CN220106483U - Chip separation head assembly and chip separation device - Google Patents

Abstract

A chip separation head assembly and a chip separation apparatus, wherein the chip separation head assembly comprises: the thimble shell is provided with a storage cavity and a guide through hole, and the guide through hole is communicated with the storage cavity; the elastic body is filled in the storage containing cavity of the thimble shell; the ejector pin is wrapped and fixed by the elastic body, and the top end of the ejector pin penetrates through the guide through hole and extends to the outside of the ejector pin shell. The elastic body can enable the top crystal needle to damp in the process of jacking up the chip, so that hard contact between the top crystal needle and the chip is avoided, protection of the chip is realized, and improvement of the yield of the chip is facilitated. In addition, the ejection position of the top crystal needle is limited through the guide through hole, so that the alignment contact between the top crystal needle and the chip is more accurate and stable. The space occupied by the whole structure is small, simple and practical.

Description

Chip separation head assembly and chip separation device

Technical Field

The utility model belongs to the technical field of semiconductor manufacturing, and particularly relates to a chip separation head assembly and a chip separation device.

Background

In die bonding, the die is typically separated from the adhesive tape by a vacuum chuck and then placed on a package, substrate, or another die to bond or attach it thereto. In the chip pick-up step, the chip is held on the vacuum chuck by vacuum suction, and can be lifted from the adhesive tape by means of the chip separating device.

However, the force of the head of the chip separating device during up-and-down movement and jacking up of the chip can not be adjusted at present, and the top of the crystal pushing needle is in hard contact with the chip, so that the chip is easy to be damaged.

Disclosure of Invention

The utility model solves the technical problem of providing a chip separation head assembly and a chip separation device so as to reduce damage to a chip.

In order to solve the above technical problems, the technical solution of the present utility model provides a chip separation head assembly, including: the thimble shell is provided with a storage cavity and a guide through hole, and the guide through hole is communicated with the storage cavity; the elastic body is filled in the storage containing cavity of the thimble shell; the ejector pin is wrapped and fixed by the elastic body, and the top end of the ejector pin penetrates through the guide through hole and extends to the outside of the ejector pin shell.

Optionally, the thimble housing includes: a needle tube; the guide cover is detachably connected with the thimble tube, the storage containing cavity is formed after the guide cover is detachably connected with the thimble tube, and the guide through hole is formed in the guide cover.

Optionally, the detachably connected structure includes: one or more of a threaded connection structure, a buckle connection structure, a mortise and tenon connection structure and a nested connection structure.

Optionally, the elastomer includes: a silicone rubber elastomer.

Optionally, the method further comprises: the crystal pushing needle fixing piece is fixedly connected with the bottom end of the crystal pushing needle, and the elastic body wraps and fixes the crystal pushing needle fixing piece.

Optionally, the top wafer needle fixing piece includes: a fixing portion having a first fixing through hole; the step portion, the step portion with fixed portion is connected, the step portion has the fixed through-hole of second, first fixed through-hole with the fixed through-hole intercommunication of second, the top brilliant needle runs through first fixed through-hole with the fixed through-hole of second and respectively with fixed portion with step portion fixed connection.

Optionally, the fixing portion and the step portion are of an integral structure.

Optionally, the axis of the guide through hole coincides with the axis of the top wafer needle.

Optionally, a connecting hole is formed in the top needle tube, and the connecting hole is close to the bottom end of the top crystal needle.

Correspondingly, the utility model further provides a chip separation device, which comprises the chip separation head assembly.

Compared with the prior art, the technical scheme of the embodiment of the utility model has the following beneficial effects:

in the chip separation head assembly provided by the technical scheme of the utility model, through the elastomer filled in the storage containing cavity of the thimble shell, when the top crystal needle is in the process of jacking up the chip, the top crystal needle is subjected to downward acting force under the interaction of force, at the moment, the elastomer can meet the downward movement of the top crystal needle through self deformation, so that the top crystal needle is damped to absorb the impact force between the top crystal needle and the chip, and further, the hard contact between the top crystal needle and the chip is avoided, so that the damage to the chip is reduced. In addition, the ejection position of the top crystal needle is limited through the guide through hole, so that the alignment contact between the top crystal needle and the chip is more accurate and stable. The space occupied by the whole structure is small, simple and practical.

Further, the top wafer needle fixing piece comprises: a fixing portion having a first fixing through hole; the step portion, the step portion with fixed portion is connected, the step portion has the fixed through-hole of second, first fixed through-hole with the fixed through-hole intercommunication of second, the top brilliant needle runs through first fixed through-hole with the fixed through-hole of second and respectively with fixed portion with step portion fixed connection. The fixing part is used for mainly fixing the top crystal needle, and the step part is used for improving the combination of the top crystal needle fixing piece and the elastic body, so that the top crystal needle is guaranteed to have better stability in the process of jacking up the chip.

Further, the axis of the guide through hole coincides with the axis of the top crystal needle, so that the alignment deviation between the top crystal needle and the guide through hole is prevented, the top crystal needle is forced to be coaxially limited in the guide through hole under the action of external force, and the top crystal needle is further damaged.

Drawings

FIG. 1 is a schematic perspective view of a chip detachment head assembly in accordance with an embodiment of the present utility model;

FIG. 2 is a schematic cross-sectional view taken along line A-A in FIG. 1;

FIG. 3 is a schematic perspective view of a chip separating device according to an embodiment of the present utility model;

fig. 4 is a schematic cross-sectional view taken along line B-B in fig. 3.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the utility model is further described in detail below with reference to the accompanying drawings and embodiments.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", or a third "may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise. The meaning of "a number" is one or more than one unless specifically defined otherwise.

Unless defined otherwise, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. In the description of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings, are merely for convenience in describing the present disclosure and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present disclosure.

Embodiments of the present disclosure are described in detail below, examples of which are illustrated in the accompanying drawings. In the drawings, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions. The embodiments described below by referring to the drawings are exemplary only for explaining the present disclosure and are not to be construed as limiting the present disclosure.

FIG. 1 is a schematic perspective view of a chip detachment head assembly in accordance with an embodiment of the present utility model; fig. 2 is a schematic cross-sectional view taken along line A-A in fig. 1.

Referring to fig. 1 and 2, a chip detachment head assembly 10 includes: the thimble shell 100 is provided with a storage cavity 101 and a guide through hole 102, and the guide through hole 102 is communicated with the storage cavity 101; an elastic body 103 filled in the storage cavity 101 of the thimble housing 100; the ejector pin 104 is wrapped and fixed by the elastic body 103, and the top end of the ejector pin 104 penetrates through the guide through hole 102 and extends to the outside of the ejector pin housing 100.

In this embodiment, through the elastomer 103 filled in the storage cavity 101 of the ejector pin housing 100, when the ejector pin 104 is in the process of ejecting the chip, the ejector pin 104 is also subjected to a downward acting force under the interaction of forces, and at this time, the elastomer 103 can meet the downward movement of the ejector pin 104 through self elastic deformation, so as to provide an elastic space for the retraction of the ejector pin 104, thereby avoiding hard contact between the ejector pin 104 and the chip, and reducing damage to the chip. In addition, the ejection position of the top wafer needle 103 is limited by the guide through hole 102, so that the alignment contact between the top wafer needle 103 and the chip is more accurate and stable. The space occupied by the whole structure is small, simple and practical.

With continued reference to fig. 1 and 2, in this embodiment, the ejector pin housing 100 includes: thimble 1001; the guide cover 1002, the guide cover 1002 with thimble tube 1001 can dismantle the connection, just the guide cover 1002 with thimble tube 1001 passes through can dismantle the connection after constitutes the storage appearance chamber 101, the direction through-hole 102 open and locate in the guide cover 1002.

In this embodiment, the thimble tube 1001 and the guide cover 1002 are detachably connected to facilitate installation, maintenance, or replacement of components of the overall structure.

In this embodiment, the detachable connection structure adopts a threaded connection structure; in other embodiments, the detachably connected structure may further include: one or more of a snap connection structure, a mortise and tenon connection structure and a nested connection structure.

In this embodiment, the elastomer 103 is a silicone rubber elastomer, and the silicone rubber material is filled into the storage cavity 101 of the thimble housing 100 by injection molding, and is cured and elastic after being left to stand at room temperature for about 10 hours, so as to form the elastomer 103.

With continued reference to fig. 2, in this embodiment, the method further includes: the crystal pushing needle fixing piece 105, the crystal pushing needle fixing piece 105 is fixedly connected with the bottom end of the crystal pushing needle 104, and the elastic body 103 wraps and fixes the crystal pushing needle fixing piece 105.

With continued reference to fig. 2, in this embodiment, the top needle holder 105 includes: a fixing portion 1051, the fixing portion 1051 having a first fixing through hole 1052; the step portion 1053, the step portion 1053 is connected with the fixing portion 1051, the step portion 1053 has a second fixing through hole 1054, the first fixing through hole 1052 is communicated with the second fixing through hole 1054, and the top-die needle 104 penetrates through the first fixing through hole 1052 and the second fixing through hole 1054 and is fixedly connected with the fixing portion 1051 and the step portion 1053 respectively. The fixing portion 1051 is mainly used for fixing the top crystal needle 104, and the step portion 1053 is used for improving the combination of the fixing piece of the top crystal needle 104 and the elastic body 103, so that the top crystal needle 104 is guaranteed to have better stability in the process of jacking up the chip.

In this embodiment, the fixing portion 1051 and the step portion 1053 are of an integral structure; in other embodiments, the fixing portion and the step portion may be a separate type connection structure.

With continued reference to fig. 2, in the present embodiment, the axis S1 of the guide through hole 102 coincides with the axis S2 of the top needle 104, so as to prevent the top needle 104 from having an alignment deviation with the guide through hole 102, and force the top needle 104 to be coaxially limited in the guide through hole 102 under the action of external force, thereby causing damage to the top needle 104.

With continued reference to fig. 2, in this embodiment, a connection hole 1003 is formed in the ejector tube 1001, and the connection hole 1003 is close to the bottom end of the ejector pin 104, so as to facilitate detachable connection of the die attach head assembly 10 with a power assembly in the die attach device.

FIG. 3 is a schematic perspective view of a chip separating device according to an embodiment of the present utility model; fig. 4 is a schematic cross-sectional view taken along line B-B in fig. 3.

Correspondingly, the embodiment of the utility model further provides a chip separating device, please refer to fig. 3 and 4, and refer to fig. 1 and 2 in combination, including the chip separating head assembly 10 provided in any of the above embodiments. The elastic body 103 can enable the top crystal needle 104 to retract in the process of jacking up the chip, so that hard contact between the top crystal needle 104 and the chip is avoided, protection of the chip is realized, and improvement of the yield of the chip is facilitated.

Although the present utility model is disclosed above, the present utility model is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the utility model, and the scope of the utility model should be assessed accordingly to that of the appended claims.

Claims (10)

1. A chip detachment head assembly, comprising:

the thimble shell is provided with a storage cavity and a guide through hole, and the guide through hole is communicated with the storage cavity;

the elastic body is filled in the storage containing cavity of the thimble shell;

the ejector pin is wrapped and fixed by the elastic body, and the top end of the ejector pin penetrates through the guide through hole and extends to the outside of the ejector pin shell.

2. The die attach head assembly of claim 1, wherein said ejector pin housing comprises: a needle tube;

the guide cover is detachably connected with the thimble tube, the storage containing cavity is formed after the guide cover is detachably connected with the thimble tube, and the guide through hole is formed in the guide cover.

3. The chip detachment head assembly of claim 2, wherein the detachably connected structure comprises: one or more of a threaded connection structure, a buckle connection structure, a mortise and tenon connection structure and a nested connection structure.

4. The chip detachment head assembly of claim 1, wherein the elastomer comprises: a silicone rubber elastomer.

5. The chip detachment head assembly of claim 1, further comprising: the crystal pushing needle fixing piece is fixedly connected with the bottom end of the crystal pushing needle, and the elastic body wraps and fixes the crystal pushing needle fixing piece.

6. The die attach head assembly of claim 5, wherein the top die needle mount comprises:

a fixing portion having a first fixing through hole;

the step portion, the step portion with fixed portion is connected, the step portion has the fixed through-hole of second, first fixed through-hole with the fixed through-hole intercommunication of second, the top brilliant needle runs through first fixed through-hole with the fixed through-hole of second and respectively with fixed portion with step portion fixed connection.

7. The chip separation head assembly of claim 6, wherein the securing portion and the step portion are of unitary construction.

8. The die attach head assembly of claim 1, wherein an axis of the guide through hole coincides with an axis of the top die needle.

9. The die attach head assembly of claim 2, wherein said ejector pin tube has a connecting hole formed therein, said connecting hole being proximate to a bottom end of said ejector pin.

10. A chip separating apparatus, comprising: a chip detachment head assembly as claimed in any one of claims 1 to 9.