CN220033393U - Silicon wafer receiving device, receiving equipment and sorting machine - Google Patents
Silicon wafer receiving device, receiving equipment and sorting machine Download PDFInfo
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- CN220033393U CN220033393U CN202320993801.7U CN202320993801U CN220033393U CN 220033393 U CN220033393 U CN 220033393U CN 202320993801 U CN202320993801 U CN 202320993801U CN 220033393 U CN220033393 U CN 220033393U
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- receiving device
- wafer receiving
- material box
- sliding plate
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 184
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 184
- 239000010703 silicon Substances 0.000 title claims abstract description 184
- 239000000463 material Substances 0.000 claims abstract description 99
- 230000001360 synchronised effect Effects 0.000 claims abstract description 44
- 238000009434 installation Methods 0.000 claims abstract description 29
- 235000012431 wafers Nutrition 0.000 claims description 205
- 210000001503 joint Anatomy 0.000 claims description 4
- 238000007599 discharging Methods 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 8
- 230000003139 buffering effect Effects 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a silicon wafer receiving device, which comprises a cylinder, a fixed plate, a sliding plate, a synchronous belt linkage mechanism, a material box installation part and a material box, wherein: the sliding plate is connected to the fixed plate in a sliding way, and the air cylinder is used for driving the sliding plate to slide; the sliding plate is provided with a first belt pulley and a second belt pulley; the synchronous belt is sleeved on the first belt pulley and the second belt pulley; the material box installation part is connected to the sliding plate in a sliding way and is fixedly connected with the first side belt body of the synchronous belt, the material box is installed on the material box installation part and is configured at a wafer collecting station for collecting the silicon wafer, and the silicon wafer is taken out at a wafer taking station; the synchronous belt linkage mechanism is at least partially fixedly arranged on the fixed plate, the cylinder drives the sliding plate to move for a first distance along a first direction, and the synchronous belt linkage mechanism drives the material box installation part to move for a second distance along the first direction. Compared with the method that the cylinder is simply adopted to directly push the feeding box, the silicon wafer receiving device is more compact in structure and can reduce the size of a discharging area of the silicon wafer sorting machine.
Description
Technical Field
The utility model relates to the field of silicon wafer sorting, in particular to a silicon wafer receiving device, receiving equipment and a sorting machine.
Background
After the silicon wafers are sorted and detected by a sorting machine, sorting and collecting the silicon wafers according to the sorted grades, and collecting the silicon wafers into different material boxes. In order to facilitate the taking out of the silicon wafer in the material box, after the completion of the taking-up, the material box needs to be pushed out of the material box by a certain distance from the material taking-up station, and then the silicon wafer in the material box is taken out. The existing automatic pushing of the material box adopts an air cylinder to directly push the material box, however, the stroke of the air cylinder is limited, and the required pushing distance cannot be met.
Disclosure of Invention
In order to solve the technical problems, the utility model provides a silicon wafer receiving device, which adopts the following technical scheme:
the utility model provides a silicon chip receiving device, includes cylinder, fixed plate, sliding plate, hold-in range link gear, magazine installation department and magazine, wherein:
the sliding plate is connected to the fixed plate in a sliding way, the driving end of the air cylinder is connected with the sliding plate, and the air cylinder is used for driving the sliding plate to slide;
the sliding plate is provided with a first belt wheel and a second belt wheel along the sliding direction of the sliding plate;
the synchronous belt is sleeved on the first belt pulley and the second belt pulley;
the material box installation part is connected to the sliding plate in a sliding way and is fixedly connected with the first side belt body of the synchronous belt, the material box is installed on the material box installation part and is configured at a wafer collecting station for collecting the silicon wafer, and the silicon wafer is taken out at a wafer taking station;
the synchronous belt linkage mechanism is at least partially fixedly arranged on the fixed plate, the cylinder drives the sliding plate to move for a first distance along a first direction, and the synchronous belt linkage mechanism drives the material box installation part fixedly connected with the first side belt body to move for a second distance along the first direction.
Compared with the method that a cylinder is simply adopted to directly push the feeding box, the silicon wafer collecting device is further provided with the synchronous belt and the synchronous belt linkage mechanism, and the moving distance of the feeding box along the first direction is the sum of the first distance and the second distance (namely double stroke of the cylinder) under the pushing of the cylinder through the synchronous belt and the synchronous belt linkage mechanism, so that the structure of the silicon wafer collecting device is more compact, and the size of a discharging area of a silicon wafer sorting machine can be reduced.
In some embodiments, the timing belt linkage comprises a first clamping block mounted on the fixed plate, the clamping end of the first clamping block clamped on a second side belt body of the timing belt opposite to the first side belt body; the cylinder drives the sliding plate to move along the first direction for a first distance, and meanwhile, the first clamping block pulls the synchronous belt, so that the material box installation part is driven to move along the first direction for a second distance.
The second side belt body of the synchronous belt is clamped by the first clamping block arranged on the fixed plate, so that when the cylinder drives the sliding plate to move along the first direction for a first distance, the first clamping block can realize reverse traction of the synchronous belt, and accordingly the material box installation part is driven to move along the first direction for a second distance relative to the sliding plate, and double stroke pushing of the cylinder to the material box is realized.
In some embodiments, the fixed plate and the sliding plate are both vertically arranged, the first side belt is an upper side belt, and the second side belt is a lower side belt; or the first side belt body is a lower side belt body, and the second side belt body is an upper side belt body.
The fixed plate and the sliding plate are vertically arranged, so that the occupied space of the silicon wafer collecting device on the horizontal plane can be reduced, and the silicon wafer collecting device can be more conveniently and integrally installed on the installation support of the silicon wafer sorting device.
In some embodiments, the silicon wafer receiving device further comprises a buffer assembly, wherein the buffer assembly comprises a limiting part and a buffer part, one of the limiting part and the buffer part is fixedly arranged at the end part of the sliding plate, and the other one of the limiting part and the buffer part is arranged along the sliding direction of the sliding plate.
Through the cooperation at spacing portion and buffering portion, cushion the slip board when sliding in place, avoid taking place rigid impact when putting in place, damage the silicon chip in the magazine.
In some embodiments, the timing belt linkage includes a rack, a shaft, and a gear, wherein: the rack is arranged on the fixed plate along the sliding direction of the sliding plate; the rotating shaft is rotatably arranged on the sliding plate, the first belt wheel and the gear are fixedly arranged on the rotating shaft, and the gear is meshed with the rack; the cylinder drives the sliding plate to move along the first direction for a first distance, and meanwhile, the gear is driven by the rack to rotate, and the synchronous belt is driven by the first belt wheel to rotate, so that the material box installation part is driven to move along the first direction for a second distance.
The synchronous belt linkage mechanism is in transmission connection with the first belt wheel through the rack and the gear, and when the cylinder drives the sliding plate to move for a first distance along the first direction, the synchronous belt linkage mechanism drives the synchronous belt to rotate, so that the material box installation part is driven to move for a second distance along the first direction relative to the sliding plate, and double stroke pushing of the cylinder to the material box is realized.
In some embodiments, the cartridge mount comprises a mounting plate and a second clamping block, wherein: the mounting plate is connected to the sliding plate in a sliding way, and the material box is mounted on the mounting plate; the second clamping block is fixedly connected to the mounting plate, and the clamping end of the second clamping block is clamped on the first side belt body of the synchronous belt.
Through setting up the magazine installation department for the magazine installation department can press from both sides tightly on the first side area body of hold-in range, and provides sufficient installation space for the magazine.
In some embodiments, the cartridge mounting portion further comprises a cartridge mounting block through which the cartridge is mounted on the mounting plate, the cartridge mounting block being provided with a plurality of mounting holes arranged obliquely thereon, the cartridge being mounted obliquely on the cartridge mounting block via the mounting holes.
Through setting up the magazine installation piece, further made things convenient for the installation to the magazine. And through set up the mounting hole of slope arrangement on the magazine installation piece, then realized the regulation to magazine installation angle for the magazine is tilting device. Therefore, the silicon wafers received into the material box can slide towards one side wall of the material box and finally lean against one side wall of the material box, and the uniformity of silicon wafer receiving is improved.
In some embodiments, the take-up station and the take-out station are located on the same horizontal plane.
The collecting station and the taking station are positioned on the same horizontal plane, and the material box can be adjusted to the taking station from the collecting station only by driving the material box to move along the first horizontal direction.
In some embodiments, the take-up station is at a first elevation and the take-up station is at a second elevation; the silicon wafer receiving device further comprises a lifting adjusting part, the material box is arranged on a movable part of the lifting adjusting part, and the lifting adjusting part is used for driving the material box to lift between a first height position and a second height position; the lifting adjusting part comprises a lifting cylinder and a lifting guide rod, wherein the lifting guide rod is arranged on the material box installation part along the vertical direction, and the material box is slidably installed on the lifting guide rod and is in butt joint with the driving end of the lifting cylinder.
The collecting station and the taking station are positioned at different heights, and the height of the material box can be adjusted by arranging the lifting adjusting part on the material box mounting part, so that the material box can be ensured to be adjusted to the taking station from the collecting station.
The utility model also provides silicon wafer receiving equipment, which comprises a mounting frame, a first silicon wafer receiving device and a second silicon wafer receiving device, wherein the first silicon wafer receiving device and the second silicon wafer receiving device are sequentially arranged on the mounting frame up and down, and a material box of the second silicon wafer receiving device is configured to be capable of lifting along the vertical direction, so that when the silicon wafer needs to be received, the material box of the second silicon wafer receiving device and the material box of the first silicon wafer receiving device are positioned on the same horizontal plane; when the silicon wafers need to be taken out, the material box of the second silicon wafer receiving device and the material box of the first silicon wafer receiving device are not in the same horizontal plane.
By arranging two groups of silicon wafer receiving devices, synchronous receiving of two silicon wafers on the same discharging branch line can be realized, and the receiving efficiency can be effectively improved; in addition, when the material box in one silicon wafer receiving device is fully received, the material box in the other silicon wafer receiving device can be used for receiving the silicon wafers, the time for taking out the silicon wafers in the material box is not required, and the wafer receiving efficiency can be effectively improved.
The utility model also provides a silicon wafer separator which comprises a good wafer receiving area and a bad wafer receiving area, wherein at least one of the good wafer receiving area and the bad wafer receiving area adopts the silicon wafer receiving equipment provided by the embodiment.
By adopting the silicon wafer receiving equipment provided by the utility model to receive the qualified wafers and/or the unqualified wafers, the size of the discharging area of the silicon wafer sorting machine is reduced, and the sorting efficiency of the silicon wafer sorting machine is improved.
Drawings
FIG. 1 is a schematic view of a silicon wafer receiving device according to a first embodiment of the present utility model;
FIG. 2 is a schematic view of a silicon wafer receiving device according to a first embodiment of the present utility model at another view angle;
FIG. 3 is a schematic structural view of a silicon wafer receiving device according to a second embodiment of the present utility model;
FIG. 4 is a schematic cross-sectional view of a silicon wafer receiving device according to a third embodiment of the present utility model;
FIG. 5 is a schematic view of a silicon wafer receiving device according to a third embodiment of the present utility model under another view angle;
FIG. 6 is a schematic structural diagram of a silicon wafer receiving device in an embodiment of the present utility model;
fig. 1 to 6 include:
a fixing plate 1;
a sliding plate 2;
a first pulley 3;
a second pulley 4;
a timing belt 5;
and a synchronous belt linkage mechanism 6:
a first clamping block 61;
rack 62, rotating shaft 63, gear 64;
cartridge mounting portion 7:
a mounting plate 71, a second clamping block 72, a cartridge mounting block 73, and a mounting hole 74;
elevation adjustment unit 8:
a lifting guide bar 81;
a cylinder 9;
a cartridge 10;
buffer component 11, limit part 111, buffer part 112;
the device comprises a mounting frame 100, a first silicon wafer receiving device 200 and a second silicon wafer receiving device 300.
Detailed Description
In order that the above-recited objects, features and advantages of the present utility model will become more readily apparent, a more particular description of the utility model will be rendered by reference to the appended drawings and appended detailed description.
The existing automatic pushing of the material box adopts an air cylinder to directly push the material box, however, the stroke of the air cylinder is limited, and the required pushing distance cannot be met. In order to solve the problem, the utility model provides a silicon wafer receiving device. The structure and the working process of the silicon wafer receiving device provided by the utility model are described in an exemplary manner through three embodiments.
First embodiment
As shown in fig. 1 and 2, the silicon wafer receiving device in this embodiment includes a cylinder (not shown in the drawings), a fixed plate 1, a sliding plate 2, a synchronous belt 5, a synchronous belt linkage mechanism 6, a magazine mounting portion 7, and a magazine (not shown in the drawings), wherein:
the sliding plate 2 is slidably connected to the fixed plate 1, the driving end of the air cylinder is connected with the sliding plate 2, and the air cylinder is used for driving the sliding plate 2 to slide on the fixed plate 1.
The slide plate 2 is provided with a first pulley and 3 a second pulley 4 in the sliding direction of the slide plate 2.
The synchronous belt 5 is sleeved on the first belt pulley 3 and the second belt pulley 4.
The magazine mounting portion 7 is slidably connected to the slide plate 2 and fixedly connected to the first side belt body of the timing belt 5, and the magazine is mounted on the magazine mounting portion 7. The material box is configured at the wafer collecting station A for collecting the silicon wafers, and the silicon wafers are taken out at the wafer taking station B. In this embodiment, the collecting station a and the picking station B are on the same horizontal plane.
In this embodiment, the timing belt linkage mechanism 6 includes a first clamping block 61, the first clamping block 61 is mounted on the fixed plate 1, and the clamping end of the first clamping block 61 is clamped on a second side belt body of the timing belt 5 opposite to the first side belt body.
The working process of the silicon wafer receiving device of the embodiment is as follows:
in the initial state, the material box is positioned at the receiving station A, the material box is in butt joint with the output end of a silicon wafer output mechanism (such as a sorting output mechanism of a sorting machine), and the material box receives the silicon wafer output by the silicon wafer output mechanism.
After the silicon wafer is fully received in the material box, the cylinder drives the sliding plate 2 to move along a first direction (such as the X-axis direction in the figure) for a first distance relative to the fixed plate 1. Since the second side belt body of the timing belt 5 is clamped and fixed by the first clamping block 61, during this process, the first clamping block 61 pulls the timing belt 5 in the opposite direction, so that the cartridge mounting portion 7 connected to the first side belt body of the timing belt 5 moves a second distance in the first direction (X-axis direction in the drawing) with respect to the slide plate 2. That is, the distance of movement of the cartridge mounting portion 7 and the cartridge mounted thereon with respect to the fixed plate 1 is the sum of the first distance and the second distance.
Because the second distance is equal with the first distance, the moving distance of the material box is twice of the driving stroke of the sliding plate 2 by the air cylinder, so that the silicon wafer receiving device of the embodiment can meet the requirement of the material box on the pushing distance. And the structure of the silicon wafer receiving device is more compact, and the size of a discharging area of the silicon wafer sorting machine is reduced.
Optionally, in this embodiment, the silicon wafer receiving device further includes a buffer assembly, the buffer assembly includes a limiting portion and a buffer portion, one of the limiting portion and the buffer portion is fixedly disposed at an end portion of the sliding plate, and the other one is disposed along a sliding direction of the sliding plate.
Through the cooperation at spacing portion and buffering portion, cushion the slip board when sliding in place, avoid taking place rigid impact when putting in place, damage the silicon chip in the magazine.
As shown in fig. 1 and 2, the cartridge mounting portion 7 includes a mounting plate 71 and a second clamping block 72, wherein: the mounting plate 71 is slidably connected to the slide plate 2 and the cartridge is mounted on the mounting plate 71. The second clamping block 72 is fixedly connected to the mounting plate 71, and the clamping end of the second clamping block 72 is clamped to the first side belt body of the timing belt 5.
In order to more conveniently mount the cartridge onto the mounting plate 71, optionally, as shown in fig. 2, the cartridge mounting portion 7 in this embodiment further includes a cartridge mounting block 73 disposed on the mounting plate 71, a mounting hole 74 is provided on the cartridge mounting block 73, and the cartridge is mounted and fixed on the cartridge mounting block 73 through the mounting hole 74.
With continued reference to fig. 2, optionally, a plurality of mounting holes 74 are provided in the cartridge mounting block 73, and the plurality of mounting holes 74 are arranged in an oblique direction on the cartridge mounting block 73. Through setting up the slope to a plurality of mounting holes 74, can realize the regulation to magazine installation angle for the magazine is the incline condition and installs on magazine installation piece 73, and the silicon chip of receipts material in to the magazine can slide towards one side wall of magazine, and finally support and lean on one side wall of magazine, improve the regularity of silicon chip receipts material.
With continued reference to fig. 1 and 2, in this embodiment, alternatively, the fixing plate 1 and the sliding plate 2 are both vertically disposed, the first side belt body of the synchronous belt 5 is an upper side belt body, the second side belt body of the synchronous belt 5 is a lower side belt body, that is, the magazine mounting portion 7 is fixedly connected with the upper side belt body of the synchronous belt 5, and the clamping end of the first clamping block 61 clamps the lower side belt body of the synchronous belt 5. By the arrangement, the occupied space of the silicon wafer collecting device on the horizontal plane can be reduced, so that the silicon wafer collecting device can be more conveniently and integrally installed on a frame of the sorting equipment. In addition, the fixed plate 1 and the sliding plate 2 are vertically arranged, so that the fixed plate 1 and the vertical mounting frame have more contact areas, the mounting stability can be effectively improved, and the stability of the movement of the material box is further improved.
Of course, the cartridge mounting portion 7 may be fixedly connected to the lower belt body of the timing belt 5, and the clamping end of the first clamping block 61 clamps the upper belt body of the timing belt 5, that is, the first side belt body of the timing belt 5 is the lower belt body, and the second side belt body of the timing belt 5 is the upper belt body.
Second embodiment
The silicon wafer receiving device in the first embodiment is only suitable for the situation that the receiving station A and the taking station B are in the same horizontal plane.
However, as known to those skilled in the art, in some take-up scenarios, take-up station a and take-up station B are not necessarily on the same horizontal plane, i.e. take-up station a and take-up station B are at different heights. For example, the collecting station A is at a first height, the picking station B is at a second height, and the first height is higher or lower than the second height.
The silicon wafer receiving device in the embodiment can meet the receiving requirements under the conditions.
The structure and the working process of the silicon wafer receiving device in the embodiment are basically the same as those of the silicon wafer receiving device in the first embodiment, and for simplicity of description, the description only describes the difference points of the silicon wafer receiving device in the embodiment relative to the silicon wafer receiving device in the first embodiment.
As shown in fig. 3, unlike the first embodiment, the silicon wafer receiving device in this embodiment further includes a lifting adjustment portion 8, and the magazine is disposed on a movable member of the lifting adjustment portion 8, and the lifting adjustment portion 8 is configured to drive the magazine to lift between a first height and a second height, that is, to lift along the Y direction.
When the silicon wafer is required to be received, the lifting adjusting part 8 drives the material box to the first height, so that the material box can translate to the receiving station A at the first height when the cylinder drives the sliding plate 2 to slide.
When the silicon wafer received in the material box needs to be taken out, the lifting adjusting part 8 drives the material box to the second height, so that when the cylinder drives the sliding plate 2 to slide, the material box full of the silicon wafer can translate to the position of the wafer taking station B.
Alternatively, as shown in fig. 3, the lifting adjusting part 8 includes a lifting cylinder (not shown) and a lifting guide 81, wherein the lifting guide 81 is provided on the cartridge mounting part 7 in the vertical direction (e.g., mounted on the mounting plate 71 of the cartridge mounting part 7), and the cartridge is slidably mounted on the lifting guide 75 and is abutted with the driving end of the lifting cylinder.
Alternatively, as shown in fig. 3, a cartridge mounting block 73 is provided on the lifting guide 81 so as to be slidable up and down along the lifting guide 81, and the cartridge is fixedly mounted on the cartridge mounting block 73. The lifting cylinder drives the cartridge to switch between the first height and the first height by driving the cartridge mounting block 73 to slide up and down along the lifting guide rod 81.
Third embodiment
As shown in fig. 4 and 5, the silicon wafer receiving device provided in this embodiment includes a cylinder 9, a fixing plate 1, a sliding plate 2, a synchronous belt 5, a synchronous belt linkage mechanism 6, a material box mounting portion 7 and a material box 10, wherein:
the sliding plate 2 is slidably connected to the fixed plate 1, the driving end of the air cylinder 9 is connected to the sliding plate 2, and the air cylinder 9 is used for driving the sliding plate 2 to slide on the fixed plate 1.
The slide plate 2 is provided with a first pulley and 3 a second pulley 4 in the sliding direction of the slide plate 2.
The synchronous belt 5 is sleeved on the first belt pulley 3 and the second belt pulley 4.
The magazine mounting portion 7 is slidably connected to the slide plate 2 and fixedly connected to the first side belt body of the timing belt 5, and the magazine 10 is mounted on the magazine mounting portion 7. The cassette 10 is configured to receive silicon wafers at a take-up station a and to remove silicon wafers at a take-out station B. In this embodiment, the collecting station a and the picking station B are on the same horizontal plane.
In this embodiment, the synchronous belt linkage mechanism 6 includes a rack 62, a rotating shaft 63 and a gear 64, wherein: the rack gear 62 is mounted on the fixed plate 1 in the sliding direction of the sliding plate 2. The rotating shaft 63 is rotatably mounted on the slide plate 2, and the first pulley 3 and the gear 64 are fixedly mounted on the rotating shaft 63, and the gear 64 is engaged with the rack 62.
The working process of the silicon wafer receiving device of the embodiment is as follows:
in the initial state, the material box 10 is positioned at the receiving station A, the material box 10 is in butt joint with the output end of the silicon wafer output mechanism, and the material box 10 receives the silicon wafer output by the silicon wafer output mechanism.
After the silicon wafer is fully received in the material box 10, the cylinder drives the sliding plate 2 to move along a first direction (such as the X-axis direction in the figure) for a first distance relative to the fixed plate 1. At the same time, the gear 64 moving along with the sliding plate 2 rotates under the drive of the rack 62, and the first belt wheel 3 rotates under the drive of the gear 64, so as to drive the synchronous belt 5 to rotate, and finally drive the cartridge mounting part 7 connected with the first side belt body of the synchronous belt 5 to move a second distance along a first direction (in the X-axis direction in the figure) relative to the sliding plate 2. That is, the moving distance of the cartridge 10 with respect to the fixed plate 1 is the sum of the first distance and the second distance.
Because the second distance is equal to the first distance, the moving distance of the material box 10 is twice as long as the driving stroke of the air cylinder, so that the silicon wafer material receiving device of the embodiment can meet the requirement of the material box 10 on the pushing distance. Therefore, the silicon wafer receiving device is more compact in structure, and finally the size of a discharging area of the silicon wafer sorting machine is reduced.
With continued reference to fig. 4 and 5, alternatively, the fixed plate 1 and the sliding plate 2 are both horizontally disposed, the sliding plate 2 is disposed above the fixed plate 1, the rotating shaft 63 is vertically disposed on the sliding plate 2 in a penetrating manner, the first pulley 3 is fixedly mounted on the upper end of the rotating shaft 63, and the gear 64 is fixedly mounted on the lower end of the rotating shaft 63. The first side belt and the second side belt of the conveyor belt 5 are, for example, a left side belt and a right side belt, respectively.
Optionally, in this embodiment, the silicon wafer receiving device further includes a buffer assembly, as shown in fig. 4, where the buffer assembly 11 includes a limiting portion 111 and a buffer portion 112, the limiting portion 111 is fixedly disposed at an end portion of the sliding plate 2, and the buffer portion 112 is disposed on the fixed plate 1 along a sliding direction of the sliding plate 2.
It should be noted that, without contradiction, the various alternative implementations in the first embodiment described above are also applicable to this embodiment. As in the first embodiment, the cartridge mounting portion 7 in this embodiment also includes a mounting plate 71 and a second clamping block 72, in which: the mounting plate 71 is slidably connected to the slide plate 2, and the cartridge 10 is mounted on the mounting plate 71. The second clamping block 72 is fixedly connected to the mounting plate 71, and the clamping end of the second clamping block 72 is clamped to the first side belt body of the timing belt 5.
Fourth embodiment
The silicon wafer receiving device in the third embodiment is only suitable for the situation that the receiving station A and the taking station B are in the same horizontal plane.
However, as known to those skilled in the art, in some take-up scenarios, take-up station a and take-up station B are not necessarily on the same horizontal plane, i.e. take-up station a and take-up station B are at different heights. For example, the collecting station A is at a first height, the picking station B is at a second height, and the first height is higher or lower than the second height.
The silicon wafer receiving device in the embodiment can meet the receiving requirements under the conditions.
The structure and the working process of the silicon wafer receiving device in this embodiment are basically the same as those of the silicon wafer receiving device in the third embodiment, and the difference in this embodiment is that the silicon wafer receiving device in this embodiment further includes a lifting adjustment portion, the material box is disposed on a movable component of the lifting adjustment portion, and the lifting adjustment portion is used for driving the material box to lift between the first height and the second height.
When the receiving of silicon chip needs to be implemented, the lifting adjusting part drives the material box to the first height, so that when the cylinder drives the sliding plate to slide, the material box can translate to the receiving station positioned at the first height. When the silicon wafers collected in the material box are required to be taken out, the lifting adjusting part is driven to the second height, so that when the air cylinder drives the sliding plate to slide, the material box full of the silicon wafers can translate to the position of the wafer taking station.
In the present embodiment, the elevation adjustment unit may be configured to be able to move up and down by using various existing elevation driving devices capable of driving the cartridge, and may be configured in the same manner as the elevation adjustment unit in the second embodiment.
The utility model also provides silicon wafer receiving equipment. As shown in fig. 6, the silicon wafer receiving apparatus in one embodiment of the present utility model includes a mounting frame 100, a first silicon wafer receiving device 200 and a second silicon wafer receiving device 300, where the first silicon wafer receiving device 100 and the second silicon wafer receiving device 200 are sequentially disposed on the mounting frame 100 from top to bottom, and the steps include:
the first silicon wafer receiving device 200 adopts the silicon wafer receiving device provided by the first embodiment, the material box 10 of the first silicon wafer receiving device 200 receives wafers at the first wafer receiving station A1, and the wafers are taken at the first wafer taking station B1. The first receiving station A1 and the first picking station B1 are located on the same horizontal plane, i.e. a higher first height.
The second silicon wafer receiving device 300 adopts the silicon wafer receiving device provided by the second embodiment, the material box 10 of the second silicon wafer receiving device 300 receives wafers at the second wafer receiving station A2, and takes wafers at the second wafer taking station B2. The second receiving station A2 and the first receiving station A1 are at the same height, i.e. a higher first height. The second picking station B2 is at a second lower height and is located below the first picking station B1.
After the first silicon wafer receiving device 200 receives the silicon wafer at the first receiving station A1, the silicon wafer is directly translated to the first taking station B1 to finish taking the silicon wafer.
After the second silicon wafer receiving device 300 receives the silicon wafer at the second receiving station A2, the silicon wafer needs to be lowered to the second height, and then translated to the second taking station B2 to complete taking the silicon wafer.
By arranging two groups of silicon wafer receiving devices, synchronous receiving of two silicon wafers on the same discharging branch line can be realized, and the receiving efficiency can be effectively improved; in addition, when the material box in one silicon wafer receiving device is fully received, the material box in the other silicon wafer receiving device can be used for receiving the silicon wafers, the time for taking out the silicon wafers in the material box is not required, and the wafer receiving efficiency can be effectively improved.
Of course, the silicon wafer receiving device provided in the third embodiment may also be used as the first silicon wafer receiving device 200, and the silicon wafer receiving device provided in the fourth embodiment may also be used as the second silicon wafer receiving device 300.
As an alternative embodiment, the first silicon wafer receiving device 200 and the second silicon wafer receiving device 300 are both provided with buffer assemblies, as shown in fig. 6, the buffer portions of the first silicon wafer receiving device 200 and the second silicon wafer receiving device 300 are respectively and fixedly arranged at the end portions (not shown in the figure) of the sliding plates, the limiting portions 111 are arranged on the mounting frame 100 along the sliding direction of the sliding plates, and the limiting portions 111 are located between the sliding plates of the first silicon wafer receiving device 200 and the second silicon wafer receiving device 300, so that the first silicon wafer receiving device 200 and the second silicon wafer receiving device 300 share one limiting portion 111, and the structure of the silicon wafer receiving device is more compact.
The utility model also provides a silicon wafer separator which comprises a good wafer receiving area and a bad wafer receiving area, wherein at least one of the good wafer receiving area and the bad wafer receiving area adopts the silicon wafer receiving equipment provided by the embodiment.
By adopting the silicon wafer receiving equipment provided by the embodiment of the utility model to receive the qualified wafers and/or the unqualified wafers, the size of the discharging area of the silicon wafer sorting machine is reduced, and the sorting efficiency of the silicon wafer sorting machine is improved.
The utility model has been described above in sufficient detail with a certain degree of particularity. It will be appreciated by those of ordinary skill in the art that the descriptions of the embodiments are merely exemplary and that all changes that come within the true spirit and scope of the utility model are desired to be protected. The scope of the utility model is indicated by the appended claims rather than by the foregoing description of the embodiments.
Claims (11)
1. The utility model provides a silicon chip receiving device, its characterized in that, silicon chip receiving device includes cylinder, fixed plate, sliding plate, hold-in range link gear, magazine installation department and magazine, wherein:
the sliding plate is connected to the fixed plate in a sliding way, the driving end of the air cylinder is connected with the sliding plate, and the air cylinder is used for driving the sliding plate to slide;
a first belt wheel and a second belt wheel are arranged on the sliding plate along the sliding direction of the sliding plate;
the synchronous belt is sleeved on the first belt pulley and the second belt pulley;
the material box installation part is connected to the sliding plate in a sliding way and is fixedly connected with the first side belt body of the synchronous belt, the material box is installed on the material box installation part, the material box is configured at a wafer collecting station for collecting silicon wafers, and the silicon wafers are taken out at a wafer taking station;
the synchronous belt linkage mechanism is at least partially fixedly installed on the fixed plate, the air cylinder drives the sliding plate to move for a first distance along a first direction, and the synchronous belt linkage mechanism drives the material box installation part fixedly connected with the first side belt body to move for a second distance along the first direction.
2. The silicon wafer receiving device as set forth in claim 1 wherein the timing belt linkage comprises a first clamping block mounted on the fixed plate, the clamping end of the first clamping block being clamped on a second side belt body of the timing belt opposite to the first side belt body;
the cylinder drives the sliding plate to move along a first direction for a first distance, and the first clamping block pulls the synchronous belt, so that the material box installation part is driven to move along the first direction for a second distance.
3. The silicon wafer receiving device as set forth in claim 2 wherein the fixed plate and the sliding plate are both vertically disposed, the first side belt being an upper side belt and the second side belt being a lower side belt; or, the first side belt body is a lower side belt body, and the second side belt body is an upper side belt body.
4. The silicon wafer receiving device as set forth in claim 1 further comprising a buffer assembly, the buffer assembly comprising a limit portion and a buffer portion, one of the limit portion and the buffer portion being fixedly disposed at an end of the sliding plate, the other being disposed along a sliding direction of the sliding plate.
5. The silicon wafer receiving device as recited in claim 1 wherein the timing belt linkage comprises a rack, a shaft, and a gear, wherein:
the rack is arranged on the fixed plate along the sliding direction of the sliding plate;
the rotating shaft is rotatably arranged on the sliding plate, the first belt wheel and the gear are fixedly arranged on the rotating shaft, and the gear is meshed with the rack;
the cylinder drives the sliding plate to move along a first direction for a first distance, the gear rotates under the drive of the rack, and the synchronous belt is driven to rotate through the first belt wheel, so that the material box installation part is driven to move along the first direction for a second distance.
6. The silicon wafer receiving device of claim 1, wherein the cassette mounting portion comprises a mounting plate and a second clamping block, wherein:
the mounting plate is connected to the sliding plate in a sliding manner, and the material box is mounted on the mounting plate;
the second clamping block is fixedly connected to the mounting plate, and the clamping end of the second clamping block is clamped on the first side belt body of the synchronous belt.
7. The silicon wafer receiving device as recited in claim 6 wherein the cartridge mounting portion further comprises a cartridge mounting block, the cartridge is mounted on the mounting plate by the cartridge mounting block, the cartridge mounting block is provided with a plurality of mounting holes arranged in an inclined manner, and the cartridge is mounted on the cartridge mounting block in an inclined manner via the mounting holes.
8. A silicon wafer receiving device according to any one of claims 1 to 7 wherein the receiving station and the picking station are located on the same horizontal plane.
9. A silicon wafer receiving device according to any one of claims 1 to 7 wherein the receiving station is at a first elevation and the wafer picking station is at a second elevation;
the silicon wafer receiving device further comprises a lifting adjusting part, the material box is arranged on a movable part of the lifting adjusting part, and the lifting adjusting part is used for driving the material box to lift between the first height and the second height;
the lifting adjusting part comprises a lifting cylinder and a lifting guide rod, the lifting guide rod is arranged on the material box mounting part along the vertical direction, and the material box is slidably mounted on the lifting guide rod and is in butt joint with the driving end of the lifting cylinder.
10. The silicon wafer receiving equipment is characterized by comprising a mounting frame, a first silicon wafer receiving device and a second silicon wafer receiving device, wherein the first silicon wafer receiving device is the silicon wafer receiving device of claim 8; the second silicon wafer receiving device is the silicon wafer receiving device of claim 9;
the first silicon wafer receiving device and the second silicon wafer receiving device are sequentially arranged on the mounting frame up and down, and the material box of the second silicon wafer receiving device is configured to be capable of lifting along the vertical direction, so that when the silicon wafers need to be received, the material box of the second silicon wafer receiving device and the material box of the first silicon wafer receiving device are positioned on the same horizontal plane; when the silicon wafers need to be taken out, the material box of the second silicon wafer receiving device and the material box of the first silicon wafer receiving device are not in the same horizontal plane.
11. A silicon wafer separator comprising a good wafer receiving area and a bad wafer receiving area, at least one of the good wafer receiving area and the bad wafer receiving area employing the silicon wafer receiving apparatus of claim 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320993801.7U CN220033393U (en) | 2023-04-27 | 2023-04-27 | Silicon wafer receiving device, receiving equipment and sorting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320993801.7U CN220033393U (en) | 2023-04-27 | 2023-04-27 | Silicon wafer receiving device, receiving equipment and sorting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220033393U true CN220033393U (en) | 2023-11-17 |
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ID=88724404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320993801.7U Active CN220033393U (en) | 2023-04-27 | 2023-04-27 | Silicon wafer receiving device, receiving equipment and sorting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220033393U (en) |
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2023
- 2023-04-27 CN CN202320993801.7U patent/CN220033393U/en active Active
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