CN220106551U - Photoelectric coupler packaging structure - Google Patents
Photoelectric coupler packaging structure Download PDFInfo
- Publication number
- CN220106551U CN220106551U CN202321177100.2U CN202321177100U CN220106551U CN 220106551 U CN220106551 U CN 220106551U CN 202321177100 U CN202321177100 U CN 202321177100U CN 220106551 U CN220106551 U CN 220106551U
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- Prior art keywords
- pole piece
- plastic
- slide
- chip
- frame
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 33
- 239000004033 plastic Substances 0.000 claims abstract description 61
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims 9
- 239000005022 packaging material Substances 0.000 abstract description 21
- 238000000034 method Methods 0.000 abstract description 9
- 230000003287 optical effect Effects 0.000 abstract description 9
- 239000000463 material Substances 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000032798 delamination Effects 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical group 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Abstract
The utility model provides a photoelectric coupler packaging structure which comprises an upper slide, a lower slide, an optical coupler chip and a plastic package body, wherein one end of the upper slide, one end of the lower slide and the optical coupler chip are embedded in the plastic package body, the optical coupler chip is fixedly connected with the upper slide and the lower slide respectively, the other end of the upper slide and the other end of the lower slide extend out of the plastic package body, and a guide hole is formed in the surface of the lower slide. By adopting the technical scheme of the utility model, in the process of injecting the plastic packaging material to form the plastic packaging body, the plastic packaging materials on the upper side and the lower side of the lower carrier sheet can flow through the guide holes and then are staggered and fused into a whole, so that the probability of layering between the plastic packaging material and the surface of the chip is reduced, the packaging quality of the photoelectric coupler chip is improved, the packaging performance of the photoelectric coupler chip is ensured, and the failure of the photoelectric coupler chip is avoided.
Description
Technical Field
The utility model belongs to the technical field of electronic element packaging structures, and particularly relates to a photoelectric coupler packaging structure.
Background
Nowadays, various electronic products are widely used, the electronic products comprise a plurality of electronic elements, the yield and the demand of the electronic elements are increased day by day, with the development of large-scale integrated circuits, the overall dimensions of integrated circuit chips are reduced day by day, and various integrated circuit chips are usually packaged first and then applied to various electronic products, and various electronic elements can be divided into two forms of ceramic packaging and resin packaging according to different packaging materials. The ceramic package has the advantages of good moisture resistance and long service life, but has high cost; the resin package has the advantages of low cost and high yield, and the main package form of the integrated circuit chip is currently used in the resin package. However, in the process of packaging an integrated circuit chip, the plastic packaging material has a thermal expansion coefficient different from that of the chip and the substrate, so that delamination phenomenon of the packaging body is easy to occur, and because the interface between the plastic and other materials belongs to an adhesive structure, the two materials of the interface are combined together through acting force between molecules, but not the two materials are mutually dissolved, mutually diffused and form a compound structure. The delamination phenomenon at the interface between the plastic and other materials of the plastic packaging device can cause the performance of the device to be reduced and even to be invalid. Such as: delamination occurs at the interface between the plastic and the chip, on the one hand, the bonding wires of the chip can be caused to have mechanical damage due to mechanical stretching, and the bonding wires (including inner and outer bonding points) can cause the increase of connection resistance or open circuit; on the other hand, the damage of the passivation layer on the surface of the chip can be caused, so that the electric leakage of the chip is increased, the breakdown voltage is reduced, the metallized strip is broken, and the like; furthermore, delamination of the plastic and chip interface results in easier ingress of moisture to the chip surface, degrading chip performance. In addition, if layering occurs in the electronic element packaging structure, even if the layering area is small, the part which has layered is a source with enlarged layering area, and in the use process of the device, the layering is continuously expanded due to the action of thermal stress or mechanical stress, and finally the device is invalid due to the increase of the layering area.
In the prior art, the publication number is: the patent document of CN113265211A discloses a packaging resin for reducing packaging layering and a packaging method thereof, which are applied to a chip packaging process and comprise a filler, biphenyl, a multi-aromatic ring resin, an ion trapping agent, a hardener, a catalyst and a coloring agent, wherein the filler further comprises silicon dioxide, the proportion of the added silicon dioxide of the filler is 86-88.5wt%, the filling particle size of the filler is 40-50 mu m, so that layering between a lead frame and the epoxy resin is reduced, and the yield of the process is improved. However, the essential reason for the layering phenomenon of the electronic element packaging structure is that the thermal expansion coefficients of the plastic packaging material and the chip material are different, and the technical scheme of the patent document improves the thermal expansion coefficient of the plastic packaging material by optimally combining the components of the plastic packaging material, but under different application environments and application process conditions, the thermal expansion coefficients of the plastic packaging material, the chip and the substrate still have differences, the layering phenomenon still easily occurs, and the technical scheme has too high dependence on the process conditions, so that the technical scheme is influenced to be widely popularized and applied in vast electronic manufacturing enterprises.
Disclosure of Invention
In order to solve the technical problems, the utility model provides a photoelectric coupler packaging structure.
The utility model is realized by the following technical scheme.
The utility model provides a photoelectric coupler packaging structure which comprises an upper slide, a lower slide, an optical coupler chip and a plastic package body, wherein one end of the upper slide, one end of the lower slide and the optical coupler chip are embedded in the plastic package body, the optical coupler chip is fixedly connected with the upper slide and the lower slide respectively, the other end of the upper slide and the other end of the lower slide extend out of the plastic package body, and a guide hole is formed in the surface of the lower slide.
And the aperture cross-sectional area of the guide hole is not larger than the projection area of the optocoupler chip on the surface of the lower slide.
The guide hole is arranged at the corner of the lower slide.
The guide hole is a circular through hole.
The aperture of the guide hole is 0.4mm.
The photoelectric coupler packaging structure further comprises an upper pole piece and a lower pole piece, wherein the upper pole piece is electrically connected with the upper carrying piece, the lower pole piece is electrically connected with the lower carrying piece through gold wires, one end of the upper pole piece, one end of the lower pole piece and the gold wires are embedded in the plastic package body, and the other end of the upper pole piece and the other end of the lower pole piece extend out of the plastic package body.
The upper pole piece and the upper slide are also fixedly connected with the upper frame, the lower pole piece and the lower slide are also fixedly connected with the lower frame, and the upper frame and the lower frame are uniformly distributed outside the plastic package body.
The number of the plastic package bodies is multiple, and the plastic package bodies are arranged in a linear array along the length direction of the upper frame, the width direction of the upper frame, the length direction of the lower frame and the width direction of the lower frame respectively.
The whole plastic package body is in a cuboid shape.
The upper frame, the upper pole piece and the upper slide are integrally manufactured and formed, and the lower frame, the lower pole piece and the lower slide are integrally manufactured and formed.
The utility model has the beneficial effects that: by adopting the technical scheme of the utility model, as the lower slide is provided with the guide hole, in the process of injecting the plastic packaging material to form the plastic packaging body, the plastic packaging material above the lower slide can flow through the guide hole to enter below the lower slide, and the plastic packaging material below the lower slide can also flow through the guide hole to enter above the lower slide, so that the plastic packaging materials above and below the lower slide are staggered and fused into a whole, the probability of boundary between the plastic packaging material and the chip surface is reduced, namely layering phenomenon is reduced, the packaging quality of the photoelectric coupler chip is improved, the packaging performance of the photoelectric coupler chip is ensured, and the failure of the photoelectric coupler chip is avoided.
Drawings
FIG. 1 is a front view of the present utility model;
FIG. 2 is a top view of the present utility model;
FIG. 3 is a cross-sectional view of the present utility model taken along the length of FIG. 1;
FIG. 4 is a cross-sectional view of the present utility model taken along the width of FIG. 2;
FIG. 5 is a schematic diagram of the connection structure of the upper frame, the upper carrier, the upper pole piece and the optocoupler chip of the present utility model;
FIG. 6 is a schematic diagram of the connection structure of the lower frame, the lower carrier, the lower pole piece and the optocoupler chip of the present utility model;
fig. 7 is a schematic view of a partially enlarged structure of the present utility model at i in fig. 6.
In the figure: the device comprises a 1-upper slide, a 2-lower slide, a 3-optocoupler chip, a 4-plastic package, a 5-guide hole, a 6-upper pole piece, a 7-lower pole piece, an 8-gold wire, a 9-upper frame and a 10-lower frame.
Detailed Description
The technical solution of the present utility model is further described below, but the scope of the claimed utility model is not limited to the above.
As shown in fig. 1 to 7, the utility model provides a photoelectric coupler packaging structure, which comprises an upper slide 1, a lower slide 2, an optical coupler chip 3 and a plastic package body 4, wherein one end of the upper slide 1, one end of the lower slide 2 and the optical coupler chip 3 are embedded in the plastic package body 4, the optical coupler chip 3 is fixedly connected with the upper slide 1 and the lower slide 2 respectively, the other end of the upper slide 1 and the other end of the lower slide 2 extend out of the plastic package body 4, and a guide hole 5 is formed in the surface of the lower slide 2.
By adopting the technical scheme of the utility model, as the lower slide is provided with the guide hole, in the process of injecting the plastic packaging material to form the plastic packaging body, the plastic packaging material above the lower slide can flow through the guide hole to enter below the lower slide, and the plastic packaging material below the lower slide can also flow through the guide hole to enter above the lower slide, so that the plastic packaging materials above and below the lower slide are staggered and fused into a whole, the probability of boundary between the plastic packaging material and the chip surface is reduced, namely layering phenomenon is reduced, the packaging quality of the photoelectric coupler chip is improved, the packaging performance of the photoelectric coupler chip is ensured, and the failure of the photoelectric coupler chip is avoided.
Specifically, the aperture cross-sectional area of the guide hole 5 is not larger than the projection area of the optocoupler chip 3 on the surface of the lower chip 2. Preferably, the guide holes 5 are provided at corners of the lower slide 2. The guide hole 5 is a circular through hole. The diameter of the guide hole 5 is 0.4mm.
In addition, the photoelectric coupler packaging structure further comprises an upper pole piece 6 and a lower pole piece 7, wherein the upper pole piece 6 is electrically connected with the upper carrying piece 1, the lower pole piece 7 is electrically connected with the lower carrying piece 2 through gold wires 8, one end of the upper pole piece 6, one end of the lower pole piece 7 and the gold wires 8 are embedded in the plastic package body 4, and the other end of the upper pole piece 6 and the other end of the lower pole piece 7 extend out of the plastic package body 4.
In addition, the upper pole piece 6 and the upper slide 1 are fixedly connected with the upper frame 9, the lower pole piece 7 and the lower slide 2 are fixedly connected with the lower frame 10, and the upper frame 9 and the lower frame 10 are uniformly distributed outside the plastic package body 4. The number of the plastic packages 4 is plural, and the plastic packages 4 are arranged in linear arrays along the length direction of the upper frame 9, the width direction of the upper frame 9, the length direction of the lower frame 10 and the width direction of the lower frame 10. Therefore, the requirement of enterprises on mass packaging production of the photoelectric coupler chips is met, in the actual production process, the upper pole piece 6, the upper carrying piece 1, the lower pole piece 7 and the lower carrying piece 2 are respectively arranged on the surfaces of the upper frame 9 and the lower frame 10 in order, the upper frame 9 and the lower frame 10 are overlapped, and then plastic packaging materials are injected, so that one end of the upper carrying piece 1, one end of the upper pole piece 6, one end of the lower carrying piece 2, one end of the lower pole piece 7 and the photoelectric coupler chips 3 are embedded in the plastic packaging body 4, and the plastic packaging materials are solidified.
Specifically, the plastic package 4 has a rectangular parallelepiped shape as a whole. The number of the plastic package bodies 4 is more than 60. The upper frame 9 is integrally formed with the upper pole piece 6 and the upper carrier sheet 1, and the lower frame 10 is integrally formed with the lower pole piece 7 and the lower carrier sheet 2.
Claims (10)
1. The utility model provides a photoelectric coupler packaging structure which characterized in that: including last slide glass (1), lower slide glass (2), opto-coupler chip (3) and plastic envelope body (4), go up the one end of slide glass (1), the one end of lower slide glass (2) and opto-coupler chip (3) all inlay in plastic envelope body (4), and opto-coupler chip (3) respectively with go up slide glass (1), lower slide glass (2) link firmly, go up the other end of slide glass (1), the other end of lower slide glass (2) extends outside plastic envelope body (4), lower slide glass (2) surface is equipped with guiding hole (5).
2. The optocoupler package of claim 1, wherein: the aperture cross-sectional area of the guide hole (5) is not larger than the projection area of the optocoupler chip (3) on the surface of the lower slide (2).
3. A photoelectric coupler package according to claim 1 or 2, characterized in that: the guide hole (5) is arranged at the corner of the lower slide (2).
4. A optocoupler package of claim 3, wherein: the guide hole (5) is a circular through hole.
5. The optocoupler package of claim 4, wherein: the aperture of the guide hole (5) is 0.4mm.
6. The optocoupler package of claim 1, wherein: the photoelectric coupler packaging structure further comprises an upper pole piece (6) and a lower pole piece (7), wherein the upper pole piece (6) is electrically connected with the upper slide (1), the lower pole piece (7) is electrically connected with the lower slide (2) through gold wires (8) respectively, one end of the upper pole piece (6), one end of the lower pole piece (7) and the gold wires (8) are embedded in the plastic package body (4), and the other end of the upper pole piece (6) and the other end of the lower pole piece (7) extend out of the plastic package body (4).
7. The optocoupler package of claim 6, wherein: the upper pole piece (6) and the upper slide (1) are also fixedly connected with the upper frame (9), the lower pole piece (7) and the lower slide (2) are also fixedly connected with the lower frame (10), and the upper frame (9) and the lower frame (10) are uniformly distributed outside the plastic package body (4).
8. The optocoupler package of claim 7, wherein: the number of the plastic packages (4) is multiple, and the plastic packages (4) are arranged in a linear array along the length direction of the upper frame (9), the width direction of the upper frame (9), the length direction of the lower frame (10) and the width direction of the lower frame (10) respectively.
9. A photoelectric coupler package according to claim 1 or 6 or 7 or 8, wherein: the whole plastic package body (4) is in a cuboid shape.
10. The optocoupler package of claim 7, wherein: the upper frame (9) is integrally manufactured and formed with the upper pole piece (6) and the upper carrier sheet (1), and the lower frame (10) is integrally manufactured and formed with the lower pole piece (7) and the lower carrier sheet (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321177100.2U CN220106551U (en) | 2023-05-16 | 2023-05-16 | Photoelectric coupler packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321177100.2U CN220106551U (en) | 2023-05-16 | 2023-05-16 | Photoelectric coupler packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220106551U true CN220106551U (en) | 2023-11-28 |
Family
ID=88871344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321177100.2U Active CN220106551U (en) | 2023-05-16 | 2023-05-16 | Photoelectric coupler packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220106551U (en) |
-
2023
- 2023-05-16 CN CN202321177100.2U patent/CN220106551U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |