CN210298364U - Liquid immersion type cooling cabinet - Google Patents
Liquid immersion type cooling cabinet Download PDFInfo
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- CN210298364U CN210298364U CN201920857211.5U CN201920857211U CN210298364U CN 210298364 U CN210298364 U CN 210298364U CN 201920857211 U CN201920857211 U CN 201920857211U CN 210298364 U CN210298364 U CN 210298364U
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- 239000007788 liquid Substances 0.000 title claims abstract description 244
- 238000001816 cooling Methods 0.000 title claims abstract description 63
- 238000007654 immersion Methods 0.000 title claims abstract description 13
- 239000000110 cooling liquid Substances 0.000 claims abstract description 122
- 238000005192 partition Methods 0.000 claims abstract description 50
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- 230000001105 regulatory effect Effects 0.000 claims description 40
- 238000009434 installation Methods 0.000 claims description 23
- 238000012544 monitoring process Methods 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 3
- 239000002826 coolant Substances 0.000 description 23
- 230000000694 effects Effects 0.000 description 11
- 230000000903 blocking effect Effects 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 5
- 230000020169 heat generation Effects 0.000 description 5
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- IYRWEQXVUNLMAY-UHFFFAOYSA-N carbonyl fluoride Chemical class FC(F)=O IYRWEQXVUNLMAY-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
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- 239000011737 fluorine Substances 0.000 description 1
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Abstract
The utility model relates to the technical field of heat dissipation of electronic equipment, and discloses a liquid immersion type cooling cabinet, which comprises a cabinet body, wherein the bottom wall of the cabinet body is provided with a first baffle plate which divides the cabinet body into an overflow area and a circulation area; a second partition board is arranged in the circulation area, is arranged in parallel with the first partition board and divides the circulation area into an electronic equipment arrangement area and a reflux area; a top channel and a bottom channel are arranged between the electronic equipment mounting area and the backflow area, after the cooling liquid in the electronic equipment mounting area absorbs heat, a part of the cooling liquid overflows from the first partition plate and enters the overflow area, a part of the cooling liquid enters the backflow area through the top channel, and the cooling liquid in the backflow area enters the electronic equipment mounting area through the bottom channel; the cooling system also comprises a liquid inlet pipeline and a liquid return pipeline, wherein the liquid inlet pipeline is communicated with the reflux area and is used for providing cooling liquid for the reflux area; the liquid return pipeline is communicated with the overflow area and used for guiding out the cooling liquid in the overflow area.
Description
Technical Field
The utility model relates to an electronic equipment's heat dissipation technical field especially relates to a liquid submergence formula cooling cabinet.
Background
With the rapid development of computer technology, people have higher and higher performance requirements on electronic devices. Generally speaking, high performance electronic devices have higher heat productivity, which makes the traditional air cooling method have to adopt lower control temperature and larger air flow to meet the heat dissipation requirement of the high performance electronic devices, which makes the existing air cooling method difficult and complicated, and the cost of the cooling device and the electric charge required by the operation of the cooling device are multiplied.
After air cooling technology has met with bottlenecks, new cooling technologies have been tried, for example, liquid instead of air as a cooling medium for electronic equipment is one of the ways. As a heat transfer medium, liquid has an incomparable advantage over air in terms of heat transfer efficiency and heat capacity per unit volume.
The submerged liquid cooling technology is a branch of the liquid cooling technology, and submerged cooling refers to that electronic equipment is directly immersed in insulating cooling liquid, and components in the electronic equipment directly exchange heat with the cooling liquid. Common submergence formula liquid cooling rack (hereinafter referred to as liquid cooling rack) is designed into an upper portion opening and has certain volumetric container, its inside can install many electronic equipment and contain insulating coolant liquid, the liquid cooling rack is equipped with the coolant liquid import in the bottom, the top is equipped with the coolant liquid export, the coolant liquid carries out the heat exchange back by coolant liquid export discharge rack with electronic equipment in the rack, but in the current liquid cooling rack, because do not carry out effectual tissue and regulation to its inside liquid flow, lead to the not high and not good of cooling efficiency.
SUMMERY OF THE UTILITY MODEL
The utility model provides a liquid submergence formula cooling rack through the inner structure of adjustment rack body to optimize this internal liquid runner of rack, make liquid cooling's efficiency further improve.
The embodiment of the utility model provides a liquid immersion type cooling cabinet, which comprises a cabinet body, wherein a first clapboard is arranged on the bottom wall of the cabinet body, and the cabinet body is divided into an overflow area and a circulation area by the first clapboard; wherein,
a second partition board is arranged in the circulation area, is arranged in parallel with the first partition board and divides the circulation area into an electronic equipment arrangement area and a reflux area;
a top channel and a bottom channel are arranged between the electronic equipment mounting area and the backflow area, after the cooling liquid in the electronic equipment mounting area absorbs heat, a part of the cooling liquid overflows from the first partition plate and enters the overflow area, a part of the cooling liquid enters the backflow area through the top channel, and the cooling liquid in the backflow area enters the electronic equipment mounting area through the bottom channel;
the cooling system also comprises a liquid inlet pipeline and a liquid return pipeline, wherein the liquid inlet pipeline is communicated with the reflux area and is used for providing cooling liquid for the reflux area; the liquid return pipeline is communicated with the overflow area and used for guiding out the cooling liquid in the overflow area.
In the above embodiment, this liquid submergence formula cooler is divided into the overflow district through setting up the space of baffle in with the rack, electronic equipment settles district and backward flow district, the coolant liquid will produce the layering at the top that the district was settled to electronic equipment after carrying out the heat exchange with electronic equipment, the high temperature coolant overflow that is located the upper strata enters into the overflow district, the low-temperature coolant liquid that is located the lower floor gets into the backward flow district and mixes back reentrant electronic equipment with fresh coolant liquid and settles the district and carry out the heat exchange, the circulation efficiency of coolant liquid has been improved, and then electronic equipment's cooling effect has been improved.
Optionally, a plurality of impellers are arranged in the electronic device installation area, and the plurality of impellers are used for pushing the cooling liquid to flow.
When the device is specifically arranged, the plurality of thrusters are arranged into a plurality of rows, and at least one row of thrusters is arranged below each electronic device in the electronic device arrangement area.
When the propeller mounting structure is specifically mounted, the propeller mounting structure further comprises a third partition plate, the third partition plate is arranged between the first partition plate and the second partition plate, mounting holes corresponding to the propellers are formed in the third partition plate, and the propellers are fixed in the corresponding mounting holes.
In order to facilitate wiring, a wire arranging groove is formed in one side of the electronic equipment arranging area in the vertical direction, and a threading baffle is arranged at the top of the wire arranging groove.
The threading baffle has various structures, and in a specific embodiment, the threading baffle comprises a main plate and a plurality of elastic baffle sheets, wherein one end of each elastic baffle sheet is connected with the main plate, the other end of each elastic baffle sheet is a free end, and the elastic baffle sheets are arranged side by side.
In order to strengthen the flow of cooling liquid in the backflow area, be equipped with the feed liquor distributing pipe in the backflow area, the feed liquor distributing pipe with feed liquor pipeline intercommunication, just the feed liquor distributing pipe is equipped with a plurality of nozzles along length direction.
Optionally, the top of the electronic device placement area is provided with two support frames, the two support frames are arranged side by side, and the electronic device is provided with a hanging lug matched with each support frame. The support frame can hold the hangers at two ends of the electronic equipment, so that the electronic equipment can be vertically placed in or moved out of the cabinet.
The liquid immersion cooler further includes:
the liquid inlet temperature sensor is arranged on the liquid inlet pipeline and used for monitoring the temperature of the cooling liquid in the liquid inlet pipeline;
the liquid inlet flow regulating valve is arranged on the liquid inlet pipeline and used for regulating the flow of the cooling liquid in the liquid inlet pipeline, namely the flow of the cooling liquid flowing into the reflux area;
the liquid return temperature sensor is arranged on the liquid return pipeline and used for monitoring the temperature of the cooling liquid in the liquid return pipeline;
control system, with feed liquor temperature sensor, feed liquor flow control valve and return liquid temperature sensor signal connection, be used for the basis feed liquor temperature sensor with return the temperature difference between the liquid temperature sensor and adjust feed liquor flow control valve's aperture.
Therefore, the flow of the cooling liquid entering the cabinet can be adjusted according to the temperature difference between the liquid inlet temperature sensor and the liquid return temperature sensor, so that the flow of the cooling liquid is adaptive to the total heat productivity of the electronic equipment.
Further, the method also comprises the following steps:
the liquid level sensor is arranged in the overflow area and used for monitoring the liquid level height of the cooling liquid in the overflow area;
the liquid return flow regulating valve is arranged on the liquid return pipeline and is used for regulating the flow of the cooling liquid in the liquid return pipeline, namely the flow of the cooling liquid flowing out of an overflow area;
the control system is in signal connection with the liquid level sensor and the liquid return flow regulating valve and is further used for regulating the opening degree of the liquid return flow regulating valve according to the liquid level height displayed by the liquid level sensor.
The control system can adjust the opening of the liquid return flow regulating valve according to the liquid level height displayed by the liquid level sensor, so that the liquid level in the overflow area is always kept in a proper range.
Furthermore, a plurality of propellers are arranged in the electronic equipment mounting area, the propellers are arranged in a plurality of rows, and at least one row of propellers is arranged below each electronic equipment in the electronic equipment mounting area;
each electronic device is provided with a temperature sensor, and the temperature sensor is used for detecting the temperature of a heating device on the corresponding electronic device;
the control system is in signal connection with the temperature sensors and the plurality of propellers and is further used for adjusting the rotating speed of the corresponding propeller according to the temperature detected by the temperature sensor on each electronic device.
According to the temperature detected by the temperature sensor on the electronic equipment, the control device can adjust the rotating speed of the propeller positioned below the electronic equipment so as to increase or decrease the flow of the cooling liquid passing through the electronic equipment, so that the flow of the cooling liquid can be adapted to the heat productivity of the single electronic equipment.
Drawings
Fig. 1 is a schematic structural diagram of a liquid immersion type cooling cabinet according to an embodiment of the present invention;
fig. 2 is a cross-sectional view of the cabinet shown in fig. 1;
FIG. 3 is a schematic flow diagram of the cooling fluid within the liquid submersion cooling cabinet shown in FIG. 1;
fig. 4 is a schematic structural diagram of a propeller provided in an embodiment of the present invention;
fig. 5 is a partial cross-sectional view of the liquid submersion cooling cabinet shown in fig. 1.
Reference numerals:
10-cabinet body
11-first partition 12-second partition 13-third partition
101-overflow area 102-electronics mounting area 103-return area
20-propeller 21-blade 22-motor 23-mounting bracket
30-liquid inlet pipeline 31-liquid inlet temperature sensor 32-liquid inlet flow regulating valve
40-liquid return pipeline 41-liquid return temperature sensor 42-liquid return flow regulating valve
50-support frame 60-wire arranging groove
70-threading baffle 71-main plate 72-elastic baffle
80-liquid inlet distribution pipe 81-nozzle
90-liquid level sensor
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The embodiment of the utility model provides a liquid submergence formula cooling cabinet, this liquid submergence formula cooling cabinet have optimized the runner of cooling liquid in the rack through setting up the baffle, have carried out effectual tissue and regulation to the flow of cooling liquid, have improved the circulation efficiency of cooling liquid, and then have improved electronic equipment's cooling effect.
Specifically, the liquid immersion type cooling cabinet comprises a cabinet body, wherein a first partition plate is arranged on the bottom wall of the cabinet body and divides the cabinet body into an overflow area and a circulation area; wherein,
a second partition board is arranged in the circulation area, is arranged in parallel with the first partition board and divides the circulation area into an electronic equipment arrangement area and a reflux area;
a top channel and a bottom channel are arranged between the electronic equipment mounting area and the backflow area, after the cooling liquid in the electronic equipment mounting area absorbs heat, a part of the cooling liquid overflows from the first partition plate and enters the overflow area, a part of the cooling liquid enters the backflow area through the top channel, and the cooling liquid in the backflow area enters the electronic equipment mounting area through the bottom channel;
the cooling system also comprises a liquid inlet pipeline and a liquid return pipeline, wherein the liquid inlet pipeline is communicated with the reflux area and is used for providing cooling liquid for the reflux area; the liquid return pipeline is communicated with the overflow area and used for guiding out the cooling liquid in the overflow area.
In the above embodiment, the first partition plate and the second partition plate divide the space in the cabinet into the overflow area, the electronic device installation area and the return area, the cooling liquid exchanges heat with the electronic devices placed in the electronic device installation area in the cabinet, the temperature of the cooling liquid flowing out from the top of the electronic device is not uniform due to different heat generation amounts of different electronic devices, and the cooling liquid is layered due to the difference of the densities of the cooling liquids at different temperatures, the cooling liquid with higher temperature and lower density is concentrated at a position close to the liquid level and overflows from the first partition plate into the overflow area, the cooling liquid with lower temperature and higher density is concentrated at a region from the lower layer of the liquid level to the top of the electronic device, and the cooling liquid enters the return area from the top channel between the electronic device installation area and the return area and is mixed with the fresh cooling liquid provided by the liquid inlet pipeline, and then enters the electronic equipment installation area again through a bottom channel between the electronic equipment installation area and the reflux area to participate in heat exchange between the cooling liquid and the heating electronic equipment. Like this, this liquid submergence formula cooling cabinet has carried out effectual tissue and regulation through reasonable runner design to the flow of coolant liquid, has improved the circulation efficiency of coolant liquid, and then has improved electronic equipment's cooling effect.
In order to facilitate understanding of the structure of the liquid submersion cooling cabinet provided by the present invention, the following detailed description will be made with reference to the accompanying drawings.
This liquid submergence formula cooling cabinet passes through the coolant liquid and cools off electronic equipment cooling, specifically through with the direct submergence of electronic equipment in the coolant liquid, makes the heat that electronic equipment produced in service can directly transmit for the coolant liquid to reach refrigerated purpose. It should be noted that the cooling liquid used has the characteristics of insulation, safety, stability, etc., and as typical materials of the cooling liquid, there are: aliphatic compounds, or fatty hydrocarbons, mainly include petroleum hydrocarbon radicals or isoparaffin hydrocarbon radicals, such as mineral oil, synthetic oil, etc.; silicones, including dimethylsiloxanes and methylsiloxanes, also known as silicone oils; fluorocarbon compounds mainly refer to organic compounds or polymers in which fluorine is substituted for the corresponding carbon chain hydrogen atoms, including perfluoroalkanes, perfluoroamines, hydrofluoroethers, perfluoroketones, hydrofluorocarbons, and the like.
The structure of the liquid immersion type cooling cabinet is shown in fig. 1-3, and comprises a cabinet body 10, wherein the cabinet body 10 is filled with cooling liquid, in order to effectively organize and regulate the flow of the cooling liquid in the cabinet body 10 and improve the cooling effect, a flow channel of the cooling liquid is optimized by arranging a partition plate on the cabinet body 10, and specifically, the liquid immersion type cooling cabinet comprises a first partition plate 11 and a second partition plate 12, wherein the first partition plate 11 is arranged on the bottom wall of the cabinet body 10, and divides the space in the cabinet body 10 into an overflow area 101 and a circulation area; the second partition board 12 is located in the circulation area and is arranged side by side with the first partition board 11, the second partition board 12 divides the circulation area into an electronic equipment placing area 102 and a return area 103, wherein, the electronic device installation area 102 is arranged between the overflow area 101 and the return area 103, a top channel and a bottom channel are arranged between the electronic device installation area 102 and the return area 103, after the cooling liquid in the electronic device installation area 102 absorbs heat, a part of the cooling liquid overflows from the first clapboard 11 and enters the overflow area 101, a part of the cooling liquid enters the return area 103 through the top channel, and the cooling liquid in the return area 103 enters the electronic device installation area 102 again through the bottom channel, this portion of the cooling fluid circulates between the electronics mounting region 102 and the recirculation region 103, in addition, the reflux area 103 is also communicated with a liquid inlet pipeline 30 arranged outside the cabinet body 10, and newly supplemented low-temperature cooling liquid enters the reflux area 103 to participate in circulation; referring to the bottom wall of the cabinet body 10, as shown in fig. 2, the height of the first partition 11 is higher than that of the second partition 12, and a gap is provided between the second partition 12 and the bottom wall of the cabinet body 10, so that the top passage and the bottom passage are formed between the electronic device installation region 102 and the return region 103, or the top passage and the bottom passage may be formed by other structures, which will not be described in detail herein. The cooling liquid exchanges heat with the electronic equipment placed in the electronic equipment placement area 102, the temperature of the cooling liquid flowing out of the top of the electronic equipment is not uniform due to different heat generation amounts of different electronic equipment, at the moment, the flow speed of the liquid from the top of the electronic equipment to the liquid level of the cooling liquid is reduced due to the fact that the cross section area of a flow channel is increased, after the flow speed is reduced, the density of the liquid is reduced along with the temperature rise, the cooling liquid is layered, the liquid with higher temperature and lower density is concentrated at the position close to the liquid level and overflows from the first partition plate 11 into the overflow area 101, the liquid with lower temperature and higher density is concentrated at the position below the liquid level to the top of the electronic equipment, and the part of the cooling liquid enters the backflow area 103 from the top channel. Like this, this liquid submergence formula cooling cabinet has carried out effectual tissue and regulation through reasonable runner design to the flow of coolant liquid, has improved the circulation efficiency of coolant liquid, and then has improved electronic equipment's cooling effect.
During specific setting, the top of the electronic device installation area 102 is provided with two support frames 50, the two support frames 50 are arranged side by side, the top of the electronic device is provided with two protruding lugs, the two support frames 50 support the lugs of the electronic device, so that the electronic device is suspended in the cooling liquid, and thus, the electronic device can be vertically placed into or moved out of the cabinet body 10 through the opening on the upper portion of the cabinet body 10.
A wire arrangement groove 60 is further formed in one side of the electronic device installation area 102 along the vertical direction, and the wire arrangement groove 60 is used for wiring of the electronic device, so that a network cable, a power line and the like connected with an I/O interface at the bottom of the electronic device can be led to the position above the liquid level through the wire arrangement groove 60. As shown in fig. 2, the wire management groove 60 is disposed on a side of the electronic device installation area 102 close to the first partition 11, and may also be disposed on a side of the second partition 12 or a side close to an inner wall of the cabinet body 10. In a specific embodiment, a threading baffle 70 is arranged at the top of the wire arranging groove 60, and the cable in the wire arranging groove 60 can pass through the threading baffle 70 and be connected with an external device. The threading baffle 70 can block the cooling liquid from entering the upper area of the cabinet body 10 from the opening at the top of the wire arranging groove 60, so that most of the cooling liquid can only flow through the inside of the electronic equipment and exchange heat with the heat generating devices in the electronic equipment. The threading baffle 70 is constructed as shown in fig. 5, and includes a main plate 71 and a plurality of elastic blocking pieces 72, one end of each elastic blocking piece is connected with the main plate 71, and the other end of each elastic blocking piece 72 is a free end, and the elastic blocking pieces 72 are arranged side by side and are tightly connected. When a cable in the cable arranging groove 60 passes through the threading baffle 70, the free ends of the elastic baffles 72 will be tilted so as to form holes for the cable to pass through, and areas where no cable passes through are formed, and the elastic baffles 72 are tightly connected together to block the upward flow of the cooling liquid. With continued reference to fig. 5, the main board 71 encloses a frame structure, and the elastic blocking pieces 72 are arranged in two rows and arranged in the middle area, and each row of the elastic blocking pieces 72 is connected to the main board 71 on the corresponding side. Specifically, the main plate 71 and the elastic blocking piece 72 may be an integral structure, and during the manufacturing process, the threading blocking plate 70 may be made of a flexible material and divided into the main plate 71 and the elastic blocking piece 72.
A plurality of impellers 20 are also arranged in the electronic equipment arrangement area 102, and the impellers 20 are used for driving the cooling liquid to flow; these propellers 20 are in signal connection with the control system and can be regulated in speed according to the signals of the control system, and when the rotating speed of the propeller 20 changes, the flow of the cooling liquid passing through the electronic equipment will also change. Further, in the electronic device installation area 102, the plurality of rows of the thrusters 20 may be arranged, and it is ensured that at least one row of the thrusters 20 is arranged below each electronic device, and the arrangement direction of the thrusters 20 is consistent with the arrangement direction of the electronic devices above. Wherein, each row of the propellers 20 may include one or more propellers 20, and under the pushing action of the propellers 20, the cooling liquid flows upwards and enters the electronic equipment above the propellers 20, so as to exchange heat with the heat generating devices in the electronic equipment, thereby improving the cooling effect. In practical application, the electronic devices placed in the cabinet body 10 have different heat generation amounts, and in order to match the flow rate of the cooling liquid with the heat generation amount of a single electronic device, each electronic device is provided with a temperature sensor for detecting the temperature of a heat generating device on the corresponding electronic device; the control system is in signal connection with the temperature sensors and is further used for adjusting the rotating speed of the corresponding propeller according to the temperature detected by the temperature sensors on each electronic device. Specifically, when the amount of heat generated by any one of the electronic devices increases, the temperature detected by the temperature sensor increases, and at this time, the control system adjusts the rotational speed of the propeller 20 corresponding to the electronic device to increase the rotational speed, so that the flow rate of the coolant flowing upward through the propeller 20 increases, and the flow rate of the coolant exchanging heat with the electronic device increases, thereby matching the flow rate of the coolant with the amount of heat generated by the electronic device alone.
In order to facilitate the installation of the thrusters 20, a third partition plate 13 is further arranged in the cabinet body 10, the third partition plate 13 is arranged between the first partition plate 11 and the second partition plate 12, mounting holes corresponding to each thruster 20 are formed in the third partition plate 13, and each thruster 20 is fixed in the corresponding mounting hole. As shown in fig. 4, the propeller 20 is composed of a blade 21, a motor 22 and a mounting bracket 23, and the operating principle of the propeller 20 is as follows: the motor 22 drives the paddle 21 to rotate, the rotating paddle 21 pushes the liquid behind the paddle to flow towards the front of the axis, and the pushing direction of the liquid is determined by the structure and the rotating direction of the paddle 21. Referring to fig. 2 and 3, the third partition 13 is parallel to the bottom wall of the cabinet body 10, the thrusters 20 are fixed on the third partition 13, the arrangement direction of the thrusters 20 is consistent with the arrangement direction of the electronic devices, and each row of thrusters 20 corresponds to one electronic device and is located right below the electronic device, and can independently adjust the speed according to the signal of the control system.
In the backflow zone 103, in order to enhance the flow of the liquid, a liquid inlet distribution pipe 80 is arranged in the backflow zone 103, the liquid inlet distribution pipe 80 is communicated with a liquid inlet pipeline 30 arranged outside the cabinet body 10, the liquid inlet distribution pipe 80 is provided with a plurality of nozzles 81 along the length direction, and the spraying direction of each nozzle 81 faces the bottom of the backflow zone 103. The nozzle 81 converts a part of potential energy of the cooling liquid entering the cabinet body 10 into kinetic energy to increase the flow speed of the liquid at the outlet of the nozzle 81, the cooling liquid is driven to flow downwards due to the jet effect generated by the high-speed flow of the liquid at the outlet of the nozzle 81, the cooling liquid flows upwards under the action of the propeller 20 after being baffled at the bottom of the cabinet body 10 and exchanges heat with a heating device inside the electronic equipment, the cooling liquid after absorbing heat is layered at the top of the electronic equipment, and the lower-layer liquid with lower temperature and lower density flows downwards rapidly and is mixed with the fresh cooling liquid under the influence of the jet effect at the nozzle 81. In this way, under the pushing action of the pusher 20 and the influence of the jet effect generated at the nozzle 81, the circulation flow of the cooling liquid between the electronic device placing region 102 and the return region 103 is enhanced, and the cooling effect is further improved. In a specific arrangement, the nozzles 81 are uniformly distributed along the liquid inlet pipe 30, so that the flow of the cooling liquid entering the cabinet body 10 is uniformly distributed along the length direction.
The exterior of the cabinet body 10 is provided with a liquid inlet pipeline 30 and a liquid return pipeline 40, specifically, the liquid inlet pipeline 30 is communicated with the return region 103 and used for providing cooling liquid for the return region 103, low-temperature cooling liquid entering the return region 103 from the electronic equipment mounting region 102 flows downwards and is mixed with fresh cooling liquid provided by the liquid inlet pipeline 30, and enters the electronic equipment mounting region 102 again through a bottom channel to participate in heat exchange; the liquid return pipeline 40 is communicated with the overflow area 101 and is used for leading out high-temperature cooling liquid in the overflow area 101, and the part of the cooling liquid exchanges heat with the heat-generating electronic equipment and overflows from the electronic equipment arrangement area 102. In a specific embodiment, the liquid inlet pipe 30 is communicated with the liquid return pipe 40, a heat exchanger and a pressure pump are disposed between the liquid inlet pipe 30 and the liquid return pipe 40, the high-temperature coolant in the overflow area 101 enters the heat exchanger through the liquid return pipe 40 for cooling, and the cooled low-temperature coolant enters the liquid return area 103 again through the liquid inlet pipe 30 under the driving of the pressure pump.
Further, as shown in fig. 3, the liquid immersion type cooling cabinet further includes a liquid inlet temperature sensor 31, a liquid inlet flow rate regulating valve 32, and a liquid return temperature sensor 41, wherein the liquid inlet temperature sensor 31 and the liquid inlet flow rate regulating valve 32 are respectively disposed on the liquid inlet pipeline 30, the liquid inlet temperature sensor 31 is configured to monitor a temperature of the cooling liquid in the liquid inlet pipeline 30, and the liquid inlet flow rate regulating valve 32 is configured to regulate a flow rate of the cooling liquid in the liquid inlet pipeline 30, that is, a flow rate of the cooling liquid flowing into the liquid return region 103; the liquid return temperature sensor 41 is arranged on the liquid return pipeline 40 and used for monitoring the temperature of the cooling liquid in the liquid return pipeline 40; the control system is in signal connection with the liquid inlet temperature sensor 31, the liquid inlet flow regulating valve 32 and the liquid return temperature sensor 41, the control device is used for regulating the opening degree of the liquid inlet flow regulating valve according to the temperature difference between the liquid inlet temperature sensor and the liquid return temperature sensor, specifically, when the total heat productivity of the electronic equipment is increased, the temperature of the cooling liquid in the liquid return pipeline 40 is increased, and when the temperature difference between the liquid inlet temperature sensor 31 and the liquid return temperature sensor 41 is greater than a set value, the control device is used for regulating the opening degree of the liquid inlet flow regulating valve 32 to increase the flow rate of the cooling liquid entering the liquid return area 103, and the increased part of the low-temperature cooling liquid enters the cabinet body 10 to participate in heat exchange, so that the temperature of the electronic equipment is kept in; on the contrary, when the total heat generation amount of the electronic device is reduced, the temperature of the cooling liquid in the liquid return pipeline 40 is reduced, and when the temperature difference between the liquid inlet temperature sensor 31 and the liquid return temperature sensor 41 is smaller than the set value, the control device adjusts the opening degree of the liquid inlet flow regulating valve 32, so that the flow rate of the cooling liquid entering the liquid return area 13 is reduced. In a word, the control system can adjust the flow rate of the cooling liquid entering the cabinet body 10 according to the temperature difference between the liquid inlet temperature sensor 31 and the liquid return temperature sensor 41, so that the flow rate of the cooling liquid can be adapted to the total heat productivity of the electronic equipment.
When the flow rate of the cooling liquid entering the cabinet body 10 changes, the flow rate of the cooling liquid overflowing from the top liquid level of the electronic equipment installation region 102 into the overflow region 101 also changes. In order to keep the liquid level in the overflow area 101 within a proper range all the time, the liquid-cooled cabinet body 10 further comprises a liquid level sensor 90 and a liquid return flow regulating valve 42, wherein the liquid level sensor 90 is arranged in the overflow area 101 and used for monitoring the liquid level of the cooling liquid in the overflow area 101; the liquid return flow regulating valve 42 is arranged on the liquid return pipeline 40 and is used for regulating the flow of the cooling liquid in the liquid return pipeline 40, namely the flow of the cooling liquid flowing out of the overflow area 101; the control system is in signal connection with the liquid level sensor 90 and the liquid return flow regulating valve 42, and is used for regulating the opening degree of the liquid return flow regulating valve 42 according to the liquid level height displayed by the liquid level sensor 90. Specifically, when the flow rate of the cooling liquid entering the cabinet body 10 increases, the cooling liquid overflowing into the overflow area 101 increases, the liquid level in the overflow area 101 rises, and when the liquid level height displayed by the liquid level sensor 90 is greater than the upper limit value, the opening degree of the liquid return flow regulating valve 42 is regulated by the control device, so that the flow rate of the cooling liquid flowing out of the overflow area 101 increases, and excessive cooling liquid flows out of the overflow area 101 in time; on the contrary, when the flow rate of the cooling liquid entering the cabinet body 10 is reduced, the cooling liquid overflowing into the overflow area 101 is reduced, the liquid level in the overflow area 101 is reduced, and when the liquid level height displayed by the liquid level sensor 90 is smaller than the lower limit value, the opening degree of the liquid return flow regulating valve 42 is regulated by the control device, so that the flow rate of the cooling liquid flowing out of the overflow area 101 is reduced, and the liquid level in the overflow area 101 is ensured to be always kept in a proper range.
When the total heat productivity of the electronic device in the cabinet body 10 tends to be stable, the opening degrees of the liquid inlet flow regulating valve 32 and the liquid return flow regulating valve 42 also tend to be stable, the flow rate of the cooling liquid entering the cabinet body 10 and the flow rate of the cooling liquid flowing out of the cabinet body 10 tend to be consistent, and the cooling system of the cabinet body 10 reaches a stable state.
When the liquid immersion type cooling cabinet works abnormally, the liquid level in the overflow area 101 may be too high or too low, in order to find faults and process the faults in time, a low liquid level switch and a high liquid level switch can be arranged in the overflow area 101, the low liquid level switch is used for monitoring a low liquid level alarm point in the overflow area 101, and if the liquid level in the overflow area 101 reaches the low liquid level alarm point, alarm information is sent out; the high liquid level switch is used for monitoring a high liquid level alarm point in the overflow area 101, and if the liquid level in the overflow area 101 reaches the high liquid level alarm point, alarm information is sent out. It should be noted that the above-mentioned control methods are all available in the prior art or can be implemented by hardware and the like.
As can be seen from the above description, the liquid immersion type cooling cabinet optimizes the flow channel of the cooling liquid in the cabinet body 10 by arranging the partition plate, so that the flow of the cooling liquid is effectively organized and regulated, the circulation efficiency of the cooling liquid is improved, and the cooling effect of the electronic equipment is further improved; meanwhile, the flow of the cooling liquid is adapted to the heat productivity of a single electronic device by adjusting the rotating speed of the propeller 20, and the flow of the cooling liquid entering the cabinet body 10 is adjusted according to the temperature difference between the liquid inlet temperature sensor 31 and the liquid return temperature sensor 41, so that the flow of the cooling liquid is adapted to the total heat productivity of the electronic device.
It will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (11)
1. A liquid immersion type cooling cabinet is characterized by comprising a cabinet body, wherein a first partition plate is arranged on the bottom wall of the cabinet body and divides the cabinet body into an overflow area and a circulation area; wherein,
a second partition board is arranged in the circulation area, is arranged in parallel with the first partition board and divides the circulation area into an electronic equipment installation area and a reflux area;
a top channel and a bottom channel are arranged between the electronic equipment installation area and the backflow area, after the cooling liquid in the electronic equipment installation area absorbs heat, a part of the cooling liquid overflows from the first partition plate and enters the overflow area, a part of the cooling liquid enters the backflow area through the top channel, and the cooling liquid in the backflow area enters the electronic equipment installation area through the bottom channel;
the cooling system also comprises a liquid inlet pipeline and a liquid return pipeline, wherein the liquid inlet pipeline is communicated with the backflow area and is used for providing cooling liquid for the backflow area; the liquid return pipeline is communicated with the overflow area and used for guiding out the cooling liquid in the overflow area.
2. The liquid submersion cooling cabinet of claim 1, wherein a plurality of impellers are disposed in the electronics housing area, and the plurality of impellers are configured to propel a flow of cooling liquid.
3. The liquid submersion cooling cabinet of claim 2, wherein the plurality of impellers are arranged in a plurality of rows, and at least one row of impellers is located below each electronic device in the electronic device holding area.
4. The liquid submersion cooling cabinet of claim 2, further comprising a third partition disposed between the first partition and the second partition, wherein the third partition is provided with a mounting hole corresponding to each impeller, and each impeller is fixed in the corresponding mounting hole.
5. The liquid submersion cooling cabinet of claim 1, wherein a wire arrangement groove is formed in a vertical direction on one side of the electronic equipment installation area, and a threading baffle is arranged at the top of the wire arrangement groove.
6. The liquid submersion cooling cabinet of claim 5, wherein the threading flap comprises a main plate and a plurality of resilient flaps connected to the main plate at one end and free at the other end, and the plurality of resilient flaps are disposed side by side.
7. The liquid submersion cooling cabinet of claim 1, wherein a liquid inlet distribution pipe is disposed in the recirculation zone, the liquid inlet distribution pipe is in communication with the liquid inlet conduit, and the liquid inlet distribution pipe has a plurality of nozzles along a length of the liquid inlet distribution pipe.
8. The liquid submersion cooling cabinet of claim 1, wherein two support frames are disposed on a top of the electronic equipment installation region, the two support frames are disposed side by side, and a hanging lug is disposed on the electronic equipment to be matched with each support frame.
9. A liquid submersion cooling cabinet in accordance with any one of claims 1 to 8, further comprising:
the liquid inlet temperature sensor is arranged on the liquid inlet pipeline and used for monitoring the temperature of the cooling liquid in the liquid inlet pipeline;
the liquid inlet flow regulating valve is arranged on the liquid inlet pipeline and used for regulating the flow of cooling liquid in the liquid inlet pipeline;
the liquid return temperature sensor is arranged on the liquid return pipeline and used for monitoring the temperature of the cooling liquid in the liquid return pipeline;
control system, with feed liquor temperature sensor, feed liquor flow control valve and return liquid temperature sensor signal connection, be used for the basis feed liquor temperature sensor with return the temperature difference between the liquid temperature sensor and adjust feed liquor flow control valve's aperture.
10. The liquid submersion cooling cabinet of claim 9, further comprising:
the liquid level sensor is arranged in the overflow area and used for monitoring the liquid level height of the cooling liquid in the overflow area;
the liquid return flow regulating valve is arranged on the liquid return pipeline and is used for regulating the flow of the cooling liquid in the liquid return pipeline;
the control system is in signal connection with the liquid level sensor and the liquid return flow regulating valve and is further used for regulating the opening degree of the liquid return flow regulating valve according to the liquid level height displayed by the liquid level sensor.
11. The liquid submersion cooling cabinet of claim 9, wherein a plurality of thrusters are disposed within the electronics housing section, the plurality of thrusters are arranged in a plurality of rows, and at least one row of thrusters is disposed below each electronic device within the electronics housing section;
each electronic device is provided with a temperature sensor, and the temperature sensor is used for detecting the temperature of a heating device on the corresponding electronic device;
the control system is in signal connection with the temperature sensors and the plurality of propellers and is further used for adjusting the rotating speed of the corresponding propeller according to the temperature detected by the temperature sensor on each electronic device.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920857211.5U CN210298364U (en) | 2019-06-06 | 2019-06-06 | Liquid immersion type cooling cabinet |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920857211.5U CN210298364U (en) | 2019-06-06 | 2019-06-06 | Liquid immersion type cooling cabinet |
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| CN210298364U true CN210298364U (en) | 2020-04-10 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110290677A (en) * | 2019-06-06 | 2019-09-27 | 深圳绿色云图科技有限公司 | A kind of liquid submersion cooling machine cabinet |
| TWI731719B (en) * | 2020-06-16 | 2021-06-21 | 英業達股份有限公司 | Liquid tank system and li-ion battery cooling system therewith |
| CN113782859A (en) * | 2020-06-09 | 2021-12-10 | 英业达科技有限公司 | Liquid tank system and lithium ion battery cooling system |
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2019
- 2019-06-06 CN CN201920857211.5U patent/CN210298364U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110290677A (en) * | 2019-06-06 | 2019-09-27 | 深圳绿色云图科技有限公司 | A kind of liquid submersion cooling machine cabinet |
| CN110290677B (en) * | 2019-06-06 | 2024-04-26 | 深圳绿色云图科技有限公司 | Liquid immersion type cooling cabinet |
| CN113782859A (en) * | 2020-06-09 | 2021-12-10 | 英业达科技有限公司 | Liquid tank system and lithium ion battery cooling system |
| CN113782859B (en) * | 2020-06-09 | 2023-06-02 | 英业达科技有限公司 | Liquid tank system and lithium ion battery cooling system |
| TWI731719B (en) * | 2020-06-16 | 2021-06-21 | 英業達股份有限公司 | Liquid tank system and li-ion battery cooling system therewith |
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