CN220054461U - Wafer front protection film tearing device - Google Patents
Wafer front protection film tearing device Download PDFInfo
- Publication number
- CN220054461U CN220054461U CN202320777460.XU CN202320777460U CN220054461U CN 220054461 U CN220054461 U CN 220054461U CN 202320777460 U CN202320777460 U CN 202320777460U CN 220054461 U CN220054461 U CN 220054461U
- Authority
- CN
- China
- Prior art keywords
- film tearing
- adhesive tape
- servo motor
- wafer
- platform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002390 adhesive tape Substances 0.000 claims abstract description 26
- 230000007246 mechanism Effects 0.000 claims abstract description 26
- 239000004831 Hot glue Substances 0.000 claims abstract description 10
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 238000009434 installation Methods 0.000 claims abstract description 6
- 238000004804 winding Methods 0.000 claims description 8
- 230000001681 protective effect Effects 0.000 claims 6
- 239000012943 hotmelt Substances 0.000 abstract description 7
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 239000012528 membrane Substances 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 22
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a wafer front protection film tearing device which comprises a film tearing platform, wherein a servo installation frame is arranged on one side of the film tearing platform, a first servo motor is arranged on one side of the servo installation frame, a viscous tape mechanism which is movably connected with the first servo motor is arranged on the first servo motor, a second servo motor is arranged on one side of the viscous tape mechanism, a hot melt tape mechanism which is movably connected with the second servo motor is arranged on the second servo motor, and a wafer is placed on the end face of the film tearing platform. The utility model has the beneficial effects that: the dyestripping platform can bear the thinned wafer to have rotatory and rectilinear motion function, and the dyestripping platform supports 8 cun and 12 cun placer moreover, and hot melt adhesive tape peels off the structure, contains the heating hot melt head, and the adhesive tape clamping jaw, tear structure such as membrane gyro wheel, and the sticky tape peels off the structure and contains the dyestripping gyro wheel, compresses tightly the gyro wheel, elasticity gyro wheel, through compatible two kinds of sticky tapes, utilizes different performances, realizes that hot melt peels off front sticky tape and sticky tape peels off front sticky tape, reduces getting and puts the damaged risk of wafer.
Description
Technical Field
The utility model relates to the technical field of wafer film tearing devices, in particular to a wafer front protection film tearing device.
Background
After the existing wafer is ground, the front adhesive tape needs to be peeled off, in the prior art, the wafer is manually conveyed to a film tearing station to wait for film tearing work, the front adhesive tape of the wafer is peeled off and is prepared for subsequent operation, but in the existing film tearing station, one mode is to manually tear the wafer by using a film tearing jig, such as a roller with stronger viscosity, or manually tear the wafer by using a manual film, and both modes can cause certain damage to the surface of the wafer in the film tearing process, so that the product cost is increased.
Disclosure of Invention
The utility model aims to provide a wafer front protection film tearing device for solving the problems in the background technology.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a positive protection film tearing device of wafer, includes the dyestripping platform, dyestripping platform one side is equipped with servo mounting bracket, servo mounting bracket one side is equipped with first servo motor, be equipped with the sticky tape mechanism of movable connection with it on the first servo motor, sticky tape mechanism one side is equipped with the second servo motor, is equipped with the hot melt adhesive tape mechanism of movable connection with it on it, the wafer has been placed to the dyestripping platform terminal surface.
Further preferably, pen-shaped air cylinders are symmetrically arranged on the inner side of the servo installation frame, and the telescopic ends of the pen-shaped air cylinders are respectively provided with a film tearing roller connected with the pen-shaped air cylinders.
Further preferably, the hot melt adhesive tape mechanism comprises a first fixing frame, wherein the upper end of the fixing frame is provided with a heating adhesive tape and a plurality of groups of adhesive tape winding wheels arranged at the lower end of the fixing frame.
Further preferably, the adhesive tape mechanism comprises a second fixing frame, and a pressing roller, an elastic roller and a plurality of film winding wheels are sequentially arranged on the second fixing frame from top to bottom.
Further preferably, a rotating motor is arranged at the lower end of the film tearing platform.
Further preferably, a buffer mechanism connected between the first fixing frame and the second servo motor is provided, and the buffer mechanism comprises a buffer frame and a plurality of groups of buffer springs arranged in the buffer frame.
Further preferably, one end of the press-covering roller is provided with a rotating block movably connected with the top of the second fixing frame.
Advantageous effects
The wafer front protection film tearing device provided by the utility model has the advantages that the film tearing platform can bear thinned wafers and has the functions of rotation and linear motion, the film tearing platform supports the 8-inch and 12-inch placement device, the hot melt adhesive tape stripping structure comprises a heating hot melt head, adhesive tape clamping jaws, a film tearing roller and other structures, the adhesive tape stripping structure comprises the film tearing roller, a pressing roller and an elastic roller, and the hot melt stripping front adhesive tape and the adhesive tape are stripped by utilizing different performances through compatibility of two adhesive tapes, so that the damage risk of the wafers to be taken and placed is reduced.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is another angular schematic view of the overall structure of the present utility model.
Reference numerals
The film tearing device comprises a 1-film tearing platform, a 2-servo mounting frame, a 3-first servo motor, a 4-second servo motor, a 5-pen-shaped cylinder, a 6-film tearing roller, a 7-hot melt adhesive tape mechanism, an 8-adhesive tape mechanism, a 9-adhesive tape winding wheel, a 10-heating adhesive tape, a 11-laminating roller, a 12-elastic roller, a 13-film sticking winding wheel, a 14-wafer and a 15-rotating block.
Detailed Description
The following are specific embodiments of the present utility model and the technical solutions of the present utility model will be further described with reference to the accompanying drawings, but the present utility model is not limited to these embodiments.
Examples
As shown in fig. 1-2, a wafer front protection film tearing device comprises a film tearing platform 1, wherein one side of the film tearing platform 1 is provided with a servo installation frame 2, one side of the servo installation frame 2 is provided with a first servo motor 3, the first servo motor 3 is provided with a viscous tape mechanism 8 which is movably connected with the first servo motor, one side of the viscous tape mechanism 8 is provided with a second servo motor 4, a hot melt tape mechanism 7 which is movably connected with the second servo motor is arranged on the viscous tape mechanism 8, and a wafer 14 is placed on the end face of the film tearing platform 1.
In this embodiment, pen-shaped cylinder 5 is equipped with to servo mounting bracket 2 inboard symmetry, and its flexible end all is equipped with the dyestripping gyro wheel 6 that is connected with it, and hot melt adhesive tape mechanism 7 includes first mount, and the mount upper end is equipped with heating sticky tape 10, and sets up in multiunit sticky tape winding wheel 9 of its lower extreme, and sticky tape mechanism 8 includes the second mount, is equipped with from top to bottom in proper order on the second mount and covers gyro wheel 11, elasticity gyro wheel 12 and many pad pasting winding wheels 13, and dyestripping platform 1 lower extreme is equipped with the rotating electrical machines.
And a buffer mechanism connected between the first fixing frame and the second servo motor 4 is arranged, and the buffer mechanism comprises a buffer frame and a plurality of groups of buffer springs arranged in the buffer frame.
One end of the press covered roller 11 is provided with a rotating block 15 movably connected with the top of the second fixing frame.
The film tearing platform is used for bearing the thinned wafer and has the functions of rotation and linear motion, supports 8-inch and 12-inch placement devices, and comprises a hot melt adhesive tape stripping structure, a heating hot melt head, adhesive tape clamping jaws, a film tearing roller and other structures; the adhesive tape stripping structure comprises a film tearing roller, a pressing roller and an elastic roller, wherein the wafer tearing platform bears a wafer, and supports rotation angle adjustment, position movement and wafer heating. The hot melt adhesive tape structure supports the heating of the adhesive tape, is pressed on the adhesive tape which needs to be peeled off on the front surface of the wafer, and the peeling rollers are matched, so that the front surface film tearing is completed by the peeling clamping jaw. The adhesive tape film tearing structure supports the adhesive tape to be pressed on the adhesive tape which needs to be peeled off on the front surface, and the elastic roller is matched with the film tearing roller to move, so that the front surface film tearing is completed.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present utility model has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the summary of the present utility model within the scope of the present utility model.
Claims (7)
1. The utility model provides a wafer front protection film tears device which characterized in that: including dyestripping platform (1), dyestripping platform (1) one side is equipped with servo mounting bracket (2), servo mounting bracket (2) one side is equipped with first servo motor (3), be equipped with on first servo motor (3) with it remove adhesive tape mechanism (8) of being connected, adhesive tape mechanism (8) one side is equipped with second servo motor (4), is equipped with on it with it remove hot melt adhesive tape mechanism (7) of being connected, wafer (14) have been placed to dyestripping platform (1) terminal surface.
2. The wafer front-side protective film tearing apparatus according to claim 1, wherein: the inner side of the servo installation rack (2) is symmetrically provided with pen-shaped air cylinders (5), and the telescopic ends of the pen-shaped air cylinders are respectively provided with a film tearing roller (6) connected with the pen-shaped air cylinders.
3. The wafer front-side protective film tearing apparatus according to claim 1, wherein: the hot melt adhesive tape mechanism (7) comprises a first fixing frame, wherein the upper end of the fixing frame is provided with a heating adhesive tape (10) and a plurality of groups of adhesive tape winding wheels (9) arranged at the lower end of the fixing frame.
4. The wafer front-side protective film tearing apparatus according to claim 1, wherein: the adhesive tape mechanism (8) comprises a second fixing frame, and a pressing roller (11), an elastic roller (12) and a plurality of film-sticking winding wheels (13) are sequentially arranged on the second fixing frame from top to bottom.
5. The wafer front-side protective film tearing apparatus according to claim 1, wherein: and a rotating motor is arranged at the lower end of the film tearing platform (1).
6. The wafer front-side protective film tearing apparatus according to claim 3, wherein: the buffer mechanism is connected between the first fixing frame and the second servo motor (4), and comprises a buffer frame and a plurality of groups of buffer springs arranged in the buffer frame.
7. The wafer front-side protective film tearing apparatus according to claim 4, wherein: one end of the press-covering roller (11) is provided with a rotating block (15) movably connected with the top of the second fixing frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320777460.XU CN220054461U (en) | 2023-04-11 | 2023-04-11 | Wafer front protection film tearing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320777460.XU CN220054461U (en) | 2023-04-11 | 2023-04-11 | Wafer front protection film tearing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220054461U true CN220054461U (en) | 2023-11-21 |
Family
ID=88788247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320777460.XU Active CN220054461U (en) | 2023-04-11 | 2023-04-11 | Wafer front protection film tearing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220054461U (en) |
-
2023
- 2023-04-11 CN CN202320777460.XU patent/CN220054461U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |