CN220023503U - OLED large-chip substrate packaging structure - Google Patents
OLED large-chip substrate packaging structure Download PDFInfo
- Publication number
- CN220023503U CN220023503U CN202320826705.3U CN202320826705U CN220023503U CN 220023503 U CN220023503 U CN 220023503U CN 202320826705 U CN202320826705 U CN 202320826705U CN 220023503 U CN220023503 U CN 220023503U
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- Prior art keywords
- substrate
- glue
- groove
- oled
- packaging
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- 239000000758 substrate Substances 0.000 title claims abstract description 58
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 38
- 239000003292 glue Substances 0.000 claims abstract description 52
- 238000005538 encapsulation Methods 0.000 claims description 24
- 238000010030 laminating Methods 0.000 claims description 4
- 239000000565 sealant Substances 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 13
- 239000001301 oxygen Substances 0.000 abstract description 13
- 229910052760 oxygen Inorganic materials 0.000 abstract description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 11
- 239000003795 chemical substances by application Substances 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 9
- 239000008393 encapsulating agent Substances 0.000 description 5
- 239000002274 desiccant Substances 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 3
- 239000003963 antioxidant agent Substances 0.000 description 3
- 230000003078 antioxidant effect Effects 0.000 description 3
- 229920001621 AMOLED Polymers 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 230000009545 invasion Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000009751 slip forming Methods 0.000 description 2
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003446 memory effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
Abstract
The utility model relates to the field of OLED devices, in particular to an OLED large-piece substrate packaging structure which comprises a substrate and a packaging piece, wherein a groove is formed in the side surface of the packaging piece, which is attached to the substrate, a packaging agent is placed in the groove, uv glue is further arranged on the side surface of the packaging piece, which is attached to the substrate, and the uv glue is located on the outer side of the groove. According to the utility model, the packaging agent and the groove for placing the packaging agent are arranged between the packaging sheet and the substrate, so that water and oxygen in the OLED large-sized substrate can be absorbed, and water and oxygen which invade the OLED large-sized substrate from the outside can be absorbed, thereby improving the storage effect of the OLED large-sized substrate and prolonging the storage time of the OLED large-sized substrate.
Description
Technical Field
The utility model relates to the field of OLED devices, in particular to an OLED large-piece substrate packaging structure.
Background
OLED displays are characterized by light emission, high contrast, low power consumption, light weight, thin thickness, etc., and are called next generation display technology, and they can be classified into active driving (AMOLED) and passive driving (PMOLED) according to driving modes. The PMOLED is a passive organic light-emitting diode, and has the characteristic of energy conservation compared with the AMOLED.
The PMOLED screen body structure comprises a light-emitting component and a packaging structure for protecting the light-emitting component, and the main function of the PMOLED packaging is to isolate the light-emitting component from the external environment, so that the invasion of moisture, oxygen, impurities and the like to the screen body is prevented, various parameters of the component are stabilized, the protection function on external force damage is also played, and the service life of the PMOLED screen body is prolonged. According to the sales shipment requirement, the quantity of the OLED large-sized substrates is generally larger than the output, and meanwhile, the stock-keeping requirement exists, and the OLED large-sized substrates (PMOLED semi-finished products) can be exposed to an aerobic environment for a long time for storage for months or even years. Although the screen body is adhered and solidified by the UV glue, air in the atmosphere can still invade into the display screen for a long time to influence the service life of the device. The actual luminous area of each pixel can be influenced after air invasion, the display screen is visually represented as pixel shrinkage, and the material failure of the shrinkage part can not emit light, so that the luminous performance of the screen body is influenced. Therefore, it is necessary to improve the package structure of the OLED substrate to increase the storage time of the OLED substrate.
Disclosure of Invention
In order to improve the packaging effect of the LED large-chip substrate, the utility model provides an OLED large-chip substrate packaging structure.
The utility model provides an OLED large-chip substrate packaging structure, which adopts the following technical scheme:
the utility model provides a big substrate packaging structure of OLED, includes base plate and encapsulation piece, set up flutedly on the side of encapsulation piece laminating base plate, place the sealant in the recess, still be equipped with uv on the side of laminating base plate on the encapsulation piece and glue, uv glues the outside that is located the recess.
Through adopting above-mentioned technical scheme, set up flutedly on the encapsulation piece, be equipped with the sealant in the recess, the encapsulation piece pressfitting is to the base plate on, and the encapsulation piece is glued through uv and is adhered on the base plate, and water and oxygen between encapsulation piece and the base plate can be absorbed by the sealant to the memory effect of OLED large-scale base plate has been improved. If water and oxygen enter the outside, the water and the oxygen can be preferentially absorbed by the packaging agent, so that the packaging effect of the large OLED substrate is further improved.
Preferably, the groove is formed around the periphery of the packaging piece in a penetrating way.
Preferably, the encapsulant includes a desiccant.
Preferably, the encapsulant further comprises an antioxidant.
Preferably, the uv glue is applied continuously and uninterruptedly.
Preferably, the side surface of the packaging sheet attached to the substrate is provided with a glue groove, and the glue groove is continuously formed around the periphery of the packaging sheet.
Preferably, a glue guiding groove is formed in the side surface of the packaging piece, which is attached to the substrate, and the glue guiding groove is communicated with the glue groove.
Preferably, the bottom of the glue groove is arc-shaped.
In summary, the present utility model includes at least one of the following beneficial technical effects:
1. according to the utility model, the packaging agent and the groove for placing the packaging agent are arranged between the packaging sheet and the substrate, so that water and oxygen in the OLED large-sized substrate can be absorbed, and water and oxygen which invade the OLED large-sized substrate from the outside can be absorbed, thereby improving the storage effect of the OLED large-sized substrate and prolonging the storage time of the OLED large-sized substrate;
2. according to the utility model, the uv glue is continuously coated on the outer side of the groove, so that the sealing effect between the packaging sheet and the substrate can be improved, and the penetration of water and oxygen between the substrate and the packaging sheet is reduced, thereby improving the storage time of the OLED large-sized substrate.
Drawings
Fig. 1 is a schematic cross-sectional view of an OLED chip substrate package structure according to embodiment 1 of the present utility model.
Fig. 2 is a schematic structural view of a package sheet according to embodiment 1 of the present utility model.
Fig. 3 is a schematic structural view of a package sheet according to embodiment 2 of the present utility model.
Reference numerals illustrate: 1. a substrate; 2. packaging the sheet; 21. a cavity; 3. a groove; 4. an encapsulant; 5. uv glue; 6. a glue groove; 7. and a glue guiding groove.
Detailed Description
The utility model is described in further detail below with reference to fig. 1-3.
Example 1
The embodiment 1 of the utility model discloses an OLED large-sized substrate 1 packaging structure. Referring to fig. 1 and 2, an OLED large-sized substrate 1 package structure includes a substrate 1 and a package sheet 2, wherein a cavity 21 is formed on a side surface of the package sheet 2, which is close to the substrate 1, and the cavity 21 is used for accommodating a light emitting device on the substrate 1. The side surface of the encapsulation piece 2, which is close to the substrate 1, is provided with grooves 3 around the cavity 21, the grooves 3 around the cavity 21 are communicated with each other, and the encapsulation agent 4 is placed in the grooves 3. The packaging agent 4 comprises an antioxidant and a drying agent, wherein the drying agent is used for absorbing moisture, and 1250-mesh light calcium carbonate is selected as the drying agent in the embodiment of the utility model; the antioxidant is used for absorbing oxygen, and the antioxidant 1010 is selected in the embodiment of the utility model. The encapsulant 4 can effectively absorb water and oxygen inside the cavity 21 of the encapsulation sheet 2, thereby increasing the storage time of the light emitting device inside the cavity 21 of the encapsulation sheet 2.
The side of the encapsulation piece 2 close to the substrate 1 is further coated with uv glue 5, the uv glue 5 is located on the outer side of the groove 3, and the uv glue 5 is coated continuously around the periphery of the cavity 21. The encapsulation piece 2 is connected with the substrate 1 through the uv glue 5, and the uv glue 5 can effectively prevent outside air from entering the cavity 21 of the encapsulation piece 2.
The implementation principle of the encapsulation structure of the OLED large substrate 1 in the embodiment of the utility model is as follows: the uv glue 5 is applied between the encapsulation sheet 2 and the substrate 1 to connect the encapsulation sheet 2 and the substrate 1 while blocking the outside air from entering the cavity 21 of the encapsulation sheet 2. The light emitting device on the substrate 1 is located in the cavity 21 of the encapsulation sheet 2, and when the encapsulation sheet 2 is pressed onto the substrate 1, the encapsulant 4 located in the groove 3 can absorb water and oxygen in the cavity 21 of the encapsulation sheet 2, so that the storage time of the OLED large-sized substrate 1 is prolonged. If air passes through the uv glue 5 from the outside and enters the cavity 21, the air will pass through the groove 3, so that the packaging agent 4 in the groove 3 absorbs water and oxygen in the air, and further protects the light-emitting device, and further improves the storage time and the storage effect of the OLED large substrate 1.
Example 2
The embodiment 2 of the present utility model is different from the embodiment 1 in that, referring to fig. 3, a glue groove 6 is further formed on the side surface of the package sheet 2 close to the substrate 1, the glue groove 6 is continuously formed around the periphery of the package sheet 2, the bottom of the glue groove 6 is in a circular arc shape, and uv glue 5 is coated in the glue groove 6. The uv glue 5 is liquid when not solidifying, and the glue groove 6 can hold the uv glue 5, so that the packaging piece 2 is attached to the substrate 1 more tightly, and the irregular flow of the uv glue 5 can be reduced due to the arrangement of the glue groove 6. The bottom of gluing groove 6 is set to arc to can let uv glue 5 easily laminate to the bottom of gluing groove 6, reduce the inside bubble's of gluing groove 6 production, improve uv and glue 5 sealed effect. The side of the packaging piece 2 is also provided with a glue guiding groove 7, the glue guiding groove 7 is communicated with the glue groove 6, when the dosage of uv glue 5 in the glue groove 6 is insufficient, the uv glue 5 can be injected into the glue groove 6 through the glue guiding groove 7, and the sealing effect of the uv glue 5 is further improved.
The above embodiments are not intended to limit the scope of the present utility model, so: all equivalent changes in structure, shape and principle of the utility model should be covered in the scope of protection of the utility model.
Claims (6)
1. An OLED large-chip substrate package structure, characterized in that: including base plate (1) and encapsulation piece (2), set up recess (3) on the side of encapsulation piece (2) laminating base plate (1), place sealant (4) in recess (3), still be equipped with uv on the side of encapsulation piece (2) laminating base plate (1) and glue (5), uv glues (5) and is located the outside of recess (3).
2. The OLED chip-on-substrate package of claim 1, wherein: the groove (3) is arranged around the periphery of the packaging piece (2) in a penetrating way.
3. The OLED chip-on-substrate package of claim 1, wherein: the uv glue (5) is coated continuously and uninterruptedly.
4. The OLED chip-on-substrate package of claim 1, wherein: the packaging sheet (2) is attached to the side face of the substrate (1) and is provided with a glue groove (6), and the glue groove (6) is continuously arranged around the periphery of the packaging sheet (2).
5. The OLED chip-on-substrate package structure of claim 4, wherein: the packaging piece (2) is attached to the side face of the substrate (1) and is provided with a glue guiding groove (7), and the glue guiding groove (7) is communicated with the glue groove (6).
6. The OLED chip-on-substrate package of claim 5, wherein: the bottom of the rubber groove (6) is arc-shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320826705.3U CN220023503U (en) | 2023-04-14 | 2023-04-14 | OLED large-chip substrate packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320826705.3U CN220023503U (en) | 2023-04-14 | 2023-04-14 | OLED large-chip substrate packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220023503U true CN220023503U (en) | 2023-11-14 |
Family
ID=88674766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320826705.3U Active CN220023503U (en) | 2023-04-14 | 2023-04-14 | OLED large-chip substrate packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220023503U (en) |
-
2023
- 2023-04-14 CN CN202320826705.3U patent/CN220023503U/en active Active
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