CN220034658U - Wafer jig - Google Patents

Abstract

The utility model provides a wafer jig. When the wafer is clamped in the groove, the groove is configured to clamp part of the invalid area of the wafer, so that the side wall of the groove does not shade the effective area of the wafer, and the effective area of the wafer can be completely contacted with plating solution in the chemical plating process, thereby improving the problems of edge plating leakage and thin plating of the wafer. Meanwhile, the limiting structure capable of rotating around the side wall is arranged to limit the displacement of the wafer placed in the body in the first direction, so that the floating and fragmentation risks of the wafer are reduced.

Description

Wafer jig

Technical Field

The utility model relates to the technical field of wafer processing, in particular to a wafer jig.

Background

Electroless nickel palladium gold (Electroless nickel electroless palladium immersion gold, ENEPIG) technology is widely used in the field of semiconductor technology because of its excellent corrosion resistance, solderability, and high reliability wire bonding capability of the plating layer.

The wafer electroless plating is to form a nickel palladium gold metal deposition layer by contacting the metal on the wafer surface with the liquid medicine in the tank and performing chemical reaction. In the production process, wafers are placed in the jig, the jig is placed in the hanging rack, and the hanging rack is continuously immersed into the liquid medicine of the tank body for reaction for multiple times. Therefore, as a wet deposition process, the choice of the jig is particularly important. The existing wafer chemical plating tools are generally divided into a vertical clamping groove tool and a horizontal clamping groove tool. The wafer is placed horizontally in the flat-type clamping groove jig without the influence of gravity, so that the liquid medicine exchange is stable, the metal thickness is uniform, and the flat-type clamping groove jig is more and more widely applied in the field of chemical plating. However, for the double-sided electroless plating process, the flat-type clamping groove jig is obviously not applicable because the metal on the front and back surfaces of the wafer is required to be contacted with the liquid medicine in the groove and react. The wafer is placed on the chassis horizontally, the back surface of the wafer is attached to the chassis and cannot react with the liquid medicine, the wafer is subjected to a back surface thinning and coating process before being subjected to double-sided coating, and the thinner wafer is easy to float when immersed in the coating liquid, so that collision fragments are caused. Therefore, the vertical clamping groove with the wafer vertically placed becomes a preferable jig for the double-sided plating process. The front and back metal layers of the wafer in the vertical clamping groove jig can be fully contacted with the liquid medicine, and the contact area with the liquid level is small when the wafer is vertically immersed in the plating solution, so that the wafer is not easy to float.

However, the conventional vertical clamping groove jig is easy to attach to the wafer edge in the process of vertical movement of the hanging frame, so that the liquid medicine exchange reactivity is poor, and the problems of wafer edge plating leakage and thin plating are easy to occur. The larger the contact surface between the clamping groove and the edge of the wafer is, the more the number of the affected crystal grains is, so that the product yield is lower.

Disclosure of Invention

The technical problem that this disclosure mainly solves is to provide a wafer tool, solves among the prior art wafer edge and leaks and plates and the thin problem of plating.

In order to solve the technical problems, a first technical scheme adopted by the present disclosure is as follows: a wafer jig is provided, the wafer jig comprising:

the wafer limiting device comprises a body, a wafer and a wafer, wherein the body comprises a side wall, and a groove which is arranged along a first direction and used for limiting a wafer is formed in the inner wall of the side wall; the recess is configured to trap a portion of the inactive area of the wafer.

And the base is connected with the body and used for supporting the body.

The limiting structure is arranged at one end of the side wall, far away from the base; the limit structure is configured to rotate from an outer side of the sidewall to an inner side of the sidewall to limit displacement of the wafer placed within the body in the first direction; the first direction is the extending direction of the side wall to the base.

The beneficial effects of the embodiment of the disclosure are that: unlike the prior art, the disclosed embodiments provide a wafer jig, which includes a body, a base, and a limiting structure. The body comprises a side wall, and the inner wall of the side wall is provided with a groove which is arranged along a first direction and used for limiting a wafer; the groove is configured to clamp a part of the invalid region of the wafer; the base is connected with the body and used for supporting the body; the limiting structure is arranged at one end of the side wall far away from the base; the limiting structure is configured to rotate from the outer side of the side wall to the inner side of the side wall so as to limit the displacement of the wafer placed in the body in a first direction; the first direction is the extending direction of the side wall to the base. When the wafer is clamped in the groove, the groove is configured to clamp part of the invalid area of the wafer, so that the side wall of the groove does not shade the effective area of the wafer, and the effective area of the wafer can be completely contacted with plating solution in the chemical plating process, thereby improving the problems of edge plating leakage and thin plating of the wafer. Meanwhile, the limiting structure capable of rotating around the side wall is arranged to limit the displacement of the wafer placed in the body in the first direction, so that the floating and fragmentation risks of the wafer are reduced.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without any inventive effort for a person skilled in the art.

FIG. 1 is a schematic perspective view of a wafer fixture and an embodiment of a wafer with a limiting structure outside the body according to the present utility model;

FIG. 2 is a schematic longitudinal sectional view of FIG. 1;

FIG. 3 is a schematic diagram of an embodiment of a wafer according to the present utility model;

FIG. 4 is a schematic perspective view of a wafer fixture and a wafer embodiment with a limiting structure in the body according to the present utility model;

fig. 5 is a schematic view of the longitudinal section structure of fig. 4.

Reference numerals illustrate:

the wafer jig comprises a wafer jig body 100, a body 10, a side wall 11, a first side wall 111, a second side wall 112, a groove 12, a straight section 121, a circular arc section 122, a first groove 123, a second groove 124, a notch 125, a storage cavity 126, a base 20, a limiting structure 30, a baffle 31, a limiting rod 32, a connecting rod 33, a first connecting rod 331, a second connecting rod 332, a rotating rod 34, a first rotating rod 341, a second rotating rod 342, a stop block 40, a clamping groove 41, a lifting handle 50, a vertical plate 60, a first vertical plate 61, a second vertical plate 62, a wafer 70, an effective area 71, an ineffective area 72, a first direction X, a second direction Y and a third direction Z.

Detailed Description

The following describes embodiments of the present utility model in detail with reference to the drawings.

In the following description, for purposes of explanation and not limitation, specific details are set forth such as the particular system architecture, interfaces, techniques, etc., in order to provide a thorough understanding of the present utility model.

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The terms "first," "second," "third," and the like in this disclosure are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", and "a third" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise. All directional indications (such as up, down, left, right, front, back … …) in embodiments of the present utility model are merely used to explain the relative positional relationship, movement, etc. between the components in a particular gesture (as shown in the drawings), and if the particular gesture changes, the directional indication changes accordingly. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those listed steps or elements but may include other steps or elements not listed or inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the utility model. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

Referring to fig. 1 to 5, fig. 1 is a schematic perspective view of an embodiment of a wafer jig and a wafer with a limiting structure located outside the body, fig. 2 is a schematic view of a longitudinal section structure of fig. 1, fig. 3 is a schematic view of an embodiment of a wafer with a limiting structure located inside the body, fig. 4 is a schematic perspective view of an embodiment of a wafer jig and a wafer with a limiting structure located inside the body, and fig. 5 is a schematic view of a longitudinal section structure of fig. 4.

The present utility model provides a wafer jig 100. The wafer jig 100 includes a body 10, a base 20 and a limiting structure 30.

The body 10 comprises a side wall 11, and the inner wall of the side wall 11 is provided with a groove 12 which is arranged along a first direction X and used for limiting the wafer 70; the recess 12 is configured to trap a portion of the inactive area 72 of the wafer 70. The base 20 is connected with the body 10 for supporting the body 10. The limiting structure 30 is disposed at an end of the side wall 11 away from the base 20. The limit structure 30 is configured to rotate from the outside of the sidewall 11 to the inside of the sidewall 11 to limit displacement of the wafer 70 placed in the body 10 in the first direction X. The first direction X is an extending direction of the sidewall 11 toward the base 20. By configuring the recess 12 to clamp a portion of the inactive area 72 of the wafer 70 when the wafer 70 is clamped in the recess 12, the sidewall 11 of the recess 12 does not shield the active area 71 of the wafer 70, so that the active area 71 of the wafer 70 can be completely contacted with the plating solution during the electroless plating process, thereby improving the problems of edge plating leakage and thin plating of the wafer 70. At the same time, the limiting structure 30 capable of rotating around the side wall 11 is arranged to limit the displacement of the wafer 70 placed in the body 10 in the first direction X, so that the floating and breaking risk of the wafer 70 is reduced.

The first direction X may be understood as an extending direction of the sidewall 11 toward the base 20, and the extending direction may be understood as a direction parallel to the sidewall 11 and directed toward the base 20. The first direction X is taken as an example of a direction perpendicular to the plane of the base 20.

The side wall 11 includes a first side wall 111 and a second side wall 112 disposed opposite to each other along the second direction Y, defining the groove 12 on the first side wall 111 as a first groove 123, and defining the groove 12 on the second side wall 112 as a second groove 124. A storage cavity 126 for storing the wafer 70 is formed between the first recess 123 and the corresponding second recess 124. The second direction Y is a direction perpendicular to the sidewall 11, that is, the first direction X is perpendicular to the second direction Y. The first grooves 123 and the second grooves 124 are disposed in one-to-one correspondence. Defining the opening of the first groove 123 facing the second sidewall 112 as a notch 125 of the first groove 123, and the opening of the second groove 124 facing the first sidewall 111 as a notch 125 of the second groove 124. The notches 125 of the first grooves 123 are disposed opposite to the notches 125 of the corresponding second grooves 124 in the second direction Y to better store the wafers 70.

The plurality of grooves 12 are arranged side by side along the third direction Z, so that the wafer jig 100 can accommodate a plurality of wafers 70 simultaneously. The third direction Z is perpendicular to the first direction X and perpendicular to the second direction Y.

In some embodiments, the recess 12 includes a straight segment 121 and a circular segment 122 connected to each other, and one end of the circular segment 122 is connected to one end of the straight segment 121 near the base 20, and the other end extends in an arc toward one side of the base 20. The groove 12 on the side wall 11 of the wafer jig 100 is arranged in an arc shape near one end of the base 20, so that the wafer 70 can be placed conveniently and the wafer 70 is limited in the first direction X.

In other embodiments, groove 12 includes only straight section 121. The inner wall of the portion of the sidewall 11, which is not provided with the groove 12 and is close to one end of the base 20, is an arc surface so as to limit the wafer 70 in the first direction X and reduce the collision force of the wafer 70 with the inner wall of the sidewall 11. It will be appreciated that the inner wall of the sidewall 11 includes a planar section for providing the recess 12 and a curved section at an end of the planar section adjacent the base 20 for receiving the wafer 70.

In this embodiment, the groove 12 includes a straight section 121 and an arc section 122 connected to each other, and one end of the arc section 122 is connected to one end of the straight section 121 near the base 20, and the other end extends arcuately toward one side of the base 20.

In some embodiments, the center of the arc segment 122 of the groove 12 is located inside the body 10, and the inner bottom wall of the arc segment 122 of the groove 12 is fitted to the side wall 11 of the wafer 70. When the wafer 70 is located in the storage cavity 126, the sidewall 11 of the wafer 70 can be attached to the inner bottom wall of the arc section 122 of the groove 12, so that the wafer 70 can be supported, and the collision force between the wafer 70 and the groove 12 in the electroless plating process of the wafer 70 can be reduced.

The distance between the inner bottom wall of the straight section 121 of the first groove 123 and the inner bottom wall of the straight section 121 of the corresponding second groove 124 is larger than the diameter of the wafer 70 and smaller than the sum of the diameter of the wafer 70 and the depth of the first groove 123 and smaller than the sum of the diameter of the wafer 70 and the depth of the second groove 124. The depth of the first groove 123 is defined as the distance from the inner bottom wall of the first groove 123 to the notch 125 of the first groove 123, and the depth of the second groove 124 is defined as the distance from the inner bottom wall of the second groove 124 to the notch 125 of the second groove 124. The depth of the first groove 123 may be the same as or different from the depth of the second groove 124, so that when the wafer 70 is located in the storage cavity 126, the wafer 70 can have a certain movement range in the storage cavity 126, so that the wafer 70 is prevented from being damaged in the process of placement, and the wafer 70 is convenient to place.

Further, as shown in fig. 3, the wafer 70 has an inactive area 72, the inactive area 72 of the wafer 70 surrounds the active area 71 of the wafer 70, and the inactive area 72 is annular. The depth of the recess 12 is less than or equal to a predetermined width, which is the annular width of the inactive area 72 of the wafer 70. That is, the depth of the first groove 123 is less than or equal to the annular width of the inactive area 72, and the depth of the second groove 124 is less than or equal to the annular width of the inactive area 72. The active area 71 of the wafer 70 refers to the surface of the wafer 70 that needs electroless plating. By the design, when the wafer 70 is displaced leftwards or rightwards in the second direction Y in the storage cavity 126, the inner side walls of the first groove 123 and the second groove 124 are not contacted with the effective area 71 of the wafer 70, so that when the wafer 70 is clamped in the groove 12, the side walls 11 of the groove 12 do not shield the effective area 71 of the wafer 70, and therefore, in the double-sided electroless plating process of the wafer 70, the effective area 71 of the wafer 70 can be better contacted with plating solution, and the problems of missing plating and thin plating of the wafer 70 are solved.

It should be appreciated that the width of the first recess 123 and the width of the second recess 124 are both greater than the thickness of the wafer 70 to facilitate placement of the wafer 70. The width of the first groove 123 is defined as the distance between two sidewalls of the first groove 123 along the third direction Z, and the width of the second groove 124 is defined as the distance between two sidewalls of the second groove 124 along the third direction Z. The third direction Z is perpendicular to the first direction X and perpendicular to the second direction Y. The width of the first groove 123 and the width of the second groove 124 are not limited, and may be selected according to practical requirements.

In some embodiments, the spacing structure 30 is located on the first side wall 111 and/or the second side wall 112. That is, when the number of the limiting structures 30 is one, the limiting structures 30 are disposed on the first side wall 111 or the second side wall 112. When there are two limiting structures 30, one of the limiting structures 30 is disposed on the first side wall 111, and the other is disposed on the second side wall 112. The spacing structure 30 can prevent the wafer 70 in the body 10 from floating up and down in the first direction X by too large a distance, so as to avoid the risk of floating and breaking the wafer 70.

In the present embodiment, the limiting structure 30 is disposed on the first sidewall 111.

Further, the limit structure 30 includes a limit lever 32, a connecting lever 33, and a rotating lever 34. The dwang 34 sets up in the one end of lateral wall 11 along third direction Z, and dwang 34 is connected with connecting rod 33, and connecting rod 33 is connected with gag lever post 32, and gag lever post 32 is parallel with lateral wall 11, and connecting rod 33 passes through dwang 34 rotation and drives gag lever post 32 and rotate around the top of lateral wall 11 in first direction X, and third direction Z is parallel and perpendicular first direction X with lateral wall 11. That is, the third direction Z is perpendicular to the first direction X and perpendicular to the second direction Y.

The connection rod 33 includes a first connection rod 331 and a second connection rod 332, and the rotation rod 34 includes a first rotation rod 341 and a second rotation rod 342.

The stop lever 32 extends along a third direction Z, which is perpendicular to the first direction X and perpendicular to the second direction Y. Opposite ends of the limiting rod 32 along the third direction Z are respectively connected to one end of the first connecting rod 331 and one end of the second connecting rod 332.

The two ends of the first connecting rod 331 are respectively connected to one end of the limiting rod 32 and one end of the first rotating rod 341, and the two ends of the second connecting rod 332 are respectively connected to the other end of the limiting rod 32 and one end of the second rotating rod 342.

The other end of the first rotating rod 341 and the other end of the second rotating rod 342 are respectively disposed at opposite sides of the corresponding side wall 11 in the third direction Z, and are respectively parallel to the stopper rod 32.

In some embodiments, the first connecting rod 331 and the first rotating rod 341 are integrally formed, the second connecting rod 332 and the second rotating rod 342 are integrally formed, and the other end of the first rotating rod 341 and the other end of the second rotating rod 342 are rotatably disposed on opposite sides of the corresponding side wall 11 along the third direction Z.

In other embodiments, the first connecting rod 331 and the first rotating rod 341 are not integrally formed, and the second connecting rod 332 and the second rotating rod 342 are not integrally formed, so that the rotating rod 34 can be rotatably disposed on the corresponding side wall 11, and the connecting rod 33 and the rotating rod 34 are fixedly disposed.

In still other embodiments, the first connecting rod 331 and the first rotating rod 341 are not integrally formed, and the second connecting rod 332 and the second rotating rod 342 are not integrally formed, and the rotating rod 34 may be fixedly disposed on the corresponding side wall 11, and the connecting rod 33 is rotatably disposed on the rotating rod 34.

In the present embodiment, the first connecting rod 331 and the first rotating rod 341 are integrally formed, the second connecting rod 332 and the second rotating rod 342 are integrally formed, and the other end of the first rotating rod 341 and the other end of the second rotating rod 342 are rotatably disposed on opposite sides of the corresponding side wall 11 along the third direction Z.

In some embodiments, the connecting rod 33 may be disposed perpendicular to the stop lever 32, or may be disposed non-perpendicular to the stop lever 32. When the connecting rod 33 and the limiting rod 32 are not vertically arranged, the first connecting rod 331 and the second connecting rod 332 may be arranged in parallel or may be arranged in non-parallel.

In some embodiments, the wafer fixture 100 further includes a baffle 31, the baffle 31 is located on the stop lever 32, and a length of the baffle 31 in the third direction Z is smaller than a length of the stop lever 32. The baffle 31 is located on a side of the stop bar 32 away from the corresponding side wall 11, that is, the baffle 31 and the connecting rod 33 are not located on the same side of the stop bar 32, so as to avoid collision of the baffle 31 with the side wall 11.

In the present embodiment, the connecting rod 33 is disposed perpendicularly to the stopper rod 32. The baffle 31 is rectangular, the baffle 31 extends along the third direction Z, and the side surface of the baffle 31 facing the stop lever 32 is connected with the stop lever 32.

In some embodiments, a limiting groove for clamping the wafer 70 is disposed on a side of the baffle 31 facing the wafer 70 to limit the displacement of the wafer 70 in the third direction Z. The limit grooves are multiple and are arranged in one-to-one correspondence with the wafers 70. The limiting grooves are arranged side by side in the third direction Z.

In some embodiments, the wafer jig 100 further includes a stopper 40, where the stopper 40 is disposed corresponding to the limiting structure 30. The stopper 40 is provided at an end of the sidewall 11 in the third direction Z. When the baffle 31 rotates from the outer side of the two side walls 11 to the inner side of the two side walls 11, the stop block 40 abuts against the limit rod 32 to limit the limit rod 32. The stop 40 is located on the inside of the side wall 11.

The length of the baffle 31 in the third direction Z is smaller than the length of the stop lever 32, so that the part of the stop lever 32 where the baffle 31 is not arranged can be abutted against the stop block 40, the stop block 40 is convenient to limit the stop lever 32, and collision between the baffle 31 and the stop block 40 is avoided.

In some embodiments, one of the limiting structures 30 may be disposed corresponding to one of the stoppers 40, and the stopper 40 is disposed at one end of the sidewall 11 in the third direction Z.

In other embodiments, one limiting structure 30 may be disposed corresponding to two stoppers 40, and the stoppers 40 are disposed at both ends of the sidewall 11 in the third direction Z.

In this embodiment, a limit structure 30 may be disposed corresponding to a stop block 40, where the stop block 40 is disposed at one end of the sidewall 11 in the third direction Z.

In some embodiments, a clamping groove 41 is formed on one side of the stop block 40, which abuts against the limiting rod 32, for clamping the limiting rod 32. It should be understood that a protrusion is disposed on a side of the stop block 40, which abuts against the stop block 40, and a clamping groove 41 is disposed on a side of the stop block 32, so that the protrusion of the stop block 40 is clamped with the clamping groove 41 of the stop block 32 to fix the stop block 32 to the stop block 40, thereby limiting the stop plate 31.

It should be noted that, when the wafer 70 is clamped in the groove 12 and the stop block 40 is clamped to fix the stop lever 32, the stop block 40 is spaced from the wafer 70, and the distance between the end of the stop block 40, which is close to the wafer 70, and the center of the circle of the wafer 70 is a preset distance, so that the wafer 70 can be floated upward or downward along the first direction X within the preset range in the storage cavity 126 during the electroless plating process, thereby reducing the breaking risk of the wafer 70.

In some embodiments, the width of the space between the grooves 12 may be increased, and a buckle may be provided at an end of the groove 12 near the base 20 to clamp the wafer 70, so as to prevent the wafer 70 from contacting the inner sidewall of the groove 12.

In some embodiments, the wafer jig 100 further includes a handle 50, the handle 50 being located at an end of the sidewall 11 remote from the base 20. In the process that the limiting structure 30 rotates from the outer sides of the two side walls 11 to the inner sides of the two side walls 11, the limiting structure 30 avoids the lifting handle 50. That is, the handle 50 is located between the first connecting rod 331 and the second connecting rod 332. In the process that the limit structure 30 rotates from the outer sides of the two side walls 11 to the inner sides of the two side walls 11, the limit structure 30 cannot be in contact with the handle 50, so that the handle 50 is prevented from colliding with the limit structure 30, and normal use of the limit structure 30 is prevented from being affected.

It should be understood that the handle 50 may be located at other positions of the side walls 11, and only the limit structure 30 is required to avoid the handle 50 during the process of rotating the limit structure 30 from the outer sides of the two side walls 11 to the inner sides of the two side walls 11.

In some embodiments, the wafer jig 100 further includes a vertical plate 60 connecting the first sidewall 111 and the second sidewall 112, the vertical plate 60 includes a first vertical plate 61 and a second vertical plate 62 disposed opposite to each other along the third direction Z, the first vertical plate 61 connects one end of the first sidewall 111 and one end of the second sidewall 112, and the second vertical plate 62 connects the other end of the first sidewall 111 and the other end of the second sidewall 112. The stop block 40 is located outside the vertical plate 60, so as to prevent the stop block 40 from limiting the wafer 70 clamped in the groove 12 and facilitate access to the wafer 70. When the stop block 40 resists the limit structure 30, the baffle 31 is positioned between the first vertical plate 61 and the second vertical plate 62, so that the baffle 31 can limit the wafer 70 better; and the vertical plate 60 is located between the first connecting rod 331 and the second connecting rod 332, so that the stop block 40 better abuts against the limit rod 32.

A wafer jig 100 suitable for a wafer 70 having a diameter of 150 mm and a ring width of 5 mm in the inactive area 72 will be described.

In one embodiment, the diameter of the wafer 70 is 150 mm and the annular width of the inactive area 72 of the wafer 70 is 5 mm.

The depth of the first groove 123 and the depth of the second groove 124 are both 3 mm, and the distance between the inner bottom wall of the flat section 121 of the first groove 123 and the inner bottom wall of the flat section 121 of the corresponding second groove 124 is 152 mm, so that the distance of the wafer 70 moving left and right in the second direction Y is 2 mm, and when the wafer 70 is clamped in the groove 12, the side wall 11 of the groove 12 does not shield the effective area 71 of the wafer 70, so that the problem of missing plating and thin plating at the edge of the wafer 70 is solved.

Further, when the wafer 70 is clamped in the groove 12 and the stopper 40 resists the limit structure 30, the sidewall 11 of the wafer 70 is attached to the inner bottom wall of the arc section 122 of the first groove 123 and the inner bottom wall of the arc section 122 of the second groove 124, the distance between one end of the baffle 31, which is close to the wafer 70, and the outer sidewall of the wafer 70 in the first direction X is 2 mm, and the distance between one end of the baffle 31, which is close to the wafer 70, and the outer sidewall of the wafer 70 in the second direction Y is 2 mm, so as to ensure that the floating mileage of the wafer 70 in the first direction X is 2 mm in the electroless plating process, thereby reducing the floating and breaking risk of the wafer 70.

The present utility model provides a wafer jig 100. The wafer jig 100 includes a body 10, a base 20 and a limiting structure 30. The body 10 comprises a side wall 11, and the inner wall of the side wall 11 is provided with a groove 12 which is arranged along a first direction X and used for limiting the wafer 70; the recess 12 is configured to trap a portion of the inactive area 72 of the wafer 70. The base 20 is connected with the body 10 for supporting the body 10. The limiting structure 30 is disposed at an end of the side wall 11 away from the base 20. The limit structure 30 is configured to rotate from the outside of the sidewall 11 to the inside of the sidewall 11 to limit displacement of the wafer 70 placed in the body 10 in the first direction X. The first direction X is an extending direction of the sidewall 11 toward the base 20. By configuring the recess 12 to clamp a portion of the inactive area 72 of the wafer 70 when the wafer 70 is clamped in the recess 12, the sidewall 11 of the recess 12 does not shield the active area 71 of the wafer 70, so that the active area 71 of the wafer 70 can be completely contacted with the plating solution during the electroless plating process, thereby improving the problems of edge plating leakage and thin plating of the wafer 70. At the same time, the limiting structure 30 capable of rotating around the side wall 11 is arranged to limit the displacement of the wafer 70 placed in the body 10 in the first direction X, so that the floating and breaking risk of the wafer 70 is reduced.

The foregoing is only the embodiments of the present utility model, and therefore, the patent protection scope of the present utility model is not limited thereto, and all equivalent structures or equivalent flow changes made by the content of the present specification and the accompanying drawings, or direct or indirect application in other related technical fields, are included in the patent protection scope of the present utility model.

Claims (10)

1. A wafer tool, its characterized in that, wafer tool includes:

the wafer limiting device comprises a body, a wafer and a wafer, wherein the body comprises a side wall, and a groove which is arranged along a first direction and used for limiting a wafer is formed in the inner wall of the side wall; the groove is configured to clamp a part of the invalid region of the wafer;

the base is connected with the body and used for supporting the body;

the limiting structure is arranged at one end of the side wall, far away from the base; the limit structure is configured to rotate from an outer side of the sidewall to an inner side of the sidewall to limit displacement of the wafer placed within the body in the first direction; the first direction is the extending direction of the side wall to the base.

2. The wafer jig of claim 1, wherein the groove comprises a straight section and an arc section connected to each other, one end of the arc section is connected to one end of the straight section near the base, and the other end extends arcuately toward one side of the base.

3. The wafer jig of claim 1, wherein the sidewall comprises a first sidewall and a second sidewall disposed opposite along a second direction, the groove defined on the first sidewall being a first groove, the groove defined on the second sidewall being a second groove; a storage cavity for storing the wafer is formed between the first groove and the corresponding second groove; wherein the second direction is a direction perpendicular to the side wall.

4. The wafer jig of claim 1, wherein the depth of the groove is less than or equal to a preset width, the preset width being a ring width of an inactive area of the wafer, wherein the inactive area of the wafer surrounds an active area of the wafer, and the inactive area is ring-shaped.

5. The wafer tool of claim 3, wherein,

the limiting structure is positioned on the first side wall and/or the second side wall; the limiting structure comprises a limiting rod, a connecting rod and a rotating rod; the utility model discloses a lateral wall, including the lateral wall, the dwang sets up the lateral wall is in the one end of lateral wall along the third direction, the dwang with the connecting rod is connected, the connecting rod with the gag lever post is connected, the gag lever post with the lateral wall is parallel, the connecting rod passes through the dwang rotates to drive the gag lever post is centers on the lateral wall is in on the top rotation of first direction, the third direction with the lateral wall is parallel and perpendicular the first direction.

6. The wafer tool of claim 5, wherein,

the connecting rods comprise a first connecting rod and a second connecting rod, and the rotating rods comprise a first rotating rod and a second rotating rod;

the limiting rod is arranged in an extending mode along a third direction, and the third direction is perpendicular to the first direction and the second direction; opposite ends of the limiting rod along the third direction are respectively connected with one end of the first connecting rod and one end of the second connecting rod;

two ends of the first connecting rod are respectively connected with one end of the limiting rod and one end of the first rotating rod, and two ends of the second connecting rod are respectively connected with the other end of the limiting rod and one end of the second rotating rod;

the other end of the first rotating rod and the other end of the second rotating rod are respectively arranged on two opposite sides of the side wall along the third direction and are respectively parallel to the limiting rod.

7. The wafer jig of claim 5, wherein the limit structure further comprises a baffle plate, the baffle plate is located on the limit rod, and a length of the baffle plate in the third direction is smaller than a length of the limit rod.

8. The wafer jig of claim 7, further comprising a stop disposed in correspondence with the limit structure; the stop block is arranged at the end part of the side wall in the third direction; when the baffle rotates from the outer sides of the two side walls to the inner sides of the two side walls, the stop block resists the limiting rod so as to limit the limiting rod.

9. The wafer jig of claim 8, wherein a clamping groove is formed on a side of the stop block, which is used for resisting the limiting rod, for clamping the limiting rod.

10. The wafer jig of claim 5, further comprising a handle at an end of the sidewall remote from the base; in the process that the limiting structure rotates from the outer sides of the two side walls to the inner sides of the two side walls, the limiting structure avoids the lifting handles.