CN219959392U - Air bridge and superconducting quantum chip - Google Patents

Abstract

The utility model discloses an air bridge and a superconducting quantum chip. The air bridge comprises a metal layer and four metal columns, wherein the central points of the cross section shapes of the four metal columns are two by two to form a preset quadrangle, the metal layer covers the four metal columns, and the four metal columns jointly support the metal layer. The metal column is as the bridge pier, and the metal layer is as the bridge floor of connecting the bridge pier, because there are four bridge piers, and all be connected with the bridge floor between four bridge pier two by two, structural strength obtains strengthening to can improve the structural stability of air bridge, make the air bridge be difficult to fracture and collapse when making and using.

Description

Air bridge and superconducting quantum chip

Technical Field

The utility model relates to the technical field of quantum chips, in particular to an air bridge and a superconducting quantum chip.

Background

There are a large number of coplanar waveguides in a superconducting quantum chip, and due to the limitation of process factors, the morphology of the coplanar waveguides is not perfect, flaws such as poor symmetry, uneven edges, discontinuity and the like always exist, and in addition, as the number of qubits on the superconducting quantum chip increases, the number of coplanar waveguides also increases, so that the wiring of the coplanar waveguides becomes more and more complex. In order to correct defects of the coplanar waveguide and facilitate wiring of the coplanar waveguide, an air bridge is introduced into the superconducting quantum chip, and the air bridge is used for connecting grounding strips on two sides of the coplanar waveguide.

The structure of the current air bridge is shown in fig. 1, and the air bridge is simple and has an arched structure. Since the thickness of the air bridge at the edge fold is small, the structural stability is poor, and the air bridge is easily broken and collapsed, for example, when the air bridge is manufactured, photoresist is required to be used as a support, and the air bridge is easily broken when the photoresist is removed by performing ultrasonic cleaning and other processes.

Disclosure of Invention

The utility model aims to provide an air bridge and a superconducting quantum chip, which are used for solving the problem of poor structural stability of the air bridge in the prior art and improving the structural stability of the air bridge.

In order to solve the technical problems, the utility model provides an air bridge, which comprises a metal layer and four metal columns, wherein the center points of the cross section shapes of the four metal columns are two by two to form a preset quadrilateral, the metal layer covers the four metal columns, and the four metal columns jointly support the metal layer.

Preferably, the coverage of the metal layer does not exceed the range defined by the outline of the four metal posts and the connection line of the outermost vertexes of two adjacent metal posts.

Preferably, the metal layer is provided with a through hollow hole, and the hollow hole is positioned in the preset quadrangle.

Preferably, the shape of the hollowed-out hole is a quadrangle which is parallel to the preset quadrangle and the center of the hollowed-out hole coincides with the preset quadrangle.

Preferably, the top projection of the hollowed-out hole is not overlapped with the top projections of the four metal posts.

Preferably, the preset quadrangle is rectangular.

Preferably, the cross section of the metal column is rectangular

Preferably, the metal posts are integrally formed with the metal layer.

In order to solve the technical problem, the utility model also provides a superconducting quantum chip, which comprises a substrate, a coplanar waveguide and an air bridge according to any one of the above, wherein the coplanar waveguide is formed on the substrate, two adjacent metal posts of the air bridge are positioned on one grounding strap of the coplanar waveguide, the other two metal posts are positioned on the other grounding strap of the coplanar waveguide, a central conductor of the coplanar waveguide passes through a gap between the metal posts on the two grounding straps, and the metal layer spans over the central conductor.

Compared with the prior art, the air bridge provided by the utility model comprises the metal layer and four metal columns, wherein the center points of the cross section shapes of the four metal columns are pairwise arranged to form a preset quadrangle, the metal layer covers the four metal columns, the four metal columns jointly support the metal layer, the metal columns serve as bridge piers, and the metal layer serves as bridge decks for connecting the bridge piers.

The superconducting quantum chip provided by the utility model comprises the air bridge, has the same technical effects, and is not repeated here.

Drawings

Fig. 1 is a schematic structural diagram of an air bridge in the prior art.

Fig. 2 is a schematic structural diagram of an air bridge according to an embodiment of the present utility model.

Fig. 3 is a schematic diagram illustrating a positional relationship between a top view of the metal layer and top view of four metal posts in fig. 2.

Fig. 4 is a schematic structural diagram of an air bridge according to another embodiment of the present utility model.

Fig. 5 is a schematic diagram illustrating a positional relationship between a top view of the metal layer and top view of four metal posts in fig. 4.

Fig. 6 is a schematic diagram of a portion of a superconducting quantum chip according to an embodiment of the present utility model.

Fig. 7 is a schematic view of a portion of a superconducting quantum chip according to another embodiment of the present utility model.

Detailed Description

Specific embodiments of the present utility model will be described in more detail below with reference to the drawings. Advantages and features of the utility model will become more apparent from the following description and claims. It should be noted that the drawings are in a very simplified form and are all to a non-precise scale, merely for convenience and clarity in aiding in the description of embodiments of the utility model.

In the description of the present utility model, it should be understood that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", etc., are based on the directions or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

Referring to fig. 2, an air bridge is provided in an embodiment of the present utility model. The air bridge comprises a metal layer 10 and four metal columns 20, wherein the center points of the cross section shapes of the four metal columns 20 are two by two to form a preset quadrangle, the metal layer 10 covers the four metal columns 20, and the four metal columns 20 jointly support the metal layer 10.

Wherein, the metal column 20 is used as bridge pier of the air bridge, the metal layer 10 is used as bridge deck of the air bridge, and the bridge decks are connected between every two of the four bridge piers, so that the structural strength of the air bridge is enhanced. Therefore, the utility model can improve the structural stability of the air bridge, and the air bridge is not easy to break and collapse during manufacturing and use.

The preset quadrangle may be rectangular, rhombic or other shape, and the present embodiment is preferably rectangular, especially square. The cross-sectional shape of the metal post 20 may be any shape, such as rectangular, circular, rounded rectangular, triangular, etc., and as such, the present embodiment is preferably rectangular, particularly square.

In order to minimize the area of the air bridge, in some embodiments of the present utility model, the coverage of the metal layer 10 does not exceed the range defined by the outline of the four metal posts 20 and the connection lines of the outermost vertices of the adjacent two metal posts 20. Fig. 3 is a schematic diagram showing a positional relationship between a top view of the metal layer and top view of four metal posts in fig. 2. In the figure, the preset quadrangle (shown by the inner dashed line frame in the figure) is square, the section shape of the metal column 20 is also square, the range defined by the outline of the four metal columns 20 and the connecting line of the outermost vertexes of the two adjacent metal columns 20 is just the circumscribed square of the four metal columns 20, and the coverage of the metal layer 10 is just the circumscribed square (shown by the outer dashed line frame in the figure). If the cross-sectional shape of the metal posts 20 is other than quadrilateral, such as circular, then the outermost vertices of the metal posts 20 are tangent points of common tangents to the cross-sectional shapes of adjacent two metal posts 20.

In some embodiments of the present utility model, metal posts 20 are integrally formed with metal layer 10. Stress exists at the joint of the metal post 20 and the metal layer 10, and if the metal post 20 and the metal layer 10 are integrally formed, the stress can be greatly improved, and the structural strength of the air bridge can be further enhanced. The metal pillars 20 and the metal layer 10 may be integrally formed by a metal deposition process, for example, four through holes having the same shape as the metal pillars 20 are etched in the photoresist, then metal is deposited, the metal deposited in the through holes becomes the metal pillars 20, and the metal deposited on the photoresist becomes the metal layer 10.

Referring to fig. 4, another embodiment of the present utility model provides an air bridge. The air bridge of this embodiment is based on the air bridge of the foregoing embodiment, and has all the technical features of the air bridge of the foregoing embodiment, except that in this embodiment, the metal layer 10 is provided with through hollowed holes 11, and the hollowed holes 11 are located in a preset quadrilateral.

When the area of the metal layer 10 is excessively large, the load bearing of the metal posts 20 is increased, and the photoresist is excessively blocked when the air bridge is manufactured, which is inconvenient to remove. The hollowed-out holes 11 can reduce the weight of the metal layer 10 and expose more photoresist, so that the bearing of the metal posts 20 can be reduced, and photoresist is convenient to remove when the air bridge is manufactured.

In some embodiments of the present utility model, the hollowed-out hole 11 is a quadrilateral parallel to the preset quadrilateral and having a center coincident with the preset quadrilateral. Fig. 5 is a schematic diagram showing a positional relationship between a top view of the metal layer and top view of four metal posts in fig. 4. In the figure, the preset quadrangle (shown by the innermost dashed frame in the figure) is square, the cross section of the metal column 20 is also square, the range defined by the outline of four metal columns 20 and the connection line of the outermost vertexes of two adjacent metal columns 20 is just the circumscribed square of the four metal columns 20, and the coverage of the metal layer 10 is just the circumscribed square (shown by the outermost dashed frame in the figure). The coverage area of the hollowed-out hole 11 is square (shown by a dotted line box in the middle in the figure), and the hollowed-out hole is parallel to the preset quadrangle and coincides with the center.

Further, in some embodiments of the present utility model, the top projection of the hollowed-out hole 11 does not overlap with the top projections of the four metal posts 20. Referring to fig. 5 again, the top-view projection of the hollowed-out hole 11 does not overlap with the top-view projection of the four metal posts 20, but the four vertices of the top-view projection of the hollowed-out hole 11 overlap with the innermost vertices of the top-view projection of the four metal posts 20.

Referring to fig. 6, an embodiment of the present utility model provides a superconducting quantum chip. The superconducting quantum chip comprises a substrate 2, a coplanar waveguide 3 and the air bridge of the first embodiment, wherein the coplanar waveguide 3 is formed on the substrate 2, two adjacent metal posts 20 of the air bridge are positioned on one grounding zone 31 of the coplanar waveguide 3, the other two metal posts 20 are positioned on the other grounding zone 31 of the coplanar waveguide 3, a central conductor 32 of the coplanar waveguide 3 passes through a gap between the metal posts 20 on the two grounding zones 31, and a metal layer 10 is arranged above the central conductor 32 in a crossing manner.

Because the air bridge has four piers, a gap is formed between any two adjacent piers, no air bridge is required to be arranged, only the central conductor 32 of the coplanar waveguide 3 needs to pass through the gap between two pairs of piers, and the two pairs of piers are respectively arranged on the two grounding strips 31 of the coplanar waveguide 3.

Referring to fig. 7, another embodiment of the present utility model provides a superconducting quantum chip. The superconducting quantum chip comprises a substrate 2, a coplanar waveguide 3 and an air bridge of the second embodiment, wherein the coplanar waveguide 3 is formed on the substrate 2, two adjacent metal posts 20 of the air bridge are positioned on one grounding zone 31 of the coplanar waveguide 3, the other two metal posts 20 are positioned on the other grounding zone 31 of the coplanar waveguide 3, a central conductor 32 of the coplanar waveguide 3 passes through a gap between the metal posts 20 on the two grounding zones 31, and a metal layer 10 is arranged above the central conductor 32 in a crossing manner.

The superconducting quantum chip of the present embodiment has the same technical effects as the superconducting quantum chip of the previous embodiment, and on this basis, since the metal layer 10 has the hollowed-out holes 11, the load bearing of the metal posts 20 can be further reduced, and the photoresist can be conveniently removed when the air bridge is manufactured.

In the description of the present specification, a description of the terms "one embodiment," "some embodiments," "examples," or "particular examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments. Further, one skilled in the art can engage and combine the different embodiments or examples described in this specification.

The foregoing is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Any person skilled in the art will make any equivalent substitution or modification to the technical solution and technical content disclosed in the utility model without departing from the scope of the technical solution of the utility model, and the technical solution of the utility model is not departing from the scope of the utility model.

Claims (9)

1. The utility model provides an air bridge which characterized in that includes metal level and four metal posts, the central point of four metal posts's cross-sectional shape is pairwise two to constitute and predetermine the quadrangle, the metal level covers four metal posts, just four metal posts support jointly the metal level.

2. The air bridge of claim 1, wherein the coverage area of the metal layer does not exceed the extent defined by the outline of the four metal posts and the connection lines of the outermost vertices of two adjacent metal posts.

3. The air bridge of claim 1, wherein the metal layer is provided with a through hollowed-out hole, and the hollowed-out hole is located in the preset quadrangle.

4. An air bridge according to claim 3, wherein the hollow hole is in the shape of a quadrilateral which is parallel to the preset quadrilateral and coincides with the center of the quadrilateral.

5. The air bridge of claim 4, wherein a top-view projection of the hollowed-out hole does not overlap a top-view projection of the four metal posts.

6. The air bridge of claim 1, wherein the predetermined quadrilateral is rectangular.

7. The air bridge of claim 1, wherein the metal posts are rectangular in cross-sectional shape.

8. The air bridge of claim 1, wherein the metal posts are integrally formed with the metal layer.

9. A superconducting quantum chip comprising a substrate, a coplanar waveguide and an air bridge according to any one of claims 1 to 8, the coplanar waveguide being formed on the substrate, two adjacent metal posts of the air bridge being located on one ground strap of the coplanar waveguide, two other metal posts being located on the other ground strap of the coplanar waveguide, a central conductor of the coplanar waveguide passing through a gap between the metal posts on the two ground straps, and the metal layer being disposed astride the central conductor.