TWI594416B - Organic light emitting diode display and method of manufacturing the same - Google Patents

Description

Organic light emitting diode display and method of manufacturing same

Embodiments relate to organic light emitting diode displays and methods of making the same.

An organic light-emitting diode display is a self-luminous type display device including a hole injection electrode (anode), an electron injection electrode (cathode), and an organic light-emitting layer formed between the hole injection electrode and the electron injection electrode. The organic light-emitting diode display emits light by recombining electrons injected into the cathode and holes injected into the anode into the organic light-emitting layer and dissipating electrons and holes. Furthermore, organic light-emitting diode displays exhibit high quality characteristics such as low energy consumption, high brightness, and high reaction speed. Therefore, the organic light emitting diode display has been attracting attention as a display device of a next-generation portable electronic device.

The organic light emitting diode display includes an organic light emitting display panel having a thin film transistor and a display substrate on which the organic light emitting diode is formed. The organic light emitting diode includes a cathode, an anode, and an organic light emitting layer. Electrons and holes injected from the cathode and the anode respectively form excitons, and emit light when the excitons are switched to the ground state.

Embodiments are directed to an organic light emitting diode display including a display substrate including a display region having an organic light emitting diode; and a package substrate facing the display substrate and covering the display region a first sealing material between the display substrate and the package substrate, the first sealing material sealing the display area; the second sealing material contacting the exposed surface of the first sealing material and sealing the first sealing material; and surrounding each display The side surface and the outer corner of the substrate and the package substrate, and the molded portion of the surface is exposed outside the second sealing material.

The molded portion may be formed of a material having elasticity. The elastic material may comprise any one selected from the group consisting of rubber, urethane, and hydrazine.

The molded portion may be included in the hole passing through the thickness direction in a region in contact with the exposed surface of the second sealing material. A plurality of holes can be configured at regular intervals.

The first sealing material may be disposed on the inner side of the display substrate and the package substrate, and is spaced apart from the side surface of the display substrate and the package substrate. The second sealing material may be formed between the display substrate and the package substrate.

The exposed surface of the second sealing material may form a continuous smooth surface together with the side surface of the display substrate and the side surface of the package substrate.

The second sealing material covers the inner corners of the display substrate and the package substrate facing each other, the side surface of the display substrate, and the side surface of the package substrate. The molding portion may include a display substrate molding portion formed along an outer corner of the display substrate to surround a portion of the exposed surface outside the second sealing material, spaced apart from the display substrate molding portion, and formed along an outer corner of the package substrate A package substrate molding portion that exposes a portion of the surface outside the second sealing material, and a connection portion that connects the display substrate molding portion and the package substrate molding portion. A plurality of connection portions can be configured at regular intervals.

The embodiment is also directed to a method for manufacturing an organic light emitting diode display, comprising preparing a display substrate including a display region having an organic light emitting diode, preparing a package substrate, and forming a first sealing material on the package substrate and the display substrate. The display region is sealed, the molded portion is formed to surround the side surface and the outer corner of each of the display substrate and the package substrate, and the first sealing material is sealed between the first sealing material and the molded portion by forming a second sealing material.

The molded portion may include a hole formed through the thickness direction corresponding to a position where the first sealing material is located. Sealing the first sealing material may comprise injecting a second sealing material in a liquid state through the orifice. A plurality of holes can be configured at regular intervals.

The molded portion may further include a guiding portion connected to the tunnel, the guiding portion including a passage through which the injection unit is injected and the second sealing material is injected. The second sealing material can be injected into the tunnel through the guiding portion. The injection unit of the guiding portion may have an aperture that is larger than the aperture of the aperture.

The method may further include removing the guiding portion by cutting the guiding portion after injecting the second sealing material along the passage of the guiding portion.

The molded portion may be formed of a material having elasticity. The elastic material may comprise any one selected from the group consisting of rubber, urethane, and hydrazine.

The molded portion may include a display substrate molding portion formed along a corner of the display substrate to surround a portion of the exposed surface outside the second sealing material; spaced apart from the display substrate molding portion and formed along a corner of the package substrate a package substrate molding portion that exposes a portion of the surface outside the second sealing material; and a plurality of connection portions that connect the display substrate molding portion and the package substrate molding portion and are disposed at a predetermined interval. Sealing the first sealing material may include providing a second sealing material in a liquid state to inject the second sealing material via a space formed between the mutually spaced connecting portions.

100‧‧‧ display substrate

110‧‧‧Organic Luminescent Diodes

120‧‧‧ integrated circuit

200‧‧‧Package substrate

300‧‧‧First sealing material

400, 400a, 402, 402a‧‧‧second sealing material

410‧‧‧Exposed surface

500, 502‧ ‧ molded parts

510‧‧·Molding part of the main body

520‧‧‧Guide section

522‧‧‧ Hole

524‧‧‧ channel

526‧‧‧Injection unit

528‧‧‧insert unit

530‧‧‧Display substrate molding part

540‧‧‧Packaging part of the package substrate

550‧‧‧Connected section

550a‧‧‧ space

600‧‧‧Second sealing material injection device

700‧‧‧Tools

A10‧‧‧ display area

A20‧‧‧Pushing area

II-II, IVa-IVa, IVb-IVb, IXb-IXb, VI-VI, VIIb-VIIb, VIIIb-VIIIb, Xb-Xb, XIb-XIb‧‧ tangential

The features of the present invention will become apparent to those skilled in the art from a detailed description of the exemplary embodiments, in which: FIG. 1 shows an organic illumination according to an exemplary embodiment. The top view of the display panel.

Figure 2 is a partial cross-sectional view of the organic light-emitting display panel taken along line II-II of Figure 1 Surface map.

3 is a perspective view showing an organic light emitting diode display according to an exemplary embodiment.

4A is a partial cross-sectional view of the organic light emitting diode display along the line IVa-IVa of FIG. 3; FIG. 4B is an organic light emitting diode display along the line IVb-IVb of FIG. Partial section view.

Fig. 5 is a perspective view showing a molded portion according to an exemplary embodiment.

Fig. 6 is a partial cross-sectional view showing a molding portion taken along line VI-VI of Fig. 5.

FIGS. 7A, 8A, and 9A are top views showing stages of a method of fabricating an organic light emitting diode display according to an exemplary embodiment.

FIGS. 7B, 8B, and 9B are cross-sectional views showing stages of a method of fabricating an organic light emitting diode display according to an exemplary embodiment.

FIG. 10A is a perspective view showing an organic light emitting diode display according to another exemplary embodiment.

Fig. 10B is a partial cross-sectional view of the organic light emitting diode display panel taken along the line Xb-Xb of Fig. 10A.

11A is a top view showing a stage of a method of manufacturing an organic light emitting diode display according to another exemplary embodiment.

Fig. 11B is a cross-sectional view taken along line XIb-XIb of Fig. 11A.

Hereinafter, an organic light emitting diode display and a method of manufacturing the same will be referred to the accompanying drawings Detailed description. However, the organic light emitting diode display and the method of fabricating the same are not limited to the following exemplary embodiments but can be implemented in various different forms, and the present exemplary embodiments are provided to provide a complete disclosure and to provide those skilled in the art. A complete indication of the scope of the invention. In the drawings, the same reference numerals are used to refer to the same.

In the drawings, the thickness of layers, films, panels, regions, etc. are exaggerated for clarity. In the drawings, the thickness of layers and regions will be exaggerated for convenience of description and understanding. It should be understood that when a component such as a layer, film, region or substrate is referred to as "on" other components, it may be directly on the other components or intermediate components may also be present.

In addition, unless expressly stated to the contrary, the words "comprise" and variations such as "comprises" or "comprising" should be understood as implying the inclusion of a statement, without excluding any other components. . Further, in the specification, the text "on" refers to the upper or lower side of the target portion, but does not necessarily mean that it is located above the target portion based on the direction of gravity.

1 is a top view showing an organic light emitting display panel according to an exemplary embodiment, and FIG. 2 is a partial cross-sectional view of the organic light emitting display panel taken along line II-II of FIG. 1.

First, an organic light emitting display panel will be described. As shown in FIG. 1, the organic light emitting display panel is constructed to include the display substrate 100, the package substrate 200, and the first sealing material 300.

The display substrate 100 may be an insulating substrate formed of glass, quartz, ceramic, plastic, or the like, or may be a metal substrate formed of stainless steel or the like. The display substrate 100 may have light transmittance, light reflectivity, or light absorption. The display substrate 100 is divided into a line portion (not shown) and a display area A10 on which the organic light emitting diode 110 is placed, and a pad area A20 on which the integrated circuit is mounted.

The line portion formed in the display area A10 transmits a signal to the organic light emitting diode 110 to drive the organic light emitting diode 110. The organic light emitting diode 110 emits light according to a signal transmitted from the line portion. Although not shown in the drawings, the organic light emitting diode 110 is constructed to include an anode electrode, An organic light emitting layer and a cathode electrode. In addition to performing the luminescent layer, the organic luminescent layer may further comprise an organic layer that efficiently transports electrons or holes to the luminescent layer. The organic layer may be a hole injection layer (HIL) and a hole transport layer (HTL) disposed between the anode and the light emitting layer, and an electron injection layer (EIL) and an electron transport layer disposed between the cathode and the light emitting layer ( ETL).

In the organic light-emitting diode 110, if a predetermined voltage is applied to the anode electrode and the cathode electrode, the hole injected from the anode electrode moves to the light-emitting layer via the hole transport layer (HTL), and the electrons injected from the cathode electrode pass through the electron. An transport layer (ETL) is injected into the light emitting layer. In this example, electrons and holes are recombined to form excitons in the light-emitting layer, and the excitons change from an excited state to a ground state to allow the fluorescent molecules of the light-emitting layer to emit light, thereby forming an image. The organic light emitting diode 110 receives the signal from the line portion and displays the image based on the received signal. The word "pixel" refers to the smallest unit that displays an image. An organic light emitting diode display displays an image by using a plurality of images.

If the organic light-emitting diode 110 reacts with moisture or oxygen, its performance may be deteriorated. Therefore, the package substrate 200 is provided on the display region A10 to prevent the penetration of moisture and oxygen to face the display substrate 100. The package substrate 200 may be formed of a metal material or a transparent material such as glass. Further, a moisture absorbent (not shown) may be formed on the package substrate 200 in order to absorb moisture. Since the package substrate 200 covers the display area A10 of the display substrate 100 except for the pad area A20, the package substrate 200 is formed smaller than the display substrate 100 and disposed in the display substrate 100.

The first sealing material 300 is a member for sealing the display region A10 and is formed between the display substrate 100 and the package substrate 200. The first sealing material 300 is disposed along the display area A10 of the display substrate 100 and the edge of the package substrate 200, and the display substrate 100 and the package substrate 200 are attached to each other to seal the display substrate 100 and the package substrate 200. The first sealing material 300 may be spaced apart from the corners of the surface of the attached display substrate 100 and the package substrate 200 at a predetermined interval. The first sealing material 300 may be disposed on the inner side of the display substrate 100 and the package substrate 200 instead of the side surface thereof. Herein, the term "internal" of the display substrate 100 and the package substrate 200 means that the substrate 100 is displayed. The side facing the package substrate 200. The term "internal corner" refers to the corner formed by the intersection of the inner side and the side. The term "external corner" refers to a corner formed by the intersection of the side and the main outer surface of the display substrate 100 or the package substrate 200.

The first sealing material 300 may comprise any one selected from the group consisting of epoxy, acrylate, urethane acrylate, and cyanoacrylate. The first sealing material 300 may be liquid-coated on the display substrate 100 to be ultraviolet (UV) cured, thermally cured, or naturally cured. For example, in the example in which the first sealing material 300 includes an epoxy resin, an acrylate, and a urethane acrylate, the first sealing material 300 may be cured by ultraviolet rays (UV), and in the case where the first sealing material 300 contains an acrylate, The first sealing material 300 may be thermally cured at a temperature of less than 80 ° C, and in the case where the first sealing material 300 includes a cyanoacrylate, the first sealing material 300 may be naturally cured.

3 is a perspective view showing an organic light emitting diode display according to an exemplary embodiment, and FIGS. 4A and 4B are organic light rays tangential to IVa-IVa and IVb-IVb of FIG. 3, respectively. A partial cross-sectional view of a diode display.

Referring to the drawings, an organic light emitting diode display is constructed to include a display substrate 100, a package substrate 200, a first sealing material 300, a second sealing material 400, and a molded portion 500, according to an exemplary embodiment.

Since the display substrate 100, the package substrate 200, and the first sealing material 300 have been described in the above-described organic light-emitting display panel, the following description will be omitted.

The second sealing material 400 is used to seal the members of the first sealing material 300. As shown in FIGS. 4A and 4B, the second sealing material 400 is in contact with the exposed surface of the first sealing material 300. Like the first sealing material 300, the second sealing material 400 may comprise any one selected from the group consisting of epoxy resin, acrylate, urethane acrylate or cyanoacrylate, but not limited thereto, and may be selected from various A material that prevents moisture from penetrating. The first sealing material 300 is disposed on the inner side instead of the side of the display substrate 100 In the example of the surface and the side surface of the package substrate 200, the second sealing material 400 may be formed between the display substrate 100 and the package substrate 200 to seal the first sealing material 300. In this example, as shown in FIG. 4A, the outer exposed surface 410 of the second sealing material 400 may form a continuous smooth surface together with the side surface of the display substrate 100 and the side surface of the package substrate 200.

Fig. 5 is a perspective view showing a molded portion according to an exemplary embodiment, and Fig. 6 is a partial cross-sectional view showing a molded portion along a line VI-VI of Fig. 5.

The molded portion 500 is used to protect the side surfaces of the display substrate 100 and the package substrate 200 from the external corners and to seal the structure of the second sealing material 400. The molded portion 500 may be formed along the outer corners of the display substrate 100 and the package substrate 200 to include the molded portion body 510 surrounding the corners and the side surfaces. For example, as shown in FIG. 3, in the example in which the display substrate 100 is formed into a rectangular shape, the display substrate corresponds to the display area A10 except for the corner corresponding to the portion of the pad area A20 and surrounds the package substrate 200. side.

The molded portion 500 may include any one of rubber, urethane, and enamel selected from materials that are elastic, but is not limited thereto, and various materials having elasticity and restoring force may be selected.

The molded portion 500 may further include a hole 522 that passes through a thickness direction of a region in contact with the exposed surface 410 of the second sealing material 400, that is, a molded portion main body 510 (see also FIG. 4B) corresponding to the display substrate The area of the space between the 100 and the package substrate 200. The tunnel 522 allows injection of a liquid second sealing material 400. A plurality of channels can be provided at a predetermined interval.

As shown in FIG. 6, the molded portion 500 may further include a connecting portion 520 having a connecting passage 522 and having a passage 524 through which the second sealing material 400 is injected from the outside of the molded portion main body 510 to make the liquid portion The second sealing material 400 is easily injected into the injection unit 526. The second sealing material 400 may be injected into the tunnel 522 along the guiding portion 520. The diameter of the passage 524 of the guiding portion 520 can be reduced toward the direction of the tunnel 522, and the diameter of the injection unit 526 of the guiding portion 520 can be larger than that of the tunnel. The aperture of 522 is preferred. If the aperture of the injection unit 526 of the guiding portion 520 is large, the second sealing material 400 can be easily injected, and if the aperture of the opening 522 is small, the molding portion 500 can firmly seal the second sealing material 400. The guiding portion 520 may be integrally formed with the molded portion body 510. After the second sealing material 400 is injected, the guiding portion 520 can be cut by the molding portion main body 510 by the cutter 700.

Hereinafter, a method of manufacturing an organic light emitting diode display according to an exemplary embodiment will be described with reference to the accompanying drawings.

7A, 8A, and 9A are top views showing stages of a method of manufacturing an organic light emitting diode display according to an exemplary embodiment, and FIGS. 7B, 8B, and 9B are displays. A cross-sectional view of a stage of a method of fabricating an organic light emitting diode display in accordance with an exemplary embodiment.

A method of manufacturing an organic light emitting diode display according to an exemplary embodiment includes preparing a display substrate 100, preparing a package substrate 200, forming a first sealing material 300, forming a molded portion 500, and forming a second sealing material 400.

As described above, the display substrate 100 to be divided into the wiring portion (not shown) and the display region A10 where the organic light-emitting diode 110 is located and the pad region A20 on which the integrated circuit is mounted is prepared. The package substrate 200 covering the display area A10 is prepared.

Then, the display substrate 100 and the package substrate 200 are attached to each other and sealed by forming the first sealing material 300 along the display area A10 of the display substrate 100 and the edge of the package substrate 200. The first sealing material 300 may be applied to the display substrate 100 or the package substrate 200 in a liquid form, and then cured by a method such as ultraviolet (UV) curing, heat curing or natural curing. The first sealing material 300 is spaced apart from the edge of the surface of the attached display substrate 100 and the package substrate 200 at a predetermined interval, and thus is disposed on the inner side instead of the side surface of the display substrate 100 and the side surface of the package substrate 200.

The molding portion 500 is formed to surround the side surface and the outer corner of each of the attached display substrate 100 and the package substrate 200. In this example, as shown in FIG. 7A, the attached display substrate 100 and The package substrate 200 can be inserted through an insertion unit 528 (refer to FIG. 4) formed on one side of the molded portion main body 510. A tunnel 522 and a guiding portion 520 for injecting the liquid second sealing material 400 may be further formed in the molding portion 500. The hole 522 is formed at a position corresponding to the first sealing material 300 disposed between the display substrate 100 or the package substrate 200.

After the molding portion 500 is formed, the first sealing material 300 is sealed between the first sealing material 300 and the molded portion 500 by forming the second sealing material 400. The second sealing material 400 provided in a liquid form having an appropriate viscosity is injected into the space between the first sealing material 300 and the molded portion 500 via the holes 522 or the guiding portion 520 connected to the holes 522 to fill therein. As shown in FIGS. 8A and 8B, the liquid second sealing material 400 can be injected by connecting the second sealing material injection device 600 to the injection unit of the tunnel 522 or the guiding portion 520. An injection device such as a syringe can be used as the second sealing material injection device 600. As described above, when the liquid second sealing material is injected through the tunnel 522 or the guiding portion 520 to form the second sealing material, it may prevent the liquid sealing material from splashing or flowing down.

In the example of forming the plurality of cells 522 or the guiding portion 520, the liquid second sealing material 400 is sequentially injected into each of the cells 522 or the guiding portion 520, which prevents the occurrence of the region where the second sealing material 400 is not formed.

After the second sealing material 400 is injected along the passage of the guiding portion 520, the guiding portion 520 can be cut by the cutter 700 to be removed. After the second sealing material 400 is injected, it is cured to attach the display substrate 100, the package substrate 200, and the molded portion 500.

An organic light emitting diode display according to another exemplary embodiment will be described below.

10A is a perspective view showing an organic light emitting diode display according to another exemplary embodiment, and FIG. 10B is a partial cross section of the organic light emitting diode display along the Xb-Xb tangent to FIG. 10A. Figure.

Because the organic light emitting diode display according to another exemplary embodiment is the same as described above The exemplary embodiment has the same configuration except for the modified second sealing material 402 and the molded portion 502, and only the modified configuration will be described hereinafter. The same reference numerals are used to indicate the same components as the above-described exemplary embodiments.

The second sealing material 402 may cover the exposed surface of the first sealing material 300, the space between the display substrate 100 and the package substrate 200, the inner corners of the display substrate 100 and the package substrate 200 facing each other, and the display substrate 100. The side surface and the side surface of the package substrate 200.

The molding portion 502 may be configured to include a display substrate molding portion 530 surrounding an outer corner of the display substrate 100, a package substrate molding portion 540 surrounding an outer corner of the package substrate 200, and a connection display substrate molding portion 530 and a package substrate mold. The connecting portion 550 of the portion 540. As shown in FIG. 10B, the display substrate molding portion 530 surrounds a portion of the second sealing material 402 covering the inner corner of the display substrate 100, and the package substrate molding portion 540 surrounds the second inner corner of the package substrate 200. A portion of the sealing material 402. That is, the molded portion 502 can protect the end of the second sealing material 402 to prevent peeling of the second sealing material 402.

The connection portion 550 connects the display substrate molding portion 530 and the package substrate molding portion 540 which are spatially separated from each other. A plurality of connection portions spaced and arranged at predetermined intervals are provided. The space 550a is formed as a space between the plurality of connection portions 550 spaced apart from each other. The liquid second sealing material 402 can be injected through the space.

Hereinafter, a method of manufacturing an organic light emitting diode display according to another exemplary embodiment will be described.

Fig. 11A is a top view showing a stage of a method of manufacturing an organic light emitting diode display according to another exemplary embodiment, and Fig. 11B is a cross-sectional view taken along line XIb-XIb of Fig. 11A.

The method of manufacturing an organic light emitting diode display according to another exemplary embodiment is similar to the manufacturing method of the foregoing exemplary embodiment except that the modified molding portion 502 is formed. Formed with the second sealing material 402, only the modified portion will be described. The same reference numerals are used to indicate the same members as in the manufacturing method of the above-described exemplary embodiment.

The molding portion 502 is formed to surround side surfaces and outer corners of the display substrate 100 and the package substrate 200 attached to each other. The display substrate molding portion 530 surrounds a portion of the second sealing material 402 covering the inner corner of the display substrate 100, and the molding portion 502 is disposed such that the package substrate molding portion 540 surrounds the inner corner of the package substrate 200. A portion of the second sealing material 402.

After the molding portion 500 is formed, the first sealing material 300 is sealed by forming the second sealing material 402 between the first sealing material 300 and the molding portion 500. The second sealing material 400 provided in a liquid form having an appropriate viscosity is injected through all the spaces 550a formed between the plurality of connecting portions 550 to fill the space between the first sealing material 300 and the molded portion 500.

By summarizing and reviewing, if an organic light-emitting diode containing an organic material is contaminated with moisture and oxygen, its performance may be degraded. Therefore, in organic light-emitting display panels, packaging techniques are used to reduce and/or prevent the possibility of moisture and oxygen permeation.

The packaging technology including the package substrate is for attaching the display substrate on which the organic light emitting diode is formed to the package substrate having the sealing material. However, due to the nature of the sealing material, this method may not adequately prevent the penetration of moisture and oxygen. Therefore, organic light-emitting diodes fabricated by packaging technology may have life limitations.

Conversely, according to an exemplary embodiment, the penetration of external moisture and oxygen can be effectively suppressed to reduce and/or prevent the possibility of occurrence of cracks in the sealing material, thereby reducing and/or preventing breakage of the organic light emitting diode display. The possibility and improvement of the life of the package for the organic light-emitting diode is improved. The structure of the organic light-emitting diode display prevents moisture and oxygen from entering it.

Further, in the method of manufacturing an organic light emitting diode display, when the liquid sealing material is injected, splashing or bleeding of the sealing material can be reduced or prevented. Therefore, it is possible to prevent waste of the sealing material, thereby increasing production efficiency.

Although the present invention has been described in connection with the presently preferred embodiments, it is understood that the invention is not limited to the disclosed embodiments. Modifications and equivalent configurations.

100‧‧‧ display substrate

500‧‧‧Molded parts

522‧‧‧ Hole

A10‧‧‧ display area

A20‧‧‧Pushing area

IVa-IVa‧‧‧ Tangent

IVb-IVb‧‧‧ Tangent

Claims (16)

An organic light emitting diode display comprising: a display substrate comprising a display region having an organic light emitting diode; a package substrate facing the display substrate and covering the display region; a first sealing material The first sealing material seals the display area between the display substrate and the package substrate; a second sealing material contacts an outer exposed surface of the first sealing material and seals the first sealing material; and a molding a portion surrounding a side surface and an outer corner of each of the display substrate and the package substrate, and surrounding an outer exposed surface of the second sealing material, wherein the molded portion is included in the outer portion of the second sealing material One of the areas of the exposed surface contact passes through one of the channels in the thickness direction. The organic light emitting diode display of claim 1, wherein the molded portion is formed of a material having elasticity. The organic light-emitting diode display of claim 2, wherein the elastic material comprises any one selected from the group consisting of rubber, urethane and hydrazine. The organic light emitting diode display of claim 1, wherein the plurality of the channels are arranged at a predetermined interval. The organic light emitting diode display of claim 1, wherein: The first sealing material is disposed on the inner side of the display substrate and the package substrate, and is separated from one side surface of the display substrate and one side surface of the package substrate, and the second sealing material is formed on the display. Between the substrate and the package substrate. The OLED display of claim 5, wherein the external exposed surface of the second sealing material forms a continuous smoothness with the side surface of the display substrate and the side surface of the package substrate. surface. An organic light emitting diode display comprising: a display substrate comprising a display region having an organic light emitting diode; a package substrate facing the display substrate and covering the display region; a first sealing material The first sealing material seals the display area between the display substrate and the package substrate; a second sealing material contacts an outer exposed surface of the first sealing material and seals the first sealing material; and a molding a portion surrounding a side surface and an outer corner of each of the display substrate and the package substrate, and surrounding an outer exposed surface of the second sealing material, wherein the second sealing material covers the display substrate and the package substrate a plurality of inner corners facing each other, the side surface of the display substrate, and the side surface of the package substrate, and wherein the molding portion includes: a display substrate molding portion along an outer side of the display substrate An angle is formed to surround a portion of the outer exposed surface of the second sealing material, a package substrate molding portion spaced apart from the display substrate molding portion and formed along an outer corner of the package substrate to surround the portion of the outer exposed surface of the second sealing material, and a connecting portion connecting the The substrate molding portion and the package substrate molding portion are displayed, and wherein: the plurality of connection portions are disposed at a predetermined interval. A method for manufacturing an organic light emitting diode display, the method comprising: preparing a display substrate comprising a display region having an organic light emitting diode; preparing a package substrate; forming a first sealing material on the package substrate Sealing the display area with the display substrate; forming a molding portion to surround one side surface and one outer corner of each of the display substrate and the package substrate, the molding portion being included corresponding to the first sealing material a position forming a hole through the thickness direction; and sealing the first sealing material by forming a second sealing material between the first sealing material and the molded portion. The method of manufacturing an organic light emitting diode display according to claim 8, wherein: sealing the first sealing material comprises injecting the second sealing material in a liquid state through the opening. The method for manufacturing an organic light emitting diode display as described in claim 9 The method wherein: the plurality of the channels are arranged at a predetermined interval. The method of manufacturing an organic light emitting diode display according to claim 10, wherein the molded portion further comprises a guiding portion connected to the opening, the guiding portion comprising an injection unit on an outer side thereof The second sealing material is injected through one of the channels; and the second sealing material is injected into the channel through the guiding portion. The method of manufacturing an organic light emitting diode display according to claim 11, wherein the injection unit of the guiding portion has an aperture larger than an aperture of the aperture. The method of manufacturing an organic light emitting diode display according to claim 11, further comprising, after the second sealing material is injected along the channel of the guiding portion, by cutting the guiding portion Remove the guide section. The method of manufacturing an organic light emitting diode display according to claim 8, wherein the molded portion is formed of a material having elasticity. The method of manufacturing an organic light-emitting diode display according to claim 14, wherein the elastic material comprises any one selected from the group consisting of rubber, urethane and hydrazine. A method of fabricating an organic light emitting diode display, the method comprising: Preparing a display substrate including a display region having an organic light emitting diode; preparing a package substrate; forming a first sealing material between the package substrate and the display substrate to seal the display region; forming a mold Forming a portion around a side surface and an outer corner of each of the display substrate and the package substrate; and sealing a first sealing material between the first sealing material and the molding portion by forming a second sealing material Wherein the molding portion comprises: a display substrate molding portion formed along an outer corner of the display substrate to surround a portion of the outer exposed surface of the second sealing material, a package substrate molding portion, and the display The substrate molding portion is spaced apart and formed along an outer corner of the package substrate to surround the portion of the outer exposed surface of the second sealing material, and a plurality of connecting portions connecting the display substrate molding portion and the package a substrate molding portion and disposed at a predetermined interval, and wherein sealing the first sealing material comprises providing the second sealing material in a liquid state to form via the phase Spaced apart from one of the plurality of the second seal material is injected into the space between the connection portion.