CN210157451U - High-density flexible multilayer electronic circuit board structure - Google Patents
High-density flexible multilayer electronic circuit board structure Download PDFInfo
- Publication number
- CN210157451U CN210157451U CN201920146022.7U CN201920146022U CN210157451U CN 210157451 U CN210157451 U CN 210157451U CN 201920146022 U CN201920146022 U CN 201920146022U CN 210157451 U CN210157451 U CN 210157451U
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- Prior art keywords
- copper foil
- circuit board
- electronic circuit
- film
- shielding layer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims abstract description 43
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 35
- 239000011889 copper foil Substances 0.000 claims abstract description 32
- 239000000853 adhesive Substances 0.000 claims abstract description 14
- 230000001070 adhesive effect Effects 0.000 claims abstract description 14
- 238000000576 coating method Methods 0.000 claims abstract description 14
- 230000003471 anti-radiation Effects 0.000 claims abstract description 13
- 239000011248 coating agent Substances 0.000 claims abstract description 12
- 239000003292 glue Substances 0.000 claims abstract description 11
- 239000010408 film Substances 0.000 claims description 35
- 230000003014 reinforcing effect Effects 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 8
- 239000013039 cover film Substances 0.000 claims description 5
- 230000001681 protective effect Effects 0.000 claims description 3
- 230000001965 increasing effect Effects 0.000 abstract description 7
- 239000012528 membrane Substances 0.000 abstract 1
- 208000027418 Wounds and injury Diseases 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 208000014674 injury Diseases 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Images
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a flexible multilayer electronic circuit plate structure of high density, including ring interface, base plate film, cover membrane protection film, copper foil base plate, stiffening plate, adhesive, electron shielding film, departure paper, anti-radiation coating, go up shielding layer and shielding layer down. The utility model has the advantages that: the ring interface indirectly increases the external connection density of the electronic circuit board by increasing the connection between the external circuit boards, the copper foil substrates are fixed on the substrate film in parallel through the via holes and glue, the copper foil substrates are connected in parallel, the density increase of the single electronic circuit board is ensured, the number of the single substrates on one copper foil substrate is increased, the mechanical strength of the reinforced FPC is reinforced, the surface mounting operation is facilitated, the anti-radiation coating is uniformly coated on important single-board components such as the copper foil substrate through waterproof glue, the electronic circuit board is ensured not to be damaged to a human body under the high-efficiency operation, and the potential safety hazard is reduced.
Description
Technical Field
The utility model relates to an electronic circuit plate structure specifically is a flexible multilayer electronic circuit plate structure of high density, belongs to electron and integrated circuit technical field.
Background
Flexible circuit boards, also known as "flexible boards," are printed circuits made from flexible, insulating substrates. The flexible circuit provides excellent electrical performance, can meet the design requirements of more small-sized and higher-density installation, is also beneficial to reducing assembly processes and enhancing reliability, is a unique solution meeting the requirements of miniaturization and movement of electronic products, can be freely bent, wound and folded, can bear millions of dynamic bending without damaging a lead, can be randomly arranged according to the space layout requirement, and can be randomly moved and stretched in a three-dimensional space, thereby achieving the integration of component assembly and lead connection; the flexible circuit board can greatly reduce the volume and the weight of the electronic product, and is suitable for the development of the electronic product towards high density, miniaturization and high reliability.
At present, although there are many high-density flexible multi-layer electronic circuit board structures, there still exist some problems in the existing high-density flexible multi-layer electronic circuit board structures, one is that the change and repair of the flexible PCB of the existing high-density flexible multi-layer electronic circuit board structure is difficult, the other is that the existing high-density flexible multi-layer electronic circuit board structure is slightly deficient in both element density and substrate density, and the other is that the existing high-density flexible multi-layer electronic circuit board structure can generate small radiation while working at high density, and can cause damage to human body after long-term use.
SUMMERY OF THE UTILITY MODEL
An object of the present invention is to provide a high-density flexible multi-layer electronic circuit board structure for solving the above problems.
The utility model discloses a following technical scheme realizes above-mentioned purpose: a high-density flexible multilayer electronic circuit board structure comprises a ring interface, a substrate film, a cover film protection film, a copper foil substrate, a reinforcing plate, an adhesive, an electronic shielding film, release paper, an anti-radiation coating, an upper shielding layer and a lower shielding layer; the ring interfaces are positioned on two sides of a substrate film, the substrate film is arranged between the two ring interfaces in a transparent state, the cover film protection film is connected to the ring interfaces, the copper foil substrates are densely stacked on the substrate film, the reinforcing plates are respectively fixed on the inner sides of the upper shielding layer and the lower shielding layer through adhesives, the adhesives are positioned between the reinforcing plates and the upper shielding layer and between the reinforcing plates and the lower shielding layer, the electronic shielding film is arranged on the periphery of each copper foil substrate, the release paper is fixed on each single plate on the copper foil substrate through the adhesives, the anti-radiation coatings are uniformly distributed on each element, and the upper shielding layer and the lower shielding layer are arranged on the outermost side of the circuit board structure.
Preferably, in order to indirectly increase the external connection density of the electronic circuit board by increasing the connection between the external circuit boards, the loop interfaces made of the stretch-resistant material may be connected to other multilayer electronic circuit boards.
Preferably, in order to ensure the increase of the density of the single-electron circuit board, the number of the single-substrate copper clad laminates is increased, the copper clad laminates are fixed on the substrate film in parallel through the via holes and the glue, and the copper clad laminates are connected in parallel.
Preferably, in order to reinforce the mechanical strength of the FPC and facilitate the surface mounting operation, the thickness of the reinforcing plate is 3mm, and the material, shape and size of the upper reinforcing plate and the lower reinforcing plate are the same.
Preferably, in order to ensure that the electronic circuit board cannot hurt human bodies under the high-efficiency operation and reduce potential safety hazards, the anti-radiation coating is uniformly coated on the single-board elements such as the copper foil substrate and the like through waterproof glue.
The utility model has the advantages that: this high density flexible multilayer electronic circuit board structural design is reasonable, the ring interface can be connected with other multilayer electronic circuit boards, and it comprises stretch-proofing material, external connection density of electronic circuit board is indirectly increased through increasing the connection between the external circuit board, the copper foil base plate passes through via hole and glue parallel fixation on the base plate film, and each copper foil base plate is parallel connection, ensure the increase in density of single electronic circuit board, increase the quantity of single base plate at a copper foil base plate, stiffening plate thickness is 3mil, and two upper and lower stiffening plate materials, the shape, the size is all the same, reinforcement FPC's mechanical strength, make things convenient for the real equipment operation on surface, the anti-radiation coating evenly paints on the important single plate component such as copper foil base plate through the waterproof glue, ensure that this electronic circuit board can not produce the injury to the human body under high-efficient operation, reduce the potential safety hazard.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic sectional view of a part of the structure of the present invention.
In the figure: 1. the electronic shielding film comprises a ring interface, 2, a substrate film, 3, a covering film protection film, 4, a copper foil substrate, 5, a reinforcing plate, 6, an adhesive, 7, an electronic shielding film, 8, release paper, 9, a radiation-reflecting coating, 10, an upper shielding layer, 11 and a lower shielding layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, a high-density flexible multi-layer electronic circuit board structure includes a ring interface 1, a substrate film 2, a cover film protection film 3, a copper foil substrate 4, a reinforcing plate 5, an adhesive 6, an electronic shielding film 7, release paper 8, a radiation-reflecting coating 9, an upper shielding layer 10, and a lower shielding layer 11; the ring interfaces 1 are positioned on two sides of the substrate film 2, the substrate film 2 is arranged between the two ring interfaces 1 in a transparent manner, the cover film protection film 3 is connected to the ring interfaces 1, the copper foil substrates 4 are densely stacked on the substrate film 2, the reinforcing plates 5 are respectively fixed on the inner sides of the upper shielding layer 10 and the lower shielding layer 11 through adhesives 6, the adhesives 6 are positioned between the reinforcing plates 5 and the upper shielding layer 10 and the lower shielding layer 11, the electronic shielding films 7 are arranged on the periphery of each copper foil substrate 4, the release paper 8 is fixed on each single plate on the copper foil substrate 4 through adhesives, the anti-radiation coatings 9 are uniformly distributed on each element, and the upper shielding layer 10 and the lower shielding layer 11 are arranged on the outermost side of the circuit board structure.
The ring interface 1 can be connected with other multilayer electronic circuit boards by stretch-proofing material, increases the external connection density of electronic circuit board indirectly through increasing the connection between the external circuit board, copper foil base plate 4 passes through the via hole and glue parallel fixation on base plate film 2, and each copper foil base plate 4 is parallel connection, ensures the increase of density of single electronic circuit board, increases the quantity of single base plate at a copper foil base plate 4, stiffening plate 5 thickness is 3mil, and two upper and lower stiffening plate 5 materials, shape, size are the same, and reinforcement FPC's mechanical strength makes things convenient for surperficial real installation operation, anti-radiation coating 9 evenly coats on copper foil base plate 4 etc. important single plate component through the waterproof glue, ensures that this electronic circuit board can not produce the injury to the human body under high-efficient operation, reduces the potential safety hazard.
The working principle is as follows: when the high-density flexible multilayer electronic circuit board structure is used, firstly, each part can work normally, then, a specific adhesive 6 is used according to the needs of customers, the reinforcing plate 5 is used for reinforcing the mechanical strength of the FPC, the surface mounting operation is convenient, each copper foil substrate 4 is used for high-density operation, the anti-radiation coating 9 ensures that the electronic circuit board cannot hurt the human body under the high-efficiency operation, the potential safety hazard is reduced, and the copper foil substrate 4, the protective film, the reinforcing plate 5 and the shielding layer are arranged in the structural sequence from inside to outside.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (5)
1. A high-density flexible multilayer electronic circuit board structure is characterized in that: the anti-radiation protective film comprises a ring interface (1), a substrate film (2), a covering film protective film (3), a copper foil substrate (4), a reinforcing plate (5), an adhesive (6), an electronic shielding film (7), release paper (8), a anti-radiation coating (9), an upper shielding layer (10) and a lower shielding layer (11); the ring interfaces (1) are positioned at two sides of the substrate film (2), the substrate film (2) is arranged between the two ring interfaces (1) in a transparent state, the cover film protection film (3) is connected to the ring interface (1), the copper foil substrates (4) are densely stacked on the substrate film (2), the reinforcing plate (5) is respectively fixed on the inner sides of the upper shielding layer (10) and the lower shielding layer (11) through an adhesive (6), the adhesive (6) is positioned between the reinforcing plate (5) and the upper shielding layer (10) and the lower shielding layer (11), the electronic shielding film (7) is arranged at the periphery of each copper foil substrate (4), the release paper (8) is fixed on each single board on the copper foil substrate (4) through glue, the anti-radiation coating (9) is uniformly distributed on each element, and the upper shielding layer (10) and the lower shielding layer (11) are arranged on the outermost side of the circuit board structure.
2. A high-density flexible multilayer electronic circuit board structure according to claim 1, wherein: the loop connector (1) made of tensile material can be connected with a multilayer electronic circuit board.
3. A high-density flexible multilayer electronic circuit board structure according to claim 1, wherein: the copper foil substrates (4) are fixed on the substrate rubber sheet (2) in parallel through via holes and glue, and the copper foil substrates (4) are connected in parallel.
4. A high-density flexible multilayer electronic circuit board structure according to claim 1, wherein: the thickness of the reinforcing plate (5) is 3mm, and the material, the shape and the size of the upper reinforcing plate and the lower reinforcing plate (5) are the same.
5. A high-density flexible multilayer electronic circuit board structure according to claim 1, wherein: the anti-radiation coating (9) is uniformly coated on the single-board elements such as the copper foil substrate (4) and the like through waterproof glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920146022.7U CN210157451U (en) | 2019-01-28 | 2019-01-28 | High-density flexible multilayer electronic circuit board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920146022.7U CN210157451U (en) | 2019-01-28 | 2019-01-28 | High-density flexible multilayer electronic circuit board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210157451U true CN210157451U (en) | 2020-03-17 |
Family
ID=69754610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920146022.7U Expired - Fee Related CN210157451U (en) | 2019-01-28 | 2019-01-28 | High-density flexible multilayer electronic circuit board structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210157451U (en) |
-
2019
- 2019-01-28 CN CN201920146022.7U patent/CN210157451U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200317 |