CN220155496U

CN220155496U - Double-sided brushing equipment between wafer production processes

Info

Publication number: CN220155496U
Application number: CN202321298142.1U
Authority: CN
Inventors: 陈自力
Original assignee: Xiamen Silicon Crystal Technology Co ltd
Current assignee: Xiamen Silicon Crystal Technology Co ltd
Priority date: 2023-05-26
Filing date: 2023-05-26
Publication date: 2023-12-08
Anticipated expiration: 2033-05-26

Abstract

The utility model discloses double-sided brushing equipment between wafer production processes, which belongs to the technical field of wafer double-sided brushing, and comprises a base, a double-sided cleaning device and a side cleaning device, wherein a first motor at two sides is started to drive a first two-way screw at two sides to rotate so as to adjust first conveyor belts at two sides to a position capable of clamping the outer wall of a wafer, a second motor is started to drive a second two-way screw to rotate so as to enable a scrubbing layer at two sides to clamp the outer wall of the wafer, the wafer is placed in the first conveyor belts at two sides, which are far away from the side cleaning device, of the double-sided cleaning device, the wafer is moved forwards through the rotation of the first conveyor belts at two sides, a cleaning agent is sprayed onto the wafer through a spray head by a conveying pump, and then the cleaning agent is scrubbed by a cotton layer, so that the cleaning is cleaner, after the cleaning is finished, the upper end and the lower end of the wafer are clamped by the second conveyor belts and conveyed forwards, and the outer wall of the wafer can be cleaned by the scrubbing layer.

Description

Double-sided brushing equipment between wafer production processes

Technical Field

The utility model belongs to the technical field of wafer double-sided brushing, and particularly relates to double-sided brushing equipment between wafer production processes.

Background

At present, it is well known that unnecessary residues left on the wafer surface from the already performed manufacturing operations must be cleaned during the wafer manufacturing process. Examples of such fabrication operations include plasma etching and chemical mechanical polishing. If unwanted residues and particles remain on the wafer surface during successive manufacturing operations, these residues and particles can cause imperfections such as wafer surface scratches and improper interactions between metallization features. In some cases, such imperfections may cause devices on the chip to become inoperable. To avoid the additional expense of discarding wafers having inoperable devices, the wafers must be properly and efficiently cleaned after the manufacturing process that leaves unnecessary residues on the wafer surface.

Prior art, patent application number: 201320481458.4 discloses a double-sided brushing equipment between wafer production processes, can realize the double-sided brushing of wafer, and cooperate the drive roller device to rotate the wafer, reach the omnidirectional brushing of wafer, brushing effect is good, and work efficiency is high, the brush opens the mechanism and can separate the brush axle subassembly that brushes in pairs, take out or put down abluent wafer, utilize control system to remove spray set and control, utilize multiunit nozzle to realize active agent spraying and pure water spraying to the wafer of cleaning process, degree of automation is high, the cleaning effect is good, and in the circulation process, do not artificially touch the wafer, set up completely in a cleaning box and go on, avoid the secondary pollution to the wafer in the circulation process, in addition, brush axle subassembly is detachable, brush axle and joint department of joint axle of brushing the axle subassembly, dismantle down the brush axle, take down the brush, it just can conveniently wash the brush, it has realized the particle pollutant double-sided synchronization that produces in the wafer surface processing process, the wafer has satisfied the wafer and has replaced artifical inhomogeneous, the demand of cleaning that the wafer is low in time consuming and has not reached the cleanliness factor of traditional technological requirement.

But the cleaning structure and the discharging structure of the existing double-sided brushing equipment are complex, and the production cost, the use cost and the subsequent maintenance cost are increased.

Disclosure of Invention

The utility model provides double-sided brushing equipment between wafer production procedures, which aims at solving the problems that the existing cleaning structure and discharging structure of the double-sided brushing equipment are complex, the production cost, the use cost and the subsequent maintenance cost are increased.

In order to solve the problems, the utility model adopts the following technical scheme.

The double-sided brushing equipment between wafer production processes comprises a base, wherein one side of the upper end of the base is connected with a double-sided cleaning device in a sliding manner, and the other side of the upper end of the base is connected with a side surface cleaning device in a sliding manner.

Specifically, the upper side and the lower side of the wafer can be cleaned by the double-sided cleaning device, and the outer wall of the wafer can be cleaned by the side surface cleaning device.

Further, the center of the upper end of the base and one side of the upper end of the base are provided with second sliding grooves, the other side of the upper end of the base is provided with first sliding grooves, and one side of the inner wall of each of the first sliding grooves and the second sliding grooves on two sides is provided with a through hole.

Specifically, the second sliding chute is used for installing the double-sided cleaning device, and the first sliding chute is used for installing the side cleaning device.

Further, two-sided belt cleaning device include symmetrical first motor, the rotation end fixedly connected with symmetrical first two-way lead screw of both sides first motor, the outer wall threaded connection of both sides first two-way lead screw has symmetrical first slider, the upper end rotation of every first slider is connected with first transmission shaft, first conveyer belt has been cup jointed to the outer wall of two first transmission shafts of both sides around, the first transmission shaft of every built-in power device drive of first slider rotates, the upper end of the first conveyer belt of both sides is provided with the U type lid, the bottom center department of U type lid is provided with lug and the built-in storehouse of storing of U type lid and delivery pump, bottom fixedly connected with bottom plate, bottom plate and lug opposite face one side is provided with a plurality of shower nozzles, opposite face opposite side is provided with the cotton layer, and one side fixedly connected with transmission plate of bottom plate.

Specifically, the first motor on two sides rotates to drive the first bidirectional screw rod to rotate, the distance between the first sliding blocks on two sides and the first conveyor belt can be adjusted, the cleaning agent can be applied to wafers of different sizes, the cleaning agent is sprayed onto the wafers through the spray head by the conveying pump, the cleaning agent is scrubbed by the cotton layer, the cleaning agent can be cleaner, and the cleaning agent can be conveyed to the side cleaning device after the wafers are cleaned by the conveying plate.

Further, the side cleaning device include the second motor, the rotation end fixedly connected with second bidirectional screw rod of second bidirectional screw rod, the outer wall threaded connection of second bidirectional screw rod has symmetrical second slider, the upper end fixedly connected with symmetry mounting panel of both sides second slider, be provided with symmetrical third spout on the mounting panel of both sides, the inside of every third spout is provided with two third sliders, every third slider embeds drive arrangement, and the relative face rotation of a plurality of third sliders of both sides is connected with the second transmission shaft, the drive arrangement of third slider embeds can drive the second transmission shaft and rotate, the outer wall of every two horizontal second transmission shafts has cup jointed the second conveyer belt, the inside rotation of every third spout is connected with the unidirectional screw rod, the upper end fixedly connected with third motor's of every unidirectional screw rod rotates the end, the inside that every third spout is close to the bottom is fixed at the third spout, every unidirectional screw rod is provided with the third threaded connection that is close to the upper end with inside every third spout, be provided with the scrubbing layer on the inner wall between two second conveyer belts on the mounting panel.

Specifically, the third sliding blocks inside each third sliding groove and close to the upper end can be adjusted to move through the rotation of the third motor, so that wafers with different thicknesses can be used conveniently, the distance between the mounting plates on two sides can be adjusted through the rotation of the second motor to drive the rotation of the second bidirectional screw rods, the outer wall of the wafer can be cleaned through the scrubbing layer, and each unidirectional screw rod is connected with the upper end face of each third sliding block close to the bottom in a rotating mode.

Further, the second sliding block is in sliding connection with the first sliding groove, and the second bidirectional screw rod is rotationally connected in the first sliding groove.

Further, the first sliding block is in sliding connection with the inside of the second sliding groove, the first two-way screw rods on two sides are rotationally connected to the inside of the second sliding groove on two sides, the bottom plate is movably connected to the upper end face of the base, and the transmission plate is arranged towards the side surface cleaning device.

Advantageous effects

Compared with the prior art, the utility model has the beneficial effects that:

(1) According to the utility model, when the cleaning agent is used, the cleaning agent is added into the U-shaped cover, the first motors at two sides are started to drive the first bidirectional screw rods at two sides to rotate so as to adjust the first conveyor belts at two sides to a position capable of clamping the outer wall of the wafer, the second motors are started to drive the second bidirectional screw rods to rotate so as to enable the scrubbing layers at two sides to clamp the outer wall of the wafer, the second conveyor belts and the first conveyor belts are enabled to rotate at the moment, the wafer is placed into the first conveyor belts at two sides far away from one side of the side cleaning device from the two sides of the side cleaning device, the wafer is enabled to move forwards through the rotation of the first conveyor belts at two sides, the cleaning agent is sprayed onto the wafer through the spray heads through the conveying pumps, the cotton layers are used for scrubbing, the cleaning is enabled to be cleaner, the upper end and the lower end of the wafer are clamped by the second conveyor belts through the conveying plates after the cleaning is completed, the outer wall of the wafer is enabled to be cleaned through the scrubbing layers, and the wafer is output from the other side, and the cleaning agent cleaning device is simpler and convenient in structure.

(2) According to the utility model, the distance between the second conveyor belt close to the upper end and the second conveyor belt close to the lower end can be adjusted through the rotation of the third motor, and the wafer conveying device can adapt to the conveying of wafers with different thicknesses, so that the application range is more convenient.

Drawings

FIG. 1 is a schematic diagram of a double-sided brushing apparatus between wafer manufacturing processes in accordance with the present utility model;

FIG. 2 is a schematic view of a double-sided cleaning apparatus according to the present utility model;

FIG. 3 is a schematic view of a side cleaning apparatus according to the present utility model.

The correspondence between the reference numerals and the component names in the drawings is as follows:

1. a base; 101. a first chute; 102. a second chute; 103. a through hole;

2. a double-sided cleaning device; 201. a U-shaped cover; 202. a bump; 203. a first motor; 204. a first bidirectional screw rod;

205. a first conveyor belt; 206. a first drive shaft; 207. a first slider; 208. a bottom plate; 209. a transmission plate;

3. a side surface cleaning device; 301. a second motor; 302. a second bidirectional screw rod; 303. a mounting plate; 304. a second slider;

305. a third chute; 306. a unidirectional screw rod; 307. a third slider; 308. a second drive shaft; 309. a second conveyor belt; 310. a third motor; 311. the scrubbing layer.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Examples

Referring to fig. 1 to 3, which are schematic structural views of a double-sided brushing device between wafer production steps according to a preferred embodiment of the present utility model, the double-sided brushing device between wafer production steps of the present embodiment includes a base 1, wherein one side of the upper end of the base 1 is slidably connected with a double-sided cleaning device 2, and the other side of the upper end of the base 1 is slidably connected with a side cleaning device 3.

Specifically, the upper and lower sides of the wafer can be cleaned by the double-sided cleaning device 2, and the outer wall of the wafer can be cleaned by the side cleaning device 3.

Further, a second chute 102 is arranged at the center and at one side of the upper end of the base 1, a first chute 101 is arranged at the other side of the upper end of the base 1, and a through hole 103 is arranged at one side of the inner walls of the first chute 101 and the second chutes 102 at two sides.

Specifically, the second chute 102 is used for mounting the double-sided cleaning device 2, and the first chute 101 is used for mounting the side cleaning device 3.

Further, the double-sided cleaning device 2 includes a symmetrical first motor 203, the rotating ends of the first motors 203 on two sides are fixedly connected with a symmetrical first bidirectional screw rod 204, the outer walls of the first bidirectional screw rods 204 on two sides are in threaded connection with symmetrical first sliding blocks 207, the upper end of each first sliding block 207 is rotatably connected with a first transmission shaft 206, the outer walls of the two first transmission shafts 206 on the front side and the rear side are sleeved with a first transmission belt 205, each first sliding block 207 is internally provided with a power device to drive the first transmission shaft 206 to rotate, the upper ends of the first transmission belts 205 on two sides are provided with a U-shaped cover 201, the bottom center of the U-shaped cover 201 is provided with a bump 202, a storage bin and a delivery pump are arranged in the U-shaped cover 201, the bottom of the 210 is fixedly connected with a bottom plate 208, one side of the opposite surface of the bottom plate 208 and the bump 202 is provided with a plurality of spray heads, the other side of the opposite surface is provided with a cotton layer, and one side of the bottom plate 208 is fixedly connected with a transmission plate 209.

Specifically, the first two-way screw rod 204 is driven to rotate through the first motors 203 on two sides to rotate, so that the distance between the first sliding blocks 207 on two sides and the first conveyor belt 205 can be adjusted, wafers with different sizes can be adapted, the cleaning agent is sprayed onto the wafers through the spray heads through the conveying pump, the cleaning agent is scrubbed through the cotton layer, the cleaning agent can be cleaner, and the cleaning agent can be conveyed to the side cleaning device 3 after the wafers are cleaned through the conveying plate 209.

Further, the side cleaning device 3 includes a second motor 301, the rotating end of the second motor 301 is fixedly connected with a second bidirectional screw rod 302, the outer wall of the second bidirectional screw rod 302 is in threaded connection with a symmetrical second sliding block 304, the upper ends of the second sliding blocks 304 on both sides are fixedly connected with symmetrical mounting plates 303, symmetrical third sliding grooves 305 are arranged on the mounting plates 303 on both sides, two third sliding blocks 307 are arranged in the third sliding grooves 305, a driving device is arranged in each third sliding block 307, the opposite surfaces of the plurality of third sliding blocks 307 on both sides are rotationally connected with a second transmission shaft 308, the driving device arranged in the third sliding blocks 307 can drive the second transmission shaft 308 to rotate, the outer wall of each second transmission shaft 308 on the transverse direction is sleeved with a second transmission belt 309, the inner part of each third sliding groove 305 is rotationally connected with a unidirectional screw rod 306, the rotating end of each third sliding groove 305 on the upper end of each unidirectional screw rod 306 is fixedly connected with the rotating end of the third motor 310, the third sliding block 307 near the bottom is fixed in the third sliding block 307, and the inner wall of each unidirectional screw rod 306 is connected with the second transmission belt 309 on the inner wall of each third sliding groove 307 near the upper end of the third sliding groove 307.

Specifically, the third sliding blocks 307 inside each third sliding groove 305 and close to the upper end can be adjusted to move through the rotation of the third motor 310, so that wafers with different thicknesses can be used conveniently, the distance between the mounting plates 303 on two sides can be adjusted through the rotation of the second motor 301 to drive the second bidirectional screw rods 302 to rotate, the outer wall of each wafer can be wiped and cleaned through the scrubbing layer 311, and each unidirectional screw rod 306 is rotationally connected with the upper end face of each third sliding block 307 close to the bottom.

Further, the second slider 304 is slidably connected to the first chute 101, and the second bidirectional screw 302 is rotatably connected to the inside of the first chute 101.

Further, the first slider 207 is slidably connected with the inside of the second chute 102, the first two-way screw rods 204 on two sides are rotatably connected with the inside of the second chute 102 on two sides, the bottom plate 208 is movably connected with the upper end surface of the base 1, and the transmission plate 209 is arranged towards the direction of the side cleaning device 3.

Working principle: when the cleaning agent is used, cleaning agent is added into the U-shaped cover 201, the first motors 203 on two sides are started to drive the first two-way screw rods 204 on two sides to rotate so as to adjust the first conveying belts 205 on two sides to a position capable of clamping the outer wall of a wafer, the second motors 301 are started to drive the second two-way screw rods 302 to rotate so as to enable the scrubbing layers 311 on two sides to clamp the outer wall of the wafer, at the moment, the second conveying belts 309 and the first conveying belts 205 are enabled to rotate, the wafer is placed into the first conveying belts 205 on two sides far away from one side of the side cleaning device 3 from the double-sided cleaning device 2, the wafer is enabled to move forwards through the rotation of the first conveying belts 205 on two sides, the cleaning agent is sprayed onto the wafer through a spray head by a conveying pump, scrubbing is carried out through a cotton layer, the upper end and lower end of the wafer are clamped by the second conveying belts 309 and are conveyed forwards through the conveying plates 209 after cleaning is completed, the outer wall of the wafer is enabled to be cleaned, and the wafer is output from the other side through the scrubbing layers 311, and the structure is simpler and more convenient; the distance between the second conveying belt 309 close to the upper end and the second conveying belt 309 close to the lower end can be adjusted through the rotation of the third motor 310, and wafers with different thicknesses can be conveyed in a suitable mode, so that the application range is more convenient.

The foregoing is a further elaboration of the present utility model in connection with the detailed description, and it is not intended that the utility model be limited to the specific embodiments shown, but rather that a number of simple deductions or substitutions be made by one of ordinary skill in the art without departing from the spirit of the utility model, should be considered as falling within the scope of the utility model as defined in the appended claims.

Claims

1. The double-sided brushing equipment between wafer production processes is characterized in that: comprises a base (1), base (1) upper end one side sliding connection have two-sided belt cleaning device (2), base (1) upper end opposite side sliding connection have side belt cleaning device (3), two-sided belt cleaning device (2) include symmetrical first motor (203), the rotation end fixedly connected with symmetrical first two-way lead screw (204) of both sides first motor (203), the outer wall threaded connection of both sides first two-way lead screw (204) has symmetrical first slider (207), the upper end rotation of every first slider (207) is connected with first transmission shaft (206), first conveyer belt (205) have been cup jointed to the outer wall of two first transmission shafts (206) of front and back both sides, every first slider (207) embeds power device drive first transmission shaft (206) and rotates, the upper end of both sides first conveyer belt (205) is provided with U type lid (201), the bottom center department of U type lid (201) is provided with lug (202) and U type lid embeds storage bin and delivery pump, (210) bottom fixedly connected with bottom plate (208), bottom plate (202) and one side of side (208) are provided with relative shower nozzle plate (301) and the opposite side of two-sided belt cleaning device (301), the rotating end of the second motor (301) is fixedly connected with a second bidirectional screw rod (302), the outer wall of the second bidirectional screw rod (302) is in threaded connection with a symmetrical second sliding block (304), the upper ends of the second sliding blocks (304) on two sides are fixedly connected with symmetrical mounting plates (303), symmetrical third sliding grooves (305) are arranged on the mounting plates (303) on two sides, two third sliding blocks (307) are arranged in the third sliding grooves (305), a driving device is arranged in each third sliding block (307), the opposite surfaces of the plurality of third sliding blocks (307) on two sides are in rotary connection with a second transmission shaft (308), the driving device arranged in the third sliding blocks (307) can drive the second transmission shaft (308) to rotate, the outer wall of each transverse second transmission shaft (308) is sleeved with a second transmission belt (309), the inner part of each third sliding groove (305) is in rotary connection with a unidirectional screw rod (306), the upper end of each unidirectional screw rod (306) is fixedly connected with the rotating end of the third motor (310), the third sliding block (307) near the bottom is in the third sliding block (307), the inner wall (307) is in the direction close to the inner wall of each third sliding groove (307) and is in the direction close to the second transmission belt (309), each unidirectional screw rod (306) is rotationally connected with the upper end face of each third sliding block (307) close to the bottom.

2. The apparatus for double-sided brushing between wafer production processes according to claim 1, wherein: the center of the upper end of the base (1) and one side of the upper end of the base are provided with second sliding grooves (102), the other side of the upper end of the base (1) is provided with a first sliding groove (101), and one side of the inner wall of the first sliding groove (101) and one side of the inner wall of the second sliding grooves (102) on two sides is provided with a through hole (103).

3. The apparatus for double-sided brushing between wafer production processes according to claim 1, wherein: the second sliding block (304) is in sliding connection with the first sliding groove (101), and the second bidirectional screw rod (302) is rotationally connected inside the first sliding groove (101).

4. The apparatus for double-sided brushing between wafer production processes according to claim 1, wherein: the first sliding block (207) is in sliding connection with the inside of the second sliding groove (102), the first two-way screw rods (204) on two sides are rotationally connected to the inside of the second sliding groove (102) on two sides, the bottom plate (208) is movably connected to the upper end face of the base (1), and the transmission plate (209) is arranged towards the side surface cleaning device (3).