CN220019942U

CN220019942U - Parallel optical transceiver

Info

Publication number: CN220019942U
Application number: CN202321032303.2U
Authority: CN
Inventors: 王鹏; 于佩
Original assignee: Allray Inc ltd
Current assignee: Allray Inc ltd
Priority date: 2023-05-04
Filing date: 2023-05-04
Publication date: 2023-11-14
Anticipated expiration: 2033-05-04

Abstract

The utility model relates to a parallel light transceiver, which comprises an upper shell, an optical fiber assembly, a PCB assembly, a lower shell, a chip protection cover, a chip assembly, a ceramic radiating fin assembly and an electric connector, wherein the upper shell is connected with the optical fiber assembly; the ceramic radiating fin assembly is combined with the PCB assembly to form the efficient heat transfer structure for transferring heat generated by the chip assembly to the chip and the shell of the upper shell and the lower shell.

Description

Parallel optical transceiver

Technical Field

The utility model relates to the technical field of optical communication technology and optical communication equipment, in particular to a parallel optical transceiver.

Background

An optical module is a device for transmitting a signal using an optical fiber, in which a fine optical fiber is enclosed in a plastic sheath so that it can be bent without breaking, and generally, a transmitting device at one end of the optical fiber transmits an optical pulse to the optical fiber using a light emitting diode or a laser beam, and a receiving device at the other end of the optical fiber detects the pulse using a photosensitive element.

With the rapid development of the communication field, the conventional transmission technology has hardly satisfied the requirements of transmission capacity and speed, and in the typical application fields such as data center, network connection, search engine, high performance computing, etc., in order to prevent the shortage of broadband resources, carriers and service providers have planned and deployed new generation high-speed network protocols, and corresponding optical high-speed transceiver modules are needed to satisfy the requirements of high-density and high-speed data transmission.

Parallel optical transmission is a Vertical Cavity Surface Emitting Laser (VCSEL) and parallel optical interconnection technology, each laser is used for aligning one transmission optical fiber, and the transmission rate of each optical fiber is reduced on the premise of not reducing the transmission capacity of the system, so that a simple, low-cost and reliable optical transmission mode is realized.

But the parallel light transmission mode used at present corresponds to the heat dissipation of the chip, and the heat conduction is carried out by adopting the heat conduction substrate formed by metal materials, so that the chip and the shell are in a conducting state, and the risk of breakdown of the chip by an external circuit is high.

Accordingly, it is necessary to provide a parallel optical transceiver device to solve the above-mentioned problems.

Disclosure of Invention

The utility model aims to provide a parallel optical transceiver.

The technical proposal is as follows:

a parallel optical transceiver comprises an upper shell, an optical fiber assembly, a PCB assembly, a lower shell, a chip protection cover, a chip assembly, a ceramic radiating fin assembly and an electric connector;

the ceramic radiating fin assembly is combined with the PCB assembly to form the efficient heat transfer structure for transferring heat generated by the chip assembly to the chip and the shell of the upper shell and the lower shell.

Further, the fiber optic assembly communicates with the chip assembly, the chip assembly communicates with the PCB assembly, and the PCB assembly communicates with an electrical connector that serves as a module-to-external electrical interface.

Further, the electric connector is welded on the PCB component, the PCB component is stuck on the lower shell, the ceramic radiating fin component is stuck on the PCB component, the chip component is stuck on the ceramic radiating fin A and the ceramic radiating fin B of the ceramic radiating fin component, the optical fiber component and the chip component are stuck on the ceramic radiating fin A and the ceramic radiating fin B of the ceramic radiating fin component after being coupled, the chip protection cover is stuck on the PCB component, and the upper shell is pressed on the ceramic radiating fin C, the ceramic radiating fin D, the ceramic radiating fin E and the ceramic radiating fin F of the ceramic radiating fin component and is fixedly connected with the upper shell through fixing screws.

Further, the fiber optic assembly includes an optical fiber, an optical fiber connector, an optical device a, and an optical device B.

Further, one end of the optical fiber is connected with the optical fiber connector, the other end of the optical fiber is connected with the optical device A and the optical device B, and the optical fiber connector is used as an optical path interface of the optical module.

Further, the chip assembly comprises an electric chip A, an electric chip B, an optical chip A and an optical chip B, wherein the electric chip A and the electric chip B are in optical path coupling with the optical chip A and the optical chip B, and a lens and an isolator are further arranged in a transmitting optical path to form an optical path structure for improving optical path performance and coupling efficiency.

Further, the electric chip A is attached to the metal heat sink, the metal heat sink is attached to the ceramic radiating fin assembly, and the electric chip B, the optical chip A and the optical chip B are directly attached to the ceramic radiating fin A and the ceramic radiating fin B.

Further, a plurality of through holes are formed in the positions of the corresponding PCB assemblies, and heat generated by the chip assemblies is transferred to the through holes through the metal heat layer, the ceramic radiating fins A and the ceramic radiating fins B; the heat in the through holes is transferred to a copper sheet layer inside the PCB assembly, the heat diffuses on the copper sheet layer, part of the heat is transferred to a ceramic radiating fin C, a ceramic radiating fin D, a ceramic radiating fin E and a ceramic radiating fin F of a ceramic radiating fin assembly attached above the PCB assembly through the through holes around the PCB assembly, and then the heat is transferred to an upper shell, and the upper shell dissipates the heat into the air; the other part of heat is transferred to the lower shell and then is transferred to the air by the lower shell; and forming a high-efficiency heat transfer type heat dissipation structure.

Further, the ceramic radiating fin assembly stuck on the PCB assembly increases the radiating area, and has smaller thermal expansion deformation at high temperature, thus forming a high-stability light path working environment.

Further, the chip protection cover covers the chip assembly to form a high-efficiency dustproof and waterproof vapor-proof chip assembly protection structure.

Compared with the prior art, the embodiment can transfer the heat generated by the chip to the shell rapidly, and meanwhile, the chip is not conducted with the shell, so that the chip is effectively prevented from being broken down by an external circuit.

Drawings

Fig. 1 is a schematic diagram of the front structure of the present utility model.

Fig. 2 is a schematic view of the reverse structure of the present utility model.

Fig. 3 is an exploded view of the present utility model.

Fig. 4 is a schematic diagram of the connection of the optical fiber assembly, the chip assembly, the PCB assembly, the ceramic heat sink and the chip protection cover of the present utility model.

Fig. 5 is a schematic diagram of the fiber optic assembly, chip assembly, PCB assembly and ceramic heat sink connection of the present utility model.

Fig. 6 is a schematic diagram of a chip assembly, PCB assembly and ceramic heat sink connection of the present utility model.

Fig. 7 is a schematic diagram of the connection of the ceramic heat sink to the PCB assembly of the present utility model.

Fig. 8 is a schematic diagram of the connection of the PCB assembly and the electrical connector according to the present utility model.

Fig. 9 is a second schematic diagram of the connection between the PCB assembly and the electrical connector according to the present utility model.

Fig. 10 is a schematic diagram of a chip assembly of the present utility model.

Detailed Description

Examples:

referring to fig. 1 to 10, the present embodiment shows a parallel optical transceiver device, which includes a set screw 100, an upper case 200, an optical fiber assembly 300, a PCB assembly 400, a lower case 500, a chip protection cover 600, a chip assembly 700, a ceramic heat sink assembly 800, and an electrical connector 900;

the ceramic heat sink assembly 800 in combination with the PCB assembly 400 forms a chip and housing non-conductive efficient heat transfer structure that transfers heat generated by the chip assembly 700 to the upper and lower housings 200, 500.

The fiber optic assembly 300 communicates with the chip assembly 700, the chip assembly 700 communicates with the PCB assembly 400, the PCB assembly 400 communicates with the electrical connector 900, and the electrical connector 900 serves as a module-to-external electrical interface.

The electrical connector 900 is soldered on the PCB assembly 400, the PCB assembly 400 is adhered to the lower case 500, the ceramic heat sink assembly 800 is adhered to the PCB assembly 400, the chip assembly 700 is adhered to the ceramic heat sink a850 and the ceramic heat sink B860 of the ceramic heat sink assembly 800, the optical fiber assembly 300 and the chip assembly 700 are coupled and then adhered to the ceramic heat sink a850 and the ceramic heat sink B860 of the ceramic heat sink assembly 800, the chip protection cover 600 is adhered to the PCB assembly 400, and the upper case 200 is pressed on the ceramic heat sink C810, the ceramic heat sink D820, the ceramic heat sink E830 and the ceramic heat sink F840 of the ceramic heat sink assembly 800 and is fixedly connected to the upper case 500 by the fixing screws 100.

The fiber optic assembly 300 includes an optical fiber, a fiber optic connector 330, an optic device a310, and an optic device B320.

One end of the optical fiber is connected with the optical fiber connector 330, the other end of the optical fiber is connected with the optical device A310 and the optical device B320, and the optical fiber connector 330 is used as an optical path interface of the optical module.

The chip assembly 700 includes an electrical chip a710, an electrical chip B720, an optical chip a730, and an optical chip B740, where the electrical chip a710, the electrical chip B720, the optical chip a730, and the optical chip B740 are coupled in an optical path, and a lens 760 and an isolator 770 are added in an emission optical path to form an optical path structure for improving optical path performance and coupling efficiency.

The electric chip A710 is attached to the metal heat sink, the metal heat sink is attached to the ceramic heat sink assembly 800, and the electric chip B720, the optical chip A730 and the optical chip B740 are directly attached to the ceramic heat sink A850 and the ceramic heat sink B860.

A plurality of through holes 410 are formed at the corresponding positions of the PCB assembly, and heat generated by the chip assembly 700 is transferred to the through holes 410 through the metal heat layer, the ceramic radiating fins A850 and the ceramic radiating fins B860; the heat in the via holes 410 is transferred to the copper sheet layer inside the PCB assembly, the heat diffuses on the copper sheet layer, a part of the heat is transferred to the ceramic radiating fins C810, D820, E830 and F840 of the ceramic radiating fin assembly 800 attached above the PCB assembly through the via holes 410 around the PCB assembly, and then the heat is transferred to the upper shell 200, and the upper shell 200 radiates the heat into the air; the other part of heat is transferred to the lower shell and then is transferred to the air by the lower shell; and forming a high-efficiency heat transfer type heat dissipation structure.

The ceramic heat sink assembly 800 attached to the PCB assembly 400 increases a heat dissipation area and has less thermal expansion deformation at high temperature, forming a highly stable optical path working environment.

The chip protection cover 600 covers the chip assembly 700 to form a high-efficiency dust-proof and moisture-proof chip assembly protection structure.

The packaging steps of the parallel optical transceiver module of this embodiment are as follows:

step 1: the electrical connector 900 is soldered to the PCB assembly 400 as shown in fig. 8 and 9.

Step 2: the ceramic heat sink 800 is adhered to the PCB assembly 400 using conductive silver paste.

Step 3: the chip assembly 700 is attached to the ceramic heat sinks 850, 860 using conductive silver paste.

Step 4: the two optical devices of the optical fiber assembly are respectively coupled and fixed with the optical chips of the corresponding optical paths.

Step 5: the PCB assembly 400 is adhered to the lower case 500 using BF-4 glue.

Step 6: the upper case 200 is assembled on the lower case 500 and is tightened with the screw 100.

What has been described above is merely some embodiments of the present utility model. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit of the utility model.

Claims

1. A parallel optical transceiver, characterized in that: the optical fiber module comprises an upper shell, an optical fiber module, a PCB module, a lower shell, a chip protecting cover, a chip module, a ceramic radiating fin module and an electric connector;

2. A parallel optical transceiver according to claim 1, wherein: the optical fiber assembly communicates with the chip assembly, the chip assembly communicates with the PCB assembly, and the PCB assembly communicates with the electrical connector that serves as a module-to-external electrical interface.

3. A parallel optical transceiver according to claim 2, wherein: the electric connector is welded on the PCB assembly, the PCB assembly is pasted on the lower shell, the ceramic radiating fin assembly is pasted on the PCB assembly, the chip assembly is pasted on the ceramic radiating fin A and the ceramic radiating fin B of the ceramic radiating fin assembly, the optical fiber assembly is pasted on the ceramic radiating fin A and the ceramic radiating fin B of the ceramic radiating fin assembly after being coupled with the chip assembly, the chip protection cover is pasted on the PCB assembly, and the upper shell is pressed on the ceramic radiating fin C, the ceramic radiating fin D, the ceramic radiating fin E and the ceramic radiating fin F of the ceramic radiating fin assembly and is fixedly connected with the upper shell through fixing screws.

4. A parallel optical transceiver according to claim 3, wherein: the optical fiber assembly comprises an optical fiber, an optical fiber connector, an optical device A and an optical device B.

5. The parallel optical transceiver of claim 4, wherein: one end of the optical fiber is connected with the optical fiber connector, the other end of the optical fiber is connected with the optical device A and the optical device B, and the optical fiber connector is used as an optical path interface of the optical module.

6. The parallel optical transceiver of claim 5, wherein: the chip component comprises an electric chip A, an electric chip B, an optical chip A and an optical chip B, wherein the electric chip A, the electric chip B, the optical chip A and the optical chip B are in optical path coupling, and a lens and an isolator are further arranged in a transmitting optical path to form an optical path structure for improving optical path performance and coupling efficiency.

7. The parallel optical transceiver of claim 6, wherein: the electric chip A is attached to the metal heat sink, the metal heat sink is attached to the ceramic radiating fin assembly, and the electric chip B, the optical chip A and the optical chip B are directly attached to the ceramic radiating fin A and the ceramic radiating fin B.

8. The parallel optical transceiver of claim 7, wherein: a plurality of through holes are formed in the positions of the corresponding PCB components, and heat generated by the chip components is transferred to the through holes through the metal heat layer, the ceramic radiating fins A and the ceramic radiating fins B; the heat in the through holes is transferred to a copper sheet layer inside the PCB assembly, the heat diffuses on the copper sheet layer, part of the heat is transferred to a ceramic radiating fin C, a ceramic radiating fin D, a ceramic radiating fin E and a ceramic radiating fin F of a ceramic radiating fin assembly attached above the PCB assembly through the through holes around the PCB assembly, and then the heat is transferred to an upper shell, and the upper shell dissipates the heat into the air; the other part of heat is transferred to the lower shell and then is transferred to the air by the lower shell; and forming a high-efficiency heat transfer type heat dissipation structure.

9. The parallel optical transceiver of claim 8, wherein: further, the ceramic radiating fin assembly stuck on the PCB assembly increases the radiating area, and has smaller thermal expansion deformation at high temperature, thus forming a high-stability light path working environment.

10. The parallel optical transceiver of claim 9, wherein: the chip protection cover covers the chip assembly to form the high-efficiency dustproof and waterproof vapor-proof chip assembly protection structure.