CN219998063U

CN219998063U - Capacitor array and capacitor array assembly

Info

Publication number: CN219998063U
Application number: CN202290000199.6U
Authority: CN
Inventors: 加藤知树; 古川刚史
Original assignee: Murata Manufacturing Co Ltd
Current assignee: Murata Manufacturing Co Ltd
Priority date: 2021-09-06
Filing date: 2022-08-16
Publication date: 2023-11-10
Anticipated expiration: 2032-08-16
Also published as: JP7294563B1; JPWO2023032657A1; WO2023032657A1

Abstract

The present utility model relates to a capacitor array and a capacitor array assembly. The capacitor array (1) is provided with a plurality of capacitor elements (10). The plurality of capacitor elements (10) each include: an anode plate (21) which is provided with a porous portion (21A) on at least one main surface and is composed of a valve metal; a dielectric layer (22) provided on the surface of the porous portion (21A); and a cathode layer (23) which is provided on the surface of the dielectric layer (22) and contains a solid electrolyte layer (23A). The anode plate (21) is a rolled metal foil. In a plan view as seen from the thickness direction of the anode plate (21), the Rolling Direction (RD) of the anode plate (21) is neither parallel nor perpendicular to each side constituting the outer shape of the capacitor array (1).

Description

Capacitor array and capacitor array assembly

Technical Field

The present utility model relates to a capacitor array and a capacitor array assembly.

Background

Patent document 1 discloses a package substrate for a semiconductor composite device that supplies a dc voltage regulated by a voltage regulator including a semiconductor active element to a load. The package substrate described in patent document 1 includes: a first layer formed with a capacitor; a second layer, which is different from the first layer, and has an inductor formed thereon; and a connection terminal disposed on a mounting surface of the package substrate, the connection terminal being configured to electrically connect to the voltage regulator and the load, wherein a first via hole and a second via hole penetrating the first layer and the second layer in a direction perpendicular to the mounting surface are formed in the package substrate, the capacitor is electrically connected to the load via the first via hole, and the inductor is electrically connected to the load via the first via hole and the voltage regulator via the second via hole.

Patent document 1: international publication No. 2019/130746

Patent document 1 describes that an electrolytic capacitor using a metal such as aluminum as a base material is preferably used as the capacitor.

As in the case of the package substrate described in patent document 1, in a product in which an electrolytic capacitor as a capacitor element is built in the substrate, strain occurs when the contraction behavior of a metal foil constituting an anode plate of the capacitor element overlaps with the warp behavior of the product. In particular, when a plurality of capacitor elements are arranged in an array in order to reduce ESR (equivalent series resistance) and ESL (equivalent series inductance), there is a tendency that the area increases with respect to the thickness of the product, and thus a large strain may occur.

Disclosure of Invention

The utility model aims to provide a capacitor array capable of reducing the generation of strain. The present utility model also provides a capacitor array assembly in which a plurality of capacitor arrays capable of reducing the occurrence of strain are arranged in a common master.

The capacitor array of the present utility model includes a plurality of capacitor elements. The plurality of capacitor elements each include: an anode plate having a porous portion provided on at least one main surface and made of a valve metal; a dielectric layer provided on a surface of the porous portion; and a cathode layer provided on the surface of the dielectric layer and including a solid electrolyte layer. The anode plate is a rolled metal foil. In a plan view as viewed from the thickness direction of the anode plate, the rolling direction of the anode plate is neither parallel nor perpendicular to each side constituting the outer shape of the capacitor array.

The capacitor array assembly of the present utility model includes a plurality of capacitor arrays disposed on a common master. The plurality of capacitor arrays each include a plurality of capacitor elements. The plurality of capacitor elements each include: an anode plate having a porous portion provided on at least one main surface and made of a valve metal; a dielectric layer provided on a surface of the porous portion; and a cathode layer provided on the surface of the dielectric layer and including a solid electrolyte layer. The anode plate is formed by the master plate. The master is a rolled metal foil. In a plan view seen from the thickness direction of the master, the rolling direction of the master is neither parallel nor perpendicular to each side constituting the outer shape of the capacitor array.

According to the present utility model, a capacitor array capable of reducing the occurrence of strain can be provided. According to the present utility model, there can be provided a capacitor array assembly in which a plurality of capacitor arrays capable of reducing the occurrence of strain are arranged in a common master.

Drawings

Fig. 1 is a plan view schematically showing an example of a capacitor array of the present utility model.

Fig. 2 is a cross-sectional view along line II-II of the capacitor array shown in fig. 1.

Fig. 3 is a top view schematically illustrating a characteristic portion of the capacitor array shown in fig. 1.

Fig. 4 is a perspective view schematically showing an example of a process of cutting a master from a rolled metal foil.

Fig. 5 is a plan view schematically showing an example of a process for producing a capacitor array assembly.

Fig. 6 is a perspective view schematically showing another example of a process of cutting a master from a rolled metal foil.

Fig. 7 is a plan view schematically showing another example of a process for producing a capacitor array assembly.

Detailed Description

The capacitor array of the present utility model will be described below.

However, the present utility model is not limited to the following configuration, and can be applied with appropriate modifications within the scope of not changing the gist of the present utility model. The present utility model also provides a combination of two or more preferred configurations of the present utility model described below.

In the present specification, terms (e.g., "parallel", "perpendicular", "orthogonal", etc.) indicating the relationship between elements and terms indicating the shapes of the elements are not only meant to indicate strict meaning, but also mean substantially equivalent ranges, and include, for example, expressions of differences of about several percent.

The drawings shown below are schematic, and the scale of the dimensions, aspect ratio, etc. may be different from the actual products.

[ capacitor array ]

Fig. 1 is a plan view schematically showing an example of a capacitor array of the present utility model. Fig. 2 is a cross-sectional view along line II-II of the capacitor array shown in fig. 1.

The capacitor array 1 shown in fig. 1 includes a plurality of capacitor elements 10. The capacitor array 1 has a chip-like shape as a whole. Although 6 capacitor elements 10 are shown in fig. 1, the number of capacitor elements 10 included in the capacitor array 1 is not particularly limited as long as it is 2 or more. The capacitor element 10 may be the same in size, shape, or the like, or may be partially or entirely different.

As shown in fig. 2, each of the plurality of capacitor elements 10 includes: the anode plate 21 having a porous portion 21A provided on at least one main surface and made of a valve metal; a dielectric layer 22 provided on the surface of the porous portion 21A; and a cathode layer 23 provided on the surface of the dielectric layer 22 and including a solid electrolyte layer 23A. The anode plate 21 constituting the capacitor element 10 includes, for example, a core portion 21B and a porous portion 21A provided on at least one main surface of the core portion 21B. The cathode layer 23 constituting the capacitor element 10 includes, for example, a solid electrolyte layer 23A provided on the surface of the dielectric layer 22 and a conductor layer 23B provided on the surface of the solid electrolyte layer 23A.

As shown in fig. 1 and 2, the capacitor array 1 may further include a sealing layer 11, and the sealing layer 11 may be provided so as to cover the cathode layer 23 constituting each capacitor element 10. In this case, the capacitor array 1 may further include: a first external electrode 12 disposed outside the sealing layer 11 and electrically connected to the anode plate 21; and a second external electrode 13 provided outside the sealing layer 11 and electrically connected to the cathode layer 23. The manner in which the anode plate 21 is connected to the first external electrode 12 is not particularly limited, and may be connected via a via conductor or a via conductor. Similarly, the manner in which the cathode layer 23 is connected to the second external electrode 13 is not particularly limited, and may be connected via a via conductor or may be connected via a via conductor.

The structures of the capacitor elements 10 are preferably identical, respectively. In addition, it is preferable that the distance from the surface of the sealing layer 11 to the anode plate 21 constituting each capacitor element 10 is constant.

The anode plate 21 is a rolled metal foil. Specifically, the anode plate 21 constituting each capacitor element 10 is formed by cutting out one sheet of rolled metal foil.

As shown in fig. 3, in a plan view as seen from the thickness direction of the anode plate 21, the rolling direction of the anode plate 21 (the direction indicated by the double-headed arrow RD in fig. 3) is neither parallel nor perpendicular to each side constituting the outer shape of the capacitor array 1. For example, as shown in fig. 3, in the case where the outer shape of the capacitor array 1 as viewed from the thickness direction of the anode plate 21 is rectangular, the rolling direction RD of the anode plate 21 is neither parallel nor perpendicular to the longitudinal direction (the direction indicated by the double-headed arrow LD in fig. 3) of the outer shape of the capacitor array 1, and is neither parallel nor perpendicular to the width direction (the direction indicated by the double-headed arrow WD in fig. 3) of the outer shape of the capacitor array 1.

The rolled metal foil has a different shrinkage behavior when heated in a direction parallel to the rolling direction RD and in a direction perpendicular to the rolling direction RD and parallel to the metal foil. As described in the package substrate described in patent document 1, when the contraction behavior of the metal foil constituting the anode plate 21 of each capacitor element 10 overlaps the warp behavior of the capacitor array 1 as a product, there is a concern that a large strain is generated in the capacitor array 1. Therefore, by shifting the rolling direction RD of the anode plate 21 with respect to each side constituting the outer shape of the capacitor array 1, it is possible to reduce the occurrence of a large strain in the capacitor array 1.

The rolling direction RD (Rolling Direction) of the anode plate 21 is a direction in which the metal foil is stretched when the metal foil is passed between a pair of rollers and pressed in the metal foil rolling step. As shown in fig. 3, linear ribs called rolling marks 30 are formed on the surface of the anode plate 21 in the rolling direction RD of the anode plate 21. Since the rolling mark 30 extends along the rolling direction RD, the rolling direction RD of the anode plate 21 can be grasped by observing the surface of the anode plate 21.

In a plan view as viewed from the thickness direction of the anode plate 21, the rolling direction RD of the anode plate 21 is preferably arranged at an angle of 30 ° to 60 °, more preferably 40 ° to 50 °, and even more preferably 45 ° ± 3 ° with respect to at least one side constituting the outer shape of the capacitor array 1. In this case, as shown in fig. 3, a plurality of capacitor elements 10 are easily repeatedly and regularly arranged. In a plan view as seen from the thickness direction of the anode plate 21, the rolling direction RD of the anode plate 21 may be arranged at an angle of 30 ° or more and 60 ° or less, may be arranged at an angle of 40 ° or more and 50 ° or less, or may be arranged at an angle of 45 ° ± 3 ° with respect to each side constituting the outer shape of the capacitor array 1.

In a plan view as seen from the thickness direction of the anode plate 21, each side constituting the outer shape of the capacitor element 10 is preferably neither parallel nor perpendicular to the rolling direction RD of the anode plate 21, but may include a capacitor element 10 in which a part or all of the sides are parallel or perpendicular to the rolling direction RD of the anode plate 21.

The anode plate 21 is composed of a valve metal exhibiting a so-called valve action. Examples of the valve metal include a metal monomer such as aluminum, tantalum, niobium, titanium, zirconium, or an alloy containing these metals. Among them, aluminum or aluminum alloy is preferable.

The anode plate 21 may include the porous portion 21A on at least one main surface, or may include the porous portion 21A on both main surfaces. The porous portion 21A is preferably an etching layer formed on at least the surface of the anode plate 21.

The thickness of the anode plate 21 before etching treatment is preferably 60 μm or more and 200 μm or less. The thickness of the core portion 21B which is not etched after the etching treatment is preferably 15 μm or more and 70 μm or less. The thickness of the porous portion 21A is designed so as to match the required withstand voltage and capacitance, but it is preferable that the porous portion 21A on both sides of the core portion 21B be 10 μm or more and 180 μm or less together.

The pore diameter of the porous portion 21A is preferably 10nm or more and 600nm or less. The pore diameter of the porous portion 21A is the median diameter D50 measured by a mercury porosimeter. The pore diameter of the porous portion 21A can be controlled by adjusting various conditions during etching, for example.

The dielectric layer 22 is provided on the surface of the porous portion 21A. The dielectric layer 22 is porous reflecting the surface state of the porous portion 21A, and has a fine uneven surface shape. The dielectric layer 22 is preferably formed of an oxide film of the valve metal. For example, in the case of using aluminum foil as the anode plate 21, the dielectric layer 22 formed of an oxide film can be formed by subjecting the surface of the aluminum foil to an anodic oxidation treatment (also referred to as a chemical conversion treatment) in an aqueous solution containing ammonium adipate or the like.

The thickness of the dielectric layer 22 is designed to match the required withstand voltage and capacitance, but is preferably 10nm to 100 nm.

The cathode layer 23 is disposed on the surface of the dielectric layer 22. The cathode layer 23 includes a solid electrolyte layer 23A provided on the surface of the dielectric layer 22. The cathode layer 23 preferably further includes a conductor layer 23B provided on the surface of the solid electrolyte layer 23A.

Examples of the material constituting the solid electrolyte layer 23A include conductive polymers such as polypyrroles, polythiophenes, and polyanilines. Among them, polythiophenes are preferable, and poly (3, 4-ethylenedioxythiophene) called PEDOT is particularly preferable. The conductive polymer may contain a dopant such as polystyrene sulfonic acid (PSS). The solid electrolyte layer 23A preferably includes an inner layer filling pores (recesses) of the dielectric layer 22 and an outer layer covering the dielectric layer 22.

The thickness of the solid electrolyte layer 23A from the surface of the porous portion 21A is preferably 2 μm or more and 20 μm or less.

The solid electrolyte layer 23A is formed, for example, by a method of forming a polymer film such as poly (3, 4-ethylenedioxythiophene) on the surface of the dielectric layer 22 using a treatment liquid containing a monomer such as 3, 4-ethylenedioxythiophene, a method of applying a dispersion of a polymer such as poly (3, 4-ethylenedioxythiophene) to the surface of the dielectric layer 22 and drying the dispersion, or the like.

The solid electrolyte layer 23A can be formed in a predetermined region by applying the above-described treatment liquid or dispersion liquid to the dielectric layer 22 by a method such as sponge transfer, screen printing, dispenser coating, or ink jet printing.

The conductor layer 23B includes at least one of a conductive resin layer and a metal layer. The conductor layer 23B may be a conductive resin layer alone or a metal layer alone. The conductor layer 23B preferably covers the entire surface of the solid electrolyte layer 23A.

Examples of the conductive resin layer include a conductive adhesive layer containing at least one conductive filler selected from the group consisting of silver fillers, copper fillers, nickel fillers, and carbon fillers.

Examples of the metal layer include a metal plating film and a metal foil. The metal layer is preferably composed of at least one metal selected from the group consisting of nickel, copper, silver, and alloys containing these metals as main components. The "main component" refers to the element component having the largest weight ratio.

The conductor layer 23B includes, for example, a carbon layer provided on the surface of the solid electrolyte layer 23A, and a copper layer provided on the surface of the carbon layer.

The carbon layer is provided for electrically and mechanically connecting the solid electrolyte layer 23A and the copper layer. The carbon layer can be formed in a predetermined region by applying a carbon paste to the solid electrolyte layer 23A by a method such as sponge transfer, screen printing, dispenser coating, or ink jet printing. The carbon layer is preferably a copper layer in the next step in a state of having tackiness before drying. The thickness of the carbon layer is preferably 2 μm or more and 20 μm or less.

The copper layer can be formed by applying a copper paste to the carbon layer by using a sponge transfer, screen printing, spray coating, dispenser coating, inkjet printing, or the like. The thickness of the copper layer is preferably 2 μm or more and 20 μm or less.

The plurality of capacitor elements 10 included in the capacitor array 1 may be arranged linearly or in a planar shape. The plurality of capacitor elements 10 may be regularly arranged or irregularly arranged. The size, planar shape, etc. of the capacitor element 10 as viewed in the thickness direction may be the same or may be partially or entirely different.

The capacitor array 1 may include two or more types of capacitor elements 10 having different areas of the capacitor portions as viewed in the thickness direction.

The capacitor array 1 may include a capacitor element 10 having a capacitor portion whose planar shape as viewed in the thickness direction is not rectangular. In the present specification, "rectangular" means square or rectangular. Therefore, for example, the capacitor element 10 may be configured to have a polygonal shape such as a quadrangle, a triangle, a pentagon, or a hexagon, a shape including a curved portion, a circle, or an ellipse, other than a rectangle in the planar shape of the capacitor portion. In this case, two or more types of capacitor elements 10 having different planar shapes of the capacitance portions may be included. The capacitor element 10 having a rectangular planar shape of the capacitor portion may be included or not included in addition to the capacitor element 10 having a non-rectangular planar shape of the capacitor portion.

Although not shown in fig. 1 and 2, at least one set of adjacent capacitor elements 10 may be slit-divided therebetween. With the slits, the anode plate 21 is broken between the adjacent capacitor elements 10. The inside of the slit may be filled with the sealing layer 11. The anode plate 21 is reliably broken between the adjacent capacitor elements 10 by the seal layer 11. In addition, between adjacent capacitor elements 10, anode plate 21 may be physically disconnected by the slit, or may be electrically disconnected.

In the case where the capacitor elements 10 are divided by slits, the width of the slits is not particularly limited, but is preferably 15 μm or more, more preferably 30 μm or more, and still more preferably 50 μm or more. On the other hand, the width of the slit is preferably 500 μm or less, more preferably 200 μm or less, and still more preferably 150 μm or less.

The slit may have a tapered shape with a smaller width in the thickness direction.

At least a part of the slit may be arranged so as not to cover the entire capacitor array 1. In this case, at least one capacitor element 10 may be disposed on the extension of the slit.

In the case where the capacitor array 1 includes the sealing layer 11, the sealing layer 11 is provided so as to cover the cathode layers 23 constituting the respective capacitor elements 10. The seal layer 11 may be provided so as to cover both principal surface sides of the anode plate 21, or may be provided so as to cover either principal surface side.

The sealing layer 11 is preferably made of resin. Examples of the resin constituting the sealing layer 11 include epoxy resin and phenolic resin. In addition, the sealing layer 11 preferably contains a filler. Examples of the filler contained in the sealing layer 11 include inorganic fillers such as silica particles, alumina particles, and metal particles.

The sealing layer 11 may be formed of only one layer or two or more layers. In the case where the sealing layer 11 is formed of two or more layers, the materials constituting the sealing layers may be the same or different.

A layer such as a stress relaxation layer or a moisture barrier film may be provided between the capacitor element 10 and the sealing layer 11.

An insulating layer for insulating the anode plate 21 from the cathode layer 23 may be provided on the surface of the dielectric layer 22 where the cathode layer 23 is not provided.

The insulating layer is preferably made of resin. Examples of the resin constituting the insulating layer include insulating resins such as a polyphenylsulfone resin, a polyethersulfone resin, a cyanate resin, a fluororesin (tetrafluoroethylene, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, etc.), a polyimide resin, a polyamideimide resin, an epoxy resin, and derivatives or precursors thereof.

The insulating layer may be composed of the same resin as the sealing layer 11. Unlike the sealing layer 11, when the insulating layer contains an inorganic filler, the effective portion of the capacitor element 10 may be adversely affected, and therefore, it is preferable that the insulating layer is composed of only a resin alone.

The insulating layer can be formed by applying a masking material such as a composition containing an insulating resin to the dielectric layer 22 by, for example, sponge transfer, screen printing, dispenser application, inkjet printing, or the like.

The capacitor array 1 may include via conductors provided in the through holes. The cross-sectional shape of the through-hole as viewed in the thickness direction is not particularly limited, and examples thereof include polygonal shapes such as quadrangles, circular shapes, and elliptical shapes. The aperture is a diameter when the cross-sectional shape is circular, and is a maximum length passing through the center of the cross-section when the aperture is other than circular. The through hole may have a tapered shape in which the diameter of the hole decreases in the thickness direction.

The through-hole conductor may be provided on at least an inner wall surface of the through-hole. The inner wall surface of the through hole is metallized with a low-resistance metal such as copper, gold, or silver. From the viewpoint of ease of processing, for example, metallization can be performed by electroless copper plating, electrolytic copper plating, or the like. The metallization of the via conductors is not limited to the case of metallizing only the inner wall surfaces of the through holes, and may be performed by filling the through holes with a metal or a composite material of a metal and a resin.

The via conductors are classified as a. For the anode of the capacitor, b. For the cathode of the capacitor and ground, c.i/O lines. A. The anode of the capacitor is electrically connected to the anode plate 21, and the cathode of the capacitor and the ground through-hole conductor are electrically connected to the cathode layer 23, and the C.I/O line through-hole conductor is not electrically connected to both the anode plate 21 and the cathode layer 23.

A. The through hole conductor for the anode of the capacitor may be filled with an insulating material between the through hole and the through hole conductor, or may be not filled. B. A cathode of the capacitor, a via conductor for grounding, and a via conductor for a C.I/O line are filled with an insulating material between the via and the via conductor.

The capacitor array of the present utility model can be preferably manufactured by the following method.

The method for manufacturing a capacitor array according to the present utility model preferably includes:

cutting out a master from the rolled metal foil;

a step of producing a capacitor array assembly in which a plurality of capacitor arrays are arranged on the master; and

and a step of dividing the capacitor array aggregate into individual capacitor arrays by cutting.

In the example shown in fig. 4, the master 121 is cut out from the rolled metal foil 120 at an angle with respect to the rolling direction (the direction indicated by the double arrow RD in fig. 4). The angle of at least one side of the master 121 with respect to the rolling direction RD is preferably 30 ° or more and 60 ° or less, more preferably 40 ° or more and 50 ° or less, and still more preferably 45 ° ± 3 °. The angle of each side of the master 121 with respect to the rolling direction RD may be 30 ° or more and 60 ° or less, or may be 40 ° or more and 50 ° or less, or may be 45 ° ± 3 °.

Although not shown, a porous portion 21A (see fig. 2) is formed on at least one main surface of the master 121, and a dielectric layer 22 (see fig. 2) is formed on the surface of the porous portion 21A. For example, in the case of using aluminum foil as the metal foil 120, after the porous portion 21A is formed by etching the surface of the aluminum foil, an anodic oxidation treatment is performed in an aqueous solution containing ammonium adipate or the like, thereby forming the dielectric layer 22 composed of an oxide film.

As the master 121 having the porous portion 21A provided on at least one main surface and the dielectric layer 22 provided on the surface of the porous portion 21A, a chemical-conversion foil of aluminum or the like may be prepared.

As shown in fig. 5, a capacitor array assembly 100 in which a plurality of capacitor arrays 1 are arranged in a common master 121 is produced. The capacitor array assembly 100 has a sheet-like shape as a whole. Although 8 capacitor arrays 1 are shown in fig. 5, the number of capacitor arrays 1 included in the capacitor array assembly 100 is not particularly limited as long as it is 2 or more. The capacitor array 1 may be the same in size, shape, or the like, or may be partially or entirely different.

Each of the plurality of capacitor arrays 1 includes a plurality of capacitor elements 10 (see fig. 1 and 2).

For example, the cathode layer 23 is formed on the surface of the dielectric layer 22 of the master 121 (see fig. 2). Specifically, the solid electrolyte layer 23A is formed on the surface of the dielectric layer 22 of the master 121 (see fig. 2). Further, it is preferable to form the conductor layer 23B on the surface of the solid electrolyte layer 23A (see fig. 2). Thus, the capacitor element 10 (see fig. 2) in which the anode plate 21 (see fig. 2) is formed of the mother sheet 121 can be manufactured.

Before forming the cathode layer 23 on the surface of the dielectric layer 22, an insulating layer may be formed on the surface of the dielectric layer 22 to distinguish the effective portions of the capacitor element 10, as necessary.

As shown in fig. 4, the master 121 is formed by being cut out from the rolled metal foil 120 at an angle with respect to the rolling direction RD. Therefore, as shown in fig. 5, in a plan view seen from the thickness direction of the master 121, the rolling direction of the master 121 (the direction indicated by the double-headed arrow RD in fig. 5) is neither parallel nor perpendicular to each side constituting the outer shape of the master 121. For example, as shown in fig. 5, when the outer shape of the master 121 as viewed from the thickness direction of the master 121 is rectangular, the rolling direction RD of the master 121 is neither parallel nor perpendicular to the longitudinal direction (the left-right direction in fig. 5) of the outer shape of the master 121, nor parallel nor perpendicular to the width direction (the up-down direction in fig. 5) of the outer shape of the master 121.

In manufacturing the capacitor array assembly 100, the plurality of capacitor arrays 1 are arranged at an angle with respect to the rolling direction RD of the master 121. As a result, as shown in fig. 5, in a plan view as seen from the thickness direction of the master 121, the rolling direction RD of the master 121 is neither parallel nor perpendicular to each side constituting the outer shape of the capacitor array 1. For example, as shown in fig. 5, in the case where the outer shape of the capacitor array 1 as viewed from the thickness direction of the master 121 is rectangular, the rolling direction RD of the master 121 is neither parallel nor perpendicular to the longitudinal direction (the direction indicated by the double-headed arrow LD in fig. 5) of the outer shape of the capacitor array 1, and is neither parallel nor perpendicular to the width direction (the direction indicated by the double-headed arrow WD in fig. 5) of the outer shape of the capacitor array 1.

As in fig. 3, linear ribs called rolling marks 130 are formed on the surface of the master 121 in the rolling direction RD of the master 121. Since the rolling mark 130 extends along the rolling direction RD, the rolling direction RD of the master 121 can be grasped by observing the surface of the master 121.

In a plan view as seen from the thickness direction of the master 121, the rolling direction RD of the master 121 is preferably arranged at an angle of 30 ° or more and 60 ° or less, more preferably 40 ° or more and 50 ° or less, and still more preferably 45 ° ± 3 ° with respect to at least one side constituting the outer shape of the capacitor array 1. In a plan view as seen from the thickness direction of the master 121, the rolling direction RD of the master 121 may be arranged at an angle of 30 ° or more and 60 ° or less, may be arranged at an angle of 40 ° or more and 50 ° or less, or may be arranged at an angle of 45 ° ± 3 ° with respect to each side constituting the outer shape of the capacitor array 1.

As shown in fig. 5, in a plan view as seen from the thickness direction of the mother sheet 121, each side constituting the outline of the mother sheet 121 is preferably parallel or perpendicular to at least one side constituting the outline of the capacitor array 1, and more preferably parallel or perpendicular to each side constituting the outline of the capacitor array 1.

In a plan view as seen from the thickness direction of the master 121, each side constituting the outer shape of the capacitor element 10 is preferably neither parallel nor perpendicular to the rolling direction RD of the master 121, but may include a capacitor element 10 in which some or all sides are parallel or perpendicular to the rolling direction RD of the master 121.

In the example shown in fig. 6, the master 122 is cut out of the rolled metal foil 120 parallel or perpendicular to the rolling direction (the direction indicated by the double-headed arrow RD in fig. 6).

Although not shown, a porous portion 21A (see fig. 2) is formed on at least one main surface of the master 122, and a dielectric layer 22 (see fig. 2) is formed on the surface of the porous portion 21A.

As the master 122 having the porous portion 21A provided on at least one main surface and the dielectric layer 22 provided on the surface of the porous portion 21A, a chemical-conversion foil of aluminum or the like may be prepared.

As shown in fig. 7, a capacitor array assembly 110 in which a plurality of capacitor arrays 1 are arranged in a common master 122 is fabricated. The capacitor array aggregate 110 has a sheet-like shape as a whole. Although 6 capacitor arrays 1 are shown in fig. 7, the number of capacitor arrays 1 included in the capacitor array aggregate 110 is not particularly limited as long as it is 2 or more. The capacitor array 1 may be the same in size, shape, or the like, or may be partially or entirely different.

For example, the cathode layer 23 is formed on the surface of the dielectric layer 22 of the master 122 (see fig. 2). Specifically, the solid electrolyte layer 23A is formed on the surface of the dielectric layer 22 of the master 122 (see fig. 2). Further, it is preferable to form the conductor layer 23B on the surface of the solid electrolyte layer 23A (see fig. 2). Thus, the capacitor element 10 (see fig. 2) in which the anode plate 21 (see fig. 2) is formed of the mother sheet 122 can be manufactured.

As shown in fig. 6, the master 122 is formed by being cut out from the rolled metal foil 120 in parallel or perpendicular to the rolling direction RD. Therefore, as shown in fig. 7, in a plan view as seen from the thickness direction of the master 122, the rolling direction of the master 122 (the direction indicated by the double-headed arrow RD in fig. 7) is preferably parallel or perpendicular to at least one side constituting the outer shape of the master 122, and more preferably parallel or perpendicular to each side constituting the outer shape of the master 122. For example, as shown in fig. 7, when the outer shape of the master 122 as viewed from the thickness direction of the master 122 is rectangular, the rolling direction RD of the master 122 is perpendicular to the longitudinal direction (left-right direction in fig. 7) of the outer shape of the master 122, and is parallel to the width direction (up-down direction in fig. 7) of the outer shape of the master 122.

When the capacitor array assembly 110 is manufactured, the plurality of capacitor arrays 1 are arranged at an angle with respect to the rolling direction RD of the master 122. As a result, as shown in fig. 7, in a plan view as seen from the thickness direction of the master 122, the rolling direction RD of the master 122 is neither parallel nor perpendicular to each side constituting the outer shape of the capacitor array 1. For example, as shown in fig. 7, in the case where the outer shape of the capacitor array 1 as viewed from the thickness direction of the master 122 is rectangular, the rolling direction RD of the master 122 is neither parallel nor perpendicular to the longitudinal direction (the direction indicated by the double-headed arrow LD in fig. 7) of the outer shape of the capacitor array 1, and is neither parallel nor perpendicular to the width direction (the direction indicated by the double-headed arrow WD in fig. 7) of the outer shape of the capacitor array 1.

The method shown in fig. 7 is advantageous in terms of processing in manufacturing the capacitor array 1 as compared with the method shown in fig. 5. For example, in the case of forming the effective portion of the capacitor element 10 by screen printing, the sides of the squeegee are not overlapped in parallel with the sides constituting the outer shape of the capacitor array 1, so that the processing is stable.

As in fig. 5, linear ribs called roll marks 130 are formed on the surface of the master 122 in the rolling direction RD of the master 122. Since the rolling mark 130 extends along the rolling direction RD, the rolling direction RD of the master 122 can be grasped by observing the surface of the master 122.

In a plan view as seen from the thickness direction of the master 122, the rolling direction RD of the master 122 is preferably arranged at an angle of 30 ° or more and 60 ° or less, more preferably 40 ° or more and 50 ° or less, and still more preferably 45 ° ± 3 ° with respect to at least one side constituting the outer shape of the capacitor array 1. In a plan view as seen from the thickness direction of the master 122, the rolling direction RD of the master 122 may be arranged at an angle of 30 ° or more and 60 ° or less, may be arranged at an angle of 40 ° or more and 50 ° or less, or may be arranged at an angle of 45 ° ± 3 ° with respect to each side constituting the outer shape of the capacitor array 1.

As shown in fig. 7, in a plan view as seen from the thickness direction of the mother sheet 122, it is preferable that each side constituting the outline of the mother sheet 122 is neither parallel nor perpendicular to each side constituting the outline of the capacitor array 1.

In a plan view as seen from the thickness direction of the master 122, each side constituting the outline of the master 122 is preferably arranged at an angle of 30 ° or more and 60 ° or less, more preferably 40 ° or more and 50 ° or less, and still more preferably 45 ° ± 3 ° with respect to at least one side constituting the outline of the capacitor array 1. In a plan view as seen from the thickness direction of the master 122, each side constituting the outer shape of the master 122 may be disposed at an angle of 30 ° or more and 60 ° or less, may be disposed at an angle of 40 ° or more and 50 ° or less, or may be disposed at an angle of 45 ° ± 3 ° with respect to each side constituting the outer shape of the capacitor array 1.

In a plan view as seen from the thickness direction of the master 122, each side constituting the outer shape of the capacitor element 10 is preferably neither parallel nor perpendicular to the rolling direction RD of the master 122, but may include a capacitor element 10 in which some or all sides are parallel or perpendicular to the rolling direction RD of the master 122.

After the capacitor array assembly 100 or 110 is fabricated by the above-described method, the sealing layer 11 may be formed so as to cover the cathode layer 23 (see fig. 1 and 2) constituting each capacitor element 10. For example, by providing an insulating material by press working, the sealing layer 11 can be formed so as to cover from both main surface sides or either main surface side of the master 121 or 122. A first external electrode 12 (see fig. 1 and 2) electrically connected to the anode plate 21 and a second external electrode 13 (see fig. 1 and 2) electrically connected to the cathode layer 23 may be further formed outside the sealing layer 11.

If necessary, a through hole conductor extending in the thickness direction may be formed in the through hole after the through hole is formed. Examples of the method for forming the through hole include laser processing and cutting processing.

Alternatively, slits may be formed between the capacitor elements 10. Examples of the method for forming the slit include laser processing and cutting processing.

Then, the capacitor array assembly 100 or 110 is cut, whereby the capacitor array assembly can be diced into individual capacitor arrays 1. Cutting of the capacitor array assembly 100 or 110 uses dicing or the like.

Thereby, the capacitor array 1 can be manufactured.

[ composite electronic component ]

The capacitor array of the present utility model can be suitably used as a constituent material of a composite electronic component. Such a composite electronic component includes, for example: the capacitor array of the present utility model; an external electrode provided outside the capacitor array (preferably outside the sealing layer of the capacitor array) and electrically connected to each of the anode plate and the cathode layer of the capacitor array; and an electronic component connected to the external electrode.

In the composite electronic component, the electronic component connected to the external electrode may be a passive element or an active element. The external electrode may be connected to both the passive element and the active element, or may be connected to either one of the passive element and the active element. Further, a composite of a passive element and an active element may be connected to an external electrode.

Examples of the passive element include an inductor. Examples of the active element include a memory, a GPU (Graphical Processing Unit: image processor), a CPU (Central Processing Unit: central processing unit), an MPU (Micro Processing Unit: microprocessor), and a PMIC (Power Management IC: power management IC).

The capacitor array of the present utility model has a chip shape as a whole. Therefore, in the composite electronic component, the capacitor array can be handled like a mounting board, and the electronic component can be mounted on the capacitor array. By forming the electronic components mounted on the capacitor array in a chip shape, the capacitor array and the electronic components can be connected in the thickness direction via the via conductors penetrating the electronic components in the thickness direction. As a result, the active element and the passive element can be configured as a collective module.

For example, the capacitor array of the present utility model can be electrically connected between a voltage regulator including a semiconductor active element and a load to which a converted dc voltage is supplied to form a switching regulator.

In the composite electronic component, a circuit layer may be formed on any one of the capacitor matrix sheets on which the plurality of capacitor arrays of the present utility model are further arranged, and then the circuit layer may be connected to a passive element or an active element. As the capacitor matrix sheet, the above-described capacitor array aggregate can be used.

The capacitor array of the present utility model may be arranged in a cavity portion provided in advance in a substrate, and may be embedded with a resin, and then a circuit layer may be formed on the resin. Other electronic components (passive elements or active elements) may be mounted in other cavity portions of the substrate.

Alternatively, the capacitor array of the present utility model may be mounted on a smooth carrier such as a wafer or glass, and the outer layer portion may be formed of a resin, and then the circuit layer may be formed and connected to a passive element or an active element.

Description of the reference numerals

A capacitor array; capacitor element; sealing layer; first external electrode; second external electrode; anode plate; a porous portion; core. A dielectric layer; cathode layer; a solid electrolyte layer; an electrical conductor layer; 30. rolling marks; 100. capacitor array aggregate; rolled metal foil; 121. master slice; RD. the rolling direction; LD. the length of the profile of the capacitor array; WD. the width direction of the outline of the capacitor array.

Claims

1. A capacitor array comprising a plurality of capacitor elements, characterized in that,

the plurality of capacitor elements each include: an anode plate having a porous portion provided on at least one main surface and made of a valve metal; a dielectric layer provided on the surface of the porous portion; and a cathode layer disposed on the surface of the dielectric layer and including a solid electrolyte layer,

the anode plate is a rolled metal foil,

in a plan view as seen from the thickness direction of the anode plate, the rolling direction of the anode plate is neither parallel nor perpendicular to each side constituting the outline of the capacitor array.

2. The capacitor array of claim 1, wherein the capacitor array comprises a plurality of capacitors,

in a plan view as viewed from a thickness direction of the anode plate, a rolling direction of the anode plate is arranged at an angle of 30 ° to 60 ° with respect to at least one side constituting an outer shape of the capacitor array.

3. A capacitor array assembly comprising a plurality of capacitor arrays arranged on a common master, characterized in that,

the plurality of capacitor arrays each include a plurality of capacitor elements,

the anode plate is formed by the master plate,

the master is a rolled metal foil,

in a plan view seen from the thickness direction of the master, the rolling direction of the master is neither parallel nor perpendicular to each side constituting the outline of the capacitor array.

4. The capacitor array aggregate according to claim 3, characterized in that,

in a plan view seen from the thickness direction of the master, each side constituting the outline of the master is neither parallel nor perpendicular to each side constituting the outline of the capacitor array.

5. The capacitor array aggregate according to claim 3 or 4, characterized in that,

each side constituting the outline of the master is disposed at an angle of 30 ° to 60 ° in a plan view as viewed from the thickness direction of the master with respect to at least one side constituting the outline of the capacitor array.

6. The capacitor array aggregate according to claim 3 or 4, characterized in that,

in a plan view seen from the thickness direction of the master, the rolling direction of the master is arranged at an angle of 30 ° to 60 ° with respect to at least one side constituting the outer shape of the capacitor array.