CN219995197U - Ultrathin single-point COB lamp strip - Google Patents
Ultrathin single-point COB lamp strip Download PDFInfo
- Publication number
- CN219995197U CN219995197U CN202321194680.6U CN202321194680U CN219995197U CN 219995197 U CN219995197 U CN 219995197U CN 202321194680 U CN202321194680 U CN 202321194680U CN 219995197 U CN219995197 U CN 219995197U
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- Prior art keywords
- fpc board
- lamp strip
- point
- cob lamp
- ultra
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000000741 silica gel Substances 0.000 claims abstract description 20
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 20
- 235000012431 wafers Nutrition 0.000 claims abstract description 17
- 230000001681 protective effect Effects 0.000 claims description 7
- 239000003292 glue Substances 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000000843 powder Substances 0.000 abstract description 5
- 239000011324 bead Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Landscapes
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The utility model discloses an ultrathin single-point COB lamp strip, which comprises an FPC board, wherein a plurality of LED wafers are arranged on the upper surface of the FPC board at intervals along the length direction of the FPC board, and fluorescent silica gel is sprayed on the LED wafers; firstly, the mode of arranging the traditional silica gel in a whole way is abandoned, a plurality of LED wafers are arranged on the upper surface of the FPC board at intervals along the length direction of the FPC board, and then fluorescent silica gel is sprayed on each LED wafer, so that the cost of the glue dispensing mode is lower than that of the traditional glue pulling mode, the production efficiency can be improved, and meanwhile, the lamp strip is more convenient to bend; the fluorescent powder is closer to the light-emitting chip, so that the brightness is higher, and the light efficiency is better improved; meanwhile, a rectifier bridge is arranged on the FPC board, and the FPC board can be directly connected with high-voltage 220v mains supply through the arrangement of the rectifier bridge, so that the COB lamp strip is free from being connected with a driving power supply.
Description
Technical Field
The utility model relates to the technical field of lamp strips, in particular to an ultrathin single-point COB lamp strip.
Background
The COB lamp strip is a novel LED lamp strip which appears in recent years, and is different from the traditional LED lamp strip which uses LED patch lamp beads as a light source, the COB lamp strip removes a patch packaging process, and an LED wafer is directly bound on a lamp strip substrate, so that the COB lamp strip has the advantages of long service life, simple manufacturing process, energy conservation and environment friendliness, and is gradually used in various lighting decoration industries.
At present, the COB lamp strip on the market is characterized in that an LED flip chip is fixed on a lamp strip substrate, then a continuous semicircular or flat silica gel is coated on the surface of the LED flip chip, fluorescent powder is selectively added in the packaging silica gel according to actual needs, light rays emitted by the LED flip chip are reflected and refracted in the silica gel, and a visual effect of 180 degrees or full surface luminescence is provided for people.
However, the silica gel coated on the surface of the LED wafer is integrally arranged, so that the bending performance of the LED wafer is affected, the integral thickness is thicker, and the glue is wasted; in addition, the traditional integral light source is 2835 lamp beads, the number of the light emitting chips is small, so that the light guiding performance of fluorescent powder is low, meanwhile, the traditional lamp strip cannot be directly connected with 220V electricity, and a driving power supply is generally required to be configured for connecting with the mains supply for use, so that the cost is high, and the production is troublesome.
Disclosure of Invention
The utility model aims to solve at least one of the problems existing in the prior art to a certain extent, and therefore, the utility model provides an ultrathin single-point COB lamp strip.
The above purpose is achieved by the following technical scheme:
the ultrathin single-point COB lamp strip comprises an FPC board, wherein a plurality of LED wafers are arranged on the upper surface of the FPC board along the length direction of the FPC board at intervals, and fluorescent silica gel is sprayed on the LED wafers.
In some embodiments, a rectifier bridge is disposed on the FPC board.
In some embodiments, a plurality of the LED chips are uniformly spaced.
In some embodiments, the spacing between the two LED chips is 0.5mm to 30cm.
In some embodiments, the thickness of the FPC board is 0.1mm to 1mm.
In some embodiments, the surface of the fluorescent silica gel is an arc surface and the height is 0.1 mm-4 mm.
In some embodiments, the FPC board is wrapped with a transparent protective sleeve on the outside.
In some embodiments, the protective sleeve is PVC or silicone.
In some embodiments, the FPC board includes a plurality of circuit board units connected in parallel, and each circuit board unit is provided with a rectifier bridge.
In some embodiments, a power supply pad and a cutting mark are arranged on the FPC board at positions corresponding to each circuit board unit.
Compared with the prior art, the utility model at least comprises the following beneficial effects:
firstly, the mode of arranging the traditional silica gel in a whole way is abandoned, a plurality of LED wafers are arranged on the upper surface of the FPC board at intervals along the length direction of the FPC board, and then fluorescent silica gel is sprayed on each LED wafer, so that the cost of the glue dispensing mode is lower than that of the traditional glue pulling mode, the production efficiency can be improved, and meanwhile, the lamp strip is more convenient to bend; and the fluorescent powder is closer to the light-emitting chip, so that the brightness is higher, and the light efficiency is better improved.
Drawings
FIG. 1 is a schematic perspective view of a COB light strip of the present utility model;
FIG. 2 is a schematic top view of the COB light strip of the present utility model;
fig. 3 is a schematic partial cross-sectional view of the present utility model.
Detailed Description
The following examples illustrate the utility model, but the utility model is not limited to these examples. Modifications and equivalents of some of the technical features of the specific embodiments of the present utility model may be made without departing from the spirit of the present utility model, and they are all included in the scope of the claimed utility model.
As shown in fig. 1-3, the present embodiment provides an ultra-thin single-point COB lamp strip, which includes an FPC board 1, wherein a plurality of LED chips 2 are disposed on the upper surface of the FPC board 1 along the length direction thereof at intervals, and fluorescent silica gel 3 is sprayed on the LED chips 2.
According to the utility model, a traditional mode of arranging the whole piece of silica gel is abandoned, the upper surface of the FPC board 1 is provided with the plurality of LED wafers 2 at intervals along the length direction of the FPC board, and then fluorescent silica gel is sprayed on each LED wafer 2, so that the cost of the glue dispensing mode is lower than that of the traditional glue pulling mode, the production efficiency can be improved, and meanwhile, the lamp strip is more convenient to bend; and the fluorescent powder is closer to the light-emitting chip, so that the brightness is higher, and the light efficiency is better improved.
The conventional COB lamp strip generally needs to be configured with a driving power supply to be connected with a mains supply, so that the cost is high, the production is troublesome, and in order to solve the problem, the FPC board 1 is provided with a rectifier bridge 21, and the FPC board 1 can be directly connected with the high-voltage 220v mains supply through the arrangement of the rectifier bridge 21, so that the COB lamp strip is free from being connected with the driving power supply.
Of course, the resistor 30 is also provided on the FPC board 1.
In the utility model, a plurality of LED chips 2 are uniformly distributed and arranged at intervals.
Further, the distance between the two LED chips 2 is 0.5mm to 30cm.
Further, the pitch of the two LED chips 2 is preferably 0.5mm to 20mm, wherein the closer the pitch is, the higher the luminance is.
In the present utility model, the thickness of the FPC board 1 is 0.1mm to 1mm, preferably 0.4mm.
The surface of the fluorescent silica gel 3 is an arc surface, the height is 0.1-4 mm, the light emitted by the LED wafer 2 is refracted by the fluorescent silica gel 3 and more uniformly emitted, and glare can be effectively prevented.
In the present utility model, the FPC board 1 includes a plurality of circuit board units 11 connected in parallel, and each circuit board unit 11 is provided with a rectifier bridge 21.
Further, the FPC board 1 is provided with a power supply pad 10 and a cutting mark 20 corresponding to each circuit board unit 11, and the cutting mark 20 can be used for conveniently identifying each circuit board unit 11, so that cutting is convenient and quick.
However, when the conventional COB lamp strip is used, the power supply pad 10 is easy to contact with the outside, particularly when the conventional COB lamp strip is used outdoors, the power supply pad 10 is not safe to use because the lamp housing cannot be completely waterproof and is in contact with a humid environment; a transparent protective cover (not shown in the drawings) is wrapped around the outside of the FPC board 1.
Further, the protective sleeve is made of PVC or silica gel.
Therefore, the COB lamp strip is wrapped by the protective sleeve, so that the COB lamp strip can be completely waterproof, the power supply pad 10 is not contacted with the outside, and the use is safe.
What has been described above is merely some embodiments of the present utility model. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit of the utility model.
Claims (9)
1. An ultra-thin single-point type COB lamp area, its characterized in that: the LED lamp comprises an FPC board (1), wherein a plurality of LED wafers (2) are arranged on the upper surface of the FPC board (1) along the length direction at intervals, fluorescent silica gel (3) is sprayed on the LED wafers (2), and a rectifier bridge (21) is further arranged on the FPC board (1).
2. The ultra-thin single-point COB lamp strip of claim 1, wherein: the FPC board (1) comprises a plurality of circuit board units (11) which are connected in parallel, and rectifier bridges (21) are arranged on the circuit board units (11).
3. The ultra-thin single-point COB lamp strip of claim 2, wherein: the FPC board (1) is provided with a power supply pad (10) and a cutting marking (20) at positions corresponding to each circuit board unit (11).
4. The ultra-thin single-point COB lamp strip of claim 1, wherein: the LED chips (2) are uniformly distributed at intervals.
5. The ultra-thin single-point COB lamp strip of claim 4, wherein: the distance between the two LED chips (2) is 0.5 mm-30 cm.
6. The ultra-thin single-point COB lamp strip of claim 5, wherein: the distance between the two LED wafers (2) is 0.5-20 mm, and the thickness of the FPC board (1) is 0.1-1 mm.
7. The ultra-thin single-point COB lamp strip of claim 1, wherein: the surface of the fluorescent silica gel (3) is an arc surface, and the height is 0.1 mm-4 mm.
8. The ultra-thin single-point COB lamp strip of claim 1, wherein: the outside of FPC board (1) parcel has transparent protective sheath.
9. The ultra-thin single-point COB lamp strip of claim 8, wherein: the protective sleeve is made of PVC or silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321194680.6U CN219995197U (en) | 2023-05-17 | 2023-05-17 | Ultrathin single-point COB lamp strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321194680.6U CN219995197U (en) | 2023-05-17 | 2023-05-17 | Ultrathin single-point COB lamp strip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219995197U true CN219995197U (en) | 2023-11-10 |
Family
ID=88614610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321194680.6U Active CN219995197U (en) | 2023-05-17 | 2023-05-17 | Ultrathin single-point COB lamp strip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219995197U (en) |
-
2023
- 2023-05-17 CN CN202321194680.6U patent/CN219995197U/en active Active
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