TW202033700A - Conductive bonding sheet for fpc and fpc using the same - Google Patents

Conductive bonding sheet for fpc and fpc using the same Download PDF

Info

Publication number
TW202033700A
TW202033700A TW109115674A TW109115674A TW202033700A TW 202033700 A TW202033700 A TW 202033700A TW 109115674 A TW109115674 A TW 109115674A TW 109115674 A TW109115674 A TW 109115674A TW 202033700 A TW202033700 A TW 202033700A
Authority
TW
Taiwan
Prior art keywords
fpc
conductive adhesive
adhesive sheet
conductive
flame
Prior art date
Application number
TW109115674A
Other languages
Chinese (zh)
Other versions
TWI754931B (en
Inventor
野村直宏
櫻木喬規
竹山早苗
後藤信弘
Original Assignee
日商藤森工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商藤森工業股份有限公司 filed Critical 日商藤森工業股份有限公司
Publication of TW202033700A publication Critical patent/TW202033700A/en
Application granted granted Critical
Publication of TWI754931B publication Critical patent/TWI754931B/en

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/10—Interconnection of layers at least one layer having inter-reactive properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00—Adhesive articles, e.g. adhesive tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit

Abstract

A conductive adhesive sheet used for FPC is provided. When the conductive adhesive sheets used for FPC bonded to a metal reinforcing plate are stacked, blocking between the conductive adhesive layer and the metal reinforcing plate will not occur, and it has good peelability which means it can be easily peeled off. In addition, it can be firmly fixed to the FPC. The conductive adhesive sheet 5 used for FPC is provided. The conductive adhesive sheet 5 used for FPC is formed by coating an adhesive composition including a flame-retardant resin, a crosslinking agent 2, a conductive filler 3, and an antiblocking agent 4 onto one side of a support film 1, and stacking a conductive adhesive layers 13. When the sum volume Va of the non-volatile portion of the flame-retardant resin and the crosslinking agent is 100 (VOL%), the sum volume Vb of the conductive filler and the antiblocking agent is in a range of 15~70 (VOL%) preferably.

Description

FPC用導電性黏著片材及使用此片材之FPCConductive adhesive sheet for FPC and FPC using this sheet

本發明涉及一種熱固化性的FPC用導電性黏著片材及使用了該黏著片材的FPC，所述FPC用導電性黏著片材用於在可撓性印刷基板（以下稱為FPC）的表面上貼合金屬加強板。更詳細而言，提供一種FPC用導電性黏著片材，其在將貼合於金屬加強板的FPC用導電性黏著片材層疊的狀態下，不引起導電性黏著劑層與金屬加強板的黏連（貼附），具備能夠容易剝離的易剝離性，且牢固地固定在FPC上。The present invention relates to a thermosetting conductive adhesive sheet for FPC and an FPC using the adhesive sheet. The conductive adhesive sheet for FPC is used on the surface of a flexible printed circuit board (hereinafter referred to as FPC) A metal reinforcing plate is attached to the upper surface. In more detail, there is provided a conductive adhesive sheet for FPC, which does not cause adhesion between the conductive adhesive layer and the metal reinforcement plate in the state where the conductive adhesive sheet for FPC bonded to the metal reinforcement plate is laminated. Connect (attach), with easy peelability that can be easily peeled off, and firmly fixed on the FPC.

在可攜式電話、平板終端等可攜式電子設備中，為了減小外殼的外形尺寸以易於攜帶，在印刷電路板上集成電子部件。更進一步，為了減小外殼的外形尺寸，將印刷電路板分割成多個，在該分割的印刷電路板之間使用有可撓性的FPC進行連接線路，由此折疊印刷電路板或使其滑動。 此外，在近年，為了防止受到由電子設備外部接收的電磁波的噪音、或是配設在電子設備內部的電子部件相互間接收的電磁波的噪音的影響而發生誤操作，進行用電磁遮罩材料包覆重要的電子部件或FPC。In portable electronic devices such as portable phones and tablet terminals, in order to reduce the outer size of the housing for easy portability, electronic components are integrated on the printed circuit board. Furthermore, in order to reduce the outer dimensions of the housing, the printed circuit board is divided into multiple, and flexible FPC is used to connect the circuit between the divided printed circuit boards, thereby folding the printed circuit board or making it slide . In addition, in recent years, in order to prevent erroneous operation caused by electromagnetic wave noise received from the outside of electronic equipment, or electromagnetic wave noise received between electronic components arranged inside electronic equipment, electromagnetic shielding materials have been used. Important electronic components or FPC.

以往，作為用於所述電磁遮罩目的的電磁遮罩材料，使用了在壓延銅箔、軟鋁箔等金屬箔的表面設有黏著劑層的材料。使用這樣的金屬箔構成的電磁遮罩材料覆蓋遮蔽物件物（例如，參照專利文獻1）。 具體而言，為了從電磁波中遮蔽重要的電子部件，使用金屬箔或金屬板做成密閉箱狀進行覆蓋。此外，為了從電磁波中遮蔽彎曲的FPC的線路，使用在金屬箔的單面上設置了黏著劑層的材料，經由黏著劑層進行貼合。Conventionally, as an electromagnetic shield material used for the purpose of the electromagnetic shield, a material provided with an adhesive layer on the surface of metal foil such as rolled copper foil and soft aluminum foil has been used. The electromagnetic shielding material composed of such a metal foil is used to cover the shielding object (for example, refer to Patent Document 1). Specifically, in order to shield important electronic components from electromagnetic waves, metal foils or metal plates are used to cover them in a sealed box. In addition, in order to shield the curved FPC line from electromagnetic waves, a material in which an adhesive layer is provided on one surface of a metal foil is used, and the adhesive layer is bonded via the adhesive layer.

如此，用於可攜式電話的FPC、及覆蓋FPC進行電磁波遮蔽的FPC用電磁遮罩材料，以超過以往的攜帶式電子設備的常識的頻率受到反復的彎曲操作。因此，發揮FPC的電磁波遮蔽功能的FPC用電磁遮罩材料受到嚴重的反復應力。若無法耐受該反復應力（repeated stress），最終則會造成構成FPC用電磁遮罩材料的支承體及金屬箔等遮罩材料發生破裂或受到剝離等損傷，存在作為FPC用電磁遮罩材料的功能降低或消失的擔憂。 因此，已知有對應於受到這種反復彎曲操作的電磁遮罩材料（例如，參照專利文獻2）。In this way, the FPC used in a portable phone and the electromagnetic shielding material for the FPC that covers the FPC and shields electromagnetic waves are subjected to repeated bending operations at a frequency exceeding the common sense of conventional portable electronic devices. Therefore, the electromagnetic shielding material for FPC, which exerts the electromagnetic wave shielding function of FPC, receives severe repeated stress. If the repeated stress cannot withstand the repeated stress, the supporting body and metal foil that constitute the electromagnetic shielding material for FPC will eventually be damaged or damaged by peeling, etc., and there are some as electromagnetic shielding materials for FPC. Worries about reduced or disappeared functions. Therefore, there is known an electromagnetic mask material corresponding to such repeated bending operations (for example, refer to Patent Document 2).

此外，在近年，作為隨身攜帶的電子設備，可攜式電話、平板終端等飛速普及。在可攜式電話中，較佳為不使用而收納在口袋或包等之中時整體尺寸盡可能小，在使用時能夠擴大整體尺寸。在此，要求可攜式電話的小型化與薄型化，謀求操作性的改善。 此外，在組裝入電子設備中的FPC上，在與安裝有部件的一側相對一側的面或以連接器連接的FPC的終端等上貼附有塑膠板的加強板，但在近年，為了薄型化，提出了貼附由不銹鋼等構成的薄板的金屬加強板（例如，參照專利文獻3）。 [先行技術文獻] [專利文獻]In addition, in recent years, portable phones, tablet terminals, etc., have rapidly spread as portable electronic devices. In a portable telephone, it is preferable that the overall size be as small as possible when not in use but stored in a pocket or bag, etc., so that the overall size can be enlarged when in use. Here, miniaturization and thinning of portable telephones are required, and improvement in operability is sought. In addition, in FPC assembled in electronic equipment, a reinforcing plate of a plastic plate is attached to the surface opposite to the side where the components are installed or the terminal of the FPC connected by a connector. However, in recent years, for For thinning, a metal reinforcing plate to which a thin plate made of stainless steel or the like is attached has been proposed (for example, refer to Patent Document 3). [Advanced Technical Literature] [Patent Literature]

專利文獻1：日本特開昭61-222299號公報 專利文獻2：日本特開平7-122883號公報 專利文獻3：日本特開2009-218443號公報Patent Document 1: Japanese Patent Laid-Open No. 61-222299 Patent Document 2: Japanese Patent Laid-Open No. 7-122883 Patent Document 3: Japanese Patent Application Publication No. 2009-218443

[本發明要解決的技術問題][Technical Problem to be Solved by the Invention]

在上述專利文獻1中公開的在壓延銅箔、軟鋁箔等金屬箔的表面設置黏著劑層的電磁遮罩材料中，在彎曲操作的次數少、使用時間短的情況下，對遮罩性能沒有影響。 但是在最近的可攜式電話中，外殼的外形尺寸的厚度以0.1mm單位進行削減，要求盡可能地薄型化，因此無法適用。In the electromagnetic mask material disclosed in Patent Document 1 in which an adhesive layer is provided on the surface of a metal foil such as rolled copper foil and soft aluminum foil, the number of bending operations is small and the use time is short. influences. However, in recent portable phones, the thickness of the outer dimensions of the casing is reduced in units of 0.1 mm, and it is required to be as thin as possible, so it cannot be applied.

此外，專利文獻2的實施例所述的電磁遮罩材料，是在厚度12μm的樹脂膜上積層厚度0.5μm的導電性塗料的塗佈膜、及厚度30μm的導電性黏著劑層，其電磁遮罩材料的整體厚度超過40μm。 如上所述，為了使可攜式電話的外殼外形尺寸盡可能薄，因此要求FPC用電磁遮罩材料的整體厚度薄至30μm以下。即，要求一種與現有的FPC用電磁遮罩材料相比整體厚度更薄、且能夠耐受更嚴酷的彎曲試驗的堅固的FPC用電磁遮罩材料。In addition, the electromagnetic mask material described in the examples of Patent Document 2 is a resin film with a thickness of 12 μm and a coating film of a conductive paint with a thickness of 0.5 μm and a conductive adhesive layer with a thickness of 30 μm. The overall thickness of the cover material exceeds 40 μm. As described above, in order to make the outer dimensions of the casing of the portable phone as thin as possible, the overall thickness of the electromagnetic shielding material for FPC is required to be as thin as 30 μm or less. That is, there is a demand for a strong FPC electromagnetic shield material that is thinner in overall thickness than the conventional electromagnetic shield material for FPC and can withstand a more severe bending test.

此外，專利文獻3所述的具有金屬加強板的可撓性印刷線路板，經由導電性黏著劑黏著FPC的地線與金屬加強板。然而，在對裁切成規定尺寸的金屬加強板與導電性黏著劑的積層體進行層疊的情況下，存在產生黏連的現象，有難以剝離的問題。 因此，需要一種FPC用導電性黏著片材，其在將貼合於金屬加強板的FPC用導電性黏著片材層疊的狀態下，不引起導電性黏著劑層與金屬加強板的黏連，具有可輕易剝離的易剝離性，且牢固地固定在FPC上。In addition, the flexible printed wiring board with a metal reinforcement board described in Patent Document 3 adheres the ground wire of the FPC and the metal reinforcement board via a conductive adhesive. However, in the case of laminating a laminate of a metal reinforcing plate cut to a predetermined size and a conductive adhesive, there is a problem of blocking and difficulty in peeling. Therefore, there is a need for a conductive adhesive sheet for FPC, which does not cause adhesion between the conductive adhesive layer and the metal reinforcement plate in the state where the conductive adhesive sheet for FPC bonded to the metal reinforcement plate is laminated, and has It can be easily peeled off easily and firmly fixed on the FPC.

鑒於上述狀況，本發明的技術問題在於提供一種FPC用導電性黏著片材，其在將貼合於金屬加強板的FPC用導電性黏著片材層疊的狀態中，不引起導電性黏著劑層與金屬加強板之間的黏連，具有可輕易剝離的易剝離性，且牢固地固定在FPC上。 [解決技術問題的技術手段]In view of the above situation, the technical problem of the present invention is to provide a conductive adhesive sheet for FPC, which does not cause the conductive adhesive layer and the conductive adhesive sheet to be laminated to the metal reinforcing plate in the state where the conductive adhesive sheet for FPC is laminated The adhesion between the metal reinforcing plates is easy to peel off, and it is firmly fixed on the FPC. [Technical means to solve technical problems]

本發明的FPC用導電性黏著片材不引起導電性黏著劑層與金屬加強板的黏連，具有可輕易剝離的易剝離性，且需要具備能夠牢固地固定在FPC上這一相反的物性。 因此，本發明的技術構思在於，藉由相對於阻燃性樹脂與交聯劑的不揮發成分的總體積將導電性填充劑與防黏連劑的總體積或導電性填充劑的體積設在規定的範圍內，而能夠兼顧該相反的物性。The conductive adhesive sheet for FPC of the present invention does not cause adhesion between the conductive adhesive layer and the metal reinforcing plate, has easy peelability that can be easily peeled off, and needs to have the opposite physical properties of being able to be firmly fixed on the FPC. Therefore, the technical idea of the present invention is to set the total volume of the conductive filler and the anti-blocking agent or the volume of the conductive filler relative to the total volume of the nonvolatile components of the flame-retardant resin and the crosslinking agent Within the prescribed range, the opposite physical properties can be considered.

為了解決所述技術問題，本發明提供一種FPC用導電性黏著片材，其特徵在於，該FPC用導電性黏著片材用於FPC中，在支承體膜的單面上，塗佈含有阻燃性樹脂、交聯劑、導電性填充劑的黏著性組合物，或者塗佈含有阻燃性樹脂、交聯劑、導電性填充劑、防黏連劑的黏著性組合物，積層導電性黏著劑層而成。In order to solve the above technical problems, the present invention provides a conductive adhesive sheet for FPC, which is characterized in that the conductive adhesive sheet for FPC is used in FPC, and the support film is coated with flame retardant on one side Adhesive composition of flexible resin, cross-linking agent, conductive filler, or coating of adhesive composition containing flame-retardant resin, cross-linking agent, conductive filler, and anti-blocking agent, laminated conductive adhesive Layered.

此外，以所述阻燃性樹脂與所述交聯劑的不揮發成分的總體積VA 作為100（VOL%）時，所述導電性填充劑與所述防黏連劑的總體積VB 較佳為15~70（VOL%）的範圍。In addition, when the total volume V A of the non-volatile components of the flame-retardant resin and the crosslinking agent is taken as 100 (VOL%), the total volume V B of the conductive filler and the anti-blocking agent It is preferably in the range of 15 to 70 (VOL%).

此外，所述阻燃性樹脂較佳為含磷的聚氨酯樹脂。In addition, the flame-retardant resin is preferably a phosphorous-containing polyurethane resin.

此外，所述導電性填充劑為樹枝狀的金屬微粒，所述金屬微粒為由銀微粒、銅微粒、銀塗佈銅(Silver-coated copper)微粒所構成的群組中選擇的一種以上，以所述阻燃性樹脂與所述交聯劑的不揮發成分的總體積VA 作為100（VOL%）時，所述導電性填充劑的體積VC 較佳為15~60（VOL%）的範圍。In addition, the conductive filler is dendritic metal particles, and the metal particles are one or more selected from the group consisting of silver particles, copper particles, and silver-coated copper particles. When the total volume V A of the non-volatile components of the flame-retardant resin and the crosslinking agent is taken as 100 (VOL%), the volume V C of the conductive filler is preferably 15-60 (VOL%) range.

此外，所述防黏連劑為疏水性二氧化矽粉，以所述阻燃性樹脂與所述交聯劑的不揮發成分的總體積VA 作為100（VOL%）時，所述防黏連劑的體積VD 較佳為0~15（VOL%）的範圍。In addition, the anti-blocking agent is hydrophobic silica powder. When the total volume V A of the non-volatile components of the flame-retardant resin and the cross-linking agent is 100 (VOL%), the anti-blocking agent The volume V D of the coupling agent is preferably in the range of 0-15 (VOL%).

此外，本發明提供一種將所述的FPC用導電性黏著片材用於在FPC的表面貼合金屬加強板的FPC。 [發明效果]In addition, the present invention provides an FPC in which the conductive adhesive sheet for FPC is used for bonding a metal reinforcing plate on the surface of the FPC. [Invention Effect]

根據本發明的FPC用導電性黏著片材，在支承體膜的單面上，塗佈含有阻燃性樹脂、交聯劑、導電性填充劑的黏著性組合物，或者塗佈含有阻燃性樹脂、交聯劑、導電性填充劑、防黏連劑的黏著性組合物，積層導電性黏著劑層。其結果，貼合於金屬加強板的FPC用導電性黏著片材在層疊的狀態下，不引起導電性黏著劑層與金屬加強板的黏連，具有可輕易剝離的易剝離性，且能夠牢固地固定在FPC上。 因此，本發明的FPC用導電性黏著片材在經由導電性黏著劑層積層於金屬加強板後，裁切成規定的尺寸，作為帶有金屬加強板的導電性黏著片材，雖然以去除了支承體膜的狀態進行積層而保存，但能夠避免引起黏連現象，可輕易剝離。因此，本發明的FPC用導電性黏著片材有望提高在FPC上貼合帶有金屬加強板的導電性黏著片材（金屬加強板與導電性黏著劑層的積層體）的作業工程的效率，可有助於提高生產性，在產業上的利用價值大。According to the conductive adhesive sheet for FPC of the present invention, an adhesive composition containing a flame-retardant resin, a crosslinking agent, and a conductive filler is coated on one side of a support film, or an adhesive composition containing flame-retardant Adhesive composition of resin, crosslinking agent, conductive filler, and anti-blocking agent, laminated conductive adhesive layer. As a result, the conductive adhesive sheet for FPC bonded to the metal reinforcement plate does not cause adhesion between the conductive adhesive layer and the metal reinforcement plate in the laminated state, has easy peelability that can be easily peeled, and can be strong Ground is fixed on the FPC. Therefore, the conductive adhesive sheet for FPC of the present invention is laminated on a metal reinforcing plate via a conductive adhesive, and then cut into a predetermined size as a conductive adhesive sheet with a metal reinforcing plate. The state of the support film is laminated and stored, but it can avoid causing adhesion and can be easily peeled off. Therefore, the conductive adhesive sheet for FPC of the present invention is expected to improve the efficiency of the work process of laminating a conductive adhesive sheet with a metal reinforcement plate (a laminate of a metal reinforcement plate and a conductive adhesive layer) on the FPC. It can help to improve productivity and has great industrial use value.

以下對本發明的較佳實施方式進行說明。 本發明的FPC用導電性黏著片材為在作為被黏著體的金屬加強板等上貼合導電性黏著劑層的單面，從導電性黏著劑層的另單面上去除支承體膜而得到的積層體，在將帶有被黏著體的導電性黏著片材重疊保管時，不引起導電性黏著劑層的另一個面與被黏著體（金屬加強板等）的外表面的黏連，可容易地將帶有被黏著體的導電性黏著片材逐片剝離，且相對於阻燃性樹脂與交聯劑的不揮發成分的總體積將導電性填充劑與防黏連劑的總體積設定在規定範圍，使帶有被黏著體的導電性黏著片材能夠牢固地黏著在FPC上。The preferred embodiments of the present invention will be described below. The conductive adhesive sheet for FPC of the present invention is obtained by bonding a conductive adhesive layer on one side of a metal reinforcing plate or the like as an adherend, and removing the support film from the other side of the conductive adhesive layer When stacking the conductive adhesive sheet with the adherend, it will not cause the other surface of the conductive adhesive layer to adhere to the outer surface of the adherend (metal reinforcement plate, etc.). The conductive adhesive sheet with the adherend can be easily peeled off one by one, and the total volume of the conductive filler and the anti-blocking agent is set relative to the total volume of the non-volatile components of the flame-retardant resin and the crosslinking agent Within the specified range, the conductive adhesive sheet with the adherend can be firmly adhered to the FPC.

第1圖為表示本發明的FPC用導電性黏著片材的一例的概要剖面圖。 第1圖所示的本發明的FPC用導電性黏著片材5由在單面經過剝離處理的支承體膜1的剝離處理面上積層導電性黏著劑層13而成。此外，如第3圖所示，FPC用導電性黏著片材5在經由導電性黏著劑層13積層在金屬加強板6上之後，被剪切成規定尺寸，作為帶有金屬加強板的導電性黏著片材30，以除去支承體膜1的狀態而被積層保管。該帶有金屬加強板的導電性黏著片材30為金屬加強板6與導電性黏著劑層13的積層體，可通過第2圖的方式用作FPC用電磁遮罩性加強板。在第2圖中，FPC 20為如下結構，在基板膜8上具有安裝件7及接地電路9，通過在絕緣膜11上設有絕緣性黏著劑層10的覆蓋膜12，保護接地電路9。在覆蓋膜12上設有通孔14，帶有金屬加強板的導電性黏著片材30的導電性黏著劑層13通過通孔14與接地電路9接觸，由此金屬加強板6作為電磁遮罩材料而發揮作用。Fig. 1 is a schematic cross-sectional view showing an example of the conductive adhesive sheet for FPC of the present invention. The conductive adhesive sheet 5 for FPC of the present invention shown in FIG. 1 is formed by laminating a conductive adhesive layer 13 on the release-treated surface of the support film 1 that has been released on one side. In addition, as shown in Fig. 3, the conductive adhesive sheet 5 for FPC is laminated on the metal reinforcement plate 6 via the conductive adhesive layer 13, and then cut to a predetermined size as a conductive material with a metal reinforcement plate. The adhesive sheet 30 is laminated and stored in a state where the support film 1 is removed. The conductive adhesive sheet 30 with a metal reinforcement plate is a laminate of the metal reinforcement plate 6 and the conductive adhesive layer 13 and can be used as an electromagnetic shielding reinforcement plate for FPC by the method shown in FIG. 2. In FIG. 2, the FPC 20 has a structure in which a mount 7 and a ground circuit 9 are provided on a substrate film 8, and the ground circuit 9 is protected by providing a cover film 12 of an insulating adhesive layer 10 on the insulating film 11. A through hole 14 is provided on the cover film 12, and the conductive adhesive layer 13 of the conductive adhesive sheet 30 with a metal reinforcing plate contacts the ground circuit 9 through the through hole 14, whereby the metal reinforcing plate 6 serves as an electromagnetic shield The materials play a role.

（支承體膜） 作為在本發明中使用的支承體膜1，例如可列舉出聚對苯二甲酸乙二醇酯、聚對苯二甲酸丁二醇酯、聚萘二甲酸乙二醇酯等聚酯膜；聚丙烯或聚乙烯等聚烯烴膜。 支承體膜1例如為聚對苯二甲酸乙二醇酯等，在支承體膜自身具有一定程度的剝離性的情況下，可以在支承體膜1上不施加剝離處理而直接積層導電性黏著劑層13。此外，也可以在支承體膜1的表面施加用於更容易地將導電性黏著劑層13從支承體膜1上剝離的剝離處理。 此外，在作為上述支承體膜1而使用的樹脂膜不具有剝離性的情況下，通過塗佈氨基醇酸樹脂或矽酮樹脂等剝離劑後進行加熱乾燥，而實施剝離處理。本發明的FPC用導電性黏著片材5由於貼合於FPC上，因此該剝離劑中最好不使用矽酮樹脂。因為若將矽酮樹脂用作剝離劑，則在與支承體膜1的表面接觸的導電性黏著劑層13的表面上，部分矽酮樹脂發生轉移，進而有通過導電性黏著劑層13的內部嚮導電性黏著劑層13的另一面轉移的可能。轉移至該導電性黏著劑層13的表面的矽酮樹脂，有使導電性黏著劑層13對於金屬加強板6的黏著力減弱的可能。 在本發明中使用的支承體膜1的厚度是不包括在貼附於FPC而使用時的導電性黏著劑層13的厚度中的，故而沒有特別的限定，通常為12~150μm左右。(Support body membrane) Examples of the support film 1 used in the present invention include polyester films such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate; Polyolefin films such as propylene or polyethylene. The support film 1 is, for example, polyethylene terephthalate. When the support film itself has a certain degree of peelability, a conductive adhesive can be directly laminated on the support film 1 without peeling. Layer 13. In addition, a peeling treatment for more easily peeling the conductive adhesive layer 13 from the support film 1 may be applied to the surface of the support film 1. In addition, when the resin film used as the support film 1 does not have releasability, the peeling process is performed by applying a release agent such as an amino alkyd resin or a silicone resin and then heating and drying. Since the conductive adhesive sheet 5 for FPC of the present invention is bonded to the FPC, it is preferable not to use silicone resin in the release agent. This is because if silicone resin is used as a release agent, part of the silicone resin is transferred on the surface of the conductive adhesive layer 13 in contact with the surface of the support film 1, and further passes through the inside of the conductive adhesive layer 13 It may transfer to the other side of the conductive adhesive layer 13. The silicone resin transferred to the surface of the conductive adhesive layer 13 may weaken the adhesive force of the conductive adhesive layer 13 to the metal reinforcing plate 6. The thickness of the support film 1 used in the present invention is not included in the thickness of the conductive adhesive layer 13 when it is attached to the FPC and used, so it is not particularly limited, and is usually about 12 to 150 μm.

（導電性黏著劑層） 本發明的FPC用導電性黏著片材5在支承體膜1的單面上積層有導電性黏著劑層13。導電性黏著劑層13是由向由阻燃性樹脂（阻燃性黏著劑）和交聯劑構成的樹脂成分中混合導電性填充劑從而具有導電性的黏著性組合物構成，所述阻燃性樹脂（阻燃性黏著劑）為對選自由丙烯酸類黏著劑、聚氨酯類黏著劑、環氧類黏著劑、橡膠類黏著劑、矽酮類黏著劑等黏著劑群中的黏著劑賦予了阻燃性的阻燃性樹脂，所述導電性填充劑為從銀、銅、銀塗佈銅(Silver-coated copper)等導電性微粒中選擇的一種以上的導電性填充劑。在該黏著性組合物中，可進一步使用選自二氧化矽等無機微粒粉末或由丙烯酸、苯乙烯等構成的有機填充劑中的一種以上的防黏連劑，並沒有特別的限定。 導電性黏著劑層13，並非在常溫下表現壓敏黏著性的黏著劑層，若為藉由加熱加壓的黏著劑層，則耐熱性不易降低，故而較佳。 第1~3圖所示的導電性黏著劑層13含有樹脂成分的阻燃性樹脂及交聯劑2、導電性填充劑3、防黏連劑4。在第1~3圖中，因顆粒相互接觸導致體現出導電性，因此以樹枝狀對導電性填充劑3進行說明，但顆粒形狀沒有特別的限定，可以是球狀、薄片狀等其他形狀。此外，為了與導電性填充劑3進行區別，將防黏連劑4設為球狀，但顆粒形狀沒有特別的限定，可以是柱狀、破碎狀等其他形狀。導電性黏著劑層13的樹脂成分也可以含有阻燃性樹脂及交聯劑以外的成分（添加劑等）。(Conductive adhesive layer) The conductive adhesive sheet 5 for FPC of the present invention has a conductive adhesive layer 13 laminated on one side of the support film 1. The conductive adhesive layer 13 is formed by mixing a conductive filler with a resin component composed of a flame-retardant resin (flame-retardant adhesive) and a cross-linking agent to have conductivity. The flame-retardant Resins (flame retardant adhesives) provide resistance to adhesives selected from the group of adhesives such as acrylic adhesives, polyurethane adhesives, epoxy adhesives, rubber adhesives, and silicone adhesives. A flammable flame-retardant resin, and the conductive filler is one or more conductive fillers selected from conductive particles such as silver, copper, and silver-coated copper. In the adhesive composition, one or more anti-blocking agents selected from inorganic particulate powders such as silicon dioxide or organic fillers composed of acrylic acid, styrene, and the like can be further used, and are not particularly limited. The conductive adhesive layer 13 is not an adhesive layer that exhibits pressure-sensitive adhesiveness at room temperature. If it is an adhesive layer that is heated and pressurized, the heat resistance is not easily reduced, so it is preferable. The conductive adhesive layer 13 shown in FIGS. 1 to 3 contains a flame-retardant resin of a resin component and a crosslinking agent 2, a conductive filler 3, and an anti-blocking agent 4. In Figures 1 to 3, the particles are in contact with each other to exhibit conductivity. Therefore, the conductive filler 3 is described in the form of dendrites, but the shape of the particles is not particularly limited, and may be other shapes such as spheres and flakes. In addition, in order to distinguish it from the conductive filler 3, the anti-blocking agent 4 is made into a spherical shape, but the particle shape is not particularly limited, and other shapes such as a columnar shape and a crushed shape may be used. The resin component of the conductive adhesive layer 13 may contain components (additives, etc.) other than the flame-retardant resin and the crosslinking agent.

添加於導電性黏著劑層13中的阻燃性樹脂（阻燃性黏著劑）沒有特別的限定，可適用現有的公知的阻燃性樹脂。阻燃性樹脂可以是熱固化性樹脂，也可以是熱塑性樹脂。作為樹脂的添加物，可添加磷類、鹵素類、銻類、金屬氫氧化物等阻燃劑。此外，高分子的樹脂自身，可在與樹脂的同一分子中具有磷類、鹵素類等構成阻燃性成分的官能基團。 此外，阻燃性樹脂較佳為酸值高者，從而易與交聯劑進行交聯。阻燃性樹脂的酸值較佳為5以上，更佳為10以上。阻燃性樹脂的酸值未滿前述的下限值，例如在未滿5的情況下，無法充分進行交聯，有時無法得到充分的耐熱性。 作為添加在導電性黏著劑層13中的交聯劑，較佳為2官能基以上的環氧樹脂。在這種環氧樹脂中，可列舉出雙酚A型環氧樹脂、雙酚F型環氧樹脂、苯酚酚醛型環氧樹脂（Phenol novolak type epoxy resin）、縮水甘油胺型等。其中，從耐熱性的觀點來看，較佳為多官能基環氧樹脂。作為這樣的多官能基環氧樹脂，例如可列舉jER（註冊商標）154、jER157、jER1031、jER1032（三菱化學（股份公司））、EPICLON（註冊商標）N-740、EPICLON N-770（DIC（股份公司））、YDPN-638、YDCN-700、YH-434（新日鐵住金化學（股份公司））、TETRAD（註冊商標）-X、TETRAD-C（三菱瓦斯化學（股份公司））等，但並沒有特別的限定。The flame-retardant resin (flame-retardant adhesive) added to the conductive adhesive layer 13 is not particularly limited, and a conventionally known flame-retardant resin can be applied. The flame-retardant resin may be a thermosetting resin or a thermoplastic resin. As resin additives, flame retardants such as phosphorus, halogen, antimony, and metal hydroxide can be added. In addition, the polymer resin itself may have functional groups constituting flame retardant components such as phosphorus and halogen in the same molecule as the resin. In addition, the flame-retardant resin preferably has a high acid value, so that it is easily cross-linked with a cross-linking agent. The acid value of the flame-retardant resin is preferably 5 or more, more preferably 10 or more. The acid value of the flame-retardant resin is less than the aforementioned lower limit. For example, if it is less than 5, crosslinking cannot be sufficiently performed, and sufficient heat resistance may not be obtained in some cases. The crosslinking agent added to the conductive adhesive layer 13 is preferably an epoxy resin having a bifunctional group or more. Examples of such epoxy resins include bisphenol A type epoxy resins, bisphenol F type epoxy resins, phenol novolak type epoxy resins, and glycidylamine type epoxy resins. Among them, from the viewpoint of heat resistance, a polyfunctional epoxy resin is preferred. Examples of such polyfunctional epoxy resins include jER (registered trademark) 154, jER157, jER1031, jER1032 (Mitsubishi Chemical Corporation), EPICLON (registered trademark) N-740, EPICLON N-770 (DIC (DIC) Co., Ltd.), YDPN-638, YDCN-700, YH-434 (Nippon Steel & Sumikin Chemical Co., Ltd.), TETRAD (registered trademark)-X, TETRAD-C (Mitsubishi Gas Chemical Co., Ltd.), etc., But there is no particular limitation.

此外，導電性黏著劑層13的樹脂中的阻燃性樹脂的添加比由阻燃性成分的濃度決定，例如在導入了磷類阻燃劑的阻燃性樹脂中，在全部樹脂組分中的磷濃度較佳為1.0重量%以上。全部樹脂組分中的磷濃度在未滿1.0重量%的情況下，有時無法獲得充分的阻燃性。In addition, the addition ratio of the flame-retardant resin in the resin of the conductive adhesive layer 13 is determined by the concentration of the flame-retardant component. For example, in the flame-retardant resin into which the phosphorus-based flame retardant is introduced, the total resin component The phosphorus concentration of is preferably 1.0% by weight or more. When the phosphorus concentration in all resin components is less than 1.0% by weight, sufficient flame retardancy may not be obtained.

添加於導電性黏著劑層13中的導電性填充劑3沒有特別的限定，可適用現有的公知的導電性填充劑。例如可列舉出由碳黑、銀、鎳、銅、鋁等金屬構成的樹枝狀的金屬微粒以及在這些金屬微粒的表面披覆其它金屬的複合金屬微粒，可以適當選擇它們中的一種或兩種以上使用。 此外，在上述FPC用導電性黏著片材5中，若為了得到優異的導電性，大量含有導電性填充劑3使導電性填充劑粒子相互的接觸及導電性填充劑與作為被黏著體的FPC的接觸更好，則導電性黏著劑層13的黏著力降低。另一方面，若為了提高黏著力而降低導電性填充劑3的含量，則導電性填充劑3與作為被黏著體的FPC的接觸變得不充分，而存在導電性降低這一相反的問題。因此，導電性填充劑的添加量在以阻燃性樹脂與交聯劑的不揮發成分的總體積VA 作為100（VOL%）時，導電性填充劑的體積VC 較佳為15~60（VOL%）的範圍，更佳為20~30（VOL%）的範圍。The conductive filler 3 added to the conductive adhesive layer 13 is not particularly limited, and a conventionally known conductive filler can be applied. For example, dendritic metal particles made of metals such as carbon black, silver, nickel, copper, aluminum, and composite metal particles coated with other metals on the surface of these metal particles can be cited. One or two of them can be appropriately selected. Used above. In addition, in the above-mentioned conductive adhesive sheet 5 for FPC, in order to obtain excellent conductivity, a large amount of conductive filler 3 is contained so that the conductive filler particles are in contact with each other, and the conductive filler and the FPC as the adherend If the contact is better, the adhesive force of the conductive adhesive layer 13 decreases. On the other hand, if the content of the conductive filler 3 is decreased in order to increase the adhesive force, the contact between the conductive filler 3 and the FPC as the adherend becomes insufficient, and there is the opposite problem of a decrease in conductivity. Therefore, when the amount of the conductive filler added is 100 (VOL%), the total volume V A of the non-volatile components of the flame-retardant resin and the cross-linking agent, the volume V C of the conductive filler is preferably 15-60 The range of (VOL%) is more preferably the range of 20-30 (VOL%).

添加於導電性黏著劑層13的防黏連劑4沒有特別的限定，可適用現有的公知的防黏連劑。可列舉出二氧化矽或碳酸鈣等無機填充劑、丙烯酸、苯乙烯等構成的有機填充劑等，可以適當選擇它們中的一種或兩種以上使用。 此外，在上述FPC用導電性黏著片材5中，若為了獲得耐黏連性而含有大量防黏連劑4，則黏著力降低。另一方面，若為了提高黏著力而降低防黏連劑4的含量，則FPC用導電性黏著片材與金屬加強板發生黏連，存在操作性變差這一相反的問題。因此，防黏連劑的添加量以在阻燃性樹脂與交聯劑的不揮發成分的總體積VA 作為100（VOL%）時，防黏連劑的體積VD 較佳為0~15（VOL%）的範圍。在導電性黏著劑層13含有防黏連劑4的情況下，以VA 作為100（VOL%）時，VD 較佳為0.01（VOL%）以上。 此外，由於導電性填充劑3也具有耐黏連性，因此也可不在導電性黏著劑層13中添加防黏連劑4。導電性填充劑與防黏連劑的添加量以在阻燃性樹脂與交聯劑的不揮發成分的總體積VA 作為100（VOL%）時，導電性填充劑與所述防黏連劑的總體積VB 較佳為15~70（VOL%）的範圍。The anti-blocking agent 4 added to the conductive adhesive layer 13 is not particularly limited, and a conventionally known anti-blocking agent can be applied. Examples include inorganic fillers such as silica and calcium carbonate, organic fillers composed of acrylic acid, styrene, and the like, and one or two or more of them can be appropriately selected and used. In addition, in the above-mentioned conductive adhesive sheet 5 for FPC, if a large amount of the anti-blocking agent 4 is contained in order to obtain blocking resistance, the adhesive force will decrease. On the other hand, if the content of the anti-blocking agent 4 is lowered in order to increase the adhesive force, the conductive adhesive sheet for FPC and the metal reinforcing plate will stick to each other, and there is the opposite problem of poor workability. Therefore, when the amount of the anti-blocking agent added is 100 (VOL%), the total volume V A of the non-volatile components of the flame-retardant resin and the cross-linking agent, the volume V D of the anti-blocking agent is preferably 0-15 (VOL%) range. When the conductive adhesive layer 13 contains the anti-blocking agent 4, when V A is set to 100 (VOL%), V D is preferably 0.01 (VOL%) or more. In addition, since the conductive filler 3 also has blocking resistance, the anti-blocking agent 4 may not be added to the conductive adhesive layer 13. When the addition amount of the conductive filler and the anti-blocking agent is based on the total volume of the non-volatile components of the flame retardant resin and the cross-linking agent V A as 100 (VOL%), the conductive filler and the anti-blocking agent The total volume of V B is preferably in the range of 15 to 70 (VOL%).

導電性黏著劑層13的黏著力不受特別限定，其測定方法以JIS C6471的8.1.1的方法A所述的試驗方法為標準。對被黏著體表面的黏著力，較佳在剝離角度90°剝離、剝離速度50mm/分鐘的條件下為15~30N/cm的範圍。黏著力未滿15N/cm時，存在例如貼合於FPC的電磁遮罩材料剝落、翹起的情況。 對於FPC的FPC用導電性黏著片材的加熱加壓黏著的條件沒有特別限定，例如較佳溫度160℃、壓力4.5MPa，進行60分鐘熱壓。The adhesive force of the conductive adhesive layer 13 is not particularly limited, and its measurement method is based on the test method described in JIS C6471 8.1.1 Method A. The adhesion to the surface of the adherend is preferably in the range of 15 to 30 N/cm under the conditions of a peeling angle of 90° and a peeling speed of 50 mm/min. When the adhesive force is less than 15 N/cm, for example, the electromagnetic shielding material attached to the FPC may peel off or warp. There are no particular restrictions on the heating and pressing conditions of the FPC conductive adhesive sheet for FPC. For example, it is preferable to perform hot pressing at a temperature of 160° C. and a pressure of 4.5 MPa for 60 minutes.

（剝離膜） 第1圖所示的本發明的FPC用導電性黏著片材5，在支承體膜1的單面上積層有導電性黏著劑層13。此外，本發明的FPC用導電性黏著片材5的結構也可以為：在支承體膜1的單面上積層導電性黏著劑層13，在基材的單面上積層有剝離劑層的剝離膜經由該剝離劑層而貼合於導電性黏著劑層13。 作為剝離膜的基材，例如可列舉聚對苯二甲酸乙二醇酯、聚對苯二甲酸丁二醇酯、聚萘二甲酸乙二醇酯等聚酯膜、聚丙烯或聚乙烯等聚烯烴膜。在這些樹脂膜中，在塗佈氨基醇酸樹脂或矽酮樹脂等剝離劑後，通過加熱乾燥實施剝離處理。由於本發明的FPC用導電性黏著片材貼合於FPC上，因此在該剝離劑中最好不使用矽酮樹脂。這是由於若將矽酮樹脂用作剝離劑，在與剝離膜的表面接觸的導電性黏著劑層的表面上，部分矽酮樹脂轉移，進一步存在通過FPC用導電性黏著片材的內部從導電性黏著劑層向支承體膜1轉移的可能。轉移至該導電性黏著劑層的表面的矽酮樹脂有可能減弱導電性黏著劑層的黏著力。用於本發明的剝離膜的厚度沒有特別的限定，通常為12~150μm左右。(Peeling film) The conductive adhesive sheet 5 for FPC of the present invention shown in FIG. 1 has a conductive adhesive layer 13 laminated on one surface of the support film 1. In addition, the conductive adhesive sheet 5 for FPC of the present invention may have a structure such that a conductive adhesive layer 13 is laminated on one side of the support film 1, and a release agent layer is laminated on one side of the substrate. The film is bonded to the conductive adhesive layer 13 via the release agent layer. As the base material of the release film, for example, polyester films such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate; Olefin film. In these resin films, after applying a release agent such as amino alkyd resin or silicone resin, a release treatment is performed by heating and drying. Since the conductive adhesive sheet for FPC of the present invention is bonded to FPC, it is preferable not to use silicone resin in the release agent. This is because if silicone resin is used as a release agent, part of the silicone resin is transferred on the surface of the conductive adhesive layer in contact with the surface of the release film, and there is further conduction from the inside of the conductive adhesive sheet for FPC. It is possible for the adhesive layer to transfer to the support film 1. The silicone resin transferred to the surface of the conductive adhesive layer may weaken the adhesive force of the conductive adhesive layer. The thickness of the release film used in the present invention is not particularly limited, but is usually about 12 to 150 μm.

本發明的FPC用導電性黏著片材為裁切成規定尺寸的金屬加強板6與導電性黏著劑層13的積層體，在層疊帶有金屬加強板的導電性黏著片材30的情況下，避免了產生黏連現象，可容易地將帶有金屬加強板的導電性黏著片材30逐片剝離，可在使用了機械手臂等的自動化生產線上使用。因此，本發明的FPC用導電性黏著片材有望提高將帶有金屬加強板的導電性黏著片材貼合於FPC上的作業工程的效率，能夠期待生產性的提高，在產業上的利用價值大。 [實施例]The conductive adhesive sheet for FPC of the present invention is a laminate of a metal reinforcement plate 6 and a conductive adhesive layer 13 cut into a predetermined size. When the conductive adhesive sheet 30 with a metal reinforcement plate is laminated, The adhesion phenomenon is avoided, the conductive adhesive sheet 30 with the metal reinforcing plate can be easily peeled off one by one, and it can be used in an automated production line using a robotic arm. Therefore, the conductive adhesive sheet for FPC of the present invention is expected to improve the efficiency of the work process of bonding the conductive adhesive sheet with a metal reinforcing plate to the FPC, and it can be expected to improve productivity and have industrial utility value. Big. [Example]

以下，以實施例對本發明進行具體的說明，但本發明並不受該實施例的任何限制。Hereinafter, the present invention will be specifically described with examples, but the present invention is not limited in any way by the examples.

（實施例1） 將對單面實施了剝離處理、厚度為50μm的聚對苯二甲酸乙二醇酯（PET）膜用作為支承體膜1。 另外，相對於阻燃性樹脂的40%溶液（A-1）250重量份（樹脂成分為100重量份），加入交聯劑的70%溶液（B-1）8.3重量份（樹脂成分為5.8重量份）、防黏連劑（平均粒徑16nm的疏水性二氧化矽）11.2重量份、平均粒徑17μm的銀塗佈銅（戶田工業（股份公司）製，商品名：RM-D1）167重量份，使用甲基乙基酮及甲苯稀釋，進行攪拌混煉，得到導電性黏著劑溶液。 在該導電性黏著劑溶液中，相對於阻燃性樹脂的40%溶液（A-1）及交聯劑的70%溶液（B-1）中的固體成分的總量（即全部樹脂成分）100VOL%，防黏連劑的體積比為5.8VOL%。此外，銀塗佈銅的量為樹脂與防黏連劑的合計固體成分（117重量份）的143重量%。 在上述的支承體膜1的剝離處理面上，塗佈得到的導電性黏著劑溶液，以千分錶（dial gauge）測定的乾燥後的厚度為40μm，在150℃加熱乾燥3分鐘，使其半固化，得到實施例1的FPC用導電性黏著片材。(Example 1) As the support film 1, a polyethylene terephthalate (PET) film with a thickness of 50 μm that was peeled off on one side was used. In addition, with respect to 250 parts by weight of the flame-retardant resin 40% solution (A-1) (100 parts by weight of the resin component), 8.3 parts by weight of the 70% solution (B-1) of the crosslinking agent added (the resin component is 5.8 Parts by weight), anti-blocking agent (hydrophobic silica with an average particle size of 16nm) 11.2 parts by weight, silver-coated copper with an average particle size of 17μm (manufactured by Toda Industry Co., Ltd., trade name: RM-D1) 167 parts by weight, diluted with methyl ethyl ketone and toluene, stirred and kneaded to obtain a conductive adhesive solution. In this conductive adhesive solution, relative to the total amount of solid content in the flame-retardant resin 40% solution (A-1) and the crosslinking agent 70% solution (B-1) (that is, the total resin content) 100VOL%, the volume ratio of anti-blocking agent is 5.8VOL%. In addition, the amount of silver-coated copper was 143% by weight of the total solid content (117 parts by weight) of the resin and the anti-blocking agent. On the peeling treatment surface of the support film 1 described above, the conductive adhesive solution obtained was coated, the thickness after drying measured by a dial gauge was 40 μm, and it was heated and dried at 150°C for 3 minutes to make it Semi-cured, and the conductive adhesive sheet for FPC of Example 1 was obtained.

（實施例2~3） 除了將導電性填充劑的添加比例按照表1進行變更以外，以與實施例1相同的方法，得到實施例2~3的FPC用導電性黏著片材。 （實施例4~5） 除了將導電性填充劑的添加比例按照表1進行變更，且不添加防黏連劑以外，以與實施例1相同的方法，得到實施例4~5的FPC用導電性黏著片材。 （實施例6） 除了將後述的D-2作為導電性填充劑，添加比例按照表1進行變更以外，以與實施例1相同的方法，得到實施例6的FPC用導電性黏著片材。(Examples 2~3) Except that the addition ratio of the conductive filler was changed in accordance with Table 1, the conductive adhesive sheets for FPC of Examples 2 to 3 were obtained in the same manner as in Example 1. (Examples 4~5) Except that the addition ratio of the conductive filler was changed according to Table 1, and the anti-blocking agent was not added, the same method as in Example 1 was used to obtain the conductive adhesive sheets for FPC of Examples 4 to 5. (Example 6) The conductive adhesive sheet for FPC of Example 6 was obtained by the same method as Example 1, except that D-2 described later was used as a conductive filler and the addition ratio was changed in accordance with Table 1.

（比較例1~6） 除了將導電性填充劑及防黏連劑的量按照表1進行變更以外，以與實施例1相同的方法，得到比較例1~6的FPC用導電性黏著片材。(Comparative examples 1~6) Except that the amounts of the conductive filler and the anti-blocking agent were changed according to Table 1, the conductive adhesive sheets for FPC of Comparative Examples 1 to 6 were obtained in the same manner as in Example 1.

（黏著力的測定方法） 使FPC用導電性黏著片材的導電性黏著劑層13側與由厚度為30μm的SUS箔（日新製鋼（股份公司）製、材質：SUS304）構成的金屬加強板相對重疊，在140℃、1m/分鐘的條件下熱層壓後，剝離支承體膜1，將FPC用導電性黏著片材剪裁成50mm×120mm的尺寸。與剪裁的帶有金屬加強板的導電性黏著片材的導電性黏著劑層側相對地重疊厚度50μm的聚醯亞胺膜（東麗杜邦株式會社製，商品號：200H），在160℃、2.5MPa下進行60分鐘熱壓，得到試驗片。以JIS-C-6471“可撓性印刷線路板用覆銅積層板試驗方法”的8.1.1的方法A（90°方向剝離）為標準，將厚度30μm的SUS箔一側固定在支援配件上，從後面剝離黏著的厚度50μm的聚醯亞胺膜，測定剝離力（N/cm）。(Method of measuring adhesion) The conductive adhesive layer 13 side of the conductive adhesive sheet for FPC is relatively overlapped with a metal reinforcing plate composed of a 30μm thick SUS foil (manufactured by Nisshin Steel (Co., Ltd.), material: SUS304), at 140°C, After thermal lamination under the condition of 1 m/min, the support film 1 was peeled off, and the conductive adhesive sheet for FPC was cut into a size of 50 mm×120 mm. A polyimide film with a thickness of 50μm (manufactured by Toray DuPont Co., Ltd., product number: 200H) is overlapped opposite to the conductive adhesive layer side of the conductive adhesive sheet with a metal reinforcement plate, at 160°C, Hot pressing was performed at 2.5 MPa for 60 minutes to obtain a test piece. According to JIS-C-6471 "Test Method for Copper Clad Laminates for Flexible Printed Wiring Boards" 8.1.1 Method A (90° direction peeling) as the standard, fix the 30μm thick SUS foil side to the support part , Peel off the adhered polyimide film with a thickness of 50 μm from the back, and measure the peel force (N/cm).

（耐黏連性的評估方法） 使FPC用導電性黏著片材的導電性黏著劑層13側與厚度25μm的聚醯亞胺膜（東麗杜邦株式會社製，商品號：100H）相對重疊，在140℃、1m/分鐘的條件下進行熱層壓後，剝離支承體膜1，剪裁成90mm×140mm的尺寸。將剪裁的帶有聚醯亞胺膜的導電性黏著片材固定於SUS板，放上5kg的重物，在常溫下放置1小時，製成試樣。以JIS-C-6471“可撓性印刷線路板用覆銅積層板試驗方法”的8.1.1的方法B（180°方向剝離）為標準，從SUS板上剝離帶有聚醯亞胺膜的導電性黏著片材，測定剝離力（mN/50mm）。剝離力未滿100mN/50mm的試樣記為○，在該數值以上則記為×。 該評估方法為，作為將層疊了2個帶有金屬加強板的導電性黏著片材時引起的黏連現象的模型，用帶有聚醯亞胺膜的導電性黏著片材代替一個帶有金屬加強板的導電性黏著片材（導電性黏著劑層一側），用SUS板代替另一個帶有金屬加強板的導電性黏著片材（金屬加強板一側）。(Evaluation method of blocking resistance) The conductive adhesive layer 13 side of the conductive adhesive sheet for FPC is relatively overlapped with a polyimide film (manufactured by Toray DuPont Co., Ltd., product number: 100H) with a thickness of 25 μm at 140°C and 1 m/min. After performing thermal lamination under the lower part, the support film 1 was peeled off and cut into a size of 90 mm×140 mm. The cut conductive adhesive sheet with a polyimide film was fixed to a SUS plate, a 5 kg weight was placed on it, and it was left at room temperature for 1 hour to prepare a sample. According to JIS-C-6471 "Test Methods for Copper Clad Laminates for Flexible Printed Wiring Boards" 8.1.1 Method B (180° direction peeling) as the standard, peel off the polyimide film from the SUS board Conductive adhesive sheet, measure the peel force (mN/50mm). A sample with a peeling force of less than 100mN/50mm is marked as ○, and a value above this value is marked as ×. The evaluation method is to use a conductive adhesive sheet with a polyimide film instead of a conductive adhesive sheet with a metal as a model of the adhesion phenomenon caused when two conductive adhesive sheets with a metal reinforcing plate are laminated. The conductive adhesive sheet (on the side of the conductive adhesive layer) of the reinforcing plate is replaced by another conductive adhesive sheet with a metal reinforcing plate (on the side of the metal reinforcing plate) with a SUS plate.

（導電性的評估方法） 使FPC用導電性黏著片材5的導電性黏著劑層13側與由厚度30μm的SUS箔（日新製鋼（股份公司）製、材質：SUS304）構成的金屬加強板6的單面相對重疊，在140℃、1m/分鐘的條件下進行熱層壓後，將其剪裁成寬15mm×長100mm的尺寸，剝離支承體膜1，得到帶有金屬加強板的導電性黏著片材30。然後，如第4圖所示，在由聚醯亞胺膜構成的基板膜8上，將寬5mm×長50mm的條狀的銅箔片9以30mm的齒距間隔排成一列，配置多個銅箔片，製成模擬的可撓性基板。 然後，如第5圖所示，將該模擬的可撓基板的條狀的銅箔片9的一部分用具有直徑1.5mm的通孔14的覆蓋膜12覆蓋，進一步，經由導電性黏著劑層13將帶有金屬加強板的導電性黏著片材30臨時固定以覆蓋通孔14，在160℃、2.5MPa下進行60分鐘熱壓，得到導電性的評估用試驗片。然後用數位式萬用表（股份公司TFF Keithley Instruments社製，型號：2100/100）測定露出所述模擬的可撓基板的銅箔片9的部分與帶有金屬加強板的導電性黏著片材30的金屬加強板6之間的電阻率，將電阻率未滿0.5Ω的試樣記為（○），0.5Ω以上~未滿1.0Ω的試樣記為（△），1.0Ω以上的試樣記為（×）。(Evaluation method of conductivity) The conductive adhesive layer 13 side of the conductive adhesive sheet 5 for FPC is relatively overlapped with one side of a metal reinforcing plate 6 made of a 30 μm thick SUS foil (manufactured by Nisshin Steel Co., Ltd., material: SUS304). After thermal lamination was performed under the conditions of 140° C. and 1 m/min, it was cut into a size of 15 mm in width×100 mm in length, and the support film 1 was peeled off to obtain a conductive adhesive sheet 30 with a metal reinforcing plate. Then, as shown in Fig. 4, on the substrate film 8 made of polyimide film, the strip-shaped copper foil pieces 9 having a width of 5 mm × a length of 50 mm are arranged in a row at 30 mm pitch intervals, and a plurality of Copper foil is made into a simulated flexible substrate. Then, as shown in FIG. 5, a part of the strip-shaped copper foil 9 of the simulated flexible substrate was covered with a cover film 12 having a through hole 14 with a diameter of 1.5 mm, and further, a conductive adhesive layer 13 The conductive adhesive sheet 30 with a metal reinforcing plate was temporarily fixed to cover the through holes 14, and hot pressing was performed at 160° C. and 2.5 MPa for 60 minutes to obtain a test piece for conductivity evaluation. Then, a digital multimeter (manufactured by TFF Keithley Instruments Co., Ltd., model: 2100/100) was used to measure the relationship between the portion of the copper foil 9 exposed on the simulated flexible substrate and the conductive adhesive sheet 30 with a metal reinforcement plate. For the resistivity between the metal reinforcement plates 6, the sample with a resistivity of less than 0.5Ω is marked as (○), the sample with a resistivity of 0.5Ω or more to less than 1.0Ω is marked as (△), and the sample with a resistivity of 1.0Ω or more is marked as (△). Is (×).

（試驗結果） 對於實施例1~6及比較例1~6，通過上述的試驗方法，進行導電性糊狀層的黏著試驗，將得到的試驗結果示於表1~2。表1~2的簡寫符號如下所示。 ・阻燃性樹脂的40%溶液（A-1）：東洋紡（股份公司）製，商品名“UR-3575”（阻燃性聚氨酯樹脂，含磷濃度：2.5%，酸值：10KOHmg/g） ・交聯劑的70%溶液（B-1）：東洋紡製，商品名“HY-30” ・防黏連劑（C-1）：日本Aerosil（股份公司）製，商品名“R972”（疏水性氣相二氧化矽） ・導電性填充劑（D-1）：戶田工業（股份公司）製，商品名“RM-D1”（平均粒徑17μm的10%銀混合銅粉） ・導電性填充劑（D-2）：福田金屬箔粉工業（股份公司）製、商品名“FCC-TBX”（平均粒徑8μm的10%銀塗佈銅粉）(test results) For Examples 1 to 6 and Comparative Examples 1 to 6, the adhesion test of the conductive paste layer was performed by the above-mentioned test method, and the obtained test results are shown in Tables 1 and 2. The abbreviated symbols of Tables 1 to 2 are as follows. ・40% solution of flame-retardant resin (A-1): manufactured by Toyobo (Co., Ltd.), brand name "UR-3575" (flame-retardant polyurethane resin, phosphorus concentration: 2.5%, acid value: 10KOHmg/g) ・70% solution of crosslinking agent (B-1): manufactured by Toyobo, trade name "HY-30" ・Anti-blocking agent (C-1): manufactured by Japan Aerosil (Co., Ltd.), brand name "R972" (hydrophobic fumed silica) ・Conductive filler (D-1): manufactured by Toda Industry Co., Ltd., brand name "RM-D1" (10% silver mixed copper powder with an average particle size of 17μm) ・Conductive filler (D-2): manufactured by Fukuda Metal Foil Industry Co., Ltd., brand name "FCC-TBX" (10% silver-coated copper powder with an average particle size of 8μm)

此外，在表1~2中，“A-1”、“B-1”、“C-1”、“D-1”、“D-2”欄中所示的數值，如實施例1中的說明所述，表示各成分的重量份（在溶液的情況下僅為固體成分）。此外，“C-1”、“D-1”、“D-2”欄的（）內所示數值表示阻燃性樹脂與交聯劑的不揮發成分的總體積VA 為100時的各成分的體積比（VOL%）。“-”表示不含有該成分。 此外，防黏連劑的體積VD 相對於阻燃性樹脂與交聯劑的不揮發成分的總體積VA 的比（VD /VA ×100%）及導電性填充劑的體積VC相對於阻燃性樹脂與交聯劑的不揮發成分的總體積VA 的比（VC /VA ×100%），以阻燃性樹脂及交聯劑的密度為1.2g/cm3 、防黏連劑（疏水性二氧化矽）的密度為2.2g/cm3 、導電性填充劑（10%銀塗佈銅粉）的密度為9.1g/cm3 進行計算。在此，粉體的密度為將粉體的空隙從體積中除去的物質本身的密度（真密度）。此外，表1的“填充劑體積比”欄表示防黏連劑的體積比與導電性填充劑的體積比的總值（VB /VA ×100%）。In addition, in Tables 1 to 2, the values shown in the columns of "A-1", "B-1", "C-1", "D-1", and "D-2" are as in Example 1. As described in the description, it means the weight of each component (in the case of a solution, it is only a solid component). In addition, the values shown in () in the columns of "C-1", "D-1", and "D-2" represent the respective values when the total volume V A of the non-volatile components of the flame-retardant resin and the crosslinking agent is 100 The volume ratio of the components (VOL%). "-" means that the ingredient is not contained. In addition, the ratio of the volume V D of the anti-blocking agent to the total volume V A of the non-volatile components of the flame retardant resin and the crosslinking agent (V D /V A ×100%) and the volume VC of the conductive filler The ratio of the total volume V A of the non-volatile components of the flame-retardant resin and the cross-linking agent (V C /V A × 100%), based on the density of the flame-retardant resin and the cross-linking agent being 1.2 g/cm 3 , The density of the binding agent (hydrophobic silica) is 2.2g/cm 3 and the density of the conductive filler (10% silver coated copper powder) is 9.1g/cm 3 for calculation. Here, the density of the powder is the density (true density) of the substance itself by removing the voids of the powder from the volume. In addition, the "filler volume ratio" column of Table 1 shows the total value of the volume ratio of the anti-blocking agent and the volume ratio of the conductive filler (V B /V A ×100%).

[表1] 項目 實施例1 實施例2 實施例3 實施例4 實施例5 實施例6 阻燃性樹脂（重量份） A-1 100 100 100 100 100 100 交聯劑（重量份） B-1 5.8 5.8 5.8 5.8 5.8 5.8 防黏連劑 （重量份（VOL%）） C-1 11.2 （5.8） 11.2 （5.8） 11.2 （5.8） ― ― 11.2 （5.8） 導電性填充劑 （重量份（VOL%）） D-1 167 （20.8） 133 （16.6） 111 （13.8） 150 （18.7） 120 （15） ― D-2 ― ― ― ― ― 464 （57.8） 填充劑體積比 100:26.6 100:22.4 100:19.6 100:18.7 100:15 100:63.6 黏著力（N/cm） 18.5 22.7 16.0 19.6 21.2 16.4 耐黏連性 （mN/50mm） 9 10 66 27 9 12 ○ ○ ○ ○ ○ ○ 導電性 ○ ○ △ △ ○ ○ [Table 1] project Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Flame retardant resin (parts by weight) A-1 100 100 100 100 100 100 Crosslinking agent (parts by weight) B-1 5.8 5.8 5.8 5.8 5.8 5.8 Anti-blocking agent (parts by weight (VOL%)) C-1 11.2 (5.8) 11.2 (5.8) 11.2 (5.8) ― ― 11.2 (5.8) Conductive filler (parts by weight (VOL%)) D-1 167 (20.8) 133 (16.6) 111 (13.8) 150 (18.7) 120 (15) ― D-2 ― ― ― ― ― 464 (57.8) Filler volume ratio 100:26.6 100:22.4 100:19.6 100:18.7 100:15 100:63.6 Adhesion (N/cm) 18.5 22.7 16.0 19.6 21.2 16.4 Adhesion resistance (mN/50mm) 9 10 66 27 9 12 ○ ○ ○ ○ ○ ○ Conductivity ○ ○ △ △ ○ ○

[表2] 項目 比較例1 比較例2 比較例3 比較例4 比較例5 比較例6 阻燃性樹脂（重量份） A-1 100 100 100 100 100 100 交聯劑（重量份） B-1 5.8 5.8 5.8 5.8 5.8 5.8 防黏連劑 （重量份（VOL%）） C-1 ― 11.2 （5.8） 20 （10.3） 30 （15.5） 30 （15.5） 30 （15.5） 導電性填充劑 （重量份（VOL%）） D-1 100 （12.5） 44 （5.5） 48 （6） 52 （6.5） 156 （19.4） 195 （24.3） D-2 ― ― ― ― ― ― 填充劑體積比 100:12.5 100:11.3 100:16.3 100:22 100:34.9 100:39.8 黏著力（N/cm） 33.2 26.1 34.9 11.2 12.1 9.5 耐黏連性 （mN/50mm） 150 132 30 10 8 9 × × ○ ○ ○ ○ 導電性 × × × × ○ ○ [Table 2] project Comparative example 1 Comparative example 2 Comparative example 3 Comparative example 4 Comparative example 5 Comparative example 6 Flame retardant resin (parts by weight) A-1 100 100 100 100 100 100 Crosslinking agent (parts by weight) B-1 5.8 5.8 5.8 5.8 5.8 5.8 Anti-blocking agent (parts by weight (VOL%)) C-1 ― 11.2 (5.8) 20 (10.3) 30 (15.5) 30 (15.5) 30 (15.5) Conductive filler (parts by weight (VOL%)) D-1 100 (12.5) 44 (5.5) 48 (6) 52 (6.5) 156 (19.4) 195 (24.3) D-2 ― ― ― ― ― ― Filler volume ratio 100:12.5 100:11.3 100:16.3 100:22 100:34.9 100:39.8 Adhesion (N/cm) 33.2 26.1 34.9 11.2 12.1 9.5 Adhesion resistance (mN/50mm) 150 132 30 10 8 9 × × ○ ○ ○ ○ Conductivity × × × × ○ ○

根據表1、2的試驗結果，在阻燃性樹脂與交聯劑的不揮發成分的總體積VA 為100（VOL%）時，導電性填充劑與防黏連劑的總體積VB 為15~70（VOL%）的範圍的實施例1~6中，能夠兼顧耐黏連性與黏著力。但是，如比較例1~2若導電性填充劑的添加量變少，則耐黏連性變差。此外，如比較例4~6若防黏連劑的添加量增多，則耐黏連性雖然優異，但黏著力降低。此外，如比較例1~4導電性填充劑的添加量少的情況下，導電性能降低。其中，比較例1~2的黏著力雖然充分，但耐黏連性差，導電性能也降低。 因此，通過相對於阻燃性樹脂與交聯劑的不揮發成分的總體積將導電性填充劑與防黏連劑的總體積設為規定的範圍，能夠得到兼具耐黏連性、黏著力、導電性的操作性良好的FPC用導電性黏著片材。 [產業上的利用可能性]According to the test results in Tables 1 and 2, when the total volume V A of the non-volatile components of the flame-retardant resin and the crosslinking agent is 100 (VOL%), the total volume V B of the conductive filler and the anti-blocking agent is In Examples 1 to 6 in the range of 15 to 70 (VOL%), both blocking resistance and adhesive strength can be achieved. However, as in Comparative Examples 1 and 2, if the addition amount of the conductive filler decreases, the blocking resistance deteriorates. In addition, as in Comparative Examples 4 to 6, if the addition amount of the anti-blocking agent is increased, the blocking resistance is excellent, but the adhesive force is reduced. In addition, as in Comparative Examples 1 to 4, when the addition amount of the conductive filler is small, the conductivity is reduced. Among them, although the adhesive strength of Comparative Examples 1 to 2 is sufficient, the blocking resistance is poor and the conductivity is also reduced. Therefore, by setting the total volume of the conductive filler and the anti-blocking agent in a predetermined range relative to the total volume of the non-volatile components of the flame-retardant resin and the crosslinking agent, it is possible to obtain a combination of blocking resistance and adhesion. , Conductive adhesive sheet for FPC with good conductivity and workability. [Industrial use possibility]

本發明的FPC用導電性黏著片材在可攜式電話、筆記型電腦、攜帶終端等各種電子設備中使用的FPC的作業工程中，有望提高在FPC上貼合金屬加強板與導電性黏著劑層的積層體的作業工程的效率。The conductive adhesive sheet for FPC of the present invention is expected to improve the bonding of metal reinforcing plates and conductive adhesives on FPC in the work process of FPC used in various electronic devices such as portable phones, notebook computers, and portable terminals. The efficiency of the work process of the layered laminate.

1:支承體膜 2:阻燃性樹脂及交聯劑 3:導電性填充劑 4:防黏連劑 5:FPC用導電性黏著片材 6:金屬加強板 7:安裝件 8:基板膜 9:接地電路（銅箔片） 10:絕緣性黏著劑層 11:絕緣膜 12:覆蓋膜 13:導電性黏著劑層 14:通孔 20:FPC 30:帶有金屬加強板的導電性黏著片材1: Support body membrane 2: Flame retardant resin and crosslinking agent 3: Conductive filler 4: Anti-blocking agent 5: Conductive adhesive sheet for FPC 6: Metal reinforcement board 7: Installation parts 8: Substrate film 9: Grounding circuit (copper foil) 10: Insulating adhesive layer 11: Insulating film 12: Cover film 13: Conductive adhesive layer 14: Through hole 20: FPC 30: Conductive adhesive sheet with metal reinforcing plate

第1圖為表示本發明的FPC用導電性黏著片材的一例的概要剖面圖； 第2圖為表示加強板經由本發明的FPC用導電性黏著片材貼附於FPC上的一例的概要剖面圖； 第3圖為表示本發明的FPC用導電性黏著片材經由導電性黏著劑層積層於金屬加強板上的帶有金屬加強板的導電性黏著片材的概要剖面圖； 第4圖（a）為在導電性的評估方法中使用的模擬可撓性基板的概要平面圖，第4圖（b）為從A-A箭頭方向觀察第4圖（a）的剖面圖； 第5圖（a）為在導電性的評估方法中使用的導電性的評估用試驗片的概要平面圖，第5圖（b）為從B-B箭頭方向觀察第5圖（a）的剖面圖。Figure 1 is a schematic cross-sectional view showing an example of the conductive adhesive sheet for FPC of the present invention; Figure 2 is a schematic cross-sectional view showing an example in which the reinforcing plate is attached to the FPC via the conductive adhesive sheet for FPC of the present invention; Figure 3 is a schematic cross-sectional view showing the conductive adhesive sheet for FPC of the present invention laminated on a metal reinforcement plate via a conductive adhesive; Figure 4(a) is a schematic plan view of a simulated flexible substrate used in the conductivity evaluation method, and Figure 4(b) is a cross-sectional view of Figure 4(a) viewed from the direction of the A-A arrow; Fig. 5(a) is a schematic plan view of a test piece for conductivity evaluation used in the conductivity evaluation method, and Fig. 5(b) is a cross-sectional view of Fig. 5(a) viewed from the direction of the B-B arrow.

1:支承體膜 1: Support body membrane

2:阻燃性樹脂及交聯劑 2: Flame retardant resin and crosslinking agent

3:導電性填充劑 3: Conductive filler

4:防黏連劑 4: Anti-blocking agent

5:FPC用導電性黏著片材 5: Conductive adhesive sheet for FPC

13:導電性黏著劑層 13: Conductive adhesive layer

Claims (5)

一種FPC用導電性黏著片材，該FPC用導電性黏著片材用於FPC中，其特徵在於，其是在支承體膜的單面上，塗佈含有阻燃性樹脂、交聯劑、導電性填充劑、防黏連劑的黏著性組合物，從而積層導電性黏著劑層而成； 以所述阻燃性樹脂與所述交聯劑的不揮發成分的總體積VA 作為100（VOL%）時，所述防黏連劑的體積VD 為0.01~15（VOL%）的範圍，且所述導電性填充劑與所述防黏連劑的總體積VB 為15~70（VOL%）的範圍； 所述FPC用導電性黏著片材的所述導電性黏著劑層的一面藉由熱層壓貼合於作為被黏著體的金屬加強板上，即使依序重疊保管從所述導電性黏著劑層的另一面上去除所述支承體膜的狀態下之複數個帶有金屬加強板的FPC用導電性黏著片材，不引起帶有所述金屬加強板的FPC用導電性黏著片材的所述導電性黏著劑層的所述另一面與另一帶有所述金屬加強板的FPC用導電性黏著片材的所述金屬加強板的黏連。A conductive adhesive sheet for FPC. The conductive adhesive sheet for FPC is used in FPC. It is characterized in that it is coated on one side of a support film containing flame-retardant resin, crosslinking agent, and conductive Adhesive composition composed of flexible fillers and anti-blocking agents, thereby laminating conductive adhesive layers; the total volume V A of the non-volatile components of the flame-retardant resin and the crosslinking agent is taken as 100 (VOL %), the volume V D of the anti-blocking agent is in the range of 0.01-15 (VOL%), and the total volume V B of the conductive filler and the anti-blocking agent is 15-70 (VOL%) %); one side of the conductive adhesive layer of the conductive adhesive sheet for FPC is bonded to the metal reinforcing plate as the adherend by thermal lamination, even if it is stacked and stored sequentially from the A plurality of conductive adhesive sheets for FPC with a metal reinforcement plate in the state where the support film is removed on the other side of the conductive adhesive layer does not cause conductive adhesion of the FPC with the metal reinforcement plate Adhesion of the other side of the conductive adhesive layer of the sheet to the metal reinforcement plate of another conductive adhesive sheet for FPC with the metal reinforcement plate. 如申請專利範圍第1項所述之FPC用導電性黏著片材，其特徵在於，所述阻燃性樹脂為含磷的聚氨酯樹脂。The conductive adhesive sheet for FPC described in item 1 of the scope of patent application is characterized in that the flame-retardant resin is a phosphorus-containing polyurethane resin. 如申請專利範圍第1或2項所述之FPC用導電性黏著片材，其特徵在於，所述導電性填充劑為樹枝狀的金屬微粒，所述金屬微粒為選自由銀微粒、銅微粒、銀塗佈銅微粒所構成的群組中的一種以上，以所述阻燃性樹脂與所述交聯劑的不揮發成分的總體積VA 作為100（VOL%）時，所述導電性填充劑的體積VC 為15~60（VOL%）的範圍。The conductive adhesive sheet for FPC described in item 1 or 2 of the scope of patent application is characterized in that the conductive filler is dendritic metal particles, and the metal particles are selected from silver particles, copper particles, One or more of the group consisting of silver-coated copper particles, when the total volume V A of the non-volatile components of the flame-retardant resin and the crosslinking agent is 100 (VOL%), the conductive filler The volume V C of the agent is in the range of 15-60 (VOL%). 如申請專利範圍第1或2項所述之FPC用導電性黏著片材，其特徵在於，所述防黏連劑為疏水性二氧化矽粉。The conductive adhesive sheet for FPC described in item 1 or 2 of the scope of patent application is characterized in that the anti-blocking agent is hydrophobic silica powder. 一種將如申請專利範圍第1至4項任一項所述之FPC用導電性黏著片材用於在FPC的表面貼合金屬加強板的FPC。An FPC that uses the conductive adhesive sheet for FPC as described in any one of items 1 to 4 in the scope of the patent application for bonding a metal reinforcing plate on the surface of the FPC.
TW109115674A 2015-04-17 2016-04-07 Conductive bonding sheet for fpc and fpc using the same TWI754931B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015084928A JP6280518B2 (en) 2015-04-17 2015-04-17 Conductive adhesive sheet for FPC and FPC using the same
JP2015-084928 2015-04-17

Publications (2)

Publication Number Publication Date
TW202033700A true TW202033700A (en) 2020-09-16
TWI754931B TWI754931B (en) 2022-02-11

Family

ID=57251926

Family Applications (2)

Application Number Title Priority Date Filing Date
TW109115674A TWI754931B (en) 2015-04-17 2016-04-07 Conductive bonding sheet for fpc and fpc using the same
TW105110861A TWI754611B (en) 2015-04-17 2016-04-07 Conductive bonding sheet for fpc and fpc using the same

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW105110861A TWI754611B (en) 2015-04-17 2016-04-07 Conductive bonding sheet for fpc and fpc using the same

Country Status (4)

Country Link
JP (1) JP6280518B2 (en)
KR (3) KR101764754B1 (en)
CN (1) CN106042519B (en)
TW (2) TWI754931B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109890124B (en) * 2017-12-06 2024-03-19 昆山雅森电子材料科技有限公司 Multilayer anisotropic puncture type conductive cloth adhesive and FPC reinforcing shielding structure using same
US20230319988A1 (en) * 2020-09-03 2023-10-05 Toyo Aluminium Kabushiki Kaisha Electrically conductive adhesive, electronic circuit using the same, and method for manufacturing such electronic circuit
CN111968536B (en) * 2020-09-09 2022-06-10 武汉华星光电半导体显示技术有限公司 Shielding belt and preparation method of display module

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61222299A (en) 1985-03-28 1986-10-02 日本光フアイバ株式会社 Tape or sheet for shielding electromagnetic wave
JPH07122883A (en) 1993-10-21 1995-05-12 Nitto Denko Corp Electromagnetic-wave shielding material
JPH1197879A (en) * 1997-09-19 1999-04-09 Bridgestone Corp Electromagnetic wave shielding light-transmitting window material
JP3535412B2 (en) * 1999-04-06 2004-06-07 株式会社巴川製紙所 A conductive adhesive composition, a conductive adhesive sheet, an electromagnetic wave shielding material using the same, and an electromagnetic wave shielding flexible printed board.
US6344155B1 (en) * 1999-04-06 2002-02-05 Tomoegawa Paper Co., Ltd. Electrically conductive adhesive composition, electrically conductive adhesive sheet and use thereof
JP4956867B2 (en) * 2001-04-27 2012-06-20 大日本印刷株式会社 Flat cable shield material and shielded flat cable
JP4759899B2 (en) * 2001-09-28 2011-08-31 大日本印刷株式会社 Electromagnetic shielding material and flat cable with electromagnetic shielding
JP2004212496A (en) * 2002-12-27 2004-07-29 Nippon Aerosil Co Ltd Mixed particles
JP4825830B2 (en) * 2008-03-11 2011-11-30 住友電気工業株式会社 Flexible printed circuit board with metal reinforcement
JP6081819B2 (en) * 2013-02-28 2017-02-15 藤森工業株式会社 Electromagnetic wave shielding material for FPC
JP6254386B2 (en) * 2013-08-29 2017-12-27 共同印刷株式会社 Pressure sensitive adhesive composition
JPWO2017043455A1 (en) * 2015-09-07 2018-06-28 株式会社巴川製紙所 Conductive adhesive composition, conductive adhesive sheet and wiring device using the same

Also Published As

Publication number Publication date
KR20160123990A (en) 2016-10-26
CN106042519B (en) 2020-05-05
KR20180040129A (en) 2018-04-19
JP2016207738A (en) 2016-12-08
KR101764754B1 (en) 2017-08-03
KR101848635B1 (en) 2018-04-13
CN106042519A (en) 2016-10-26
TWI754931B (en) 2022-02-11
JP6280518B2 (en) 2018-02-14
KR101953555B1 (en) 2019-03-04
KR20170092502A (en) 2017-08-11
TW201702336A (en) 2017-01-16
TWI754611B (en) 2022-02-11

Similar Documents

Publication Publication Date Title
KR101794147B1 (en) Conductive adhesive layer, conductive adhesive sheet, printed wiring board and electronic device
JP2017126735A (en) Coverlay film
KR101953555B1 (en) Conductive bonding sheet for fpc and fpc using the same
CN104219873B (en) Shape-retaining film and shape-retaining flexible circuit board provided with same
JP6761884B2 (en) Conductive adhesive sheet for FPC and FPC using it
JP6883400B2 (en) Coverlay film
KR102161993B1 (en) Coverlay film
CN107613628B (en) Electromagnetic wave shielding material
JP6542920B2 (en) Conductive adhesive sheet for FPC and FPC using the same
JP6541283B2 (en) Conductive adhesive sheet for FPC and FPC using the same
JP6448160B2 (en) Adhesive composition and conductive adhesive sheet for FPC
TWI732917B (en) Conductive bonding sheet for fpc and fpc
JP2010285463A (en) Adhesive composition, and adhesive sheet and cover-lay film obtained using the same
TWI823254B (en) Electromagnetic wave shielding film and printed circuit board with electromagnetic wave shielding film
TW201940021A (en) Electromagnetic wave shield film and shield printed circuit board enables the connection portion of the ground component to easily penetrate through the insulation layer of the electromagnetic wave shield film while pressing the ground component
TW202132514A (en) Electromagnetic wave shielding film
CN116472171A (en) Electromagnetic wave shielding film and shielding printed circuit board