CN220127722U

CN220127722U - Semiconductor frame cutting device

Info

Publication number: CN220127722U
Application number: CN202321712725.4U
Authority: CN
Inventors: 陈勇伶; 刘维强; 刘林晖; 陈锦杰
Original assignee: Shenzhen Silicon Valley Semiconductor Equipment Co ltd
Current assignee: Shenzhen Silicon Valley Semiconductor Equipment Co ltd
Priority date: 2023-06-30
Filing date: 2023-06-30
Publication date: 2023-12-05
Anticipated expiration: 2033-06-30

Abstract

The utility model discloses a semiconductor frame cutting device, which comprises a rack, a pressing module and a cutting module, wherein the rack is provided with a first conveying groove capable of inputting a frame; the pressing die assembly comprises a first pressing plate which can be pressed against the frame and a first actuating mechanism for driving the first pressing plate to be pressed against the frame; the cutting module comprises a cutter and a second actuating mechanism capable of driving the cutter to cut the frame. Compared with the prior art, the frame is fixed by the first pressing plate which is pressed against the frame before the frame is cut by the cutter, and then the frame is cut by the cutter; so the structure can prevent that the cutter from cutting the in-process frame that the frame cut because of the cutter from cutting and swing from top to bottom, reduces the frame to the abrasive resistance of cutter to delay the damage of cutter, thereby improve the life of cutter, let the cutting effect of cutter better, also can improve the accuracy that the cutter cut the frame simultaneously.

Description

Semiconductor frame cutting device

Technical Field

The utility model relates to the technical field of semiconductor packaging, in particular to a semiconductor frame cutting device.

Background

At present, the semiconductor wafer packaging technology in China is rapidly developed, and the yield, efficiency and precision of semiconductor wafer packaging and die bonding equipment are also higher. The productivity, efficiency and precision are also important indicators for the measuring equipment.

At present, the frame material for realizing the semiconductor chip package of the existing equipment is punched by a tape, and the tape needs to be cut to a fixed length when a single frame is formed by the tape; for example, chinese utility model CN 216502092U discloses a cutting mechanism for a semiconductor lead frame, although it can cut to separate the semiconductor from the lead frame; however, due to the simple structure, when the cutter repeatedly cuts, the lead frame rubs against the cutter, and the cutter becomes unsharpened over time, thereby affecting the cutting effect of the cutter.

Therefore, a new technical solution is needed to solve the above problems.

Disclosure of Invention

In view of the above, the present utility model aims at overcoming the drawbacks of the prior art, and it is a primary object of the present utility model to provide a semiconductor frame cutting device, which effectively solves the drawbacks of the prior art that the cutting knife becomes not sharp.

In order to achieve the above purpose, the present utility model adopts the following technical scheme:

a semiconductor frame trimming apparatus comprising:

the rack is provided with a first conveying groove capable of inputting the frame;

the pressing module comprises a first pressing plate which can be pressed against the frame and a first actuating mechanism for driving the first pressing plate to be pressed against the frame;

and the cutting module comprises a cutter and a second actuating mechanism which can drive the cutter to cut the frame.

The semiconductor frame cutting device provided by the utility model has the beneficial effects that: compared with the prior art, the frame is fixed by the first pressing plate which is pressed against the frame before the frame is cut by the cutter, and then the frame is cut by the cutter; so the structure can prevent that the cutter from cutting the in-process frame that the frame cut because of the cutter from cutting and swing from top to bottom, reduces the frame to the abrasive resistance of cutter to delay the damage of cutter, thereby improve the life of cutter, let the cutting effect of cutter better, also can improve the accuracy that the cutter cut the frame simultaneously.

As a preferred embodiment: the first pressing plates are provided with two pressing plates which are arranged at left and right intervals, and the cutter is positioned between the two first pressing plates.

As a preferred embodiment: the first actuating mechanism comprises a first cylinder arranged on the frame and a first fixed plate arranged on a telescopic rod of the first cylinder, and the first cylinder drives the first fixed plate to move up and down.

As a preferred embodiment: the movable plate is connected with the spring, and the first pressing plate is arranged at the bottom of the first movable plate.

Compared with the prior art, the first pressing plate is arranged in the first movable plate, and when the first pressing plate presses the frame, elastic buffer force can be provided, so that the frame is prevented from being crushed due to overlarge force exerted by the first pressing plate, and meanwhile, the stroke of pressing down of the first pressing plate is conveniently adjusted.

As a preferred embodiment: the second actuating mechanism comprises a first tool rest and a second cylinder for driving the first tool rest to move, and the cutter is detachably arranged on the first tool rest.

As a preferred embodiment: one end of the first tool rest is rotatably arranged on the frame, and the second cylinder is connected with the other end of the first tool rest to drive the first tool rest to swing up and down relative to the first conveying groove.

As a preferred embodiment: the first conveying groove is provided with a first avoiding concave position capable of providing avoidance for the cutter.

As a preferred embodiment: the frame is provided with a first fixing seat which is positioned above the first conveying groove; the pressing module and the cutting module are both installed on the first fixing seat.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic perspective view of a semiconductor frame cutting device according to an embodiment of the present utility model;

FIG. 2 is an enlarged view of a portion of FIG. 1 at A;

FIG. 3 is a schematic view of another perspective view of the pressing module and the cutting module shown in FIG. 1;

fig. 4 is a cross-sectional view of fig. 3.

Wherein, each reference sign in the figure:

10. a frame; 11. a first conveying trough; 12. the first avoidance concave position; 13. a first fixing seat; 14. a positioning module; 141. positioning an executing mechanism; 142. a positioning member;

20. a pressing module; 21. a first pressing plate; 211. pressing the convex part; 22. a first actuator; 221. a first cylinder; 222. a first fixing plate; 223. a first movable plate; 224. a spring;

30. a cutting module; 31. a cutter; 32. a second actuator; 321. a first tool post; 322. a second cylinder;

40. and a frame.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the utility model is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are merely for convenience in describing and simplifying the description based on the orientation or positional relationship shown in the drawings, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent.

Referring to fig. 1 to 4, a semiconductor frame cutting device according to an embodiment of the utility model will be described. The semiconductor frame cutting device comprises a frame 10, a pressing module 20 and a cutting module 30.

The frame 10 is provided with a first conveying groove 11 capable of inputting a frame 40, the frame 40 is input from one end of the first conveying groove 11, and is output from the other end of the first conveying groove 11 after cutting is completed; the pressing module 20 comprises a first pressing plate 21 capable of being pressed against the frame and a first actuating mechanism 22 for driving the first pressing plate 21 to be pressed against the frame; the cutting module 30 includes a cutter 31 and a second actuator 32 capable of driving the cutter 31 to cut the frame.

In operation, the frame is input from one end of the first conveying groove 11, the frame can be conveyed to the lower part of the pressing module 20, then the first actuating mechanism 22 drives the first pressing plate 21 to press against the frame, furthermore, the second actuating mechanism 32 drives the cutter 31 to cut the frame, and finally the first pressing plate 21 cancels the low pressure on the frame to finish the cutting of the frame.

Specifically, before the cutter 31 cuts the frame, the first pressing plate 21 can press against the frame to fix the frame, and then the cutter 31 cuts the frame; so the structure can prevent that cutter 31 from cutting the in-process frame that the frame cut because of cutter 31 cuts and swing from top to bottom, reduces the frame to the abrasive resistance of cutter 31 to delay cutter 31's damage, thereby improve cutter 31's life, let cutter 31's cutting effect better, also can improve cutter 31 simultaneously and cut the accuracy of frame, guarantee at the damage protection of cutting the in-process to the material.

In the embodiment of the present utility model, the first pressing plates 21 have two pressing plates 21 disposed at left and right intervals, and the cutter 31 is located between the two first pressing plates 21; with this structure, the cutter 31 cuts from the middle by pressing both end portions of the frame, and further controls the displacement of the frame. The first actuator 22 includes a first cylinder 221 mounted on the frame 10 and a first fixing plate 222 mounted on a telescopic rod of the first cylinder 221, and the first cylinder 221 drives the first fixing plate 222 to move up and down.

The first pressing plate 21 is mounted at the bottom of the first movable plate 223, and a spring 224 is connected between the first fixed plate 222 and the first movable plate 223. The first pressing plate 21 is installed in the first movable plate 223, and when the first pressing plate 21 presses against the frame, elastic buffering force can be provided, so that the frame is prevented from being crushed due to overlarge force of the first pressing plate 21, and meanwhile, the pressing stroke of the first pressing plate 21 is conveniently adjusted. The bottom of the first pressing plate 21 is provided with the pressing convex part 211 which can be matched with the frame, so that when the pressing convex part 211 presses the frame 40, the pressing convex part 211 can be just inserted into a vacancy of the frame, and therefore the frame is not easy to crush; if frames with different structures are input, only the first pressing plate 21 matched with the frames needs to be replaced, so that the universality of the cutting device is improved.

The second actuating mechanism 32 comprises a first tool rest 321 and a second cylinder 322 for driving the first tool rest 321 to move, and the cutter 31 is detachably arranged on the first tool rest 321; through the first knife rest 321 that sets up, install cutter 31 detachably in first knife rest 321 to be convenient for change cutter 31. Specifically, one end of the first tool post 321 is rotatably mounted to the frame 10, and the second cylinder 322 is connected to the other end of the first tool post 321 to drive the first tool post 321 to swing up and down with respect to the first conveying groove 11. In the embodiment of the utility model, the rear end of the first tool rest 321 is pivoted to the rear side of the frame 10, the second air cylinder 322 is connected to the front end of the first tool rest 321, and when the telescopic rod of the second air cylinder 322 extends downwards, the cutter 31 can be driven to swing downwards to cut the frame.

The first conveyer trough 11 is provided with the first concave position 12 of dodging that can provide dodging for cutter 31, through the first concave position 12 of dodging that sets up, can guarantee on the one hand that cutter 31 can cut the frame completely, on the other hand can prevent that cutter 31 from cutting to the surface of first conveyer trough 11 to guarantee that cutter 31 can normal use.

The frame 10 is provided with a first fixed seat 13, and the first fixed seat 13 is positioned above the first conveying groove 11; the pressing module 20 and the cutting module 30 are both installed on the first fixing seat 13; the frame 10 is further provided with positioning modules 14 on the left and right sides of the first fixing seat 13, each positioning module 14 includes a positioning executing mechanism 141 and a positioning component 142, and the positioning executing mechanism 141 can drive the positioning component 142 to abut against the frame, so as to provide positioning for the frame, and ensure that the cutter 31 can accurately cut the frame.

The foregoing description of the preferred embodiments of the present utility model has been provided for the purpose of illustrating the general principles of the present utility model and is not to be construed as limiting the scope of the utility model in any way. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model, and other embodiments of the present utility model as will occur to those skilled in the art without the exercise of inventive faculty, are intended to be included within the scope of the present utility model.

Claims

1. A semiconductor frame cutting device, characterized in that: comprising the following steps:

a frame (10), wherein the frame (10) is provided with a first conveying groove (11) capable of inputting a frame (40);

the pressing module (20), the pressing module (20) comprises a first pressing plate (21) which can be pressed against the frame, and a first actuating mechanism (22) for driving the first pressing plate (21) to be pressed against the frame;

the cutting module (30), the cutting module (30) is including cutter (31) and can drive cutter (31) and cut second actuating mechanism (32) of frame.

2. A semiconductor frame cutting apparatus according to claim 1, wherein: the first pressing plates (21) are provided with two pressing plates (21) which are arranged at left and right intervals, and the cutter (31) is positioned between the two first pressing plates (21).

3. A semiconductor frame cutting apparatus according to claim 1 or 2, wherein: the first actuating mechanism (22) comprises a first air cylinder (221) arranged on the frame (10) and a first fixing plate (222) arranged on a telescopic rod of the first air cylinder (221), and the first air cylinder (221) drives the first fixing plate (222) to move up and down.

4. A semiconductor frame cutting apparatus according to claim 3, wherein: the movable plate further comprises a first movable plate (223) arranged at the bottom of the first fixed plate (222), a spring (224) is connected between the first fixed plate (222) and the first movable plate (223), and the first pressing plate (21) is arranged at the bottom of the first movable plate (223).

5. A semiconductor frame cutting apparatus according to claim 1 or 4, wherein: the second actuating mechanism (32) comprises a first tool rest (321) and a second air cylinder (322) for driving the first tool rest (321) to move, and the cutter (31) is detachably arranged on the first tool rest (321).

6. A semiconductor frame cutting apparatus according to claim 5, wherein: one end of the first tool rest (321) is rotatably arranged on the frame (10), and the second air cylinder (322) is connected to the other end of the first tool rest (321) to drive the first tool rest (321) to swing up and down relative to the first conveying groove (11).

7. A semiconductor frame cutting apparatus according to claim 1, wherein: the first conveying groove (11) is provided with a first avoiding concave position (12) capable of providing avoidance for the cutter (31).

8. A semiconductor frame cutting apparatus according to claim 1, wherein: the frame (10) is provided with a first fixing seat (13), and the first fixing seat (13) is positioned above the first conveying groove (11); the pressing module (20) and the cutting module (30) are both arranged on the first fixing seat (13).