outer wall cover of gear below is equipped with the lantern ring to the avris outer wall swing joint of lantern ring has branch.

Preferably, the positioning rod is in sliding connection with the sliding sleeve, the sliding sleeve is connected with the positioning frame through a spring, and the positioning frame and the vacuum chuck are arranged in a sliding manner.

Preferably, the adjusting rod is rotatably connected with the positioning frame, and the adjusting rod is in threaded connection with the lantern ring.

Preferably, the two ends of the supporting rod are respectively arranged in a rotating way with the lantern ring and the sliding sleeve.

Preferably, the limit handle is fixedly arranged on the outer wall of the side of the positioning frame, the support is fixedly arranged on the upper surface of the end part of the limit handle, the square rod is movably connected with the inner wall of the end part of the support, the toothed plate is fixedly arranged on the end face of one end of the square rod, and the limit mechanism is arranged on the inner wall of the support on the side of the other end of the square rod.

Preferably, the support and the square rod form a sliding structure, the square rod is connected with the support through a spring, and the toothed plate and the gear are meshed.

Preferably, the limiting mechanism comprises a knob, a limiting ring and a limiting rod, the knob is movably mounted on the inner wall of the bracket, the limiting ring is sleeved on the outer wall of the knob, and the limiting rod is movably mounted on the outer wall of the side of the limiting ring.

Preferably, the knob is rotationally connected with the bracket, the knob and the limiting ring are in threaded arrangement, and two ends of the limiting rod are respectively rotationally arranged with the limiting ring and the square rod.

Compared with the prior art, the utility model has the beneficial effects that: through the rotation of adjusting the pole for the lantern ring drives branch displacement along adjusting the pole, and rethread lantern ring drive branch displacement, makes branch promote the sliding sleeve along the locating lever slip, thereby makes the sliding sleeve drive the vacuum chuck and remove, adjusts vacuum chuck's interval, makes things convenient for vacuum chuck to adsorb not unidimensional wafer, then after vacuum chuck position adjustment is accomplished, rotatory knob, make the spacing ring move down along the knob, the spacing pole displacement is driven in the spacing pole of rethread spacing ring move down, make the spacing pole promote the square pole and remove in the support, thereby make the square pole promote the pinion rack and remove the meshing gear, and then carry out spacing to the adjusting lever, the stability that guarantee device used.

Drawings

FIG. 1 is a schematic view of the present utility model in a front cross-section;

FIG. 2 is a schematic top view of the bracket of the present utility model;

FIG. 3 is a schematic view of a slide sleeve according to the present utility model in a top-down view;

FIG. 4 is a schematic top view of the positioning frame of the present utility model;

fig. 5 is an enlarged schematic view of the structure of fig. 1 a according to the present utility model.

In the figure: 1. a positioning frame; 2. a positioning rod; 3. a sliding sleeve; 4. a vacuum chuck; 5. an adjusting rod; 6. a gear; 7. a collar; 8. a support rod; 9. a limit handle; 10. a bracket; 11. square rods; 12. a toothed plate; 13. a limiting mechanism; 1301. a knob; 1302. a limiting ring; 1303. and a limit rod.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-5, the present utility model provides a technical solution: the wafer adsorption device comprises a positioning frame 1, a positioning rod 2, a sliding sleeve 3, a vacuum chuck 4, an adjusting rod 5, a gear 6, a lantern ring 7, a supporting rod 8, a limiting handle 9, a bracket 10, a square rod 11, a toothed plate 12, a limiting mechanism 13, a knob 1301, a limiting ring 1302 and a limiting rod 1303, wherein the positioning rod 2 is fixed on the inner wall of the side wall of the positioning frame 1 at equal angles, the sliding sleeve 3 is movably connected with the outer wall of the positioning rod 2, the positioning rod 2 and the sliding sleeve 3 form a sliding structure, the sliding sleeve 3 is connected with the positioning frame 1 through a spring, the positioning frame 1 is in sliding connection with the vacuum chuck 4, the supporting rod 8 is convenient for pushing the sliding sleeve 3 to slide along the positioning rod 2 to drive the spring to deform, the sliding sleeve 3 drives the vacuum chuck 4 to move relative to the positioning frame 1, so as to adjust the position of the vacuum chuck 4, and the vacuum chuck 4 is convenient for adsorbing wafers with different sizes;

the side outer wall of the positioning frame 1 is fixedly connected with a limit handle 9, the upper surface of the end part of the limit handle 9 is fixedly provided with a bracket 10, the inner wall of the end part of the bracket 10 is movably provided with a square rod 11, the end surface of one end of the square rod 11 is fixedly connected with a toothed plate 12, meanwhile, the inner wall of the bracket 10 at the other side of the square rod 11 is provided with a limit mechanism 13, the device is convenient to connect with a driving mechanism through the limit handle 9, and the device is convenient to limit the adjusting rod 5, so that the stability in use of the device is improved, the bracket 10 and the square rod 11 are slidably arranged, the square rod 11 is connected with the bracket 10 through a spring, the toothed plate 12 is in meshed connection with a gear 6, and the square rod 11 pushes the toothed plate 12 to engage the gear 6 when the square rod 11 slides relative to the bracket 10 to drive the spring to deform, and the adjusting rod 5 is limited;

the stop gear 13 includes knob 1301, stop collar 1302 and gag lever post 1303, and knob 1301 swing joint is in the inner wall of support 10, and the outer wall movable mounting of knob 1301 has stop collar 1302, and the limit collar 1302's avris outer wall swing joint has gag lever post 1303, be convenient for lock gear 6 through stop gear 13, knob 1301 and support 10 rotate and set up, and knob 1301 and stop collar 1302 threaded connection, the both ends of gag lever post 1303 constitute rotating structure with stop collar 1302 and square rod 11 respectively, be convenient for rotate knob 1301, make stop collar 1302 move down along knob 1301, drive gag lever post 1303 remove, thereby make gag lever post 1303 promote square rod 11 to drive toothed plate 12 meshing gear 6, after the regulation is accomplished, as shown in fig. 1 and fig. 5, then stop collar 1302 slides along knob 1301, then the one end rotation of gag lever post 1303 and drive gag lever post 1303 one end and remove, the other end of gag lever post 1303 rotates and promotes square rod 11 and slides relative support 10, and square rod 11 compression spring deformation, then square rod 11 promotes toothed plate 12 towards gear 6 and toothed plate 12 and gear 6, then drive the wafer suction cup 4 and take vacuum chuck suction device to carry out the motion, thereby the wafer suction device is accomplished, and wafer suction cup 4 is moved through the vacuum chuck suction device is accomplished.

The lower surface of the sliding sleeve 3 is fixedly provided with a vacuum chuck 4, the center of the inner wall of the lower end of the positioning frame 1 is movably provided with an adjusting rod 5, the adjusting rod 5 and the positioning frame 1 form a rotating structure, the adjusting rod 5 and the lantern ring 7 are arranged in a threaded mode, the adjusting rod 5 is convenient to rotate, the lantern ring 7 moves in the vertical direction along the adjusting rod 5, as shown in fig. 1-4, the limiting handle 9 is connected with the driving mechanism, the position of the vacuum chuck 4 is adjusted according to the size of a wafer, the adjusting rod 5 is rotated at the moment, and then the lantern ring 7 moves in the vertical direction along the adjusting rod 5.

The upper end outer wall fixedly connected with gear 6 of adjusting the pole 5, and adjust pole 5 outer wall movable mounting of gear 6 below has lantern ring 7, and the avris outer wall activity of lantern ring 7 is provided with branch 8, the both ends of branch 8 respectively with lantern ring 7 and sliding sleeve 3 swivelling joint, drive branch 8 displacement when being convenient for the vertical removal of lantern ring 7, make branch 8 promote sliding sleeve 3 and remove, the one end rotation of lantern ring 7 relative branch 8 just drives branch 8 one end and remove, the other end relative sliding sleeve 3 rotation of branch 8 just drives sliding sleeve 3 and slides along locating lever 2 simultaneously, and along with sliding sleeve 3 sliding spring carries out deformation, then sliding sleeve 3 drives the relative locating frame 1 of vacuum chuck 4 and slides, thereby adjust the position of vacuum chuck 4, make things convenient for vacuum chuck 4 to adsorb not unidimensional wafer, the commonality of device has been increased.

Although the present utility model has been described with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements and changes may be made without departing from the spirit and principles of the present utility model.

Claims

1. The utility model provides a wafer adsorption equipment, includes locating frame (1) and vacuum chuck (4), its characterized in that: the inner wall constant angle of locating frame (1) lateral wall is fixed with locating lever (2), and the outer wall cover of locating lever (2) is equipped with sliding sleeve (3) to the lower fixed surface of sliding sleeve (3) is provided with vacuum chuck (4), and the center department swing joint of locating frame (1) lower extreme inner wall has regulation pole (5) moreover, the upper end outer wall fixed mounting of regulation pole (5) has gear (6), and regulation pole (5) outer wall cover of gear (6) below is equipped with lantern ring (7), and the avris outer wall swing joint of lantern ring (7) has branch (8).

2. The wafer chucking apparatus of claim 1, wherein: the positioning rod (2) is in sliding connection with the sliding sleeve (3), the sliding sleeve (3) is connected with the positioning frame (1) through a spring, and the positioning frame (1) and the vacuum chuck (4) are in sliding arrangement.

3. The wafer chucking apparatus of claim 1, wherein: the adjusting rod (5) is rotationally connected with the positioning frame (1), and the adjusting rod (5) is in threaded connection with the lantern ring (7).

4. The wafer chucking apparatus of claim 1, wherein: the two ends of the supporting rod (8) are respectively arranged in a rotating way with the lantern ring (7) and the sliding sleeve (3).

5. The wafer chucking apparatus of claim 1, wherein: the locating frame is characterized in that a limit handle (9) is fixedly arranged on the outer wall of the side of the locating frame (1), a support (10) is fixedly arranged on the upper surface of the end part of the limit handle (9), a square rod (11) is movably connected to the inner wall of the end part of the support (10), a toothed plate (12) is fixedly arranged on the end face of one end of the square rod (11), and a limit mechanism (13) is arranged on the inner wall of the support (10) on the side of the other end of the square rod (11).

6. The wafer chucking apparatus of claim 5, wherein: the support (10) and the square rod (11) form a sliding structure, the square rod (11) is connected with the support (10) through a spring, and the toothed plate (12) and the gear (6) are meshed.

7. The wafer chucking apparatus of claim 5, wherein: the limiting mechanism (13) comprises a knob (1301), a limiting ring (1302) and a limiting rod (1303), the knob (1301) is movably mounted on the inner wall of the bracket (10), the limiting ring (1302) is sleeved on the outer wall of the knob (1301), and the limiting rod (1303) is movably mounted on the outer wall of the side of the limiting ring (1302).

8. The wafer chucking apparatus of claim 7, wherein: the knob (1301) is rotationally connected with the bracket (10), the knob (1301) and the limiting ring (1302) are in threaded arrangement, and two ends of the limiting rod (1303) are respectively rotationally arranged with the limiting ring (1302) and the square rod (11).