CN219979521U

CN219979521U - Direct-drive driving device for carrying wafers

Info

Publication number: CN219979521U
Application number: CN202320303699.3U
Authority: CN
Inventors: 李小烨; 何爱军; 张杰威
Original assignee: Hangzhou Huixiang Electro Hydraulic Technology Development Co ltd
Current assignee: Hangzhou Huixiang Electro Hydraulic Technology Development Co ltd
Priority date: 2023-02-20
Filing date: 2023-02-20
Publication date: 2023-11-07
Anticipated expiration: 2033-02-20

Abstract

The utility model discloses a direct-drive driving device for carrying wafers, which comprises a guide rail, a main body and a driving assembly, wherein the main body is arranged on the guide rail and is used for bearing the wafers, the main body can move along the extending direction of the guide rail relative to the guide rail so as to enable the wafers to move in the extending direction of the guide rail, the driving assembly comprises a rod piece, a connecting piece, a direct-drive motor and an encoder, the rod piece extends along the extending direction of the guide rail, the connecting piece is connected with the main body and the rod piece, the connecting piece can move on the rod piece relative to the rod piece, the direct-drive motor is connected with the rod piece, the direct-drive motor is used for driving the rod piece to rotate around the axis direction of the rod piece so as to enable the connecting piece to drive the main body to move on the rod piece, the encoder is positioned below the direct-drive motor, and the encoder is used for recording the rotating angle of the rod piece and calculating the moving position of the main body on the guide rail according to the rotating angle. The direct-drive driving device for carrying the wafers has the advantages of small moment of inertia, long service life and high reliability.

Description

Direct-drive driving device for carrying wafers

Technical Field

The utility model relates to the field of semiconductors, in particular to a direct-drive driving device for carrying wafers.

Background

Wafer refers to a silicon wafer used in the fabrication of silicon semiconductor circuits. In the semiconductor manufacturing process, a wafer handling robot is required to frequently transfer wafers between several processes, and in a classical wafer handling robot, an end effector is required to perform ascending and descending actions in the Z-axis direction.

In the related art, a wafer handling manipulator mostly uses a servo motor or a stepping motor, is provided with a speed reducer for speed reduction, and realizes the linear motion of a wafer in the Z-axis direction through synchronous belt transmission. However, the synchronous belt has the defects of error, elastic deformation and fatigue wear, the rigidity of the transmission system is low, and vibration can be generated in the acceleration or deceleration process, so that the transmission precision of the system is reduced.

Disclosure of Invention

The present utility model aims to solve at least one of the technical problems in the related art to some extent. Therefore, the embodiment of the utility model provides a direct-drive driving device for carrying wafers, which has the advantages of high transmission rigidity, small moment of inertia of a load, long service life and high reliability.

The direct drive driving device for carrying wafers according to the embodiment of the utility model comprises: a guide rail;

the main body is arranged on the guide rail and is used for bearing a wafer, and the main body can move along the extending direction of the guide rail relative to the guide rail so as to enable the wafer to move along the extending direction of the guide rail;

the driving assembly comprises a rod piece, a connecting piece and a direct-drive motor, the rod piece extends along the extending direction of the guide rail, the connecting piece is connected with the main body and the rod piece, the connecting piece can move on the rod piece relative to the rod piece, the direct-drive motor is connected with the rod piece, and the direct-drive motor is used for driving the rod piece to rotate around the extending direction of the guide rail so that the connecting piece drives the main body to move on the rod piece;

the encoder is positioned below the direct-drive motor, and is used for recording the rotation angle of the rod piece around the extending direction of the guide rail and calculating the moving position of the main body on the guide rail according to the rotation angle.

According to the direct-drive driving device for carrying the wafer, the rod is driven by the direct-drive motor to rotate around the axis of the rod, so that the connecting piece drives the main body to move along the extending direction of the guide rail, the main body carries the wafer to move along the extending direction of the rod, the position of the main body moving on the rod is calculated through the encoder, and the position of the wafer on the rod is determined. In addition, compared with the prior art, the direct-drive driving device for carrying the wafer has the advantages that the particle dust is reduced, the cleanliness can be guaranteed, the service life of the direct-drive driving device for carrying the wafer is prolonged, and the reliability is improved.

In some embodiments, the direct drive apparatus for wafer handling further comprises:

the rack body is provided with a first cavity, the guide rail is arranged on the inner wall surface of the first cavity, and the main body and the driving assembly are arranged in the first cavity;

the sliding block is arranged in the guide rail, the sliding block can move on the guide rail along the extending direction of the guide rail relative to the guide rail, and at least part of the sliding block is connected with the main body so as to drive the main body to move along the extending direction of the guide rail.

In some embodiments, the side of the slider adjacent the body is curved protruding toward the body.

In some embodiments, the direct drive driving device for wafer handling further includes a first bearing and a second bearing, the first bearing and the second bearing are arranged at intervals along the extending direction of the guide rail, the first bearing is located at the bottom of the first chamber, the second bearing is disposed at the top of the first chamber, one end of the rod is connected to the first bearing, and the other end of the rod is connected to the second bearing.

In some embodiments, the direct drive driving device for wafer handling further includes a mounting base, the mounting base is disposed on a bottom surface of the first chamber, the mounting base has a second chamber, the first bearing is disposed in the second chamber, an outer wall surface of the first bearing is connected to an inner wall surface of the second chamber, and the encoder is disposed in the second chamber.

In some embodiments, the direct drive driving device for wafer handling further includes a magnetic ring, the magnetic ring is located between the direct drive motor and the encoder, the magnetic ring is disposed in the second chamber, and the magnetic ring is disposed around an outer wall surface of the rod member.

In some embodiments, the direct drive apparatus for wafer handling further includes a stopper provided at a bottom of the first chamber, the stopper being mounted at a bottom of the mounting seat, the stopper being for maintaining a state of the main body.

In some embodiments, the frame body includes a base, a top surface, and support members, the base and the top surface being spaced apart in an extending direction of the guide rail, at least two of the support members being spaced apart around a circumference of the base, the support members connecting the base and the top surface, the first chamber being formed between the base, the top surface, and the support members.

In some embodiments, the bottom of the base has a mounting slot, and the detent is disposed in the mounting slot.

Drawings

Fig. 1 is a schematic diagram of a direct drive apparatus for wafer handling according to an embodiment of the present utility model.

Fig. 2 is a schematic cross-sectional view of a direct drive apparatus for wafer handling according to an embodiment of the present utility model.

Reference numerals: 1. a guide rail; 2. a main body; 3. a drive assembly; 31. a rod piece; 32. a connecting piece; 321. perforating; 33. a direct drive motor; 4. a frame body; 41. a first chamber; 42. a base; 421. a mounting groove; 43. a top surface; 44. a support; 5. a slide block; 61. a first bearing; 62. a second bearing; 71. a mounting base; 72. an encoder; 73. a magnetic conductive ring; 74. a brake.

Detailed Description

Reference will now be made in detail to embodiments of the present utility model, examples of which are illustrated in the accompanying drawings. The embodiments described below by referring to the drawings are illustrative and intended to explain the present utility model and should not be construed as limiting the utility model.

As shown in fig. 1-2, the direct drive apparatus for wafer handling according to the embodiment of the present utility model includes a guide rail 1, a main body 2, a drive assembly 3, and an encoder 72. The body 2 is provided on the guide rail 1, the body 2 is for carrying a wafer (not shown), and the body 2 is movable relative to the guide rail 1 along the extending direction of the guide rail 1 so that the wafer moves in the extending direction of the guide rail 1. Specifically, as shown in fig. 1, the guide rail 1 extends in the up-down direction, and the main body 2 may extend in the up-down direction with respect to the guide rail 1 to move the wafer in the up-down direction.

The driving assembly 3 comprises a rod 31, a connecting piece 32 and a direct-drive motor 33, wherein the rod 31 extends along the extending direction of the guide rail 1, the connecting piece 32 is connected with the main body 2 and the rod 31, the connecting piece 32 can move on the rod 31 relative to the rod 31, the direct-drive motor 33 is connected with the rod 31, and the direct-drive motor 33 is used for driving the rod 31 to rotate around the extending direction of the guide rail 1 so that the connecting piece 32 drives the main body 2 to move on the rod 31. Specifically, the rod 31 extends in the up-down direction, and the direct drive motor 33 drives the rod 31 to rotate around the up-down direction, so that the connecting piece 32 drives the main body 2 to move in the up-down direction, and the main body 2 carries the wafer to move in the up-down direction.

An encoder 72, the encoder 72 is located below the direct-drive motor 33, and the encoder 72 is configured to record a rotation angle of the lever 31 about the extending direction of the guide rail 1, and calculate a position where the main body 2 moves on the guide rail 1 based on the rotation angle.

Specifically, the encoder 72 is located below the direct-drive motor 33, and the encoder 72 has an input end (not shown) and an output end (not shown), the input end being connected to one end of the lever 31 (the lower end of the lever 31 shown in fig. 2). The encoder 72 is used for converting the angular displacement generated by the rotation of the rod 31 around the vertical direction into an electrical signal, and the electrical signal is transmitted into the encoder 72 through the input end and then output by the output end, so as to calculate the position of the main body 2 on the rod 31 according to the electrical signal.

Therefore, the direct-drive driving device for wafer handling in the embodiment of the utility model has the advantages that the direct-drive motor 33 is directly connected with the rod piece 31, no unbalanced load is generated, no torque loss is generated, the transmission precision is high, the transmission rigidity of the direct-drive driving device for wafer handling in the embodiment of the utility model is high, the moment of inertia of a load is reduced, and the response speed of the direct-drive driving device for wafer handling in the embodiment of the utility model is obviously improved. In addition, compared with the prior art, the direct-drive driving device for carrying the wafer has the advantages that the particle dust is reduced, the cleanliness can be guaranteed, the service life of the direct-drive driving device for carrying the wafer is prolonged, and the reliability is improved.

In some embodiments, the direct drive apparatus for wafer handling according to the embodiments of the present utility model further includes a frame 4 and a slider 5. The frame 4 has a first chamber 41, the guide rail 1 is provided on an inner wall surface of the first chamber 41, and the main body 2 and the driving unit 3 are provided in the first chamber 41. Specifically, the frame body 4 extends in the up-down direction, the first chamber 41 extends in the up-down direction, and the guide rail 1 is provided on the inner wall surface of the first chamber 41 and extends in the extending direction of the first chamber 41.

The sliding block 5 is arranged in the guide rail 1, the sliding block 5 can move on the guide rail 1 along the extending direction of the guide rail 1 relative to the guide rail 1, and at least part of the sliding block 5 is connected with the main body 2 so as to drive the main body 2 to move along the extending direction of the guide rail 1. Specifically, the slider 5 is slidably mounted on the guide rail 1, and the slider 5 is not easily separated from the guide rail 1, so that the slider 5 can drive the column to move in the up-down direction relative to the guide rail 1, thereby making the main body 2 more stable when moving in the up-down direction.

In some embodiments, the side of the slider 5 adjacent to the body 2 is curved, protruding towards the body 2. Specifically, as shown in fig. 1, the cross section of the main body 2 is circular, and the side surface of the slider 5 adjacent to the main body 2 is in an arc shape protruding toward the main body 2, so as to increase the contact area between the slider 5 and the outer wall surface of the main body 2, thereby making the connection between the slider 5 and the main body 2 more stable, and further making the slider 5 drive the main body 2 to move in the up-down direction more stable.

In some embodiments, the direct drive apparatus for wafer handling according to the embodiment of the present utility model further includes a first bearing 61 and a second bearing 62, the first bearing 61 and the second bearing 62 are spaced apart along the extending direction of the guide rail 1, the first bearing 61 is located at the bottom of the first chamber 41, the second bearing 62 is disposed at the top of the first chamber 41, one end of the rod 31 (the lower end of the rod 31 as shown in fig. 2) is connected to the first bearing 61, and the other end of the rod 31 (the upper end of the rod 31 as shown in fig. 2) is connected to the second bearing 62.

Specifically, as shown in fig. 2, the first bearing 61 and the second bearing 62 are arranged at intervals in the up-down direction, the lower end of the lever 31 is connected to the first bearing 61, and the upper end of the lever 31 is connected to the second bearing 62 so that the lever 31 can rotate in the up-down direction with respect to the frame body 4.

In some embodiments, the direct drive apparatus for wafer handling according to the embodiments of the present utility model further includes a mounting base 71, the mounting base 71 is disposed on the bottom surface of the first chamber 41, the mounting base 71 has a second chamber (not shown), the first bearing 61 is disposed in the second chamber, the outer wall surface of the first bearing 61 is connected to the inner wall surface of the second chamber, and the encoder 72 is disposed in the second chamber.

Specifically, as shown in fig. 1, the mounting seat 71 is disposed on the bottom surface of the first chamber 41, and the first bearing 61 is disposed in the second chamber, so that the lower end of the rod 31 is connected with the bottom surface of the first chamber 41 through the mounting seat 71, the contact area between the rod 31 and the frame 4 is increased, and the rod 31 is firmly mounted in the first chamber 41, so that the moving stability of the body on the rod 31 is further improved.

In some embodiments, the direct-drive driving device for wafer handling according to the embodiments of the present utility model further includes a magnetic ring 73, where the magnetic ring 73 is located between the direct-drive motor 33 and the encoder 72, and the magnetic ring 73 is disposed in the second chamber, and the magnetic ring 73 is disposed around the outer wall surface of the rod 31. Specifically, as shown in fig. 2, the magnetic ring 73 is located between the direct-drive motor 33 and the encoder 72, so that the influence of the magnetic field generated by the coil in the direct-drive motor 33 on the encoder 72 can be effectively avoided, and the calculation result of the encoder 72 is more accurate.

In some embodiments, the direct drive apparatus for wafer handling according to the embodiment of the present utility model further includes a stopper 74, the stopper 74 is disposed at the bottom of the first chamber 41, the stopper 74 is mounted at the bottom of the mounting seat 71, and the stopper 74 is used to maintain the state of the main body 2. Specifically, the lower end of the lever 31 is located in the stopper 74, and the lever 31 is rotatable in the up-down direction with respect to the stopper 74. When the direct drive apparatus for wafer handling according to the embodiment of the present utility model is stopped or powered off, the brake 74 can maintain the direct drive apparatus for wafer handling according to the embodiment of the present utility model in the current state.

In some embodiments, the frame body 4 includes a base 42, a top surface 43, and support members 44, the base 42 and the top surface 43 are spaced apart in the extending direction of the guide rail 1, at least two support members 44 are spaced apart around the circumference of the base 42, the support members 44 connect the base 42 and the top surface 43, and the first chamber 41 is formed between the base 42, the top surface 43, and the support members 44.

Specifically, as shown in fig. 1 and 2, the base 42 and the top surface 43 are spaced apart and oppositely arranged in the up-down direction, the two supporting members 44 are spaced apart around the circumference of the base 42, the upper ends of the supporting members 44 are connected to the top surface 43, the lower ends of the supporting members 44 are connected to the base 42, and the first chamber 41 is formed between the base 42, the top surface 43 and the supporting members 44, whereby the structure of the frame 4 is simple, the manufacturing is easy, and the cost is saved.

In some embodiments, the bottom of the base 42 has a mounting slot 421 and the detent 74 is disposed within the mounting slot 421. Specifically, as shown in fig. 2, the top of the base 42 has a mounting groove 421, and the stopper 74 is provided in the mounting groove 421 so that the stopper 74 is firmly mounted in the first chamber 41, thereby stabilizing the rotation of the lever 31 in the up-down direction.

In some embodiments, the rod 31 has an external thread on an outer wall surface, the connecting member 32 has a through hole 321, and an internal thread on an inner wall surface of the through hole 321, the rod 31 is threaded in the through hole 321, and the rod 31 is in threaded engagement with the connecting member 32. Specifically, the inner wall surface of the through hole 321 is in threaded fit with the outer wall surface of the rod 31, so that when the rod 31 rotates around the vertical direction under the action of the direct-drive motor 33, the connecting piece 32 can move up and down on the rod 31, and compared with the prior art, dust particles generated by the synchronous belt are reduced, cleanliness is ensured, the service life of the direct-drive driving device for carrying wafers is prolonged, and the reliability of operation is improved. In addition, the rod 31 and the connecting piece 32 are matched in a simple manner, and the operation is easy.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

For purposes of this disclosure, the terms "one embodiment," "some embodiments," "example," "a particular example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

While the above embodiments have been shown and described, it should be understood that the above embodiments are illustrative and not to be construed as limiting the utility model, and that variations, modifications, alternatives, and variations of the above embodiments may be made by those of ordinary skill in the art without departing from the scope of the utility model.

Claims

1. A direct drive apparatus for wafer handling, comprising:

a guide rail (1);

the main body (2) is arranged on the guide rail (1), the main body (2) is used for bearing a wafer, and the main body (2) can move along the extending direction of the guide rail (1) relative to the guide rail (1) so as to enable the wafer to move in the extending direction of the guide rail (1);

the driving assembly (3), the driving assembly (3) comprises a rod piece (31), a connecting piece (32) and a direct-drive motor (33), the rod piece (31) extends along the extending direction of the guide rail (1), the connecting piece (32) is connected with the main body (2) and the rod piece (31), the connecting piece (32) can move on the rod piece (31) relative to the rod piece (31), the direct-drive motor (33) is connected with the rod piece (31), and the direct-drive motor (33) is used for driving the rod piece (31) to rotate around the axis of the direct-drive motor so that the connecting piece (32) drives the main body (2) to move on the rod piece (31);

the encoder (72) is positioned below the direct-drive motor (33), and the encoder (72) is used for recording the rotation angle of the rod piece (31) around the extending direction of the guide rail (1) and calculating the moving position of the main body (2) on the guide rail (1) according to the rotation angle.

2. The direct drive apparatus for wafer handling according to claim 1, further comprising:

the frame body (4), the frame body (4) is provided with a first cavity (41), the guide rail (1) is arranged on the inner wall surface of the first cavity (41), and the main body (2) and the driving assembly (3) are arranged in the first cavity (41);

the sliding block (5), the sliding block (5) is arranged in the guide rail (1), the sliding block (5) can move along the extending direction of the guide rail (1) on the guide rail (1) relative to the guide rail (1), and at least part of the sliding block (5) is connected with the main body (2) so as to drive the main body (2) to move along the extending direction of the guide rail (1).

3. Direct drive for wafer handling according to claim 2, characterized in that the side of the slider (5) adjacent to the body (2) is arc-shaped protruding towards the body (2).

4. The direct drive apparatus for wafer handling according to claim 2, further comprising a first bearing (61) and a second bearing (62), the first bearing (61) and the second bearing (62) being arranged at intervals along the extending direction of the guide rail (1), the first bearing (61) being located at the bottom of the first chamber (41), the second bearing (62) being provided at the top of the first chamber (41), one end of the lever (31) being connected to the first bearing (61), and the other end of the lever (31) being connected to the second bearing (62).

5. The direct drive apparatus for wafer handling according to claim 4, further comprising a mount (71), the mount (71) being provided on a bottom surface of the first chamber (41), the mount (71) having a second chamber, the first bearing (61) being provided in the second chamber, an outer wall surface of the first bearing (61) being connected to an inner wall surface of the second chamber, and the encoder (72) being provided in the second chamber.

6. The direct drive apparatus for wafer handling according to claim 5, further comprising a magnetically permeable ring (73), the magnetically permeable ring (73) being located between the direct drive motor (33) and the encoder (72), the magnetically permeable ring (73) being provided in the second chamber, the magnetically permeable ring (73) being provided around an outer wall surface of the rod (31) for one revolution.

7. The direct drive apparatus for wafer handling according to claim 5, further comprising a stopper (74), the stopper (74) being provided at a bottom of the first chamber (41), the stopper (74) being mounted at a bottom of the mounting base (71), the stopper (74) being for maintaining a state of the main body (2).

8. The direct drive apparatus for wafer handling according to claim 7, wherein the frame body (4) includes a base (42), a top surface (43) and support members (44), the base (42) and the top surface (43) are arranged at intervals in an up-down direction, at least two of the support members (44) are arranged at intervals around a circumference of the base (42), the support members (44) connect the base (42) and the top surface (43), and the first chamber (41) is formed between the base (42), the top surface (43) and the support members (44).

9. The direct drive apparatus for wafer handling according to claim 8, wherein the bottom of the base (42) has a mounting groove (421), and the stopper (74) is provided in the mounting groove (421).