CN220139802U - Waterproof ultrathin flexible circuit board - Google Patents
Waterproof ultrathin flexible circuit board Download PDFInfo
- Publication number
- CN220139802U CN220139802U CN202321531856.2U CN202321531856U CN220139802U CN 220139802 U CN220139802 U CN 220139802U CN 202321531856 U CN202321531856 U CN 202321531856U CN 220139802 U CN220139802 U CN 220139802U
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- waterproof
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- circuit board
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- 238000001035 drying Methods 0.000 claims abstract description 9
- 239000010410 layer Substances 0.000 claims description 183
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 30
- 229910052802 copper Inorganic materials 0.000 claims description 30
- 239000010949 copper Substances 0.000 claims description 30
- 239000004698 Polyethylene Substances 0.000 claims description 18
- -1 polyethylene Polymers 0.000 claims description 18
- 229920000573 polyethylene Polymers 0.000 claims description 18
- 239000004642 Polyimide Substances 0.000 claims description 15
- 229920001721 polyimide Polymers 0.000 claims description 15
- 238000007791 dehumidification Methods 0.000 claims description 13
- 238000002955 isolation Methods 0.000 claims description 13
- 239000003795 chemical substances by application Substances 0.000 claims description 10
- 239000004973 liquid crystal related substance Substances 0.000 claims description 10
- 239000011241 protective layer Substances 0.000 claims description 10
- 239000012790 adhesive layer Substances 0.000 claims description 7
- 239000003292 glue Substances 0.000 claims description 6
- 230000002265 prevention Effects 0.000 claims description 6
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical group N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000003063 flame retardant Substances 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims description 4
- 238000005868 electrolysis reaction Methods 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 238000005452 bending Methods 0.000 description 5
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000003490 calendering Methods 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 238000004078 waterproofing Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 210000003484 anatomy Anatomy 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The utility model relates to the technical field of circuit boards, and discloses a waterproof ultrathin flexible circuit board which comprises a waterproof mechanism, a soft mechanism and a fireproof mechanism, wherein the soft mechanism is arranged on the lower surface of the waterproof mechanism, the fireproof mechanism is arranged on the lower surface of the soft mechanism, the waterproof mechanism comprises a waterproof layer, a drying layer, a rust-proof layer, a dehumidifying layer and a connecting layer, the drying layer is adhered to the lower surface of the waterproof layer, the rust-proof layer is adhered to the lower end of the drying layer, the waterproof layer is adhered to the upper surface of the rust-proof layer, the dehumidifying layer is adhered to the lower end of the rust-proof layer, and the drying layer and the dehumidifying layer are arranged on the upper surface of the dehumidifying layer.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a waterproof ultrathin flexible circuit board.
Background
The flexible circuit board is called FPC for short, is a printed circuit board made of flexible insulating base material (mainly polyimide or polyester film), has many advantages not possessed by the rigid printed circuit board, can greatly reduce the volume of electronic products by using the FPC, and is suitable for the requirement of the development of the electronic products in the high-density, miniaturized and high-reliability directions, so that the FPC is widely applied to the fields or products of aerospace, military, mobile communication, portable computers, computer peripherals, PDA, digital cameras and the like. The FPC also has the advantages of good heat dissipation, good solderability, easiness in assembly and connection, low comprehensive cost and the like.
The existing waterproof ultrathin flexible circuit board cannot remove corrosion and rust of internal parts of equipment when external water stains enter the equipment, and influences the service life of the equipment.
Disclosure of Invention
(one) solving the technical problems
The utility model aims to provide a waterproof ultrathin flexible circuit board, which solves the problem that internal water stains cannot be removed in the background technology.
(II) technical scheme
In order to achieve the above purpose, the present utility model provides the following technical solutions: including waterproof mechanism, soft mechanism and fire prevention mechanism, waterproof mechanism's lower surface is provided with soft mechanism, soft mechanism's lower surface is provided with fire prevention mechanism, waterproof mechanism includes waterproof layer, dry layer, antirust layer, dehumidification layer and tie coat, the lower surface bonding of waterproof layer has the dry layer, the lower extreme bonding of dry layer has the antirust layer, the upper surface bonding of antirust layer has the waterproof layer, the lower extreme bonding of antirust layer has the dehumidification layer.
Preferably, the upper surface bonding of dehumidification layer has the dry layer, the lower extreme bonding of dehumidification layer has the tie layer, the upper surface bonding of tie layer has the antirust layer, can make through setting up dry layer and dehumidification layer go on evaporating the inside water stain of equipment and avoid having the inside of equipment to lead to influencing the use of equipment for a long time, can avoid having the inside water stain of equipment to cause the erosion to rust to equipment for a long time through the antirust layer, influence the life of equipment.
Preferably, the softening mechanism comprises a polyethylene layer, a rolled copper layer, an electrolytic copper layer, a protective layer and a transparent adhesive layer, wherein the upper end of the polyethylene layer is adhered with a connecting layer, the lower end of the polyethylene layer is adhered with the rolled copper layer, the lower surface of the rolled copper layer is adhered with the electrolytic copper layer, the upper surface of the electrolytic copper layer is adhered with the polyethylene layer, the material of a circuit board can be made to be softer by arranging the polyethylene layer, the whole strength of the equipment is high and bending-resistant by arranging the rolled copper layer, and the equipment can be freely bent, coiled and folded.
Preferably, the lower surface of the electrolytic copper layer is adhered with a protective layer, the lower end of the protective layer is adhered with a transparent adhesive layer, the upper end of the transparent adhesive layer is adhered with the electrolytic copper layer, and the lower surface of the transparent adhesive layer is adhered with a fireproof layer.
Preferably, the fireproof mechanism comprises a fireproof layer, a polyimide layer, an isolation layer, a dielectric buffer layer, a liquid crystal aligning agent and a separation layer, wherein the polyimide layer is bonded on the lower surface of the fireproof layer, the isolation layer is bonded on the lower end of the polyimide layer, the fireproof layer is bonded on the upper surface of the isolation layer, and the dielectric buffer layer is bonded on the lower end of the isolation layer.
Preferably, the lower surface of the dielectric buffer layer is adhered with a liquid crystal aligning agent, the lower end of the liquid crystal aligning agent is adhered with a separating layer, the whole device can be high-temperature resistant through the fireproof layer and the polyimide layer, the use strength is high, the device can be effectively placed on an article through the separating layer, the device is prevented from being melted and adhered to the object due to high temperature caused by the outside of the device, and the device is inconvenient to remove.
Compared with the prior art, the utility model has the beneficial effects that:
1. according to the waterproof ultrathin flexible circuit board, the drying layer and the dehumidifying layer are arranged, so that water stains inside equipment can be evaporated, the equipment is prevented from being influenced by the fact that the equipment is used for a long time, and the rust prevention layer can prevent the equipment from being corroded and rusted by the water stains inside the equipment for a long time, so that the service life of the equipment is influenced;
2. according to the waterproof ultrathin flexible circuit board, the polyethylene layer is arranged to enable the material of the circuit board to be soft, and the calendaring copper layer is arranged to enable the overall strength of the equipment to be high and bending-resistant, so that the equipment can be freely bent, rolled and folded;
3. this but waterproof ultra-thin flexible line way board can make the whole of equipment become high temperature resistant through setting up flame retardant coating and polyimide layer, and use strength becomes high, separates when can making equipment put on article effectively through the separating layer and separates the high temperature that avoids equipment outside to bring and lead to equipment to melt to paste on the object, inconvenient getting rid of.
Drawings
FIG. 1 is a schematic perspective view of the present utility model;
FIG. 2 is a schematic view of the side anatomy of the waterproof layer of the present utility model;
FIG. 3 is a schematic side anatomical view of a polyethylene layer according to the utility model;
fig. 4 is a schematic side anatomical view of a fire barrier of the present utility model.
In the figure: 1. a waterproof mechanism; 101. a waterproof layer; 102. drying the layer; 103. a rust-proof layer; 104. a dehumidifying layer; 105. a connection layer; 2. a softening mechanism; 201. a polyethylene layer; 202. calendaring the copper layer; 203. electrolyzing the copper layer; 204. a protective layer; 205. a transparent adhesive layer; 3. a fire protection mechanism; 301. a fire-blocking layer; 302. a polyimide layer; 303. an isolation layer; 304. a dielectric buffer layer; 305. a liquid crystal aligning agent; 306. and separating the layers.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, the present utility model provides a technical solution: including waterproofing mechanism 1, soft mechanism 2 and fire prevention mechanism 3, the lower surface of waterproofing mechanism 1 is provided with soft mechanism 2, the lower surface of soft mechanism 2 is provided with fire prevention mechanism 3, waterproofing mechanism 1 includes waterproof layer 101, dry layer 102, antirust layer 103, dehumidification layer 104 and tie coat 105, waterproof layer 101's lower surface bonds and has dry layer 102, dry layer 102's lower extreme bonds and has antirust layer 103, antirust layer 103's upper surface bonds and has waterproof layer 101, antirust layer 103's lower extreme bonds and has dehumidification layer 104.
The upper surface bonding of dehumidification layer 104 has dry layer 102, and the lower extreme bonding of dehumidification layer 104 has tie layer 105, and the upper surface bonding of tie layer 105 has antirust layer 103, can make through setting up dry layer 102 and dehumidification layer 104 go on evaporating to the inside water stain of equipment and avoid having the inside of equipment to lead to influencing the use of equipment for a long time, can avoid having the inside water stain of equipment to cause the erosion to rust to equipment for a long time through antirust layer 103, influence the life of equipment.
The softening mechanism 2 comprises a polyethylene layer 201, a rolled copper layer 202, an electrolytic copper layer 203, a protective layer 204 and a transparent adhesive layer 205, wherein the upper end of the polyethylene layer 201 is adhered with a connecting layer 105, the lower end of the polyethylene layer 201 is adhered with the rolled copper layer 202, the lower surface of the rolled copper layer 202 is adhered with the electrolytic copper layer 203, the upper surface of the electrolytic copper layer 203 is adhered with the polyethylene layer 201, the material of a circuit board can be made to be softer by arranging the polyethylene layer 201, and the whole strength of the equipment is high and bending-resistant by arranging the rolled copper layer 202, so that the equipment can be freely bent, coiled and folded.
The lower surface of electrolytic copper layer 203 is bonded with protective layer 204, and the lower extreme of protective layer 204 is bonded with transparent glue film 205, and the upper end of transparent glue film 205 is bonded with electrolytic copper layer 203, and the lower surface of transparent glue film 205 is bonded with flame retardant coating 301.
The fireproof mechanism 3 comprises a fireproof layer 301, a polyimide layer 302, an isolation layer 303, a dielectric buffer layer 304, a liquid crystal aligning agent 305 and a separation layer 306, wherein the polyimide layer 302 is adhered to the lower surface of the fireproof layer 301, the isolation layer 303 is adhered to the lower end of the polyimide layer 302, the fireproof layer 301 is adhered to the upper surface of the isolation layer 303, and the dielectric buffer layer 304 is adhered to the lower end of the isolation layer 303.
The lower surface of the dielectric buffer layer 304 is adhered with a liquid crystal aligning agent 305, the lower end of the liquid crystal aligning agent 305 is adhered with a separating layer 306, the whole device can be high-temperature resistant by arranging the fireproof layer 301 and the polyimide layer 302, the use strength is high, the device can be effectively separated and isolated when being placed on an article by the separating layer 306, the device is prevented from being fused and adhered to the object due to high temperature caused by the outside of the device, and the device is inconvenient to remove.
Working principle: placing the equipment in suitable position, can making go on evaporating through setting up dry layer 102 and dehumidification layer 104 to the inside water stain of equipment and avoiding the inside of existence equipment to lead to influencing the use of equipment for a long time, can avoid the inside water stain of existence equipment to lead to the corrosion rust to equipment for a long time through antirust layer 103, influence the life of equipment, can make the material of circuit board become softer through setting up polyethylene layer 201, make the bulk strength of equipment high resistant bending through setting up calendering copper layer 202, can make the equipment carry out free bending, coiling and folding, can make the whole of equipment become high temperature resistant through setting up flame retardant coating 301 and polyimide layer 302, use strength becomes high, can separate when making the equipment put on article effectively through separating layer 306 and avoid the outside high temperature that brings of equipment to lead to the equipment to melt and paste on the object, inconvenient getting rid of.
Finally, it should be noted that the above description is only for illustrating the technical solution of the present utility model, and not for limiting the scope of the present utility model, and that the simple modification and equivalent substitution of the technical solution of the present utility model can be made by those skilled in the art without departing from the spirit and scope of the technical solution of the present utility model.
Claims (6)
1. The utility model provides a but ultra-thin flexible line way board of waterproof, includes waterproof mechanism (1), soft mechanism (2) and fire prevention mechanism (3), its characterized in that: the waterproof mechanism is characterized in that a soft mechanism (2) is arranged on the lower surface of the waterproof mechanism (1), a fireproof mechanism (3) is arranged on the lower surface of the soft mechanism (2), the waterproof mechanism (1) comprises a waterproof layer (101), a drying layer (102), a rust-proof layer (103), a dehumidifying layer (104) and a connecting layer (105), the drying layer (102) is bonded on the lower surface of the waterproof layer (101), the rust-proof layer (103) is bonded on the lower end of the drying layer (102), the waterproof layer (101) is bonded on the upper surface of the rust-proof layer (103), and the dehumidifying layer (104) is bonded on the lower end of the rust-proof layer (103).
2. The waterproof ultra-thin flexible circuit board according to claim 1, wherein: the upper surface of dehumidification layer (104) bonds and has dry layer (102), the lower extreme of dehumidification layer (104) bonds and has tie coat (105), the upper surface of tie coat (105) bonds and has antirust layer (103).
3. The waterproof ultra-thin flexible circuit board according to claim 1, wherein: the soft mechanism (2) comprises a polyethylene layer (201), a rolled copper layer (202), an electrolytic copper layer (203), a protective layer (204) and a transparent adhesive layer (205), wherein the upper end of the polyethylene layer (201) is adhered with a connecting layer (105), the lower end of the polyethylene layer (201) is adhered with the rolled copper layer (202), the lower surface of the rolled copper layer (202) is adhered with the electrolytic copper layer (203), and the upper surface of the electrolytic copper layer (203) is adhered with the polyethylene layer (201).
4. A waterproof ultra-thin flexible circuit board according to claim 3, wherein: the lower surface of electrolysis copper layer (203) bonds there is protective layer (204), the lower extreme of protective layer (204) bonds there is transparent glue film (205), the upper end of transparent glue film (205) bonds there is electrolysis copper layer (203), the lower surface of transparent glue film (205) bonds there is flame retardant coating (301).
5. The waterproof ultra-thin flexible circuit board according to claim 1, wherein: the fireproof mechanism (3) comprises a fireproof layer (301), a polyimide layer (302), an isolation layer (303), a dielectric buffer layer (304), a liquid crystal aligning agent (305) and a separation layer (306), wherein the polyimide layer (302) is adhered to the lower surface of the fireproof layer (301), the isolation layer (303) is adhered to the lower end of the polyimide layer (302), the fireproof layer (301) is adhered to the upper surface of the isolation layer (303), and the dielectric buffer layer (304) is adhered to the lower end of the isolation layer (303).
6. The waterproof ultra-thin flexible circuit board according to claim 5, wherein: a liquid crystal aligning agent (305) is adhered to the lower surface of the dielectric buffer layer (304), and a separation layer (306) is adhered to the lower end of the liquid crystal aligning agent (305).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321531856.2U CN220139802U (en) | 2023-06-15 | 2023-06-15 | Waterproof ultrathin flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321531856.2U CN220139802U (en) | 2023-06-15 | 2023-06-15 | Waterproof ultrathin flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220139802U true CN220139802U (en) | 2023-12-05 |
Family
ID=88951967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321531856.2U Active CN220139802U (en) | 2023-06-15 | 2023-06-15 | Waterproof ultrathin flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220139802U (en) |
-
2023
- 2023-06-15 CN CN202321531856.2U patent/CN220139802U/en active Active
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| GR01 | Patent grant |