CN220086018U - Semiconductor packaging element testing device - Google Patents
Semiconductor packaging element testing device Download PDFInfo
- Publication number
- CN220086018U CN220086018U CN202321475455.XU CN202321475455U CN220086018U CN 220086018 U CN220086018 U CN 220086018U CN 202321475455 U CN202321475455 U CN 202321475455U CN 220086018 U CN220086018 U CN 220086018U
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- clamping
- fixedly arranged
- packaging element
- testing
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- 238000012360 testing method Methods 0.000 title claims abstract description 53
- 239000004065 semiconductor Substances 0.000 title claims abstract description 49
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 40
- 238000001514 detection method Methods 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 244000309464 bull Species 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model discloses a semiconductor packaging element testing device, which comprises a main body frame, wherein a rotary table is rotatably arranged at the central position of the upper end of the main body frame, a supporting seat plate is fixedly arranged in the main body frame, a driving motor is fixedly arranged on the supporting seat plate, the output end of the driving motor is fixedly connected to the central position of the lower end of the rotary table, a plurality of groups of clamping components distributed in an annular array are fixedly arranged on the rotary table, and the clamping components are used for clamping packaging element testing; a supporting frame is fixedly arranged on one side of the upper end of the main body frame, and a feeding part is arranged on the supporting frame; according to the utility model, the clamping baffle is driven to move towards the semiconductor packaging element by the sliding clamping slide block, and the semiconductor packaging element is clamped by the plurality of clamping baffles, so that the semiconductor packaging element is ensured to be stable during testing.
Description
Technical Field
The utility model relates to the technical field of package element testing, in particular to a semiconductor package element testing device.
Background
The semiconductor is a substance with conductivity between the insulator and the conductor, the conductivity is easy to control, the semiconductor is very important from the viewpoint of technology or economic development, the core unit of many electronic products such as computers, mobile phones and digital recorders processes information by utilizing the conductivity change of the semiconductor, the common semiconductor material is silicon, germanium, gallium arsenide and the like, the silicon is one of various semiconductor materials which has the most influence on commercial application, and the semiconductor packaging refers to the process of processing a wafer which passes the test to obtain an independent chip according to the product model and the functional requirement.
The utility model discloses a testing arrangement based on super220 semiconductor packaging element, includes the box, the bottom of box inner chamber is through bolt fixedly connected with step motor, step motor's output shaft passes through shaft coupling fixedly connected with bull stick, the top of bull stick passes through bolt fixedly connected with revolving stage, the top fixedly connected with testing mechanism of revolving stage, fixed mount and frame have been welded respectively at the top of box, the bottom of fixed mount passes through bolt fixedly connected with feed mechanism, the top fixed mounting of frame has the controller, testing mechanism includes the mounting panel, the top of mounting panel is fixed mounting respectively has pilot lamp and test seat, but this equipment has following not enough, and the device only can test the semiconductor of one kind model, can not test the semiconductor element of variation in size, has the limitation, leads to the practicality of equipment to reduce.
Disclosure of Invention
The utility model aims to provide a semiconductor packaging element testing device which solves the technical problems that the prior art cannot test semiconductor elements with different sizes, has limitation and reduces the practicability of equipment.
The aim of the utility model can be achieved by the following technical scheme:
the semiconductor packaging element testing device comprises a main body frame, wherein a rotary table is rotatably arranged at the central position of the upper end of the main body frame, a supporting seat plate is fixedly arranged in the main body frame, a driving motor is fixedly arranged on the supporting seat plate, the output end of the driving motor is fixedly connected to the central position of the lower end of the rotary table, clamping components distributed in a multi-component annular array are fixedly arranged on the rotary table, and the clamping components are used for clamping packaging element testing;
a supporting frame is fixedly arranged on one side of the upper end of the main body frame, and a feeding part is arranged on the supporting frame;
the other side of main part frame upper end is fixed and is provided with the detection cylinder, the output fixed mounting of detection cylinder has the test bedplate, test bedplate lower extreme fixed mounting has the test box, test box lower extreme is provided with the test lens.
As a further scheme of the utility model: the feeding component comprises a U-shaped support, two groups of screw rod sliding blocks are arranged on the U-shaped support in a sliding mode, a clamping cylinder is fixedly arranged at the lower end of the screw rod sliding blocks, a double-head cylinder is fixedly arranged at the output end of the clamping cylinder, and clamping plates are fixedly connected to the two output ends of the double-head cylinder.
As a further scheme of the utility model: a threaded screw rod is rotatably arranged on the U-shaped bracket, and two groups of screw rod sliding blocks are in threaded connection with the threaded screw rod; and a servo motor for driving the threaded screw rod to rotate is fixedly arranged on the U-shaped bracket.
As a further scheme of the utility model: the clamping component comprises a fixed sleeve seat fixedly arranged on the rotary table, a guide seat is fixedly arranged at the upper end of the fixed sleeve seat, a plurality of guide sliding grooves are formed in the guide seat, a clamping sliding block is arranged on the guide sliding grooves in a sliding mode, and a clamping baffle is fixedly connected to one end, away from the guide seat, of the clamping sliding block.
As a further scheme of the utility model: the guide seat is provided with a connecting sleeve in a penetrating manner, the connecting sleeve is rotatably arranged on the guide seat, the upper part of the connecting sleeve is fixedly provided with a driving frame, the driving frame is rotatably provided with a driving connecting plate, and the driving connecting plate is rotatably connected to the clamping sliding block;
the lower part of the connecting sleeve is fixedly provided with a driven gear; the fixed sleeve seat is internally and fixedly provided with a fixed plate, a clamping motor is fixedly arranged on the fixed plate, and a driving gear meshed with the driven gear is fixedly arranged on an output shaft of the clamping motor.
As a further scheme of the utility model: the lifting device is characterized in that a lifting air cylinder is fixedly arranged on the fixed plate, the output end of the lifting air cylinder is fixedly connected with a lifting rod, the lifting rod is connected to the connecting sleeve in a sliding and penetrating mode, and the upper end of the lifting rod is fixedly connected with the lifting plate.
The utility model has the beneficial effects that:
(1) The clamping baffle is driven to move towards the semiconductor packaging element by the sliding clamping slide block, and the semiconductor packaging element is clamped by the clamping baffles, so that the semiconductor packaging element is ensured to be stable during testing.
(2) The screw thread screw rod is driven to rotate by the servo motor, and the screw rod transmission principle is utilized to drive the two groups of screw rod sliding blocks to slide reciprocally along the U-shaped bracket, so that the feeding and discharging conveying of the semiconductor packaging element are realized.
Drawings
The utility model is further described below with reference to the accompanying drawings.
FIG. 1 is a schematic view of the overall structure of the present utility model;
FIG. 2 is a schematic cross-sectional view of a clamping member of the present utility model;
FIG. 3 is a schematic top view of the clamping member of the present utility model;
fig. 4 is a schematic structural view of the feeding member of the present utility model.
In the figure: 1. a main body frame; 2. a support seat plate; 3. a driving motor; 4. a rotary table; 5. a clamping member; 51. fixing the sleeve seat; 52. a fixing plate; 53. jacking the air cylinder; 54. a lifting rod; 55. a jacking plate; 56. a guide seat; 561. a guide chute; 57. a connection sleeve; 58. a driven gear; 59. clamping the motor; 510. a drive gear; 511. a drive rack; 512. clamping the sliding block; 513. driving the connecting plate; 514. clamping the baffle; 6. a support frame; 7. a feeding part; 71. a U-shaped bracket; 72. a servo motor; 73. a threaded screw rod; 74. a screw rod sliding block; 75. a clamping cylinder; 76. a double-headed cylinder; 77. a clamping plate; 8. detecting a cylinder; 9. a test seat board; 10. a test box; 11. and testing the lens.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, the utility model is a semiconductor packaging element testing device, which comprises a main body frame 1, a rotary table 4 is rotatably arranged at the central position of the upper end of the main body frame 1, a supporting seat board 2 is fixedly arranged in the main body frame 1, a driving motor 3 is fixedly arranged on the supporting seat board 2, the output end of the driving motor 3 is fixedly connected at the central position of the lower end of the rotary table 4, and the semiconductor packaging element testing device is characterized in that a plurality of groups of clamping components 5 distributed in an annular array are fixedly arranged on the rotary table 4, and the clamping components 5 are used for clamping packaging element testing;
a supporting frame 6 is fixedly arranged on one side of the upper end of the main body frame 1, and a feeding part 7 is arranged on the supporting frame 6; the opposite side of main part frame 1 upper end is fixed and is provided with detection cylinder 8, and the output fixed mounting of detection cylinder 8 has test bedplate 9, and test bedplate 9 lower extreme fixed mounting has test box 10, and test box 10 lower extreme is provided with test lens 11.
Referring to fig. 2 and 3, the clamping member 5 includes a fixed sleeve seat 51 fixedly disposed on the rotary table 4, a guide seat 56 is fixedly disposed at an upper end of the fixed sleeve seat 51, a plurality of guide sliding grooves 561 are disposed on the guide seat 56, the plurality of guide sliding grooves 561 are distributed in a ring-shaped array, a clamping sliding block 512 is slidably disposed on the guide sliding groove 561, and a clamping baffle 514 is fixedly connected to an end, far away from the guide seat 56, of the clamping sliding block 512.
After the semiconductor packaging element is placed on the guide seat 56, the clamping baffle plates 514 are driven to move towards the semiconductor packaging element by sliding the clamping slide blocks 512, and the semiconductor packaging element is clamped by the clamping baffle plates 514, so that the semiconductor packaging element is ensured to be stable during testing.
A connecting sleeve 57 is arranged on the guide seat 56 in a penetrating manner, the connecting sleeve 57 is rotatably arranged on the guide seat 56, a driving frame 511 is fixedly arranged on the upper part of the connecting sleeve 57, a driving connecting plate 513 is rotatably arranged on the driving frame 511, and the driving connecting plate 513 is rotatably connected to the clamping sliding block 512;
a driven gear 58 is fixedly arranged at the lower part of the connecting sleeve 57; the fixed sleeve seat 51 is internally and fixedly provided with a fixed plate 52, a clamping motor 59 is fixedly arranged on the fixed plate 52, and a driving gear 510 meshed and connected with the driven gear 58 is fixedly arranged on an output shaft of the clamping motor 59.
The driving gear 510 is driven to rotate by the clamping motor 59, the connecting sleeve 57 is driven to rotate by the meshing transmission of the driving gear 510 and the driven gear 58, the connecting sleeve 57 drives the driving frame 511 to rotate, and the clamping slide block 512 is driven to slide along the guide slide groove 561 by the driving connecting plate 513, so that the clamping baffle 514 is driven to move to clamp the semiconductor packaging element.
The fixed plate 52 is fixedly provided with a jacking air cylinder 53, the output end of the jacking air cylinder 53 is fixedly connected with a jacking rod 54, the jacking rod 54 is connected to a connecting sleeve 57 in a sliding and penetrating mode, and the upper end of the jacking rod 54 is fixedly connected with a jacking plate 55.
The lifting cylinder 53 drives the lifting rod 54 and the lifting plate 55 to move up and down, so that the semiconductor packaging element is supported conveniently, and meanwhile, the semiconductor packaging element is discharged conveniently.
Referring to fig. 1 and 4, the feeding component 7 includes a U-shaped bracket 71, two groups of screw sliders 74 are slidably disposed on the U-shaped bracket 71, a clamping cylinder 75 is fixedly disposed at the lower end of the screw sliders 74, a double-head cylinder 76 is fixedly disposed at the output end of the clamping cylinder 75, and clamping plates 77 are fixedly connected to both output ends of the double-head cylinder 76.
By arranging two groups of screw rod sliding blocks 74 and double-head air cylinders 76, one group is used for clamping the semiconductor packaging element to be tested, and the other group is used for clamping the semiconductor packaging element after the test on the clamping part 5, the material taking and feeding of the semiconductor packaging element are realized at the same time, and the testing efficiency of the semiconductor packaging element can be effectively improved.
Further, the two sets of double-head air cylinders 76 are distributed on the two sets of clamping air cylinders 75 in a mutually perpendicular manner, so that the expansion and contraction directions of the clamping plates 77 of the two double-head air cylinders 76 are different, and clamping interference can be effectively prevented.
A threaded screw rod 73 is rotatably arranged on the U-shaped bracket 71, and two groups of screw rod sliding blocks 74 are in threaded connection with the threaded screw rod 73; a servo motor 72 for driving the threaded screw 73 to rotate is fixedly arranged on the U-shaped bracket 71.
The servo motor 72 drives the threaded screw rod 73 to rotate, and the screw rod transmission principle is utilized to drive two groups of screw rod sliding blocks 74 to slide reciprocally along the U-shaped support 71, so that the feeding and discharging conveying of the semiconductor packaging element are realized.
The working principle of the utility model is as follows: the screw rod 73 is driven to rotate by the servo motor 72, the screw rod sliding blocks 74 are driven to slide reciprocally along the U-shaped support 71 by utilizing the screw rod transmission principle, the double-head air cylinder 76 is driven to move up and down by the clamping air cylinder 75, the two groups of clamping plates 77 are driven to move oppositely to clamp the semiconductor packaging element, the semiconductor packaging element is moved above the clamping part 5 by the screw rod sliding blocks 74, the semiconductor packaging element is placed into the clamping part 5, the driving gear 510 is driven to rotate by the clamping motor 59, the connecting sleeve 57 is driven to rotate by utilizing the meshing transmission of the driving gear 510 and the driven gear 58, the connecting sleeve 57 drives the driving frame 511 to rotate, the clamping sliding blocks 512 are driven to slide along the guide sliding grooves 561 by utilizing the driving connecting plates 513, the clamping baffle 514 is driven to move to clamp the semiconductor packaging element, then the rotating table 4 is driven to rotate by the driving motor 3, the semiconductor packaging element is driven to rotate below the testing box 10, and the semiconductor packaging element is tested by the testing box 10.
The foregoing describes one embodiment of the present utility model in detail, but the description is only a preferred embodiment of the present utility model and should not be construed as limiting the scope of the utility model. All equivalent changes and modifications within the scope of the present utility model are intended to be covered by the present utility model.
Claims (6)
1. The utility model provides a semiconductor packaging element testing arrangement, includes main body frame (1), main body frame (1) upper end central point puts and rotates and be provided with revolving stage (4), main body frame (1) inside is fixedly provided with supporting seat board (2), fixedly mounted has driving motor (3) on supporting seat board (2), the output fixed connection of driving motor (3) is in the lower extreme central point put of revolving stage (4), its characterized in that, fixedly on revolving stage (4) be provided with multiunit form annular array distributed clamping part (5), clamping part (5) are used for pressing from both sides the packaging element test;
a supporting frame (6) is fixedly arranged on one side of the upper end of the main body frame (1), and a feeding component (7) is arranged on the supporting frame (6);
the testing device is characterized in that a detection cylinder (8) is fixedly arranged on the other side of the upper end of the main body frame (1), a testing seat board (9) is fixedly arranged at the output end of the detection cylinder (8), a testing box body (10) is fixedly arranged at the lower end of the testing seat board (9), and a testing lens (11) is arranged at the lower end of the testing box body (10).
2. The semiconductor packaging element testing device according to claim 1, wherein the feeding component (7) comprises a U-shaped bracket (71), two groups of screw rod sliding blocks (74) are slidably arranged on the U-shaped bracket (71), a clamping cylinder (75) is fixedly arranged at the lower end of the screw rod sliding blocks (74), a double-head cylinder (76) is fixedly arranged at the output end of the clamping cylinder (75), and clamping plates (77) are fixedly connected to the two output ends of the double-head cylinder (76).
3. A semiconductor package component testing apparatus according to claim 2, wherein a screw thread screw (73) is rotatably mounted on the U-shaped bracket (71), and two sets of screw thread sliders (74) are screwed on the screw thread screw (73); a servo motor (72) for driving the threaded screw rod (73) to rotate is fixedly arranged on the U-shaped bracket (71).
4. The semiconductor package component testing apparatus according to claim 1, wherein the clamping member (5) comprises a fixed sleeve seat (51) fixedly arranged on the rotary table (4), a guide seat (56) is fixedly arranged at the upper end of the fixed sleeve seat (51), a plurality of guide sliding grooves (561) are arranged on the guide seat (56), a clamping slide block (512) is slidably arranged on the guide sliding grooves (561), and one end, far away from the guide seat (56), of the clamping slide block (512) is fixedly connected with a clamping baffle (514).
5. The semiconductor package component testing apparatus according to claim 4, wherein a connection sleeve (57) is provided on the guide holder (56) in a penetrating manner, the connection sleeve (57) is rotatably mounted on the guide holder (56), a driving frame (511) is fixedly provided on an upper portion of the connection sleeve (57), a driving connection plate (513) is rotatably provided on the driving frame (511), and the driving connection plate (513) is rotatably connected to the clamping slider (512);
a driven gear (58) is fixedly arranged at the lower part of the connecting sleeve (57); the fixed sleeve seat (51) is internally and fixedly provided with a fixed plate (52), the fixed plate (52) is fixedly provided with a clamping motor (59), and an output shaft of the clamping motor (59) is fixedly provided with a driving gear (510) which is meshed and connected with a driven gear (58).
6. The semiconductor package testing apparatus according to claim 5, wherein a jacking cylinder (53) is fixedly installed on the fixing plate (52), an output end of the jacking cylinder (53) is fixedly connected with a jacking rod (54), the jacking rod (54) is slidably and penetratingly connected to the connecting sleeve (57), and an upper end of the jacking rod (54) is fixedly connected with a jacking plate (55).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321475455.XU CN220086018U (en) | 2023-06-08 | 2023-06-08 | Semiconductor packaging element testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321475455.XU CN220086018U (en) | 2023-06-08 | 2023-06-08 | Semiconductor packaging element testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220086018U true CN220086018U (en) | 2023-11-24 |
Family
ID=88828864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321475455.XU Active CN220086018U (en) | 2023-06-08 | 2023-06-08 | Semiconductor packaging element testing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220086018U (en) |
-
2023
- 2023-06-08 CN CN202321475455.XU patent/CN220086018U/en active Active
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