CN220154479U - Wafer test probe machine - Google Patents
Wafer test probe machine Download PDFInfo
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- CN220154479U CN220154479U CN202321319223.5U CN202321319223U CN220154479U CN 220154479 U CN220154479 U CN 220154479U CN 202321319223 U CN202321319223 U CN 202321319223U CN 220154479 U CN220154479 U CN 220154479U
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- 239000000523 sample Substances 0.000 title claims abstract description 74
- 238000012360 testing method Methods 0.000 title claims abstract description 38
- 238000001514 detection method Methods 0.000 abstract description 21
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 60
- 238000009434 installation Methods 0.000 description 10
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 230000005489 elastic deformation Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model relates to the technical field of semiconductor device detection, and provides a wafer test probe machine table, which comprises a sample table, a chuck, a moving device and a probe device, wherein the chuck is arranged at the top of the sample table, the moving devices are respectively arranged on the outer surfaces of the left side and the right side of the top of the sample table, the probe device is arranged at one end of the moving device, which is close to the chuck, a control panel is arranged on the outer surface of the left side of the sample table, a driving device is arranged in the sample table, a threaded rod is arranged at the top of the driving device, a motor is arranged on the right side of the driving device, a rotating shaft is arranged at one end of the motor, which is close to a connecting piece, a lug is arranged at the top of the threaded rod, a clamping tooth is arranged at the bottom of the lug, a supporting ring is arranged at the top of the chuck, a clamping block and a connecting rod are respectively arranged at the left side and the right side of the inside of the supporting ring, a groove and a baffle are respectively arranged inside the groove.
Description
Technical Field
The utility model relates to the technical field of semiconductor device detection, in particular to a wafer test probe machine.
Background
With rapid development of technology, applications of semiconductor wafers are increasing, and applications of wafer test probe stations are also increasing gradually, and the wafer test probe stations are one of important detection equipment in the semiconductor industry, are widely applied to precise electrical measurement of complex and high-speed devices, and aim to ensure device quality and reliability, and reduce research and development time and cost of device manufacturing processes.
The existing wafer probe testing machine adopts the structures of a sample stage, an optical device, a chuck and a mechanical main body, and because the chuck is limited in size, the wafer of a specific model can be detected, and a plurality of detection points of the wafer need to be detected by moving the wafer on the sample stage frequently during detection, so that the use is relatively complicated.
Disclosure of Invention
Aiming at the defects of the prior art, the utility model provides a wafer test probe machine which has the advantages of being capable of placing various types of wafers, detecting a plurality of wafer sites, not needing to change the probe positions and the like.
In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:
the utility model provides a wafer test probe board, includes sample platform, chuck, mobile device, probe device, the sample platform top is provided with the chuck, and the surface of sample platform top left and right sides respectively is provided with mobile device, and the one end that mobile device is close to the chuck is provided with probe device, and the surface of sample platform left side is provided with control panel.
Preferably, the sample platform top is provided with the spout, and the spout runs through sample platform top and inside, and the inside drive arrangement that is provided with of sample platform, drive arrangement top are provided with the threaded rod, and the threaded rod is inside to be provided with logical groove, and drive arrangement left and right sides both ends surface respectively is provided with the connecting piece, and connecting piece inside and surface are provided with the through-hole for guarantee the normal operating of device.
Preferably, the right side of the driving device is provided with a motor, one end of the motor, which is close to the connecting piece, is provided with a rotating shaft, the rotating shaft is sleeved inside the connecting piece, the rotating shaft is fixedly connected with the threaded rod through a through groove, the control panel is electrically connected with the motor, the control panel can control the forward and reverse rotation of the motor, and the forward and reverse rotation of the motor drives the forward and reverse rotation of the threaded rod, so that the device can normally operate.
Preferably, the threaded rod top is provided with the lug, the lug bottom is provided with the latch, the latch is connected with the threaded rod meshing, the lug top is provided with the chuck, lug top and chuck bottom fixed connection, place on the chuck when the wafer installation detects, but when need changing the check point, utilize corotation and the reversal of control panel control motor, drive the threaded rod corotation when the motor corotation, because the latch is connected with the threaded rod meshing, the threaded rod corotation drives chuck upward movement through lug and spout, make probe device's side site of examining change, same reason motor reversal makes chuck downwardly moving, make probe device can carry out the multiple spot and survey repeatedly, increase the reliability of test, promote the detection effect.
Preferably, the chuck top is provided with the holding ring, holding ring and chuck top fixed connection, and the inside left and right sides of holding ring all is provided with fixture block and connecting rod, and the one end that the connecting rod is close to the fixture block and fixture block fixed connection, and the chuck is used for placing the installation brilliant detection, and the holding ring is used for supporting the chuck and carries out spacingly to the fixture block, when the wafer is placed and is installed in the chuck, utilizes control panel to drive the mobile device and moves the probe device to chuck department and detect the test to the performance of wafer for the device makes with normal operating.
Preferably, the inside recess that is provided with of supporting ring, the inside spring and baffle that are provided with of recess, baffle and spring fixed connection, the one end and baffle fixed connection that the connecting rod is close to the supporting ring, the connecting rod passes through baffle and recess swing joint, when the wafer is placed and is installed in the chuck, the wafer is placed between the fixture block of supporting ring both sides, the wafer is exerted pressure to the fixture block and is made fixture block and connecting rod move towards the supporting ring position during installation, the connecting rod drives the baffle and removes simultaneously to exert force to make the spring take place elastic deformation compression to the spring, at this moment because spring compression connecting rod enters into the recess inside, space between the fixture block increases, the wafer can place the installation smoothly, make the wafer of equidimension all can place on the device and test and detect and need not to change the chuck, place the elasticity that spring elastic deformation produced after the installation is placed to inwards extrude on connecting rod and the fixture block, thereby carry out fixed position with the wafer, prevent that phenomenon such as slide from appearing when detecting and result to lead to the testing result to appear the error, make the testing performance of device promote.
Preferably, the fixture blocks are arranged in arc shapes, the fixture blocks arranged on the left side and the right side of the inside of the supporting ring correspond to each other, the fixture block materials are preferably high-elasticity high polymer compounds, preferably rubber, the fixture blocks are arranged in arc shapes and conform to the shape curves of the wafers, so that the fixture blocks can be completely attached to the edges of the wafers when the wafers are fixed on the chucks through the fixture block installation, the wafers can be prevented from being possibly loosened when the driving device moves due to incomplete attachment gaps, the detection result is influenced, and meanwhile, the rubber can be matched with the springs to buffer tiny vibration generated by driving the driving device, the wafer performance damage possibly caused by vibration is avoided, and the performance of the device detection test is improved.
The beneficial effects are that:
1. according to the wafer test probe machine table, the protruding blocks are arranged at the tops of the threaded rods, the clamping teeth are arranged at the bottoms of the protruding blocks and are in meshed connection with the threaded rods, the chucks are arranged at the tops of the protruding blocks, the tops of the protruding blocks are fixedly connected with the bottoms of the chucks, the threaded rods are driven to rotate forward when the motor rotates forward, the chucks are driven to move upwards by the threaded rods to rotate forward through the protruding blocks and the sliding grooves, the side detection sites of the probe device are changed, the chucks are moved downwards by the motor in the same way in a reverse rotation mode, so that the probe device can repeatedly detect multiple sites, the reliability of testing is improved, and the detection accuracy is improved;
2. according to the wafer test probe machine table, the supporting ring is arranged at the top of the chuck and fixedly connected with the top of the chuck, the clamping blocks and the connecting rods are arranged at the left side and the right side of the inside of the supporting ring, one end of each connecting rod, which is close to each clamping block, is fixedly connected with each clamping block, each clamping block is used for placing and installing a wafer for detection, the supporting ring is used for supporting the chuck and limiting each clamping block, and the control panel is used for driving the mobile device to drive the probe device to move to the chuck for detecting and testing the performance of the wafer, so that the device can normally operate, the time for manually adjusting the probe device is saved, and the detection efficiency of the device is improved;
3. according to the wafer test probe machine, the grooves are formed in the supporting ring, the springs and the baffle plates are arranged in the grooves, the baffle plates are fixedly connected with the springs, one end of the connecting rod, which is close to the supporting ring, is fixedly connected with the baffle plates, and the connecting rod is movably connected with the grooves through the baffle plates, so that wafers with different sizes can be placed on the device for test and detection without changing chucks, and after the wafers are placed and installed, the elastic force generated by elastic deformation of the springs is reversely acted on the connecting rod and the clamping blocks to be inwards extruded, so that the wafers are fixed, errors of detection results caused by the phenomena of sliding and the like of the wafers are prevented, and the detection performance of the device is improved;
4. this wafer test probe board sets up to circular-arc through the fixture block, corresponds each other between the fixture block that the inside left and right sides of supporting ring set up, the fixture block material is preferably high elastic polymer, preferably rubber, the fixture block sets up to circular-arc shape and follows the shape curve of wafer, make the wafer can laminate completely in wafer edge department when fixing on the chuck through the fixture block installation, prevent that the incomplete gap of laminating from leading to the wafer can loosen when drive arrangement removes, cause the influence to the testing result, the material is rubber and can cooperate and cushion at the tiny vibrations that drive arrangement drove the production simultaneously, avoid damaging because of the wafer performance that the vibrations probably lead to, make the device detect the performance of test and obtain promoting.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic view of a sample stage according to the present utility model;
FIG. 3 is a schematic diagram of a driving apparatus according to the present utility model;
FIG. 4 is a schematic top view of the present utility model;
fig. 5 is a schematic view of the chuck according to the present utility model.
In the figure: 1. a sample stage; 10. a chute; 11. a bump; 110. latch teeth; 12. a driving device; 120. a threaded rod; 121. a rotating shaft; 122. a connecting piece; 123. a motor; 2. a chuck; 20. a support ring; 201. a groove; 202. a spring; 21. a clamping block; 22. a connecting rod; 220. a baffle; 3. a mobile device; 4. a probe device; 5. and a control panel.
Detailed Description
The technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings.
Example 1
As shown in fig. 1-3, a wafer test probe machine comprises a sample stage 1, a chuck 2, a moving device 3 and a probe device 4, wherein the chuck 2 is arranged at the top of the sample stage 1, the moving devices 3 are respectively arranged on the outer surfaces of the left side and the right side of the top of the sample stage 1, the probe device 4 is arranged at one end of the moving device 3, which is close to the chuck 2, a control panel 5 is arranged on the outer surface of the left side of the sample stage 1, a chute 10 is arranged at the top of the sample stage 1, the chute 10 penetrates through the top and the inside of the sample stage 1, a driving device 12 is arranged inside the sample stage 1, a threaded rod 120 is arranged at the top of the driving device 12, through grooves are formed inside the threaded rod 120, connecting pieces 122 are respectively arranged on the outer surfaces of the left end and the right end of the driving device 12, and through holes are formed in the outer surfaces of the connecting pieces 122 and are used for ensuring the normal operation of the device.
The right side of the driving device 12 is provided with a motor 123, one end of the motor 123, which is close to the connecting piece 122, is provided with a rotating shaft 121, the rotating shaft 121 is sleeved inside the connecting piece 122, the rotating shaft 121 is fixedly connected with the threaded rod 120 through a through groove, the control panel 5 is electrically connected with the motor 123, the control panel 5 can control the forward and reverse rotation of the motor 123, and the forward and reverse rotation of the motor 123 drives the forward and reverse rotation of the threaded rod 120, so that the device operates normally.
The top of threaded rod 120 is provided with lug 11, lug 11 bottom is provided with latch 110, latch 110 and threaded rod 120 meshing are connected, lug 11 top is provided with chuck 2, lug 11 top and chuck 2 bottom fixed connection, when the wafer installation is placed and is detected on chuck 2, but when need change the check point, utilize control panel 5 control motor 123's corotation and reversal, drive threaded rod 120 corotation when motor 123 corotation, because latch 110 and threaded rod 120 meshing are connected, threaded rod 120 corotation drives chuck 2 through lug 11 and spout 10 and upwards move, make the side site of examining of probe device 4 change, and just motor 123 reversal makes chuck 2 downwardly moving, make probe device 4 can carry out the multiposition and survey repeatedly, increase the reliability of test, promote the detection effect.
Example two
As shown in fig. 1-4, further, on the basis of the first embodiment, a supporting ring 20 is provided at the top of the chuck 2, the supporting ring 20 is fixedly connected with the top of the chuck 2, both sides of the inside of the supporting ring 20 are provided with a clamping block 21 and a connecting rod 22, one end of the connecting rod 22, which is close to the clamping block 21, is fixedly connected with the clamping block 21, the chuck 2 is used for placing and installing a wafer for detection, the supporting ring 20 is used for supporting the chuck 2 and limiting the clamping block 21, and when the wafer is placed and installed in the chuck 2, the moving device 3 is used for driving the probe device 4 to the chuck 2 to perform detection test on the performance of the wafer by using the control panel 5, so that the device can normally operate.
The inside recess 201 that is provided with of support ring 20, the inside spring 202 and baffle 220 that is provided with of recess 201, baffle 220 and spring 202 fixed connection, the one end that connecting rod 22 is close to support ring 20 and baffle 220 fixed connection, connecting rod 22 passes through baffle 220 and recess 201 swing joint, when the wafer is placed and is installed in chuck 2, the wafer is placed between fixture block 21 of support ring 20 both sides, the wafer is exerted pressure to fixture block 21 and is made fixture block 21 and connecting rod 22 move towards support ring 20 position during installation, connecting rod 22 drives baffle 220 and removes simultaneously to exert force and make spring 202 take place elastic deformation compression to spring 202, at this moment because spring 202 compression connecting rod 22 enters into recess 201 inside, the space between the fixture block 21 increases, the wafer can place the installation smoothly, make the wafer of equidimension all can be placed on the device and test the detection and need not change chuck 2, place the wafer and place the back on the device and inwards squeeze on connecting rod 22 and fixture block 21, thereby fix the position with the wafer, prevent that the phenomenon such as slip from appearing when detecting the wafer and causing the testing result to take place and error, make the testing performance of device promote.
Example III
As shown in fig. 1-5, further, based on the second embodiment, the clamping blocks 21 are provided with arc shapes, the clamping blocks 21 provided on the left and right sides of the inside of the supporting ring 20 correspond to each other, the clamping blocks 21 are preferably made of high-elasticity polymer compounds, preferably rubber, the clamping blocks 21 are provided with arc shapes to conform to the shape curve of the wafer, so that the clamping blocks 21 can be completely attached to the edge of the wafer when the wafer is mounted and fixed on the chuck 2 through the clamping blocks 21, the wafer is prevented from being possibly loosened when the driving device 12 moves due to incomplete attachment gaps, the detection result is influenced, and meanwhile, the rubber can be matched with the springs 202 to buffer tiny vibration generated by driving the driving device 12, so that the wafer performance possibly caused by vibration is prevented from being damaged, and the performance of the device for detecting and testing is improved.
Although preferred embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications and substitutions may be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a wafer test probe board, includes sample platform (1), chuck (2), mobile device (3), probe device (4), its characterized in that: the top of the sample table (1) is provided with a chuck (2), the outer surfaces of the left side and the right side of the top of the sample table (1) are respectively provided with a moving device (3), one end, close to the chuck (2), of the moving device (3) is provided with a probe device (4), and the outer surface of the left side of the sample table (1) is provided with a control panel (5).
2. The wafer test probe station of claim 1, wherein: the utility model discloses a sample platform, including sample platform (1), sample platform, connecting piece (122) are respectively provided with at both ends surface about drive arrangement (12), sample platform (1) top is provided with spout (10), spout (10) runs through sample platform (1) top and inside, inside drive arrangement (12) that is provided with of sample platform (1), drive arrangement (12) top is provided with threaded rod (120), threaded rod (120) inside is provided with logical groove, connecting piece (122) are inside and the surface is provided with the through-hole.
3. The wafer test probe station of claim 2, wherein: the right side of the driving device (12) is provided with a motor (123), one end of the motor (123) close to the connecting piece (122) is provided with a rotating shaft (121), the rotating shaft (121) is sleeved inside the connecting piece (122), and the rotating shaft (121) is fixedly connected with the threaded rod (120) through a through groove.
4. A wafer test probe station according to claim 3, wherein: the top of threaded rod (120) is provided with lug (11), and lug (11) bottom is provided with latch (110), and latch (110) are connected with threaded rod (120) meshing, and lug (11) top is provided with chuck (2), and lug (11) top and chuck (2) bottom fixed connection.
5. The wafer test probe station of claim 4, wherein: the chuck is characterized in that a supporting ring (20) is arranged at the top of the chuck (2), the supporting ring (20) is fixedly connected with the top of the chuck (2), clamping blocks (21) and connecting rods (22) are arranged on the left side and the right side of the inside of the supporting ring (20), and one end, close to the clamping blocks (21), of each connecting rod (22) is fixedly connected with the corresponding clamping block (21).
6. The wafer test probe station of claim 5, wherein: the support ring (20) is internally provided with a groove (201), a spring (202) and a baffle (220) are arranged in the groove (201), the baffle (220) is fixedly connected with the spring (202), one end of a connecting rod (22) close to the support ring (20) is fixedly connected with the baffle (220), and the connecting rod (22) is movably connected with the groove (201) through the baffle (220).
7. The wafer test probe station of claim 5, wherein: the clamping blocks (21) are arranged in an arc shape, the clamping blocks (21) arranged on the left side and the right side of the inside of the supporting ring (20) correspond to each other, and the clamping blocks (21) are made of rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321319223.5U CN220154479U (en) | 2023-05-29 | 2023-05-29 | Wafer test probe machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321319223.5U CN220154479U (en) | 2023-05-29 | 2023-05-29 | Wafer test probe machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220154479U true CN220154479U (en) | 2023-12-08 |
Family
ID=89006117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321319223.5U Active CN220154479U (en) | 2023-05-29 | 2023-05-29 | Wafer test probe machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220154479U (en) |
-
2023
- 2023-05-29 CN CN202321319223.5U patent/CN220154479U/en active Active
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