CN220062888U - Detection device for surface smoothness of wafer chuck - Google Patents
Detection device for surface smoothness of wafer chuck Download PDFInfo
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- CN220062888U CN220062888U CN202321524486.XU CN202321524486U CN220062888U CN 220062888 U CN220062888 U CN 220062888U CN 202321524486 U CN202321524486 U CN 202321524486U CN 220062888 U CN220062888 U CN 220062888U
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- wafer chuck
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- upright post
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- 238000001514 detection method Methods 0.000 title claims abstract description 39
- 230000001681 protective effect Effects 0.000 claims abstract description 33
- 238000007789 sealing Methods 0.000 claims abstract description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 22
- 229910052757 nitrogen Inorganic materials 0.000 claims description 11
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000004140 cleaning Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 230000003749 cleanliness Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a device for detecting the surface smoothness of a wafer chuck, which comprises a light source part, a supporting part, a connecting upright post and a protective cover. The light source part is arranged at the top of the connecting upright post and comprises a light source emitter and a light source receiver; the support part is arranged at the bottom of the light source part and is fixedly connected with the connecting upright post; the supporting part comprises a supporting table and a sample table coaxially arranged on the top surface of the supporting table, and the sample table is used for placing a wafer chuck; the connecting upright post is vertically arranged and used for connecting the light source part and the supporting table; the bottom of the connecting upright post is provided with a supporting base which is used for supporting the detection device; the protective cover is covered outside the detection device, and a sealing cavity is formed in the protective cover. According to the utility model, the light source emitter emits the incident light wave, the surface smoothness of the wafer chuck is determined according to the light wave information received by the light source receiver, and the problems of microscopic burrs on the surface of the wafer chuck and the like can be timely identified.
Description
Technical Field
The utility model relates to the technical field of chip manufacturing, in particular to a device for detecting the surface smoothness of a wafer chuck.
Background
The wafer back cleaning machine is used for cleaning metal pollutants on the back of a wafer, and in the cleaning process, the front of the wafer faces downwards, and at the moment, the front of the wafer is easy to cause pollution or scratch after being contacted with a wafer chuck. Therefore, the surface smoothness of the wafer chuck is required to be high in the cleaning process, so that scratches and the like on the surface of the wafer are avoided in the cleaning process. Therefore, it is necessary to detect the surface smoothness of the wafer chuck before cleaning, and clean the wafer after the wafer chuck satisfies the smoothness requirement.
In the prior art, the smoothness of the wafer chuck is generally judged by naked eye observation before cleaning, and the method has larger error and is difficult to identify microscopic burrs and the like in time.
In view of the foregoing, there is a need to provide an improved solution to the above-mentioned deficiencies of the prior art.
Disclosure of Invention
The embodiment of the utility model aims to provide a device for detecting the surface smoothness of a wafer chuck, which can timely identify the problems of microscopic burrs and the like on the surface of the wafer chuck.
The utility model particularly provides a device for detecting the surface smoothness of a wafer chuck, which comprises a light source part, a supporting part, a connecting upright post and a protective cover. The light source part is arranged at the top of the connecting upright post and comprises a light source emitter and a light source receiver; the supporting part is arranged below the light source part and is fixedly connected with the connecting upright post; the supporting part comprises a supporting table and a sample table coaxially arranged on the top surface of the supporting table, and the sample table is used for placing a wafer chuck; the connecting upright post is vertically arranged and is used for connecting the light source part and the supporting table; the protective cover is covered outside the detection device, and a sealing cavity is formed in the protective cover.
In one embodiment, a support base is disposed at the bottom of the connecting column below the support portion, and the support base is used for supporting the detection device.
In an implementation mode, a plurality of limit posts are uniformly distributed on the periphery of the sample table.
In one embodiment, the limiting post may extend and retract along an axial direction of the sample stage, and the limiting post extends upward and is used to limit a circumferential displacement of the wafer chuck.
In one embodiment of the sample stage, the support stage is connected with the sample stage through a rotating shaft, one end of the rotating shaft is rotationally connected with the support stage, the other end of the rotating shaft is fixedly connected with the sample stage, and the rotating angle of the sample stage is controlled by controlling the rotation of the rotating shaft.
In one implementation mode, the rotating shaft is a hollow shaft, and an air inlet pipe and an air outlet pipe are arranged in the rotating shaft; one end of the air inlet pipe is communicated with high-purity nitrogen, and the other end of the air inlet pipe is flush with the upper surface of the sample table; one end of the air outlet pipe is connected with the air exhaust equipment, and the other end of the air outlet pipe is flush with the upper surface of the sample table.
In another embodiment of the sample stage, the support stage is fixedly connected to the sample stage; the top of the connecting upright post extends out of the light source supporting seat, the light source part is rotationally connected with the free end of the light source supporting seat, and the rotation angle of the light source part is controlled through a second motor.
In one embodiment, the protective cover is a cover body with an opening at the side surface, a door plate is arranged at the side surface of the opening of the protective cover, and a closed cavity is formed between the door plate and the protective cover when the door plate is closed.
In one embodiment, the light source part includes a plurality of groups of light source emitters and light source receivers, and the light source emitters and the light source receivers are arranged in an array.
Compared with the prior art, the utility model has the beneficial effects that:
according to the technical scheme, the light source emitter emits the incident light wave, the surface smoothness of the wafer chuck is determined according to the light wave information received by the light source receiver, and the problems of microscopic burrs and the like on the surface of the wafer chuck can be timely identified. According to the utility model, through the arrangement of the protective cover, the light source detection is performed in the sealed cavity, so that the interference of external environment is avoided, and the detection accuracy is ensured. The wafer chuck is subjected to smoothness detection at a plurality of angles by controlling the rotation angle between the sample table and the light source part, so that the detection accuracy is improved. And high-purity nitrogen is introduced into the protective cover through the air inlet pipe to blow the wafer chuck, so that adhered particle impurities and the like on the surface of the wafer chuck are removed, and the surface cleanliness of the wafer chuck is maintained. And the original air in the protective cover is discharged through the air outlet pipe, and after the air in the protective cover is replaced by high-purity nitrogen, the smoothness is tested, so that the detection accuracy is improved. The incident angle of the light source emitter and the receiving angle of the light source receiver can be adjusted according to the requirements so as to meet different detection requirements.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic perspective view of a device for detecting the smoothness of a surface of a wafer chuck according to an embodiment of the present utility model;
FIG. 2 is a schematic view of a structure in which a sample stage is rotatably connected to a support stage in a wafer chuck surface smoothness detection apparatus according to an embodiment of the present utility model;
FIG. 3 is a schematic view of a structure in which a sample stage is fixedly connected to a support stage in a device for detecting surface smoothness of a wafer chuck according to an embodiment of the present utility model;
FIG. 4 is another perspective view of a wafer chuck surface smoothness detection apparatus according to an embodiment of the present utility model;
FIG. 5 is a schematic view of a structure of a protective cover in a device for detecting surface smoothness of a wafer chuck according to an embodiment of the present utility model;
FIG. 6 is a schematic view of the structure of an air inlet pipe and an air outlet pipe in the device for detecting the surface smoothness of a wafer chuck according to the embodiment of the utility model;
fig. 7 is a schematic structural diagram of a wafer chuck in the apparatus for detecting surface smoothness of a wafer chuck according to an embodiment of the present utility model;
fig. 8 is a schematic view of a light source path of a first transmitter and a first receiver in the apparatus for detecting the surface smoothness of a wafer chuck according to an embodiment of the utility model.
Reference numerals illustrate:
1. connecting the upright posts; 2. a light source section; 3. a limit column; 4. a sample stage; 5. a support table; 6. a support base; 7. a light source support base; 8. a rotating shaft; 9. a protective cover; 10. an air inlet pipe; 11. an air outlet pipe; A. a first transmitter; B. a first receiver.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
According to a first aspect of the present utility model, referring to fig. 1 to 5, there is provided a wafer chuck surface smoothness detecting apparatus including a light source section 2, a supporting section, a connecting column 1, and a protective cover 9.
The light source part 2 includes a light source emitter and a light source receiver, and is provided at the top of the connection column 1. The support part is arranged at the bottom of the light source part 2 and is fixedly connected with the connecting upright post 1; the support part comprises a support table 5 and a sample table 4 coaxially arranged with the top surface of the support table 5, the sample table 4 being used for placing a wafer chuck. The connecting upright post 1 is used for connecting the light source part 2 and the supporting table 5, the bottom of the connecting upright post 1 is provided with a supporting base 6, and the supporting base 6 is used for supporting the detection device. The protection cover 9 is covered outside the detection device, and a sealing cavity is formed in the protection cover 9 so that the light source detection area is kept sealed, and interference of external environment is avoided.
According to the detection device for the surface smoothness of the wafer chuck, the light source emitter emits the incident light waves, the surface smoothness of the wafer chuck is determined according to the light wave information received by the light source receiver, and the problems of microscopic burrs on the surface of the wafer chuck and the like can be timely identified. According to the utility model, through the arrangement of the protective cover 9, the light source detection is performed in the sealed cavity, so that the interference of the external environment is avoided, and the detection accuracy is ensured.
In one embodiment, as shown in fig. 1 to 3, a plurality of stopper posts 3 are provided on the circumferential side of the sample stage 4, and the plurality of stopper posts 3 are uniformly arranged on the circumferential side of the sample stage 4. Through the setting of spacing post 3, carry out spacingly to the wafer chuck, make the wafer chuck keep stable, prevent that the wafer chuck from taking place to remove on sample platform 4 in the testing process, influence testing result.
It should be noted that, as shown in fig. 7, the periphery of the wafer chuck has a plurality of notches, and the positions of the plurality of limiting posts 3 are in one-to-one correspondence with the positions of the notches, so that the periphery of the wafer chuck is uniformly stressed on the premise of stably limiting the wafer chuck, and damage to the wafer chuck is avoided. And the spacing post 3 is established to cylindrically, through arc surface and breach contact, can further avoid spacing post 3 to cause the damage to the wafer chuck.
In one embodiment, the limiting post 3 may be extended and retracted along the axial direction of the sample stage 4, as shown in fig. 1, and the limiting post 3 is extended upward to limit the circumferential displacement of the wafer chuck. As shown in fig. 2, after the limit post 3 is contracted, the wafer chuck can be removed from the sample stage 4, thereby improving the convenience of operation.
In one embodiment of the sample stage 4, as shown in fig. 2, the support stage 5 is connected with the sample stage 4 through a rotating shaft 8, one end of the rotating shaft 8 is rotatably connected with the support stage 5, the other end of the rotating shaft 8 is fixedly connected with the sample stage 4, and the top surface of the rotating shaft 8 is flush with the upper surface of the sample stage 4. The rotation angle of the sample stage 4 is controlled by controlling the rotation of the rotation shaft 8.
Specifically, the rotation shaft 8 is controlled to rotate by the first motor, so that the sample table 4 can rotate at multiple angles, smoothness detection at multiple angles is completed on the wafer chuck, and detection accuracy is improved.
In one embodiment, as shown in fig. 6, the rotating shaft 8 is a hollow shaft, an air inlet pipe 10 and an air outlet pipe 11 are arranged in the rotating shaft 8, after the wafer chuck is placed in the sample stage 4, high-purity nitrogen is introduced into the protective cover 9 through the air inlet pipe 10 to blow the wafer chuck, so that adhered particle impurities and the like on the surface of the wafer chuck are removed, and the surface cleanliness of the wafer chuck is maintained. And the original air in the protective cover 9 is discharged through the air outlet pipe 11, and after the air in the protective cover 9 is replaced by high-purity nitrogen, the smoothness test is performed, so that the detection accuracy is improved.
Specifically, one end of the air inlet pipe 10 is communicated with high-purity nitrogen, and the other end of the air inlet pipe 10 is flush with the upper surface of the sample stage 4. One end of the air outlet pipe 11 is connected with air extraction equipment, and the other end of the air outlet pipe 11 is arranged flush with the upper surface of the sample table 4. After the high-purity nitrogen is introduced between the sample stage 4 and the wafer chuck through the air inlet pipe 10, the high-purity nitrogen is blown out through the through hole on the wafer chuck, and the whole protective cover 9 is filled. The air outlet pipe 11 is opened to extract and replace the original air in the protective cover 9.
In another embodiment of the sample stage 4, as shown in fig. 3, the support stage 5 is fixedly connected to the sample stage 4. The top of the connecting upright column 1 outwards extends out of the light source supporting seat 7, the light source part 2 is rotationally connected with the free end of the light source supporting seat 7, the rotation angle of the light source part 2 is controlled through the second motor, the smoothness detection of a plurality of angles is completed on the wafer chuck, and the detection accuracy is improved.
In one embodiment, as shown in fig. 4 and 5, the protecting cover 9 is a cover body with an open side, a door plate is arranged on the open side of the protecting cover 9, and a closed cavity is formed in the protecting cover 9 when the door plate is closed. The sample table is covered in the closed cavity through the protective cover, so that the sample table is placed in the closed cavity for operation, and the influence of the interference of the external environment on the detection accuracy is avoided.
In one embodiment, the light source section 2 includes a plurality of sets of light source emitters and light source receivers, each of which may be arranged in an array.
The projected length of the light source unit 2 is larger than the diameter of the sample stage 4 so that the light source unit 2 and the sample stage 4 can completely cover the surface of the wafer chuck after one rotation, and the smoothness of the entire surface of the wafer chuck is detected.
In this embodiment, the obtaining of the surface smoothness of the wafer chuck to be measured by the setting of the light source portion specifically includes the following:
as shown in fig. 8, the light source section includes a first emitter a and a first receiver B, the first emitter a being disposed corresponding to the first receiver B, and a height difference of the detection point is determined from a light source phase difference between the first emitter a and the first receiver B. The height difference of the detection points is determined according to the following formula:
wherein:
lambda is the wavelength of the incident light of the first emitter a;
beta is the incident angle of the light source, and is determined according to the incident angle of the first emitter A;
ΔΩ is a light source phase difference determined by the first transmitter a and the first receiver B;
h is the height difference at one inspection point of the wafer chuck surface.
And acquiring the height difference of a plurality of detection points on the surface of the wafer chuck through rotation of the light source part, and acquiring the actual map information of the wafer chuck according to the plurality of height differences. And comparing the actual pattern information with standard sample pattern information, and determining the information of the defects on the surface of the chuck, such as the degree of the defects, the specific positions of a plurality of defects and the like, according to the comparison result so as to further determine the smoothness of the surface of the wafer chuck.
It should be noted that, the obtaining of the standard sample map information at least includes the following contents: and taking a chuck which accords with the standard as a standard sample, acquiring the map information of the surface of the wafer chuck which accords with the standard through the detection device provided by the utility model, and taking the map information as the map information of the standard sample.
It should be further noted that, the specific principle of acquiring the map information of the surface of the wafer chuck based on the height difference of the plurality of detection points is the prior art, and there are various implementation manners, which are not described herein again.
In summary, according to the detection device for the surface smoothness of the wafer chuck provided by the utility model, the light source emitter emits the incident light wave, and the surface smoothness of the wafer chuck is determined according to the light wave information received by the light source receiver, so that the problems of microscopic burrs and the like on the surface of the wafer chuck can be timely identified. According to the utility model, through the arrangement of the protective cover, the light source detection is performed in the sealed cavity, so that the interference of external environment is avoided, and the detection accuracy is ensured. The wafer chuck is subjected to smoothness detection at a plurality of angles by controlling the rotation angle between the sample table and the light source part, so that the detection accuracy is improved. And high-purity nitrogen is introduced into the protective cover through the air inlet pipe to blow the wafer chuck, so that adhered particle impurities and the like on the surface of the wafer chuck are removed, and the surface cleanliness of the wafer chuck is maintained. And the original air in the protective cover is discharged through the air outlet pipe, and after the air in the protective cover is replaced by high-purity nitrogen, the smoothness is tested, so that the detection accuracy is improved. The incident angle of the light source emitter and the receiving angle of the light source receiver can be adjusted according to the requirements so as to meet different detection requirements.
The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (9)
1. The device for detecting the surface smoothness of the wafer chuck is characterized by comprising a light source part, a supporting part, a connecting upright post and a protective cover;
the light source part is arranged at the top of the connecting upright post and comprises a light source emitter and a light source receiver;
the supporting part is arranged below the light source part and is fixedly connected with the connecting upright post; the supporting part comprises a supporting table and a sample table coaxially arranged on the top surface of the supporting table, and the sample table is used for placing a wafer chuck;
the connecting upright post is vertically arranged and is used for connecting the light source part and the supporting table;
the protective cover is covered outside the detection device, and a sealing cavity is formed in the protective cover.
2. The apparatus according to claim 1, wherein a support base is disposed at a bottom of the connecting column below the support portion, and the support base is configured to support the detecting apparatus.
3. The device for detecting the surface smoothness of the wafer chuck according to claim 1, wherein a plurality of limit posts are uniformly arranged on the peripheral side of the sample stage.
4. The apparatus according to claim 3, wherein the limit posts are retractable along an axial direction of the sample stage, and the limit posts are extended upward to limit a circumferential displacement of the wafer chuck.
5. The apparatus according to claim 1, wherein the support table is connected to the sample table by a rotation shaft, one end of the rotation shaft is rotatably connected to the support table, the other end of the rotation shaft is fixedly connected to the sample table, and a rotation angle of the sample table is controlled by controlling the rotation of the rotation shaft.
6. The apparatus according to claim 5, wherein the spindle is a hollow spindle, and an air inlet pipe and an air outlet pipe are provided in the spindle; one end of the air inlet pipe is communicated with high-purity nitrogen, and the other end of the air inlet pipe is flush with the upper surface of the sample table; one end of the air outlet pipe is connected with the air exhaust equipment, and the other end of the air outlet pipe is flush with the upper surface of the sample table.
7. The apparatus according to claim 1, wherein the support table is fixedly connected to the sample table; the top of the connecting upright post extends out of the light source supporting seat, the light source part is rotationally connected with the free end of the light source supporting seat, and the rotation angle of the light source part is controlled through a second motor.
8. The apparatus according to claim 5 or 7, wherein the protective cover is a cover body with an open side, a door plate is disposed on the open side of the protective cover, and a closed cavity is formed between the door plate and the protective cover when the door plate is closed.
9. The apparatus according to claim 1, wherein the light source part comprises a plurality of sets of light source emitters and light source receivers, and the light source emitters and the light source receivers are arranged in an array.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321524486.XU CN220062888U (en) | 2023-06-14 | 2023-06-14 | Detection device for surface smoothness of wafer chuck |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321524486.XU CN220062888U (en) | 2023-06-14 | 2023-06-14 | Detection device for surface smoothness of wafer chuck |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220062888U true CN220062888U (en) | 2023-11-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321524486.XU Active CN220062888U (en) | 2023-06-14 | 2023-06-14 | Detection device for surface smoothness of wafer chuck |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220062888U (en) |
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2023
- 2023-06-14 CN CN202321524486.XU patent/CN220062888U/en active Active
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