CN220108546U

CN220108546U - Cooling device, computing equipment, data center and container data center

Info

Publication number: CN220108546U
Application number: CN202321233580.XU
Authority: CN
Inventors: 请求不公布姓名; 张楠赓
Original assignee: Canaan Creative Co Ltd
Current assignee: Canaan Creative Co Ltd
Priority date: 2023-05-17
Filing date: 2023-05-19
Publication date: 2023-11-28
Anticipated expiration: 2033-05-19

Abstract

An embodiment of the present application provides a cooling device including: a housing defining a cooling chamber therein for mounting the server module; the liquid supply pipe is arranged in the cooling cavity and used for providing cooling working medium for the cooling cavity. In the cooling device provided by the embodiment, the cooling cavity capable of installing the server module and the cooling liquid is formed in the shell, so that the immersed liquid cooling of the server module installed in the shell can be realized.

Description

Cooling device, computing equipment, data center and container data center

The present application claims priority from the chinese patent office, application number 202321197511.8, chinese patent application entitled "cooling device, computing device, data center, and container data center," filed 5.17, 2023, the entire contents of which are incorporated herein by reference.

The present application claims priority from the chinese patent office, application number 202310558891.1, chinese patent application entitled "cooling device, computing device, data center, and container data center," filed 5.17, 2023, the entire contents of which are incorporated herein by reference.

Technical Field

The present utility model relates to the field of computing devices, and in particular, to a cooling device, a computing device, a data center, and a container data center.

Background

With the recent improvement of operand and the improvement of manufacturing processes of electronic components such as chips, the power density of electronic devices is increasing, and the traditional air cooling heat dissipation mode is more and more difficult to meet the heat dissipation requirement of the electronic devices.

The related technology provides an immersed liquid cooling heat dissipation mode, which has the advantages of high heat transfer efficiency, small influence of dust on electronic equipment, high heat utilization rate, high field utilization rate and the like. Therefore, there is a need for a cooling device that can be used for submerged cooling.

Disclosure of Invention

Embodiments of the present utility model provide a cooling apparatus, a computing device, a data center, and a container data center, to solve or alleviate one or more technical problems in the prior art.

As an aspect of an embodiment of the present utility model, an embodiment of the present utility model provides a cooling apparatus including:

a housing defining a cooling chamber therein for mounting the server module;

the liquid supply pipe is arranged in the cooling cavity and used for providing cooling working medium for the cooling cavity.

In the cooling device provided by the embodiment, the cooling cavity capable of installing the server module and the cooling liquid is formed in the shell, so that the immersed liquid cooling of the server module installed in the shell can be realized.

In one embodiment, the wall of the liquid supply pipe is provided with a plurality of liquid outlets for inputting cooling working medium into the cooling cavity.

In this embodiment, a plurality of liquid outlet holes are formed in the pipe wall of the liquid supply pipe, so that a cooling working medium is more uniformly input into the cooling cavity of the cooling device, and the uniform temperature of different positions in the cooling cavity is improved.

In one embodiment, further comprising: the support piece is arranged on the upper side of the liquid supply pipe and is used for installing the server module. When the liquid supply pipe provides cooling working medium, the cooling working medium flows from bottom to top to cool and dissipate heat of the server module on the support piece, and the support piece or the periphery is provided with a channel for the cooling working medium to circulate.

In one embodiment, further comprising: the baffle is positioned on the liquid outlet direction of the liquid supply pipe, and the baffle is arranged below the server module. The upper part of the baffle plate can be provided with a supporting part for arranging the server module; the baffles can be arranged along the length direction of the liquid supply pipe, a cooling working medium flowing area is formed between the adjacent baffles, the liquid supply pipe is correspondingly discharged to the cooling working medium flowing area, and a server module is arranged above the cooling working medium flowing area.

In one embodiment, further comprising: the division board is located along vertical direction the inside of casing, so that with the inside of casing is separated into cooling chamber and play liquid chamber, the cooling chamber with go out the top intercommunication in liquid chamber.

In one embodiment, further comprising: and the cover plate is movably arranged at the top of the shell and is used for opening or closing the opening at the top of the shell.

In one embodiment, further comprising: the support piece is arranged on the upper side of the liquid supply pipe and is used for installing the server module; the baffle is arranged on the lower side of the supporting piece and positioned in the liquid outlet direction of the liquid supply pipe.

In an embodiment, the server further comprises a baffle plate, the baffle plate is arranged below the server module, a plurality of liquid outlet holes are formed in the pipe wall of the liquid supply pipe, and the baffle plate is located in the liquid outlet direction of the liquid outlet holes of the liquid supply pipe.

In one embodiment, the server module further comprises a support for mounting the server module and a partition plate higher than the server module.

In one embodiment, the supporting member is a guide plate, and is disposed in the cooling cavity, and the guide plate is provided with a plurality of guide through holes, and the guide through holes are communicated with the upper side and the lower side of the guide plate.

Through set up the guide plate in the feed pipe upside, can realize the control to the flow of coolant liquid through the guide plate for can cool off the server module as required in the cooling chamber.

Through set up the baffle in the guide plate downside to the baffle sets up in the play liquid direction of liquid supply pipe liquid outlet, can block the cooling medium of liquid outlet output, thereby avoids cooling medium to receive along the influence of liquid supply pipe axial minute speed at cooling intracavity formation torrent, and then promotes the flow homogeneity of cooling medium in cooling intracavity.

Through setting up guide plate and baffle simultaneously, not only can realize the control to the flow of coolant liquid through the guide plate for can cool off the server module as required in the cooling chamber, can also promote the flow homogeneity of cooling medium in the cooling chamber, thereby realize more balanced cooling to the server module.

In one embodiment, the upper side of the deflector is used for mounting the server module to be cooled.

In this embodiment, through installing the server module in the upside of guide plate for the flow of the cooling medium that flows through the server module through the guide plate is adjustable, can cool off the server module as required in the cooling chamber.

In one embodiment, a baffle is provided on the upper side of the liquid supply tube.

In one embodiment, the baffle comprises at least one baffle.

In this embodiment, through dividing into at least one guide plate with the guide plate, can be convenient for carry out the change of guide plate according to the specification size of server module, realized the matching to different specification server module, promoted cooling device's commonality.

In one embodiment, the at least one deflector is arranged in a first direction, the at least one deflector corresponds to the at least one server module, and the first direction is an axial direction of the liquid supply pipe.

In this embodiment, the deflector plates and the server modules are arranged along the same direction and correspond to each other, so that each server module has a respective deflector plate, and thus different deflector plates (for example, deflector plates with different sizes or deflector plates with different size deflector through holes) can be matched with different server modules in a targeted manner.

In one embodiment, the flow area and/or the arrangement density of the flow guiding holes in the flow guiding sub-plate are directly related to the computing power and/or the heat dissipation capacity and/or the heat dissipation requirement of the corresponding server module.

In this embodiment, the flow guide plates with different specifications are matched according to the computing capability and/or the heat dissipation capacity and/or the heat dissipation requirement of the server module, so that the on-demand cooling of the server module is realized, and the cooling requirements of a plurality of different server modules can be simultaneously satisfied in the same cooling device.

In one embodiment, the liquid supply tube has at least one deflector segment corresponding to the at least one deflector plate.

In this embodiment, the liquid supply pipe is further divided into at least one flow guiding section, so that suitable flow guiding sections can be conveniently matched according to different performance requirements of the server module. For example, a server module with a relatively high heat dissipation requirement is matched with a flow guiding section with a relatively high flow, and a server module with a relatively low heat dissipation requirement is matched with a flow guiding section with a relatively low flow guiding section.

In one embodiment, at least one deflector plate is arranged in a first direction, and at least one deflector section is arranged in a first direction, the first direction being axial to the liquid supply tube.

In this embodiment, through setting up the water conservancy diversion subplate and water conservancy diversion section and arranging along the same direction to can synthesize the flow of adjusting the cooling medium to the server module based on two dimensions of water conservancy diversion subplate and water conservancy diversion section simultaneously, can more nimble realization cool off as required to different server modules.

In one embodiment, the flow area and/or the arrangement density of the liquid outlet holes included in the flow guiding section are directly related to the computing power and/or the heat dissipation capacity and/or the heat dissipation requirement of the corresponding server module.

Through the setting of water conservancy diversion section, satisfied the heat dissipation demand of different server modules.

In one embodiment, the cooling device further comprises a bracket, wherein the bracket is arranged in the cooling cavity and is used for bearing the deflector.

The deflector plate is mounted by means of the bracket such that there is sufficient space between the lower surface of the deflector plate and the bottom of the housing to arrange the liquid supply pipe.

In one embodiment, the top of the bracket is provided with a bracket for carrying the deflector plate.

Through set up the bracket at the top of bracket, the installation that realizes the deflector board that can be more stable is fixed.

In one embodiment, the liquid supply pipe is provided with at least one diversion section, and the baffle plate is arranged corresponding to the diversion sections of the liquid supply pipe.

In one embodiment, the liquid supply pipe and/or the inside of the housing is provided with a baffle mounting portion for mounting the baffle.

By arranging the baffle plates on the different diversion sections respectively, the flow equalization of the cooling working medium in the cooling cavity space where the different diversion sections are positioned can be realized.

In one embodiment, the wall body of the liquid supply pipe is provided with a first baffle mounting part for mounting the baffle; and/or the inner side wall of the shell is provided with a second baffle installation part for installing the baffle.

In one embodiment, the first baffle mounting portion and/or the second baffle mounting portion adopts a clamping groove structure, and the baffle is mounted through the clamping groove structure.

In one embodiment, the included angle between the plane of the baffle and the flow guiding direction of the liquid supply pipe is 30 degrees to 60 degrees.

Through setting up the contained angle of baffle and feed liquid pipe water conservancy diversion direction for 30 degrees to 60 such acute angles, realized promptly and blockked the cooling medium, also be unlikely to because blockking the effect and lead to the cooling medium to strike too much when flowing through the baffle, ensured the stability that the cooling medium flowed.

In one embodiment, the baffle is provided with a flow guiding hole, and the flow guiding hole is used for communicating two sub-liquid inlet cavities adjacent to the baffle.

Through setting up the water conservancy diversion hole on the baffle, can slow down the impact of cooling medium to the baffle to a certain extent.

In one embodiment, the partition plate is two arranged at intervals to divide the interior of the shell into two liquid outlet cavities and one cooling cavity, and the cooling cavity is positioned between the two liquid outlet cavities.

In one embodiment, the partition plate comprises a first plate body and a second plate body, wherein the second plate body is height-adjustable in the vertical direction relative to the first plate body, and the upper side edge of the second plate body is higher than the upper side edge of the first plate body.

In the embodiment, the height-adjustable baffle is arranged, so that server modules with different heights can be matched, and the universality of the cooling device is improved.

In one embodiment, the lower end of the second plate body is provided with a sliding fit member, and a part of the first plate body is in sliding fit with the sliding fit member.

In one embodiment, the slip fit includes two oppositely disposed side walls defining a chute therebetween.

In one embodiment, the device further comprises a cover plate, wherein the cover plate is movably arranged at the top of the shell and is used for opening or closing the opening at the top of the shell.

The protection to the server in the cooling device is realized through the setting of apron, in addition can also prevent that impurity from getting into cooling device's cooling medium to avoided impurity along with cooling medium gets into the circulation pipeline and lead to the destruction to the circulation pipeline.

In one embodiment, the cover plate comprises a first sub-cover plate and a second sub-cover plate, and the first sub-cover plate and the second sub-cover plate are rotatably connected.

As one aspect of an embodiment of the present application, the embodiment of the present application provides a computing device, comprising: a server module; and, the cooling device of any one of the above embodiments of the present application.

As an aspect of the embodiment of the present application, the embodiment of the present application provides a data center, including the computing device of the above embodiment of the present application.

As one aspect of an embodiment of the present application, an embodiment of the present application provides a container data center, comprising; a computing device case; the computing device according to the above embodiment of the present application is mounted in a computing device case.

As one aspect of an embodiment of the present application, an embodiment of the present application provides a container data center, comprising; the cold source box body is provided with cold source equipment; the computing device case is provided with the computing device according to the above embodiment of the present application.

According to the technical scheme of the application, the flow guide plate with the plurality of flow guide through holes is arranged in the cooling cavity, the flow guide plate is divided into the plurality of flow guide areas corresponding to the plurality of server modules, and the flow area and/or the arrangement density of the flow guide through holes in the flow guide areas are positively correlated with the computing capacity of the corresponding server modules, so that the corresponding flow velocity of the cooling working medium guided to the server modules is matched for the server modules according to the difference of the computing capacities of the server modules. For example, for a server module with relatively strong computing power, a cooling medium with relatively high flow rate can be provided for the server module through the corresponding flow guiding area; aiming at the server module with relatively weak computing capability, the cooling working medium with low flow rate can be provided for the server module through the corresponding diversion area. Therefore, the cooling working media can be uniformly distributed for different server modules according to the computing capacity, so that the uniformity of cooling the server modules with different computing capacities is improved, the probability of uneven temperature distribution of the cooling working media in the cooling cavity is reduced, the probability of backflow of the cooling working media caused by overhigh temperature of the local cooling working media is further reduced, and the working stability and reliability of the server modules are improved.

The foregoing summary is for the purpose of the specification only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present application will become apparent by reference to the drawings and the following detailed description.

Drawings

In the drawings, the same reference numerals refer to the same or similar parts or elements throughout the several views unless otherwise specified. The figures are not necessarily drawn to scale. It is appreciated that these drawings depict only some embodiments according to the disclosure and are not therefore to be considered limiting of its scope.

Fig. 1 shows a schematic structural view of a cooling device according to an embodiment of the present application;

FIG. 2 shows a schematic view of the installation of a liquid supply tube of a cooling device in a housing according to an embodiment of the application;

fig. 3 shows a schematic structural view of a baffle of a cooling device according to an embodiment of the present application;

fig. 4 shows a perspective view of a cooling device according to an embodiment of the application;

FIG. 5 shows a top view of a cooling device according to an embodiment of the application;

FIG. 6 shows a side view of a cooling device according to an embodiment of the application;

FIG. 7 shows a partial schematic view of the structure of FIG. 6;

FIG. 8 shows a baffle installation schematic of a cooling device according to an embodiment of the present application;

FIG. 9 shows a partial schematic view of the structure of FIG. 8;

FIG. 10 shows a schematic diagram of a container data center in accordance with an embodiment of the present application;

fig. 11 shows a schematic diagram of a container data center according to another embodiment of the present application.

Detailed Description

Hereinafter, only certain exemplary embodiments are briefly described. As will be recognized by those of skill in the pertinent art, the described embodiments may be modified in various different ways without departing from the spirit or scope of the present application. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive.

A cooling device 1 according to an embodiment of the present application is described below with reference to fig. 1 to 9.

The cooling device 1 includes: a housing 10 defining a cooling chamber 10a therein for mounting the server module 2; the liquid supply pipe 20 is arranged in the cooling cavity 10a and is used for providing cooling working medium for the cooling cavity.

The pipe wall of the liquid supply pipe 20 is provided with a plurality of liquid outlet holes 20a for inputting cooling working medium into the cooling cavity. The liquid outlet holes 20a are arranged along the length direction of the liquid supply pipe 20 for uniformly supplying cooling medium to each region of the length direction of the cooling chamber.

The support member is arranged on the upper side of the liquid supply pipe 20 and is used for installing the server module 2, wherein the support member can adopt a guide plate 30. When the liquid supply pipe 20 provides cooling working medium, the cooling working medium flows from bottom to top to cool and dissipate heat of the server module on the support member, and the support member or the periphery is provided with a channel for the cooling working medium to circulate.

The baffle 40, the baffle 40 is located in the liquid outlet direction of the liquid supply pipe 20, and the baffle 40 is arranged below the server module 2. The upper portion of the baffle 40 may be provided with a support portion for arranging the server module 2; the baffles 40 may be disposed along a length direction of the liquid supply pipe, and a cooling medium flow area is formed between adjacent baffles 40, so that the liquid supply pipe 20 is correspondingly discharged to the cooling medium flow area, and the server module 2 is disposed above the cooling medium flow area.

The partition plate 50 is provided in the inside of the housing 10 in the vertical direction to partition the inside of the housing 10 into a cooling chamber and a liquid outlet chamber, the cooling chamber and the liquid outlet chamber being in upper communication.

As shown in fig. 1 to 3, the cooling device 1 includes a housing 10, a liquid supply pipe 20, and a baffle 30. Specifically, the interior of the housing 10 defines a cooling chamber 10a. The liquid supply pipe 20 is arranged in the cooling cavity 10a, and the pipe wall of the liquid supply pipe 20 is provided with a plurality of liquid outlet holes 20a for inputting cooling working medium into the cooling cavity 10a. The baffle 30 is disposed in the cooling chamber 10a and located at an upper side of the liquid supply pipe 20, and the baffle 30 is provided with a plurality of flow guide through holes 30a, wherein the flow guide through holes 30a are communicated with an upper side and a lower side of the baffle 30. The cooling cavity 10a accommodates a plurality of server modules 2 located on the upper side of the deflector 30, the deflector 30 has a plurality of deflector areas 30b corresponding to the plurality of server modules 2, and the flow area and/or arrangement density of the deflector through holes 30a in the deflector areas 30b are directly related to the computing power of the corresponding server modules 2.

For example, the flow area of the flow-directing through holes 30a in the flow-directing region 30b may be the sum of the areas of all the flow-directing through holes 30a in the flow-directing region 30 b. Or the sum of the areas of all the flow guiding through holes 30a on the flow guiding sub-plate corresponding to the flow guiding area 30 b.

For example, the arrangement density of the flow guiding through holes 30a in the flow guiding region 30b may be a ratio of the sum of the areas of all the flow guiding through holes 30a in the flow guiding region 30b to the total surface of the flow guiding region 30 b. Or the ratio of the sum of the areas of all the flow-guiding through holes 30a on the flow-guiding sub-plate corresponding to the flow-guiding area 30b to the total surface of the flow-guiding sub-plate.

In the embodiment of the present application, the cooling device 1 may be used for cooling the server modules 2, and in particular, may be used for cooling a plurality of server modules 2 simultaneously. Each server module 2 may include at least one server 201 with the same computing power, and the computing power corresponding to the servers 201 of different server modules 2 may be the same or different.

It should be noted that the computing power may be defined in various ways known to those skilled in the art. For example, the computing power of the server 201 may be defined according to the maximum floating point number of operations that can be performed in a unit time, the maximum number of operations that can be performed in a unit time, and the maximum number of instructions that can be processed in a unit time. It will be appreciated that the more the computing power of the server module 2 is, the more heat the server module 2 generates per unit time.

In the embodiment of the present application, the cooling mode of the cooling device 1 adopts an immersion liquid cooling mode. The immersion liquid cooling means that the server module 2 is directly immersed in a cooling working medium with electrical insulation property, so that heat generated by the server module 2 in the working process can be directly conducted to the cooling working medium, and cooling of the server module 2 is realized. By adopting the immersion liquid cooling mode, the heat generated by the server module 2 can be directly and effectively transferred to the cooling working medium, compared with the air cooling or water cooling mode commonly adopted in the related art, other components such as a thermal interface material, a radiator, a fan and the like are not required, the cooling efficiency of the server module 2 is obviously improved, and the energy conservation and the environmental protection are also facilitated.

In order to ensure that the server module 2 immersed in the cooling medium can work normally, the cooling medium must have insulating properties and a certain corrosion resistance, so as to avoid damage to the packaging of the server module 2, and the cooling medium must also meet the conditions of incombustibility, non-toxicity, easy cleaning and the like. Illustratively, the cooling medium may employ an electronic fluorinated fluid.

In other examples of the application, cooling fluid may also be used.

In one example, the cooling medium may specifically be GTL (Gas to Liquid) base oil. The GTL base oil is base oil synthesized by taking hydrocarbon as a raw material, has high saturated hydrocarbon content, basically contains no nitrogen and sulfur, has no aromatic hydrocarbon, is 100% isoparaffin, and has excellent oxidation stability, low-temperature performance, low volatility and extremely high viscosity index. Therefore, by adopting the GTL base oil as the cooling working medium, the stability of the cooling working medium in a low-temperature state can be improved, and the working reliability of the cooling device is improved.

In another example, transformer oil (Transformer oil) may also be used as the cooling medium. The transformer oil is a fractional distillation product of petroleum, and its main components are alkane, naphthenic saturated hydrocarbon, aromatic unsaturated hydrocarbon and other compounds. Commonly known as square shed oil, light yellow transparent liquid and relative density of 0.895. The solidifying point is less than-45 ℃. The transformer oil is a mineral oil obtained by distillation and refining of natural petroleum, and is a mixture of liquid natural hydrocarbon which is obtained by refining a lubricating oil fraction in petroleum by acid and alkali, and has the advantages of purity, stability, low viscosity, good insulativity and good cooling property. By adopting the transformer oil as the cooling working medium, the stability of the cooling working medium in a low-temperature state can be improved, the transformer oil has good insulating property, and the reliability of the computing equipment in working can be improved.

The above is merely an example, and the present application is not limited to specific materials of the cooling medium.

Furthermore, in some embodiments, the server module is waterproof, in which case the cooling medium may also be water. For example, the housing of the server module is waterproof, the electronics conduct heat to the housing, and the water carries heat away from the housing.

According to whether the cooling working medium has phase change, the immersed liquid cooling can be divided into single-phase immersed liquid cooling and phase-change immersed liquid cooling. In the single-phase immersion liquid cooling mode, the server module 2 is directly immersed in a cooling working medium, heat generated by the server module 2 is conducted to the cooling working medium, then the high-temperature cooling working medium after absorbing the heat is conveyed to the heat exchanger through the circulating pump, the high-temperature cooling working medium is cooled in the heat exchanger and then flows back to the shell 10, and the cooling working medium always keeps in a liquid state in the process. In the phase-change immersion liquid cooling, the server module 2 is directly immersed in a dielectric cooling working medium in the shell 10, and heat generated by the server module 2 is conducted to the cooling working medium, so that part of the cooling working medium is converted into a gas state from a liquid state, the gas state cooling working medium is condensed on a condenser in the shell 10 and then is converted into the liquid state, and the heat transfer efficiency of the cooling working medium can be exponentially improved through the phase change of the cooling working medium in the process. The cooling device 1 in the embodiment of the present application may specifically adopt a cooling mode of single-phase immersion liquid cooling or phase-change immersion liquid cooling, which is not particularly limited in the embodiment of the present application.

In the following description of the embodiments of the present application, the first direction and the second direction are perpendicular to each other and to the vertical direction, respectively. Specifically, the first direction may be a length direction of the case 10, and the second direction may be a width direction of the case 10.

In the embodiment of the present application, the liquid supply pipe 20 is used for inputting a cooling working medium into the cooling cavity 10a, the liquid inlet end of the liquid supply pipe 20 is connected with a heat exchange device, and the heat exchange device is used for inputting the cooled cooling working medium into the liquid supply pipe 20 through the liquid inlet end. The liquid inlet end of the liquid supply pipe 20 may be disposed at an end of the liquid supply pipe 20, or may be disposed at a middle portion of the liquid supply pipe 20 or other positions adjacent to the middle portion, which is not particularly limited in the embodiment of the present application. Illustratively, the heat exchange device may be a cold source device, such as one or more of a cooling tower, a condenser, a dry cooler, a cooling fan, as the application is not limited in this regard. The cold source device can be correspondingly arranged in the cold source box body, and the cold source box body can be manufactured according to the standard container size, for example, so as to be convenient for transportation.

Illustratively, a baffle 30 is provided in the cooling chamber 10a in a horizontal direction to divide the cooling chamber 10a into an upper side space and a lower side space. The plurality of cooling modules are disposed in the upper space of the cooling chamber 10a, and the liquid supply pipe 20 is disposed in the lower space of the cooling chamber 10 a. The plurality of flow guide through holes 30a are arranged in an array on the flow guide plate 30. For example, the plurality of flow guiding through holes 30a may be arranged in a plurality of groups at intervals in the first direction, and the plurality of flow guiding through holes 30a in each group are arranged at intervals in the second direction. It can be understood that after the liquid supply pipe 20 inputs the cooling medium into the lower space of the cooling cavity 10a, the cooling medium can enter the upper space of the cooling cavity 10a through the plurality of flow guide through holes 30a on the flow guide plate 30, so that the cooling medium submerges the plurality of cooling modules located in the upper space. The fixing manner of the baffle 30 in the cooling cavity 10a is not particularly limited in the embodiment of the present application, for example, the baffle may be fixed by fastening, or may be fixed by fastening with a fastening structure.

In the embodiment of the present application, regarding the arrangement manner of the plurality of server modules 2 in the cooling cavity 10a, the embodiment of the present application is not particularly limited thereto.

In one example, a plurality of server modules 2 may be adjacently arranged in the same direction. For example, the plurality of server modules 2 may be adjacently arranged in the first direction or the second direction. In another example, a plurality of server modules 2 may be arranged in an array. For example, the plurality of server modules 2 may be arranged in a plurality of rows in the first direction and in a plurality of columns in the second direction.

In the embodiment of the present application, the plurality of diversion areas 30b correspond to the plurality of server modules 2, and one diversion area 30b may correspond to a plurality of server modules 2, or a plurality of diversion areas 30b may correspond to one server module 2, or each diversion area 30b may correspond to one server module 2.

In one example, the plurality of diversion areas 30b of the diversion plate 30 are in one-to-one correspondence with the plurality of server modules 2, and each diversion area 30b is disposed opposite to the corresponding server module 2 in the vertical direction. For example, the plurality of server modules 2 may be adjacently arranged along the first direction, the plurality of diversion areas 30b are also adjacently arranged along the first direction, and each diversion area 30b is located directly under the corresponding server module 2.

For different flow guiding areas 30b, the flow area and/or the arrangement density of the flow guiding holes 30a in the flow guiding area 30b may be set correspondingly according to the difference of the computing power of the corresponding server module 2.

For example, the flow areas of the flow guiding holes 30a in the different flow guiding regions 30b may be the same, and the arrangement density of the flow guiding holes 30a in the flow guiding region 30b is directly related to the computing power of the server module 2 corresponding to the flow guiding region 30 b. For another example, the arrangement density of the flow guiding holes 30a in the different flow guiding areas 30b may be the same, and the flow area of the flow guiding holes 30a in the flow guiding area 30b is directly related to the computing power of the server module 2 corresponding to the flow guiding area 30 b. For another example, the flow area and the arrangement density of the flow guiding holes 30a in the different flow guiding areas 30b are directly related to the computing power of the server module 2 corresponding to the flow guiding area 30 b.

It can be understood that the greater the computing power of the server module 2 corresponding to the flow guiding region 30b, the greater the flow area of the flow guiding through holes 30a in the flow guiding region 30b and/or the greater the arrangement density of the flow guiding through holes 30 a; the weaker the computing power of the server module 2 corresponding to the flow guiding area 30b, the smaller the flow area of the flow guiding through holes 30a in the flow guiding area 30b and/or the smaller the arrangement density of the flow guiding through holes 30 a.

It should be noted that, the flow area of the flow guiding through holes 30a in the flow guiding area 30b and the arrangement density thereof directly affect the flow of the cooling medium flowing to the server module 2 in unit time through the flow guiding area 30 b. The larger the flow area of the flow guiding through holes 30a in the flow guiding area 30b is, the larger the flow of the cooling working medium flowing to the corresponding server module 2 through the flow guiding area 30b is in unit time; otherwise, the smaller the flow rate of the cooling medium flowing to the corresponding server module 2 through the flow guiding area 30b in unit time. The greater the arrangement density of the flow guide through holes 30a in the flow guide area 30b, the greater the flow rate of the cooling medium flowing to the corresponding server module 2 through the flow guide area 30b in unit time; otherwise, the smaller the flow rate of the cooling medium flowing to the corresponding server module 2 through the flow guiding area 30b in unit time. It can be understood that the greater the flow rate of the cooling medium flowing to the corresponding server module 2 through the flow guiding area 30b in unit time, the higher the cooling efficiency of the server module 2; conversely, the cooling efficiency for the server module 2 is lower.

According to the cooling device 1 of the embodiment of the application, the flow guide plate 30 with the plurality of flow guide through holes 30a is arranged in the cooling cavity 10a, the flow guide plate 30 is divided into the plurality of flow guide areas 30b corresponding to the plurality of server modules 2, and the flow area and/or the arrangement density of the flow guide through holes 30a in the flow guide areas 30b are positively correlated with the computing capacity of the corresponding server modules 2, so that the corresponding flow rates of the cooling working medium guided to the server modules 2 are matched according to the difference of the computing capacities of the server modules 2. For example, for a server module 2 with relatively high computing power, a cooling medium with a high flow rate can be provided for the server module 2 through the corresponding diversion area 30 b; for the server module 2 with relatively weak computing power, the cooling medium with low flow rate can be provided for the server module 2 through the corresponding flow guiding area 30 b. Therefore, the cooling working media can be uniformly distributed for different server modules 2 according to the computing power, so that the uniformity of cooling the server modules 2 with different computing power is improved, the probability of uneven temperature distribution of the cooling working media in the cooling cavity 10a is reduced, the probability of backflow of the cooling working media caused by overhigh temperature of the local cooling working media is further reduced, and the working stability and reliability of the server modules 2 are improved.

In the embodiment of the present application, the baffle 30 may be an integrally formed piece, or may be formed by splicing a plurality of components that are separate pieces.

In one embodiment, as shown in fig. 3, the baffle 30 includes a plurality of baffle plates 31, the baffle plates 31 defining a baffle region 30b.

Illustratively, the plurality of server modules 2 are arranged along the first direction, and the plurality of deflector plates 31 are also arranged adjacently along the first direction. The plurality of server modules 2 are in one-to-one correspondence with the plurality of deflector plates 31, and the server modules 2 and the corresponding deflector plates 31 are arranged in a vertically opposite manner. Wherein each deflector 31 defines a deflector area 30b, respectively.

In other examples of the present application, each of the deflector plates 31 may correspond to a plurality of server modules 2, and the computing capacities of the plurality of server modules 2 are the same, the plurality of deflector through holes 30a on the deflector plate 31 are uniformly distributed, and the arrangement density of the plurality of deflector through holes 30a is set according to the computing capacities of the plurality of server modules 2.

Alternatively, among the plurality of deflector plates 31, adjacent deflector plates 31 may be arranged at intervals, or may be arranged adjacently. And, the adjacent guide sub-plates 31 can be fixedly connected by fasteners or fastening structures, so that the stability of the whole structure of the guide plate 30 is improved.

In addition, the shape and size of the deflector 31 may be set correspondingly according to the cross-sectional shape and size of the cooling chamber 10a and the projected shape and size of the server module 2, which is not particularly limited in the embodiment of the present application.

According to the above embodiment, by arranging the baffle 30 as the plurality of baffle plates 31 that are separate pieces from each other, the modular design of the baffle 30 is realized, the matched baffle plates 31 can be matched for the server modules 2 with different computing capacities, and the flow area and the arrangement density of the baffle through holes 30a on the baffle plates 31 are matched with the computing capacities of the server modules 2 corresponding to the baffle plates 31. For example, for the server module 2 with relatively high computing power, the flow area of the flow guiding through holes 30a on the corresponding flow guiding sub-plates 31 is correspondingly larger and the arrangement density is correspondingly larger; for the server module 2 with relatively weak computing power, the flow area of the flow guiding through holes 30a on the corresponding flow guiding sub-plates 31 is correspondingly smaller and the arrangement density is correspondingly smaller. Based on this, the cooling device according to the embodiment of the present application can provide the adaptive deflector 31 for the server modules 2 with different computing capacities, thereby providing a uniform cooling effect for all the server modules 2, and further improving the compatibility and application range of the cooling device.

Optionally, as shown in fig. 1, the cooling device 1 further includes a bracket 60, where the bracket 60 is disposed in the cooling cavity 10a, and a plurality of brackets 61 are disposed on top of the bracket 60, where the brackets 61 are used to carry the deflector plate 31.

Illustratively, a plurality of brackets 61 are adapted to be disposed at intervals in the longitudinal direction of the housing 10, and each bracket is provided with a relief through hole disposed therethrough in the vertical direction. The number of the deflector plates 31 is plural corresponding to the plural brackets 61 one by one, and each deflector plate 31 is respectively carried on the corresponding bracket 61.

In one embodiment, the plurality of server modules 2 are arranged in a first direction perpendicular to the vertical direction, the plurality of diversion areas 30b are arranged in the first direction, and the plurality of diversion areas 30b are in one-to-one correspondence with the plurality of server modules 2.

Illustratively, the plurality of diversion areas 30b are disposed in one-to-one correspondence with the plurality of server modules 2 in the vertical direction, that is, each diversion area 30b is located directly below the corresponding server module 2. It can be understood that, after the cooling medium is input into the space below the cooling cavity 10a through the liquid supply pipe 20, the cooling medium is guided upward to the corresponding server module 2 through the guiding area 30b of the guiding plate 30.

So set up, can be through the water conservancy diversion region 30b that server module 2 corresponds, for the cooling medium that server module 2 water conservancy diversion velocity of flow and its computing power assorted to provide the cooling for different server modules 2 pertinently.

In one embodiment, the liquid supply pipe 20 has a plurality of diversion segments corresponding to the diversion areas 30b in the first direction, and the flow area and/or the arrangement density of the liquid outlet holes 20a included in the diversion segments are positively correlated to the computing power of the corresponding server module 2.

For example, the flow area of the outlet holes 20a included in the flow guiding section may be the sum of the areas of all the outlet holes 20a in the flow guiding section.

For example, the arrangement density of the liquid outlet holes 20a included in the guide section may be a ratio of the sum of the areas of all the liquid outlet holes 20a in the guide section to the total surface of the guide section.

In the embodiment of the present application, the plurality of flow guiding segments correspond to the plurality of flow guiding regions 30b, and one flow guiding segment corresponds to the plurality of flow guiding regions 30b, or the plurality of flow guiding segments corresponds to one flow guiding region 30b, or each flow guiding segment corresponds to one flow guiding region 30b. The server module 2 corresponding to the flow guiding segment refers to the server module 2 corresponding to the flow guiding region 30b corresponding to any flow guiding segment.

Optionally, the plurality of flow guiding regions 30b are arranged in a first direction perpendicular to the vertical direction, the plurality of flow guiding segments are arranged in the first direction, and the plurality of flow guiding segments are in one-to-one correspondence with the plurality of flow guiding regions 30b. Wherein each guide section comprises a plurality of liquid outlet holes 20a arranged along the first direction.

It can be understood that each diversion segment has a one-to-one diversion area 30b, and each diversion area 30b has a one-to-one correspondence with the server module 2. Therefore, each diversion section is provided with a one-to-one corresponding server module 2, so that each diversion section can guide cooling working medium into the corresponding server module 2 through the corresponding diversion area 30 b. And, the water conservancy diversion section is just right to setting up with corresponding water conservancy diversion district 30b in vertical direction, and water conservancy diversion district 30b is just right to setting up with corresponding server module 2 in vertical direction. Therefore, the diversion section and the corresponding server module 2 are arranged in a vertically opposite way.

For different flow guiding segments, the flow area and/or the arrangement density of the flow guiding through holes 30a included in the flow guiding segment can be set correspondingly according to the difference of the computing power of the corresponding server module 2.

For example, the flow areas of the liquid outlet holes 20a included in different diversion segments may be the same, and the arrangement density of the liquid outlet holes 20a included in the diversion segments is directly related to the computing power of the server module 2 corresponding to the diversion segments. For another example, the arrangement density of the liquid outlet holes 20a included in different flow guiding segments may be the same, and the flow area of the liquid outlet holes 20a included in the flow guiding segments is positively related to the computing capacity of the server module 2 corresponding to the flow guiding segments. For another example, the flow area and the arrangement density of the liquid outlet holes 20a included in different flow guiding segments are directly related to the computing power of the server module 2 corresponding to the flow guiding segments.

It can be understood that the stronger the computing power of the server module 2 corresponding to the flow guiding section, the larger the flow area of the liquid outlet holes 20a included in the flow guiding section and/or the larger the arrangement density of the liquid outlet holes 20 a; the weaker the computing power of the server module 2 corresponding to the flow guiding segment, the smaller the flow area of the liquid outlet holes 20a contained in the flow guiding segment and/or the smaller the arrangement density of the liquid outlet holes 20 a.

It should be noted that, the flow area of the liquid outlet holes 20a and the arrangement density thereof included in the flow guiding section directly affect the flow rate of the cooling medium flowing to the server module 2 in unit time. The larger the flow area of the liquid outlet hole 20a contained in the flow guiding section is, the larger the flow of the cooling working medium flowing to the corresponding server module 2 through the flow guiding section is in unit time; otherwise, the smaller the flow of the cooling working medium flowing to the corresponding server module 2 through the diversion section in unit time. The greater the arrangement density of the liquid outlet holes 20a contained in the flow guiding section is, the greater the flow of the cooling working medium flowing to the corresponding server module 2 through the flow guiding section is in unit time; otherwise, the smaller the flow of the cooling working medium flowing to the corresponding server module 2 through the diversion section in unit time. It can be understood that the greater the flow rate of the cooling medium flowing to the corresponding server module 2 through the flow guiding section in unit time, the higher the cooling efficiency of the server module 2; conversely, the cooling efficiency for the server module 2 is lower.

Thus, according to the above embodiment, the flow guiding through holes 30a included in the flow guiding section corresponding to the server module 2 are aligned according to the difference of the computing power of the server module 2

The flow area and/or the arrangement density are correspondingly set, and the flow area and/or the arrangement density of the flow guide through holes 30a is positively correlated with the computing capacity of the corresponding server module 2, so that for the server module 2 with relatively strong computing capacity, a larger flow velocity can be provided for the cooling medium guided to the server module 2 through the corresponding flow guide section, and for the server module 2 with relatively weak computing capacity, a smaller flow velocity can be provided for the cooling medium guided to the server module 2 through the corresponding flow guide section, thereby further improving the cooling uniformity of the server module 2 with different computing capacities, and being beneficial to further improving the cooling medium temperature uniformity in the cooling cavity 10 a.

In one embodiment, as shown in fig. 1, the cooling device 1 further comprises a plurality of baffles 40. The baffles 40 are disposed in the cooling cavity 10a and located at the lower side of the baffle 30, the baffles 40 are disposed corresponding to the plurality of flow guiding sections of the liquid supply pipe 20, and the baffles 40 are located in the liquid outlet direction of the liquid outlet hole 20a included in the corresponding flow guiding section.

Illustratively, the baffle 40 may be fixed to the underside surface of the baffle 30 or to the bottom wall of the cooling chamber 10a, which is not particularly limited in the embodiment of the present application.

Illustratively, the upper edge of the baffle 40 corresponds to the underside of the baffle 30, the lower edge of the baffle 40 corresponds to the bottom surface of the housing, and the side edges of the baffle 40 correspond to the inner wall of the housing, such that both surfaces of the baffle 40 are divided into two areas.

Each flow guiding section may correspond to at least one baffle 40, and the baffle 40 is located in the liquid outlet direction of the liquid outlet hole 20a included in the flow guiding section, so as to block the cooling working medium output by the liquid outlet hole 20 a.

It should be noted that, the flowing direction of the cooling medium in the flowing process of the liquid supply pipe 20 is the axial direction of the liquid supply pipe 20, and the velocity of the cooling medium flowing out through the liquid outlet hole 20a includes both the component velocity along the axial direction of the liquid supply pipe 20 and the component velocity along the radial direction of the liquid supply pipe 20, so the included angle between the liquid outlet direction of the liquid outlet hole 20a and the axial direction of the liquid supply pipe 20 is an acute angle.

The baffle 40 is located in the liquid outlet direction of the liquid outlet hole 20a contained in the flow guiding section, which means that a certain included angle is formed between the plane where the baffle 40 is located and the liquid outlet direction of the liquid outlet hole 20a, so that the baffle 40 can play a certain role in stopping the cooling working medium output by the liquid outlet hole 20 a. The included angle between the plane of the baffle 40 and the liquid outlet direction of the liquid outlet hole 20a may be specifically 0 to 45 degrees.

In one example, each flow guiding section of the liquid supply tube 20 comprises a set of liquid outlet holes 20a, respectively, and the plurality of liquid outlet holes 20a in the set are arranged at intervals along the first direction. Each flow guiding section is respectively corresponding to one baffle 40, and the baffle 40 is located in the liquid outlet direction of all liquid outlet holes 20a in the group of liquid outlet holes 20a, so that the baffle 40 can form a stopping effect on the cooling working medium output by all liquid outlet holes 20a in the group of liquid outlet holes 20 a.

In another example, each flow guiding section of the liquid supply tube 20 comprises two sets of liquid outlet holes 20a, wherein the plurality of liquid outlet holes 20a in each set are distributed at intervals along the first direction, and the two sets of liquid outlet holes 20a are symmetrically distributed about the central axis of the liquid supply tube 20. Each flow guiding section is respectively provided with two baffles 40, the two baffles 40 are in one-to-one correspondence with the two groups of liquid outlet holes 20a contained in the flow guiding section, and each baffle 40 is positioned in the liquid outlet direction of all liquid outlet holes 20a in the corresponding group of liquid outlet holes 20 a.

According to the above embodiment, by setting the baffle 40 corresponding to the flow guiding section, and the baffle 40 is located in the liquid outlet direction of the liquid outlet hole 20a contained in the flow guiding section, the baffle 40 can play a certain role in stopping the cooling medium flowing out of the liquid outlet hole 20a, so as to avoid the turbulence of the cooling medium in the cooling cavity 10a due to the influence of the axial component speed along the liquid supply pipe 20, and further improve the flow uniformity of the cooling medium in the cooling cavity 10 a.

Alternatively, as shown in fig. 8 and 9, the wall body of the liquid supply tube 20 is provided with a first clamping groove 21, the inner side wall of the shell 10 is provided with a second clamping groove 12, and two side edges of the baffle 40 are respectively inserted into the first clamping groove 21 and the second clamping groove 12.

Illustratively, the first clamping grooves 21 are a plurality of and are arranged at intervals along the axial direction of the liquid supply pipe 20, and the second clamping grooves 12 are a plurality of corresponding to the plurality of first clamping grooves 21. The first and second card slots 21 and 12 each extend in a vertical direction so that the baffle 40 inserted into the first and second card slots 21 and 12 is disposed in a vertical direction.

The first clamping groove 21 is formed by inwards sinking the wall body of the liquid supply pipe 20, or the first clamping groove 21 is of a clamping groove structure arranged on the liquid supply pipe 20, or is of a clamping groove structure arranged at the bottom of the shell and adjacent to the wall body of the liquid supply pipe 20. The foregoing is merely illustrative, and the present application is not limited to the specific form of the first card slot.

The second clamping groove 12 is formed by inwards sinking the inner side wall of the shell 10, or the second clamping groove 12 is of a clamping groove structure arranged on the inner wall of the shell 10, or is of a clamping groove structure arranged at the bottom of the shell and adjacent to the inner wall of the shell 10. The above is merely exemplary, and the specific form of the second card slot is not limited in the present application.

The first and second clamping grooves 21, 12 are disposed at intervals in the axial direction of the liquid supply pipe 20 so that the baffle 40 clamped in the first and second clamping grooves 21, 12 is disposed obliquely with respect to the axial direction of the liquid supply pipe 20.

Further, the plurality of second clamping grooves 12 are arranged at intervals along the direction parallel to the axial direction of the liquid supply pipe 20, and one side edge of the baffle 40 is inserted into any one of the plurality of second clamping grooves 12.

Illustratively, the second clamping grooves 12 are respectively corresponding to a plurality of first clamping grooves 21, and each group comprises a plurality of clamping grooves which are arranged at intervals along the direction parallel to the axial direction of the liquid supply pipe 20. It will be appreciated that one side edge of the baffle 40 may be inserted into a corresponding first card slot 21, and the other side edge of the baffle 40 may be adapted to be inserted into any one of a corresponding set of second card slots 12.

Through setting up a plurality of second draw-in grooves 12 corresponding with first draw-in groove 21, can be according to the actual conditions with the side edge selectivity of baffle 40 insert in any second draw-in groove 12 to adjust the contained angle between the water conservancy diversion direction of baffle 40 and liquid supply pipe 20, and then improve the effect of baffle 40 to the cooling medium's that liquid hole 20a flows blocking of suitability.

Optionally, the included angle between the plane of the baffle 40 and the direction of flow of the liquid supply tube 20 is 30 degrees to 60 degrees.

In the embodiment of the present application, the flow guiding direction of the liquid supply pipe 20 refers to the flow direction of the cooling medium in the liquid supply pipe 20, and the flow direction of the cooling medium in the liquid supply pipe 20 is parallel to the axial direction of the liquid supply pipe 20.

Illustratively, the axial direction of the feed tube 20 is disposed along the first direction. The plane of the baffle 40 is perpendicular to the horizontal plane, and the included angle between the plane of the baffle 40 and the direction of flow of the liquid supply pipe 20 is 30 degrees to 60 degrees. Preferably, the angle between the plane of the baffle 40 and the direction of flow of the liquid supply tube 20 is 40 to 50 degrees. More preferably, the angle between the plane of the baffle 40 and the direction of flow of the liquid supply tube 20 is 45 degrees.

For example, the liquid inlet end of the liquid supply pipe 20 is disposed at the middle position of the liquid supply pipe 20, the cooling medium is split into a first branch and a second branch after entering the liquid supply pipe 20 from the liquid inlet end, the flow direction of the first branch is the direction from the middle position of the liquid supply pipe 20 to the first end, and the flow direction of the other branch is the direction from the middle position of the liquid supply pipe 20 to the second end. The liquid supply pipe 20 includes a plurality of flow guiding segments, each having two sets of flow guiding through holes 30a symmetrically distributed in the second direction. Each flow guiding section is respectively provided with two baffles 40, and the two baffles 40 are respectively in one-to-one correspondence with the two groups of flow guiding through holes 30a of the flow guiding section. The flow guide device comprises a first flow guide section and a second flow guide section which are arranged on a first branch and a third flow guide section and a fourth flow guide section which are arranged on a second branch, wherein the first flow guide direction corresponding to the first flow guide section and the second flow guide section is the flow direction of the first branch, and the second flow guide direction corresponding to the third flow guide section and the fourth flow guide section is the flow direction of the second branch.

The included angle between the plane of the baffle 40 corresponding to the first flow guiding section and the second flow guiding section and the first flow guiding direction is 45 degrees, and the included angle between the plane of the baffle 40 corresponding to the third flow guiding section and the fourth flow guiding section and the second flow guiding direction is 45 degrees.

In a specific example, each of the first clamping grooves 21 corresponds to three second clamping grooves 12, and the three second clamping grooves 12 are arranged at intervals along a direction parallel to the axial direction of the liquid supply pipe 20. When the baffles 40 are respectively inserted into the three second clamping grooves 12, the included angles between the plane of the baffles 40 and the flow guiding direction of the liquid supply pipe 20 are respectively 30 degrees, 45 degrees and 60 degrees.

Optionally, the baffle 40 is provided with a flow guiding hole 40a, and the flow guiding hole 40a is used for communicating with two sub-liquid inlet cavities adjacent to the baffle 40.

In one example, the flow-through holes 40a may be plural and spaced apart on the baffle 40.

In another example, the lower side edge of the baffle 40 abuts against the bottom wall of the cooling cavity 10a, and the plurality of baffles 40 divide the space of the cooling cavity 10a located at the lower side of the baffle 30 into a plurality of sub-liquid inlet cavities; wherein, the lower edge of the baffle 40 is provided with a flow guide hole 40a, and the adjacent sub-liquid inlet cavities are communicated through the flow guide hole 40 a.

In the embodiment of the present application, the shape and size of the flow-guiding hole 40a may be arbitrarily set according to the actual situation. The shape of the flow-guiding hole 40a may be any shape such as triangle, square, arc or zigzag, which is not particularly limited in the embodiment of the present application. The size of the flow-through holes 40a can be set according to the overall computing power of all the server modules 2, for example, if the overall computing power of all the server modules 2 is high, the flow rate requirement for the cooling medium is high, so that the size of the flow-through holes 40a can be set to be large; conversely, the size of the flow-guiding hole 40a may be set smaller.

In one embodiment, as shown in fig. 4, the cooling device 1 further comprises a partition plate 50. The partition plate 50 is provided in the inside of the housing 10 in the vertical direction to partition the inside of the housing 10 into a cooling chamber 10a and a liquid outlet chamber 10b, the cooling chamber 10a communicating with the upper side of the liquid outlet chamber 10 b.

Illustratively, the casing 10 is provided with a liquid outlet communicating the liquid outlet cavity 10b with the outside space, and the cooling medium in the liquid outlet cavity 10b can be discharged through a liquid outlet pipe 51, and the liquid outlet pipe 51 is connected with the heat exchange device. It can be understood that the cooling medium is heated after the cooling cavity 10a absorbs the heat generated by the server module 2, and the high-temperature cooling medium enters the liquid outlet cavity 10b from the cooling cavity 10a and then enters the heat exchange device through the liquid outlet. After the high-temperature cooling working medium is cooled by the heat exchange equipment, the low-temperature cooling working medium flows back to the cooling cavity 10a through the liquid supply pipe 20, so that the circulation is realized.

It will be appreciated that, due to the communication between the upper sides of the cooling chamber 10a and the liquid outlet chamber 10b, when the liquid level of the cooling medium in the cooling chamber 10a exceeds the upper side edge of the partition plate 50, the cooling medium can flow from the cooling chamber 10a into the liquid outlet chamber 10b.

In one example, the partition plate 50 is one disposed vertically to define one cooling chamber 10a and one liquid outlet chamber 10b inside the housing 10, and the cooling chamber 10a and the liquid outlet chamber 10b are disposed side by side in the horizontal direction.

In another example, the partition plate 50 is provided in two spaced apart to divide the inside of the housing 10 into two liquid outlet chambers 10b and one cooling chamber 10a in the horizontal direction, the cooling chamber 10a being located between the two liquid outlet chambers 10b. Wherein, the two liquid outlet cavities 10b are respectively provided with a liquid outlet pipe 51 for guiding out the cooling working medium in the cooling cavity 10 a.

In still another example, the partition plate 50 is provided in two spaced apart to divide the inside of the housing 10 into two cooling chambers 10a and one liquid outlet chamber 10b in the horizontal direction, the liquid outlet chamber 10b being located between the two cooling chambers 10 a. Wherein, both cooling chambers 10a are provided with a deflector 30 and a liquid supply pipe 20, and the deflector 30 carries at least one server module 2.

Alternatively, as shown in fig. 6 and 7, the partition plate 50 includes a first plate 52 and a second plate 53, the first plate 52 is fixedly connected to the housing 10, the second plate 53 is slidable in a vertical direction with respect to the first plate 52, and an upper edge of the second plate 53 is located above an upper edge of the first plate 52.

The sliding connection manner between the first plate 52 and the second plate 53 is not particularly limited in the embodiment of the present application, and any connection manner known to those skilled in the art may be adopted. For example, the first plate 52 may be provided with a chute extending along a vertical direction, the second plate 53 is provided with a sliding fit portion, and sliding connection between the second plate 53 and the first plate 52 is achieved through sliding fit of the sliding fit portion and the chute.

Through the above embodiment, the height of the partition plate 50 may be adjusted according to the height of the server module 2 to ensure that the upper side edge of the partition plate 50 is not lower than the position of the upper side edge of the server module 2 in the vertical direction, thereby ensuring that the cooling medium in the cooling chamber 10a can submerge the server module 2. By the arrangement, the compatibility of the cooling device 1 for the server modules 2 with different heights is improved, so that the application range of the cooling device 1 is enlarged.

Optionally, a sliding fit piece 54 is provided at the lower end of the second plate 53, and a portion of the first plate 52 is slidably fitted inside the sliding fit piece 54.

Illustratively, a chute is defined within the slip fit 54 and extends in a vertical direction. The slip fitting 54 may be fixed to the lower end of the second plate 53 by a fastener. The portion of the first plate 52 adjacent to the upper end is located in the slide groove and is movable in the vertical direction with respect to the slide groove, so that the first plate 52 and the second plate 53 can slide relatively in the vertical direction.

Optionally, the slip fit 54 includes two oppositely disposed side walls 55, with a chute defined between the side walls 55.

Illustratively, the two side blocking walls 55 are disposed opposite to each other in the thickness direction of the first plate body 52, and the distance between the two side blocking walls 55 is greater than or equal to the thickness of the first plate body 52. The two side walls 55 define a chute therebetween, and the portion of the first plate 52 adjacent the upper side is adapted to extend into the interior of the chute through an opening in the bottom of the chute.

Optionally, the side blocking walls 55 are provided with positioning holes for passing the positioning members 56 therethrough to adjust the distance between the two side blocking walls 55.

Illustratively, the positioning holes on the two side blocking walls 55 are disposed facing each other in the thickness direction of the first plate body 52. The positioning member 56 may be a bolt, and the bolt passes through positioning holes on the two side blocking walls 55. Wherein, both ends of the bolt are respectively in threaded fit with the nuts, the distance between the two side blocking walls 55 is adjusted by the screwing position of the two nuts on the bolt, so that the two side blocking walls 55 are pressed against both side surfaces of the first plate body 52 to fix the first plate body 52 and the second plate body 53, or the two side blocking walls 55 are separated from both side surfaces of the first plate body 52 to realize the relative movement between the first plate body 52 and the second plate body 53, and then the height of the partition plate 50 is adjusted.

In one embodiment, the cross-sectional shape of the liquid supply tube 20 is circular, square, or triangular; and/or the shape of the liquid outlet hole 20a is circular, square or triangular.

The cross-sectional shape and size of the liquid supply tube 20 and the shape and size of the liquid outlet hole 20a may be arbitrarily set by those skilled in the art according to actual situations. The cross-sectional shape of the liquid supply pipe 20 and the shape of the liquid outlet hole 20a may be any other regular shape or irregular shape, in addition to the circular shape, square shape, or triangular shape exemplified in the above embodiment.

In one embodiment, the plurality of server modules 2 are adjacently arranged in a first direction perpendicular to the vertical direction, each server module 2 includes at least two columns of servers 201 adjacently arranged in a second direction perpendicular to the first direction, and each column of servers 201 includes at least one server 201 arranged along the first direction; the axial direction of the liquid supply tube 20 is arranged parallel to the first direction.

Illustratively, the plurality of server modules 2 are adjacently arranged along the first direction, each server module 2 includes a plurality of servers 201 arranged in an array, the plurality of servers 201 are arranged in at least one row along the first direction, and each row includes at least one server 201 arranged along the second direction; and a plurality of servers 201 are arranged in at least two columns in the second direction, each column including at least two servers 201 arranged in the first direction. The axial direction of the liquid supply pipe 20 is along the first direction, and the liquid supply pipe 20 is provided with a plurality of diversion sections in the first direction, and each diversion section is used for diversion cooling working medium of the corresponding server module 2.

In a specific example, as shown in fig. 5, the number of server modules 2 is five and are arranged at intervals along the first direction. Each server module 2 comprises three rows arranged in a first direction, each row comprising two servers 201 arranged in a second direction.

In an embodiment of the present application, the liquid supply pipe 20 may be one or more disposed along the first direction. In the case where the plurality of liquid supply pipes 20 are provided, the plurality of liquid supply pipes 20 may be arranged in parallel with each other and at equal intervals in the second direction.

Optionally, each server module 2 includes N columns of servers 201 arranged in the second direction, N being a positive integer greater than or equal to 2; the number of the liquid supply pipes 20 is N-1; wherein any two adjacent rows of servers 201 correspond to one liquid supply pipe 20.

Illustratively, the supply tube 20 is centered in the second direction relative to its corresponding two rows of servers 201. Each flow guiding section of the liquid supply pipe 20 is respectively provided with two groups of liquid inlets which are oppositely arranged in the second direction, wherein one group of liquid inlets is correspondingly arranged with one row of the two rows of servers 201 of the server module 2 corresponding to the flow guiding section, and the other group of liquid inlets is correspondingly arranged with the other row of the two rows of servers 201 of the server module 2 corresponding to the flow guiding section.

By the arrangement, distribution of the liquid supply pipes 20 in the cooling cavity 10a relative to the plurality of server modules 2 is more reasonable, so that distribution of cooling working media in the cooling cavity 10a is more uniform, and temperature uniformity of the cooling working media is further improved.

In one embodiment, as shown in fig. 1 and 6, the cooling device 1 according to the embodiment of the present application further includes a cover plate 11, where the cover plate 11 is movably disposed on the top of the housing 10, for opening or closing the opening 10c on the top of the housing 10.

In the embodiment of the present application, the cover plate 11 and the housing 10 may be connected in a sliding manner or in a rotating manner, which is not particularly limited herein, so long as the cover plate 11 can be moved relative to the housing 10, so that the cover plate 11 can open or close the opening 10c at the top of the housing 10.

Alternatively, the plurality of openings 10c are arranged at intervals, and the cover plate 11 corresponds to the plurality of openings 10c one by one.

Illustratively, the openings 10c may be a plurality of openings spaced apart in the first direction, and a cover plate 11 is correspondingly disposed at each opening 10c to open or close the corresponding opening 10c, respectively. For example, the top of the housing 10 may be provided with two openings 10c side by side along the length direction thereof, and the two openings 10c are respectively provided with a cover plate 11 correspondingly.

Optionally, the cover 11 comprises a first sub-cover 111 and a second sub-cover 112, the first sub-cover 111 and the second sub-cover 112 being rotatably connected.

Illustratively, one side edge of the first sub-cover 111 extending in the first direction is rotatably connected to one side edge of the opening 10c extending in the first direction. The other side edge of the first sub-cover 111 extending in the first direction is rotatably connected to one side edge of the second sub-cover 112 extending in the first direction. Two side edges of the opening 10c extending along the second direction are respectively provided with a guide rail 13 extending along the second direction, two ends of the other side edge of the second sub-cover plate 112 extending along the first direction are respectively provided with a sliding shaft 112a matched with the guide rail 13, and the sliding shaft 112a can slide and rotate along the guide rail 13. Thus, the first sub-cover 111 and the second sub-cover 112 can be linked, and the opening 10c at the top of the housing 10 can be opened or closed by the rotation and sliding of the second sub-cover 112 relative to the opening 10c and the rotation of the first sub-cover 111 relative to the housing 10.

Further, a handle 112b is further provided on the outer surface of the second sub-cover 112, so that a worker can push and pull the second sub-cover 112 by holding the handle 112b, so as to realize the linkage between the second sub-cover 112 and the first sub-cover 111, thereby opening and closing the opening 10c.

According to another aspect of the embodiment of the present application, there is also provided a computing device including a plurality of server modules 2 and the cooling apparatus 1 according to the above embodiment of the present application.

The computing device of the embodiment of the present application may be specifically a server 201 cluster, a data center, or a mine (a computing system composed of a plurality of mine machines), etc. The server modules 2 may include at least one server 201 with the same computing power, and the computing power of the servers 201 included in different server modules 2 may be the same or different.

According to the computing device provided by the embodiment of the application, the cooling device 1 provided by the embodiment of the application improves the cooling effect on a plurality of server modules 2, and has better working stability and reliability.

As another aspect of the embodiments of the present application, the embodiments of the present application further provide a data center, including the computing device of the foregoing embodiments of the present application.

As shown in fig. 10 and 11, as another aspect of an embodiment of the present application, an embodiment of the present application provides a container data center including;

a computing device case 70;

the computing device 80 of any of the preceding embodiments, the computing device 80 being mounted in a computing device housing 70.

As another aspect of an embodiment of the present application, an embodiment of the present application provides a container data center, including;

a cold source box 60 provided with a cold source device 90;

the computing device case 70 is provided with a computing device 80 as described in any of the previous embodiments.

Other configurations of the computing device of the above embodiments may be employed in various solutions now and in the future known to those of ordinary skill in the art, and will not be described in detail herein.

In the description of the present specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; the device can be mechanically connected, electrically connected and communicated; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

The above disclosure provides many different embodiments, or examples, for implementing different structures of the application. The foregoing description of specific example components and arrangements has been presented to simplify the present disclosure. They are, of course, merely examples and are not intended to limit the application. Furthermore, the present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed.

The foregoing is merely illustrative of the present application, and the present application is not limited thereto, and any person skilled in the art will readily recognize that various changes and substitutions are possible within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A cooling device, comprising:

a housing defining a cooling chamber therein for mounting the server module;

the liquid supply pipe is arranged in the cooling cavity and used for providing cooling working medium for the cooling cavity;

The support piece is arranged on the upper side of the liquid supply pipe and is used for installing the server module; the support piece is a guide plate and is arranged in the cooling cavity, the guide plate is provided with a plurality of guide through holes, and the guide through holes are communicated with the upper side and the lower side of the guide plate.

2. A cooling device according to claim 1, wherein,

the pipe wall of the liquid supply pipe is provided with a plurality of liquid outlet holes for inputting cooling working media into the cooling cavity.

3. The cooling device according to claim 1, characterized by further comprising:

the baffle is positioned on the liquid outlet direction of the liquid supply pipe, and the baffle is arranged below the server module.

4. The cooling device according to claim 1, characterized by further comprising:

the division board is located along vertical direction the inside of casing, so that with the inside of casing is separated into cooling chamber and play liquid chamber, the cooling chamber with go out the top intercommunication in liquid chamber.

5. The cooling device according to claim 1, characterized by further comprising:

and the cover plate is movably arranged at the top of the shell and is used for opening or closing the opening at the top of the shell.

6. The cooling device according to claim 1, characterized by further comprising:

the baffle is arranged on the lower side of the supporting piece and positioned in the liquid outlet direction of the liquid supply pipe.

7. The cooling device according to claim 1, further comprising a baffle plate, wherein the baffle plate is arranged below the server module, a plurality of liquid outlet holes are formed in the pipe wall of the liquid supply pipe, and the baffle plate is positioned in the liquid outlet direction of the liquid outlet holes of the liquid supply pipe.

8. The cooling device of claim 1, further comprising a support for mounting a server module and a divider plate that is higher than the server module.

9. The cooling device according to claim 1, characterized in that the upper side of the deflector is used for mounting a server module to be cooled.

10. The cooling device according to claim 1, wherein the baffle is provided on an upper side of the liquid supply pipe.

11. The cooling device of claim 1, wherein the baffle comprises at least one baffle.

12. The cooling device of claim 11, wherein at least one deflector is arranged in a first direction, the first direction being an axial direction of the liquid supply tube, the at least one deflector corresponding to the at least one server module.

13. The cooling device according to claim 11, wherein the flow area and/or arrangement density of the flow guiding holes in the flow guiding sub-plate is positively correlated to the computing power and/or heat dissipation capacity and/or heat dissipation requirement of the corresponding server module.

14. The cooling device of claim 11, wherein the liquid supply tube has at least one flow guide section corresponding to at least one flow guide sub-plate.

15. The cooling device of claim 14, wherein at least one deflector plate is arranged in a first direction and at least one deflector section is arranged in a first direction, the first direction being axial to the liquid supply tube.

16. The cooling device according to claim 14, wherein the flow area and/or the arrangement density of the outlet holes comprised by the flow guiding section is positively correlated to the computing power and/or the heat dissipation capacity and/or the heat dissipation requirement of the corresponding server module.

17. The cooling device of claim 11, further comprising a bracket disposed in the cooling cavity for carrying the deflector.

18. The cooling device of claim 17, wherein a bracket is provided at a top of the bracket, the bracket for carrying the deflector.

19. A cooling device according to claim 3, wherein the liquid supply pipe has at least one flow guiding section, and the baffle is arranged in correspondence with the flow guiding section of the liquid supply pipe.

20. A cooling device according to claim 19, wherein the liquid supply pipe and/or the housing are provided internally with a baffle mounting portion for mounting the baffle.

21. The cooling apparatus according to claim 20, wherein a wall body of the liquid supply pipe is provided with a first baffle mounting portion for mounting the baffle; and/or the inner side wall of the shell is provided with a second baffle installation part for installing the baffle.

22. The cooling device of claim 21, wherein the first baffle mounting portion and/or the second baffle mounting portion adopts a bayonet structure by which the baffle is mounted.

23. A cooling device according to claim 3, wherein the angle between the plane of the baffle and the direction of flow of the liquid supply pipe is 30 to 60 degrees.

24. A cooling device according to claim 3, wherein the baffle is provided with a flow guiding hole for communicating two sub-feed cavities adjacent to the baffle.

25. The cooling device according to claim 4, wherein the partition plate is provided in two spaced apart relation to divide the interior of the housing into two outlet chambers and a cooling chamber, the cooling chamber being located between the two outlet chambers.

26. The cooling device according to claim 4, wherein the partition plate includes a first plate body and a second plate body, the second plate body being height-adjustable in a vertical direction with respect to the first plate body, an upper side edge of the second plate body being higher than an upper side edge of the first plate body.

27. The cooling device of claim 26, wherein a lower end of the second plate body is provided with a slip fit, and a portion of the first plate body is slip fit to the slip fit.

28. The cooling device of claim 27, wherein the slip fit includes two oppositely disposed side walls defining a chute therebetween.

29. The cooling device of claim 5, wherein the cover plate comprises a first sub-cover plate and a second sub-cover plate, the first sub-cover plate and the second sub-cover plate being rotatably coupled.

30. A computing device, comprising:

a server module; the method comprises the steps of,

a cooling device according to any one of claims 1 to 29.

31. A data center comprising the computing device of claim 30.

32. A container data center, comprising;

a computing device case;

the computing device of claim 30, the computing device mounted in the computing device case.

33. A container data center, comprising;

the cold source box body is provided with cold source equipment;

a computing device case provided with a computing device as claimed in claim 30.