CN220021044U - Wafer wet immersion type photoresist remover - Google Patents

Abstract

The utility model provides a wafer wet immersion type photoresist remover, which comprises a sealed shell, wherein a soaking tank is designed in the shell, an air extraction module is arranged above the soaking tank, and a sealing cover capable of being opened in a back-and-forth moving way is arranged at the upper part of the soaking tank; the left and right sides of the soaking tank are respectively provided with a material receiving table and a material discharging table which are arranged on the same horizontal plane, the bottom of the soaking tank is provided with a lifting table capable of moving up and down, the upper parts of the wafer box, the soaking tank and the material discharging table are provided with a material pushing module, a pushing block of the material pushing module moves from right to left, the wafer box on the lifting table is pushed to the position of the material receiving table, and the wafer box on the material discharging table is pushed to the lifting table. The machine is sealed by the double layers of the shell and the sealing cover, and has good sealing effect. The machine simultaneously carries out the material collecting and discharging of the wafer in the soaking tank through the material pushing module, greatly improves the material changing efficiency, reduces the dissipation of gas in the shell, and improves the use effect of the liquid medicine in the soaking tank.

Description

Wafer wet immersion type photoresist remover

Technical Field

The utility model relates to the technical field of wafer processing, in particular to a wafer wet immersion type photoresist remover.

Background

During wafer processing, residual glue often remains on the wafer after etching, and the glue on the wafer is often removed by dipping. In the wet process of immersing and removing photoresist, a large amount of harmful gas is often generated, so that an immersing tank for immersing the wafer needs to be sealed, and an air extraction structure needs to be added in immersing equipment. A dipping photoresist stripper as in patent No. 202111487556.4, although the apparatus is sealed with a suction structure, the dipping tank is not sealed separately, so that the harmful gas is still dissipated into the factory when the wafer is taken. Meanwhile, when the conventional wafer soaking equipment is used for soaking Chi Fangzhi wafers in the wafer box and taking out the soaked wafers, the steps are needed, the whole production process is longer, the production efficiency is lowered, and meanwhile, the soaking tank is opened, so that the traditional Chinese medicine liquid in the soaking tank is exposed in the air for a long time, the use effect of the liquid medicine is affected, and meanwhile, harmful gas is easy to escape in a production workshop.

Disclosure of Invention

Aiming at the problems, the utility model provides the wafer wet immersion type photoresist remover which has a simple structure and a double-layer sealing structure and can be used for rapidly taking and replacing wafers.

The technical scheme adopted for solving the technical problems is as follows: the wafer wet immersion type photoresist remover comprises a sealed shell, wherein a soaking tank filled with soaking solution is designed in the shell, an air extraction module is arranged above the soaking tank, and a sealing cover capable of being opened in a back-and-forth moving way is arranged at the upper part of the soaking tank; the device comprises a soaking tank, a material collecting table, a material discharging table, a lifting table, a material pushing module and a material pushing module, wherein the material collecting table and the material discharging table are respectively assembled on the left side and the right side of the soaking tank on the same horizontal plane, the lifting table can move up and down, when the lifting table moves to the upper portion, the lifting table is flush with the material collecting table and the material discharging table, a hollowed-out wafer box filled with wafers is placed on the upper portion of the lifting table, the material pushing module is assembled on the upper portion of the material discharging table, the wafer box, the soaking tank and the upper portion of the material discharging table are used for containing wafers to be soaked, the material pushing module comprises two groups of pushing blocks capable of moving left and right, the lower portion of each pushing block stretches into the side edges of the two wafer boxes, and when the pushing blocks move from the right side to the left side, the wafer box on the lifting table is pushed to the material collecting table, and the wafer box on the material discharging table is pushed onto the lifting table.

Preferably, the pushing module comprises two horizontal transverse rails, the transverse rails and the two pushing blocks penetrate through and are assembled in a sliding mode, a transverse motor is arranged on the left side of the transverse rails, horizontal screws parallel to the transverse rails and penetrating through the two pushing blocks are arranged on the transverse motor, and the horizontal screws are assembled with the two pushing blocks in a threaded mode.

Preferably, a front motor and a rear motor are arranged at the rear part of the sealing cover, a horizontal front screw and a horizontal rear screw are arranged on the front motor and the rear motor, and the front screw and the rear screw are in threaded fit with the rear end of the sealing cover.

Preferably, the bottom of the soaking tank is provided with an upper motor and a lower motor, the upper part of the upper motor and the lower motor is provided with a vertical upper screw rod and a vertical lower screw rod, the upper screw rod and the lower screw rod are connected with two vertical lifting columns through a screw rod transmission structure, the upper ends of the lifting columns penetrate through the bottom of the soaking tank and are fixedly connected with the bottom of the lifting table, and the lifting columns are assembled with the bottom of the soaking tank in a sliding sealing manner.

Preferably, the lifting platform is in a hollowed-out design.

Preferably, the soaking tank is square, vertical guide rails are designed on the front and rear wall surfaces in the soaking tank, and notches matched with the guide rails are designed on the front and rear surfaces of the lifting table.

Preferably, the material receiving table adopts a hollowed-out design, and a liquid draining pool is arranged at the lower part of the material receiving table.

Preferably, an inclined edge is formed on the upper part of one side of the material receiving table, which is close to the soaking tank.

Preferably, the upper part of the discharging table is provided with a protruding stop block with an L-shaped top view.

The utility model has the beneficial effects that: when the wafer wet immersion type photoresist remover is used, a wafer is placed through the wafer box, and the wafer box is immersed in the immersion tank along with the wafer. The soaking pond upper portion has sealed lid in this patent, and the machine just has casing and sealed double-deck seal structure of sealed lid like this, and sealed effect is better, seals the lid when the wafer soaks simultaneously and closes, and the bleed module opens, can take out the residual harm gas in the casing, then opens the casing again and get the material, and the whole soaking process just does not have harmful gas to escape in the workshop like this. In the patent, firstly, a wafer to be soaked is placed on the discharging table through a wafer box, when the wafer soaking and photoresist removing are completed, the wafer box with the photoresist removed is lifted to an upper position through a lifting table, at the moment, the two wafer boxes are on the same plane, at the moment, a pushing module starts to work, drives two pushing blocks to move from right to left simultaneously through a screw rod structure, the left pushing block pushes the soaked wafer and the wafer box to a collecting table from the lifting table, the right pushing block pushes the wafer to be soaked and the wafer box to the lifting table from the discharging table, and then the lifting table descends to soak the wafer box and the wafer in liquid medicine for soaking. The machine carries out the receipts blowing of wafer at the soaking tank simultaneously through two ejector blades of pushing module like this, improves the efficiency of reloading greatly for the sealed lid of soaking tank top opens time extremely short, can further reduce gaseous loss like this and arrive in the casing, improves the result of use of liquid medicine in the soaking tank. And when the wafers in the soaking tank are collected and discharged, the shell keeps a sealing state, so that the gas is prevented from escaping.

Drawings

Fig. 1 is a schematic view of the front surface of a wafer during immersion in a wet immersion photoresist remover.

Fig. 2 is a schematic structural diagram of the wafer wet immersion type photoresist remover before the completion of the material replacement.

Fig. 3 is a schematic structural diagram of a wafer after finishing the material change by soaking in the wet immersion type photoresist remover.

Fig. 4 is a schematic view in the direction A-A in fig. 1.

Fig. 5 is a schematic view of the structure of the B-B directional soaking tank in fig. 1.

Detailed Description

The utility model is further illustrated by the following examples:

in this patent, directional terms are used in relation to each other based on the orientation or positional relation of the figure shown in fig. 1, only for simplifying the description of the present utility model, not indicating the specific orientation that the device or element must have, and thus should not be construed as limiting the present utility model.

In this embodiment, as shown in fig. 1, 2 and 3, the wafer wet immersion type photoresist remover includes a sealed housing 1, a soaking tank 2 filled with a soaking solution is designed in the housing 1, and the soaking tank 2 has a structure similar to a conventional structure, such as heating, on the inner side, and will not be described in detail herein. An air extraction module 3 is arranged above the soaking tank 2, and meanwhile, an air inlet module for introducing clean air into the machine shell 1 is designed. In this example, the upper part of the soaking tank 2 is provided with a sealing cover 21 which can be opened in a back-and-forth movement; the left and right sides of the soaking tank 2 are respectively provided with a receiving table 4 and a discharging table 5 which are arranged on the same horizontal plane, and the bottom of the soaking tank 2 is provided with a lifting table 22 which can move up and down. When the lifting table 22 moves to the upper part, as shown in fig. 2, the lifting table 22 is flush with the upper parts of the material receiving table 4 and the material discharging table 5. The upper portion of elevating platform 22 has placed the fretwork wafer case 6 that is equipped with the wafer, the placing table has placed hold the wafer case 6 of waiting to soak the wafer, soaking tank 2, the upper portion of blowing platform 5 are equipped with pushing module 7, pushing module 7 is including two sets of kicking blocks 71 that can move about, the lower part of kicking block 71 stretches into the side of two wafer cases 6, when the kicking block 71 moves from right to left, the wafer case 6 on the elevating platform 22 is promoted to receive the material platform 4 position, the wafer case 6 on the blowing platform 5 is promoted to elevating platform 22.

When the wafer wet immersion type photoresist remover is used, wafers are arranged in hollowed-out wafer boxes, and a solution for immersing the wafers is filled in the immersion tank 2. When the equipment is just started to be used, the front door of the shell 1 is opened, the wafer box 6 filled with wafers to be soaked is placed on the material placing table, then the front door of the shell 1 is closed, and the air extraction module 3 is opened. The door frame at the front of the casing 1 is opened, the sealing cover 21 is opened, the lifting table 22 is lifted to the upper position, and the wafer box 6 is pushed onto the lifting table 22 by the pushing block 71 of the pushing module 7. Then the lifting table 22 drives the wafer box 6 to sink into the liquid medicine in the soaking tank 2, and the sealing cover 21 is closed. The wafer cassette 6 is immersed simultaneously with the wafers in the immersion tank 2. The soaking pond 2 upper portion has sealed lid 21 in this patent, and the machine of just having casing 1 and sealed lid 21 bilayer seal structure like this, sealed effect is better, and sealed lid 21 is closed when the wafer soaks simultaneously, and the air extraction module 3 opens, can take out the residual harm gas in the casing 1, then opens casing 1 again and get the material, and the whole soaking process just does not have harmful gas dissipation to the workshop like this in.

Before the wafer is soaked in the soaking tank 2, the front door of the casing 1 is opened, and the wafer to be soaked is placed on the discharging table 5 through the wafer box 6, at this time, as shown in fig. 1. When the wafer soaking and photoresist removing in the soaking tank 2 are completed, the photoresist-removed wafer box 6 together with the wafers are lifted to the upper position by the lifting table 22, and at this time, as shown in fig. 2, the two wafer boxes 6 are on the same plane. Then, the pushing module 7 starts to work, and drives the two pushing blocks 71 to move from right to left simultaneously through the screw rod structure, the left pushing block 71 pushes the soaked wafer and the wafer box 6 from the lifting table 22 to the receiving table 4, and the right pushing block 71 pushes the wafer and the wafer box 6 to be soaked from the discharging table 5 to the lifting table 22, as shown in fig. 3. Then the lifting table 22 descends to soak the wafer box 6 together with the wafers in the chemical solution, and the wafers are soaked. At this time, the air extraction module 3 is started, when air extraction is completed, the front door of the machine shell is opened, the soaked wafer box is taken out, and the wafer box 6 to be soaked is placed on the discharging table 5. Thus, a picking and discharging period is completed, and the wafer can be continuously soaked by repeating the process. The machine carries out the collection and the discharge of the wafer in the soaking tank 2 simultaneously through the two pushing blocks 71 of the pushing module 7, greatly improves the material changing efficiency, ensures that the opening time of the sealing cover 21 above the soaking tank 2 is extremely short, can further reduce the dissipation of gas into the machine shell, and improves the use effect of the liquid medicine in the soaking tank 2. And when collecting and discharging the wafers in the soaking tank 2, the shell 1 keeps a sealing state, so that the gas is prevented from escaping.

In a specific design, as shown in fig. 1 and fig. 4, the pushing module 7 includes two parallel horizontal rails 72, the horizontal rails 72 and the two groups of pushing blocks 71 are assembled in a penetrating and sliding manner, a transverse motor 73 is assembled on the left side of the transverse rails 72, the transverse motor 73 is positioned in a forward and reverse direction, a horizontal screw 74 parallel to the horizontal rails and penetrating through the two groups of pushing blocks is assembled on the transverse motor 73, and the horizontal screw 74 is assembled with the two groups of pushing blocks 71 in a threaded manner. When the pushing module 7 starts to work, the transverse motor 73 starts to work to drive the horizontal screw 74 to rotate, and the pushing block moves forward when the horizontal screw 74 rotates due to the limit of the transverse track 72. The design of the two transverse rails 72 makes the movement of the push block 71 smoother. Meanwhile, in the present patent, the horizontal screw 74 synchronously controls the two pushing blocks 71, so that the simultaneous material taking and discharging is ensured. The control structure of the sealing cover 21 is similar to that of the pushing module, a front motor 23 and a rear motor 23 are assembled at the rear part of the sealing cover 21, a horizontal front screw 24 and a horizontal rear screw 24 are assembled on the front motor 23 and the rear screw 24 are assembled with the rear end of the sealing cover 21 in a threaded manner. Thus, the front and back motor 23 can open and close the sealing cover 21, which is convenient for automatic control.

As shown in fig. 1 and 2, the bottom of the soaking tank 2 is provided with an upper motor 25, the upper part of the upper motor 25 is provided with a vertical upper screw rod 26 and a vertical lower screw rod 26, the upper screw rod 26 is connected with two vertical lifting columns 27 through a screw rod transmission structure, the upper ends of the lifting columns 27 penetrate through the bottom of the soaking tank 2 and are fixedly connected with the bottom of the lifting table 22, and the lifting columns 27 are assembled with the bottom of the soaking tank 2 in a sliding sealing manner. In this embodiment, the control structure of the lifting table 22 is designed at the lower part of the soaking tank 2, so that the structure of the upper part of the soaking tank is simpler, and parts or materials are not easy to interfere when moving during material collection and discharging. Specifically, when the lifting table 22 needs to be controlled to ascend or descend, the upper and lower motors 25 are started, the upper and lower screws 26 rotate, and at this time, the lifting column 27 is limited by the bottom of the soaking tank 2 and cannot rotate along with the limiting, so that the lifting column 27 drives the lifting table 22 to move up and down.

In a specific design, the lifting platform 22 adopts a hollowed-out design. Thus, when the lifting table 22 moves up and down, the resistance in the liquid medicine is smaller, and the movement process is smoother. As shown in fig. 1 and 2, the soaking tank 2 is square, vertical guide rails are designed on front and rear wall surfaces in the soaking tank 2, and notches 221 matched with the guide rails are designed on front and rear surfaces of the lifting table 22. The notch 221 is engaged with the guide rail, so that the operation of the lifting platform is more stable.

In a specific design, the material receiving platform 4 adopts a hollowed-out design, and a liquid draining tank 41 is arranged at the lower part of the material receiving platform. When the soaked wafer box 6 on the lifting table 22 moves to the material receiving table 4, the residual liquid medicine can directly flow into the liquid draining pool 41 through the hollowed material receiving table 4, so that dryness of the wafer and the wafer box 6 when the wafer box 6 is taken out from the casing 1 is ensured. As shown in fig. 2, an inclined edge is formed on the upper part of one side of the material receiving table 4, which is close to the soaking tank. In this way, when the right side of the receiving table 4 is not level with the lifting table 22, the wafer box 6 can be smoothly pushed onto the receiving table 4 from the lifting table 22. As shown in fig. 1 and 4, the upper part of the discharging table 5 is provided with a protruding stopper 51 having an L-shaped top view. The protruding stop block 51 can limit the position of the wafer box 6 placed in the discharging platform 5, so that the wafer box 6 can be accurately pushed onto the lifting platform by the pushing block 71 of the pushing module 7. In this embodiment, the wafer box 6 has a rectangular shape, so that the L shape of the protruding stopper 51 can just limit the right rear of the wafer box 51.

The above embodiments are merely preferred embodiments of the present utility model and are not intended to limit the present utility model, and any modifications, equivalent substitutions, improvements, etc. within the spirit and principle of the present utility model should be included in the scope of the present utility model.

Claims (9)

1. The wafer wet immersion type photoresist remover comprises a sealed machine shell (1), wherein a soaking tank (2) filled with a soaking solution is designed in the machine shell (1), an air extraction module (3) is arranged above the soaking tank (2), and a sealing cover (21) capable of being opened in a front-back movement manner is arranged at the upper part of the soaking tank (2); the method is characterized in that: the device is characterized in that a material collecting table (4) and a material placing table (5) which are arranged on the same horizontal plane are respectively assembled at the left side and the right side of the soaking tank (2), a lifting table (22) which can move up and down is assembled at the bottom of the soaking tank (2), when the lifting table (22) moves to the upper part, the lifting table (22) is flush with the material collecting table (4) and the material placing table (5), a hollowed-out wafer box (6) filled with wafers is arranged on the upper part of the lifting table (22), a material pushing module (7) is arranged on the upper part of the material placing table (5) and used for containing the wafers to be soaked, the material pushing module (7) comprises two groups of pushing blocks (71) which can move left and right, the lower parts of the pushing blocks (71) extend into the sides of the two wafer boxes (6), when the pushing blocks (71) move from the right side to the left side, the pushing boxes (6) on the lifting table (22) are pushed by the wafer boxes (6) to the material pushing modules (4), and the upper parts of the material pushing modules (7) are assembled on the upper parts of the wafer boxes (6) and the material pushing modules (5).

2. The wafer immersion wet photoresist remover according to claim 1, wherein: the pushing module (7) comprises two horizontal transverse rails (72), the transverse rails (72) and the two pushing blocks (71) penetrate through transverse sliding assembly, a transverse motor (73) is arranged on the left side of the transverse rails (72), horizontal screws (74) parallel to the transverse rails and penetrating through the two pushing blocks are arranged on the transverse motor (73), and the horizontal screws (74) are assembled with the two pushing blocks (71) in a threaded mode.

3. The wafer immersion wet photoresist remover according to claim 1, wherein: the rear part of the sealing cover (21) is provided with a front motor and a rear motor (23), the front motor and the rear motor (23) are provided with a horizontal front screw rod and a rear screw rod (24), and the front screw rod and the rear screw rod (24) are in threaded fit with the rear end of the sealing cover (21).

4. The wafer immersion wet photoresist remover according to claim 1, wherein: the soaking pond (2) bottom is equipped with upper and lower motor (25) the upper portion of upper and lower motor (25) is equipped with vertical upper and lower screw rod (26), upper and lower screw rod (26) are connected with two vertical lift posts (27) through screw rod transmission structure, lift post (27) upper end run through soaking pond (2) bottom with elevating platform (22) bottom fixed connection, lift post (27) with soaking pond (2) bottom sliding seal assembly.

5. The wafer immersion wet photoresist remover according to any one of claims 1-4, wherein: the lifting table (22) adopts a hollowed-out design.

6. The wafer immersion wet photoresist remover according to any one of claims 1-4, wherein: the soaking tank (2) is square, vertical guide rails are designed on the front and rear wall surfaces in the soaking tank (2), and notches (221) matched with the guide rails are designed on the front and rear surfaces of the lifting table (22).

7. The wafer immersion wet photoresist remover according to any one of claims 1-4, wherein: the material receiving table (4) adopts a hollowed-out design, and a liquid draining pool (41) is arranged at the lower part of the material receiving table (4).

8. The wafer immersion wet photoresist remover according to claim 1, wherein: the upper part of one side of the material receiving table (4) close to the soaking tank (2) is provided with an inclined edge.

9. The wafer immersion wet photoresist remover according to claim 1, wherein: the upper part of the discharging table (5) is provided with a convex stop block (51) with an L-shaped overlooking direction.